US3327776A - Heat exchanger - Google Patents

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US3327776A
US3327776A US504895A US50489565A US3327776A US 3327776 A US3327776 A US 3327776A US 504895 A US504895 A US 504895A US 50489565 A US50489565 A US 50489565A US 3327776 A US3327776 A US 3327776A
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cooling
columns
plates
column
packing
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US504895A
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Alan G Butt
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Trane US Inc
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Trane Co
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Priority to US504895A priority Critical patent/US3327776A/en
Priority to GB21564/66A priority patent/GB1114066A/en
Priority to BE681699D priority patent/BE681699A/xx
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Publication of US3327776A publication Critical patent/US3327776A/en
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Assigned to TRANE COMPANY, THE reassignment TRANE COMPANY, THE MERGER (SEE DOCUMENT FOR DETAILS). DELAWARE, EFFECTIVE FEB. 24, 1984 Assignors: A-S CAPITAL INC. A CORP OF DE
Assigned to TRANE COMPANY THE reassignment TRANE COMPANY THE MERGER (SEE DOCUMENT FOR DETAILS). EFFECTIVE 12/1/83 WISCONSIN Assignors: A-S CAPITAL INC., A CORP OF DE (CHANGED TO), TRANE COMPANY THE, A CORP OF WI (INTO)
Assigned to AMERICAN STANDARD INC., A CORP OF DE reassignment AMERICAN STANDARD INC., A CORP OF DE MERGER (SEE DOCUMENT FOR DETAILS). EFFECTIVE 12/28/84 DELAWARE Assignors: A-S SALEM INC., A CORP. OF DE (MERGED INTO), TRANE COMPANY, THE
Assigned to A-S CAPITAL INC., A CORP OF DE reassignment A-S CAPITAL INC., A CORP OF DE MERGER (SEE DOCUMENT FOR DETAILS). Assignors: TRANE COMPANY THE A WI CORP
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0062—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements
    • F28D9/0068—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements with means for changing flow direction of one heat exchange medium, e.g. using deflecting zones
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • FIG 6 ALAN G. BUTT /znw V and/MW ATTORNEYS United States Patent 3,327,776 HEAT EXCHANGER Alan G. Butt, La Crosse, Wis, assignor to The Trane Company, La Crosse, Wis, a corporation of Wisconsin Filed Oct. 24, 1965, Ser. No. 504,895 8 Claims. (Cl. 165-80) ABSTRACT ⁇ BF THE DESELGEURE This invention relates to heat exchangers particularly of the plate type for cooling electronic components and the like.
  • One object of my invention is to provide a cooling plate with an improved mounting structure for the components to be cooled. Specifically this mounting structure permits the components to be compressed firmly against the cooling plate for favorable heat transfer therebetween without damage to the plate by the compressive forces.
  • Another object is to provide a cooling plate with a serpentine fluid circuit utilizing a single piece packing embracing all spans of the serpentine circuit.
  • a further object of this invention is to provide a cool ing plate having parts which can be simply and efliciently assembled.
  • FIGURE 1 is a'perspective view of'my novel cooling plate having portions broken away to illustrate the interior structure thereof;
  • FIGURE 2 is a sectional View taken at line 22 of FIGURE 1;
  • FIGURE 3 is a sectional view of a detail taken at line 33 of FIGURE 1 as it would appear during assembly;
  • FIGURE 4 is an enlarged perspective view of a portion of the fin packing shown in FIGURE 1;
  • FIGURE 5 is a reduced perspective view of the fin packing shown in FIGURE 1;
  • FIGURE 6 is an enlarged sectional view of a detail taken at line 66 of FIGURE 1.
  • Cooling plate 10 includes first and second rectangular aluminum plates 12 and 14 of similar configuration. Plates 12 and 14 are arranged in superposed spaced parallel relationship. A plurality of aluminum side closing bars 13 are interposed between plates 12 and 14 at the borders thereof for sealingly connecting plates 12 and 14 thereby defining, with said plates, a fluid conducting space 15. Each of plates '12 and 14 is clad on inner surfaces 22 and 24 thereof with a brazing alloy, not shown. Certain of bars 13 designated as 13a are provided with a transverse groove 17 facing space 15 for purposes to be explained.
  • Each plate 12 and 14 has four rows 16 of sites for mounting elements or components to be cooled, such as electronic components 18. For convenience of illustration, only the sites of one row are shown as having a component 18 mounted thereon.
  • each site Disposed within space 15 at each site is a circular disc or short circular column 20 of aluminum abutting at the ends thereof the inner faces 22 and 24 of plates 12 and 14.
  • Each of the columns 20 has at the periphery 3,327,776 Patented June 27, 1967 thereof two diametrically opposed axially extending grooves 26, the function of which will be explained hereinafter.
  • Each column 20 further has an axially extending circular aperture 30 which is arranged in registry with a through-going circular aperture 32 of similar diameter in each of plates 12 and 14.
  • Packing 34 is comprised of a corrugated metallic sheet having relatively small perforations 36 as shown in FIGURE 4. These perforations may be of var ious configurations and patterns and their spacing and size is preferably less than the fin height (the distance between plates 12 and 14). These perforations may be formed in the metallic sheet prior to being corrugated.
  • the fin packing 34 is further provided with a plurality of relatively large circular apertures 38 (FIGURE 5) which are arranged to concentrically receive discs or columns 20 asshown in FIGURES 1 and 2.
  • Apertures 38 are about one-eighth inch larger than columns 20 so that when assembled there remains a space 40 between the columns 20 and packing 34 as seen in FIGURES l and 2.
  • the rows of apertures 38 for the rows 16 of cooling sites are parallel to the hills and valleys of the corrugated packing 34.
  • Apertures 38 may be accurately formed by filling the fin packing 34 with a temporary supporting material and drilling the apertures in a fixture for proper location after which the supporting material is removed.
  • An imperforate separating strip 42 extends between each adjacent pair of columns 20 of each row 16 of cooling sites.
  • Each row 16 is further provided with an imperforate end separator strip 44 which extends from a bar 13a to a column 20 at one end of the row.
  • Each of the imperforate separator strips 42 and 44 lie within a loop or valley of the corrugated packing 34 andextend laterally to one of the plates 12 and 14 as shown in FIGURE 6.
  • the grooves 26 at the sides of columns 20 and the grooves 17 in bars 13a receive the ends of strips 42 and 44.
  • End strips 44 are placed at opposite ends of adjacent rows thereby restricting passage of cooling medium within space 15 to a serpentine path as designated by the heavy dashed arrows in FIGURE 1'.
  • This serpentine flow path is provided with inlet and outlet conduits 46 and 48 which are connected with inlet and outlet apertures 50 and 52 respectively in plate 12 for receiving and discharging a cooling fluid.
  • the end turns of the serpentine flow path may be formed by providing recessed portions 54 of packing 34 with corrugated fin sections 56 of triangular configuration having the hills and valleys thereof extending per pendicularly to the hills and valleys of packing-34.
  • FIGURE 1 A peg 58 (FIGURE 3) formed from brazing wire of square or rectangular cross-section is inserted snugly into each of the holes formed by apertures 30 and 32 to, accurately locate the discs or columns Ztlduring assembly.
  • the square or rec tangular configuration of peg 58 within the circular bores permits brazing flux to enter the bores for a subsequent brazing operation. It will be evident that separating strips 42 and 44 also assist via grooves 17 and 26 in retaining the packing 34 in proper location with respect to columns 20 and thus in respect to plates 12 and 14.
  • the assemblage is then heated to a suificiently high temperature in a furnace or bath to fuse the brazing alloy and then allowed to cool for bonding the parts together as an integral unit.
  • the clad inner faces 22 and 24 of plates 12 and 14 thus become brazed to the sides of bars 13, the hills of packing 34 and fin sections 56, the lateral edges of separating strips 42 and 44 and the end surfaces of columns 20.
  • Pegs 58 melt away leaving throughgoing hole-s in plate for receiving the studs 60 of components 18.
  • Suitable nuts 62 may be secured upon the ends of studs 60 for drawing components 18 into compressive relationship with the outer surfaces of the cooling plate 10 thereby enhancing the heat transfer from the components to the cooling plate.
  • Columns 20 function to resist the compressive forces exerted by the components thus avoiding deformation of the cooling plate surface.
  • Columns 20 also function to conduct heat from the cooling sites to the inner portion of the cooling plate in contact with the cooling fluid.
  • a cooling fluid is passed into inlet conduit 46, through inlet aperture 50, through the serpentine path as designated by the dashed arrows in FIGURE 1, out outlet aperture 52 and outlet conduit 48.
  • the fluid flowing within the serpentine path comes in direct contact with columns 20 to conduct heat therefrom.
  • the spaces 40 function to conduct cooling fluid along the side surfaces of columns 20, thus enhancing this heat transfer between the columns and the cooling fluid.
  • a cooling plate comprising first and second metallic plates of similar configuration disposed in superposed spaced relationship; sealing means sealably connecting said plates along the borders thereof whereby a fluid conducting space is defined by the inner faces of said plates and said sealing means; said first plate having an outer face thereof a plurality of rows of cooling sites for cooling a plurality of elements; each one of said sites having adjacent thereto a metallic column abutting the inner face of said first plate in alignment with said one site; each of said columns extending into said fluid conducting space; a perforated fin packing disposed within said fluid conducting space circumscribing said columns; said packing having a plurality of apertures of sufficient size to receive said columns; a substantially imperforate separator strip extending substantially from one column to the other column of each pair of columns within each row; each row of columns having at one end thereof a substantially imperforate end separator strip extending substantially from said sealing means substantially to a column at one end of each row; said end separator strips being arranged at remote ends of adjacent rows thereby defining a serpentine fluid
  • a coo-ling plate comprising first and second plates of similar configuration disposed in superposed spaced relationship; sealing means sealably connecting said plates along the borders thereof whereby a fluid conducting space is defined by the inner faces of said plates and said sealing means; said first plate having on the outer face thereof a plurality of rows of cooling sites for cooling a plurality of elements; each one of said sites having associated therewith a metallic column bonded at one end thereof to the inner face of said first plate in alignment with said one site; each of said columns extending through said fluid conducting space to the inner face of said second plate; a corrugated perforated fin packing disposed within said fluid conducting space circumscribing said columns and having the hills and valleys thereof extending in parllel relationship to said rows; said packing having a plurality of apertures of suflicient size toreceive said columns in spaced relationship thereby defining a space between said packing and each of said columns; a substantially imperforate separator strip extending substantially from one column to the other column of each pair of columns within each row; each row
  • each of said columns is provided with an axially extending through-going aperture in registry with apertures in said first and second plates for compressive mounting of elements to be cooled.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

1,114,066. Heat exchange plate. TRANE CO. 16 May, 1966 [24 Oct., 1965], No. 21564/66, Heading F4S. A cooling plate 10, suitable for cooling a plurality of electronic components 18, comprises first and second aluminium plates, 12 and 14 resp., spaced apart and sealably connected along their edges by a metallic strip 13 so defining therebetween a fluid conducting space 15, each of said plates having four rows 16 of apertures 32 which are in alignment both with one another and with the bores 30 of aluminium columns 20 extending between said plates. A stud (60), to one end of which the component to be cooled is attached, passes through the cooling plate 10 to be engaged by a nut, (62, Fig. 2), thus ensuring good thermal contact between the cooling plate and component, the column 20 preventing stress deformation of said cooling plate. Disposed within the fluid conducting space 15 is a single piece of fin packing 34 comprising a corrugated and perforated metallic sheet said packing having apertures 38 for concentrically receiving columns 20 with a space 40 being left therebetween. An imperforate separating strip 42 extends between each adjacent pair of columns 20 of each row 16 of cooling sites, the opposite ends of adjacent rows having a further imperforate strip 44 extending from the end column of a row to a sealing strip 13a; Cooling fluid, supplied through duct 46, is thus caused to take a serpentine path, indicated by the heavy broken arrows, before entering the outlet duct 48, the space 40 between the packing and each column ensuring a complete flushing of the latter. During assembly, the contact surfaces of all components of the cooling plate are covered with a brazing alloy so that on heating of said plates bonding between components is achieved.

Description

Filed Oct. 24, 1965 will! INVENTOR. FIG 6 ALAN G. BUTT /znw V and/MW ATTORNEYS United States Patent 3,327,776 HEAT EXCHANGER Alan G. Butt, La Crosse, Wis, assignor to The Trane Company, La Crosse, Wis, a corporation of Wisconsin Filed Oct. 24, 1965, Ser. No. 504,895 8 Claims. (Cl. 165-80) ABSTRACT {BF THE DESELGEURE This invention relates to heat exchangers particularly of the plate type for cooling electronic components and the like.
One object of my invention is to provide a cooling plate with an improved mounting structure for the components to be cooled. Specifically this mounting structure permits the components to be compressed firmly against the cooling plate for favorable heat transfer therebetween without damage to the plate by the compressive forces.
Another object is to provide a cooling plate with a serpentine fluid circuit utilizing a single piece packing embracing all spans of the serpentine circuit.
A further object of this invention is to provide a cool ing plate having parts which can be simply and efliciently assembled.
These and other objects will be more'clearly understood as this specification proceeds to describe in detail the preferred embodiment of my invention shown in the drawings in which:
FIGURE 1 is a'perspective view of'my novel cooling plate having portions broken away to illustrate the interior structure thereof;
FIGURE 2 is a sectional View taken at line 22 of FIGURE 1;
FIGURE 3 is a sectional view of a detail taken at line 33 of FIGURE 1 as it would appear during assembly;
FIGURE 4 is an enlarged perspective view of a portion of the fin packing shown in FIGURE 1;
FIGURE 5 is a reduced perspective view of the fin packing shown in FIGURE 1; and
FIGURE 6 is an enlarged sectional view of a detail taken at line 66 of FIGURE 1.
Now referring to the drawings, there is shown a brazed plate type heat exchanger cooling plate 10. Cooling plate 10 includes first and second rectangular aluminum plates 12 and 14 of similar configuration. Plates 12 and 14 are arranged in superposed spaced parallel relationship. A plurality of aluminum side closing bars 13 are interposed between plates 12 and 14 at the borders thereof for sealingly connecting plates 12 and 14 thereby defining, with said plates, a fluid conducting space 15. Each of plates '12 and 14 is clad on inner surfaces 22 and 24 thereof with a brazing alloy, not shown. Certain of bars 13 designated as 13a are provided with a transverse groove 17 facing space 15 for purposes to be explained.
Each plate 12 and 14 has four rows 16 of sites for mounting elements or components to be cooled, such as electronic components 18. For convenience of illustration, only the sites of one row are shown as having a component 18 mounted thereon.
Disposed within space 15 at each site is a circular disc or short circular column 20 of aluminum abutting at the ends thereof the inner faces 22 and 24 of plates 12 and 14. Each of the columns 20 has at the periphery 3,327,776 Patented June 27, 1967 thereof two diametrically opposed axially extending grooves 26, the function of which will be explained hereinafter. Each column 20 further has an axially extending circular aperture 30 which is arranged in registry with a through-going circular aperture 32 of similar diameter in each of plates 12 and 14.
Also disposed within space 15 is a single piece of fin packing 34. Packing 34 is comprised of a corrugated metallic sheet having relatively small perforations 36 as shown in FIGURE 4. These perforations may be of var ious configurations and patterns and their spacing and size is preferably less than the fin height (the distance between plates 12 and 14). These perforations may be formed in the metallic sheet prior to being corrugated.
The fin packing 34 is further provided with a plurality of relatively large circular apertures 38 (FIGURE 5) which are arranged to concentrically receive discs or columns 20 asshown in FIGURES 1 and 2. Apertures 38 are about one-eighth inch larger than columns 20 so that when assembled there remains a space 40 between the columns 20 and packing 34 as seen in FIGURES l and 2. The rows of apertures 38 for the rows 16 of cooling sites are parallel to the hills and valleys of the corrugated packing 34. Apertures 38 may be accurately formed by filling the fin packing 34 with a temporary supporting material and drilling the apertures in a fixture for proper location after which the supporting material is removed.
An imperforate separating strip 42 extends between each adjacent pair of columns 20 of each row 16 of cooling sites. Each row 16 is further provided with an imperforate end separator strip 44 which extends from a bar 13a to a column 20 at one end of the row. Each of the imperforate separator strips 42 and 44 lie within a loop or valley of the corrugated packing 34 andextend laterally to one of the plates 12 and 14 as shown in FIGURE 6. The grooves 26 at the sides of columns 20 and the grooves 17 in bars 13a receive the ends of strips 42 and 44. End strips 44 are placed at opposite ends of adjacent rows thereby restricting passage of cooling medium within space 15 to a serpentine path as designated by the heavy dashed arrows in FIGURE 1'. This serpentine flow path is provided with inlet and outlet conduits 46 and 48 which are connected with inlet and outlet apertures 50 and 52 respectively in plate 12 for receiving and discharging a cooling fluid.
The end turns of the serpentine flow pathmay be formed by providing recessed portions 54 of packing 34 with corrugated fin sections 56 of triangular configuration having the hills and valleys thereof extending per pendicularly to the hills and valleys of packing-34..
In constructing the cold plate 10, the parts thereof are assembled as shown in FIGURE 1. A peg 58 (FIGURE 3) formed from brazing wire of square or rectangular cross-section is inserted snugly into each of the holes formed by apertures 30 and 32 to, accurately locate the discs or columns Ztlduring assembly. The square or rec tangular configuration of peg 58 within the circular bores permits brazing flux to enter the bores for a subsequent brazing operation. It will be evident that separating strips 42 and 44 also assist via grooves 17 and 26 in retaining the packing 34 in proper location with respect to columns 20 and thus in respect to plates 12 and 14.
The assemblage is then heated to a suificiently high temperature in a furnace or bath to fuse the brazing alloy and then allowed to cool for bonding the parts together as an integral unit. The clad inner faces 22 and 24 of plates 12 and 14 thus become brazed to the sides of bars 13, the hills of packing 34 and fin sections 56, the lateral edges of separating strips 42 and 44 and the end surfaces of columns 20. Pegs 58 melt away leaving throughgoing hole-s in plate for receiving the studs 60 of components 18.
Suitable nuts 62 may be secured upon the ends of studs 60 for drawing components 18 into compressive relationship with the outer surfaces of the cooling plate 10 thereby enhancing the heat transfer from the components to the cooling plate. Columns 20 function to resist the compressive forces exerted by the components thus avoiding deformation of the cooling plate surface. Columns 20 also function to conduct heat from the cooling sites to the inner portion of the cooling plate in contact with the cooling fluid.
In operating the cooling plate, a cooling fluid is passed into inlet conduit 46, through inlet aperture 50, through the serpentine path as designated by the dashed arrows in FIGURE 1, out outlet aperture 52 and outlet conduit 48. The fluid flowing within the serpentine path comes in direct contact with columns 20 to conduct heat therefrom. The spaces 40 function to conduct cooling fluid along the side surfaces of columns 20, thus enhancing this heat transfer between the columns and the cooling fluid.
Although I have described in detail the preferred embodiment of my invention, I contemplate that many changes may be made without departing from the scope or spirit of my invention and I desire to be limited only by the claims.
I claim:
1. A cooling plate comprising first and second metallic plates of similar configuration disposed in superposed spaced relationship; sealing means sealably connecting said plates along the borders thereof whereby a fluid conducting space is defined by the inner faces of said plates and said sealing means; said first plate having an outer face thereof a plurality of rows of cooling sites for cooling a plurality of elements; each one of said sites having adjacent thereto a metallic column abutting the inner face of said first plate in alignment with said one site; each of said columns extending into said fluid conducting space; a perforated fin packing disposed within said fluid conducting space circumscribing said columns; said packing having a plurality of apertures of sufficient size to receive said columns; a substantially imperforate separator strip extending substantially from one column to the other column of each pair of columns within each row; each row of columns having at one end thereof a substantially imperforate end separator strip extending substantially from said sealing means substantially to a column at one end of each row; said end separator strips being arranged at remote ends of adjacent rows thereby defining a serpentine fluid flow path; and a fluid inlet and outlet disposed at opposite ends of said serpentine fiuid flow path for receiving into and discharging from said cooling plate a cooling fluid whereby elements positioned at said cooling sites are cooled.
2. The apparatus defined by claim 1 wherein said columns are provided with grooves at the sides thereof for receiving the ends of said imperforate separator strips.
3. The apparatus defined in claim 1 wherein said packing is comprised of a single piece which traverses said separator strips and is disposed in several spans of said serpentine fluid flow path.
4. A coo-ling plate comprising first and second plates of similar configuration disposed in superposed spaced relationship; sealing means sealably connecting said plates along the borders thereof whereby a fluid conducting space is defined by the inner faces of said plates and said sealing means; said first plate having on the outer face thereof a plurality of rows of cooling sites for cooling a plurality of elements; each one of said sites having associated therewith a metallic column bonded at one end thereof to the inner face of said first plate in alignment with said one site; each of said columns extending through said fluid conducting space to the inner face of said second plate; a corrugated perforated fin packing disposed within said fluid conducting space circumscribing said columns and having the hills and valleys thereof extending in parllel relationship to said rows; said packing having a plurality of apertures of suflicient size toreceive said columns in spaced relationship thereby defining a space between said packing and each of said columns; a substantially imperforate separator strip extending substantially from one column to the other column of each pair of columns within each row; each row of columns having at one end thereof a substantially imperforate 7 end separator strip extending substantially from said sealing means substantially to a column at one end of each row; said end separator strips being arranged at remote ends of adjacent rows thereby defining a serpentine fluid flow path; and a fluid inlet and outlet disposed at opposite ends of said serpentine fluid flow path for receiving into and discharging from said cooling plate a cooling fluid whereby elements positioned at said sites are cooled.
5. The apparatus as defined by claim 4 wherein said imperforate separator strips are disposed within the loop portion of said fin packing.
6. The apparatus as defined by claim 5 wherein said columns are provided with grooves at the sides thereof for receiving the ends of said imperforate strips.
7. The apparatus as defined by claim 4 wherein said packing is comprised of a single piece which traverses said separator strips and is disposed in several spans of said serpentine fluid flow path. 7
8. The apparatus defined by claim 4 wherein each of said columns is provided with an axially extending through-going aperture in registry with apertures in said first and second plates for compressive mounting of elements to be cooled.
References Cited UNITED STATES PATENTS 2,912,624 11/1959 Wagner 317- 3,048,374 8/ 1962 Hughes 80 3,135,321 6/1964 Butt et al 165-154 FOREIGN PATENTS 234,265 6/1961 Australia. 1,363,913 5/1964 France.
MEYER PERLIN, Primary Examiner.
ROBERT A. OLEARY, Examiner.
A. W. DAVIS, Assistant Examiner.

Claims (1)

1. A COOLING PLATE COMPRISING FIRST AND SECOND METALLIC PLATES OF SIMILAR CONFIGURATION DISPOSED IN SUPERPOSED SPACED RELATIONSHIP; SEALING MEANS SEALING CONNECTING SAID PLATES ALONG THE BORDERS THEREOF WHEREBY A FLUID CONDUCTING SPACE IS DEFINED BY THE INNER FACES OF SAID PLATES AND SAID SEALING MEANS; SAID FIRST PLATE HAVING AN OUTER FACE THEREOF A PLURALITY OF ROWS OF COOLING SITES FOR COOLING A PLURALITY OF ELEMENTS; EACH ONE OF SAID SITES HAVING ADJACENT THERETO A METALLIC COLUMN ABUTTING THE INNER FACE OF SAID FIRST PLATE IN ALIGNMENT WITH SAID ONE SITE; EACH OF SAID COLUMNS EXTENDING INTO SAID FLUID CONDUCTING SPACE; A PERFORATED FIN PACKING DISPOSED WITHIN SAID FLUID CONDUCTING SPACE CIRCUMSCRIBING SAID COLUMNS; SAID PACKING HAVING A PLURALITY OF APERTURES OF SUFFICIENT SIZE TO RECEIVE SAID COLUMNS; A SUBSTANTIALLY IMPERFORATE SEPARATOR STRIP EXTENDING SUBSTANTIALLY FROM ONE COLUMN TO THE OTHER COLUMN OF EACH PAIR OF COLUMNS WITHIN EACH ROW; EACH ROW OF COLUMNS HAVING AT ONE END THEREOF A SUBSTANTIALLY IMPERFORATE END SEPARATOR STRIP EXTENDING SUBSTANTIALLY FROM SAID SEALING MEANS SUBSTANTIALLY TO A COLUMN AT ONE END OF EACH ROW; SAID END SEPARATOR STRIPS BEING ARRANGED AT REMOTE ENDS OF ADJACENT ROWS THEREBY DEFINING A SERPENTINE FLUID FLOW PATH; AND A FLUID INLET AND OUTLET DISPOSED AT OPPOSITE ENDS OF SAID SERPENTINE FLUID FLOW PATH FOR RECEIVING INTO AND DISCHARGING FROM SAID COOLING PLATE A COOLING FLUID WHEREBY ELEMENTS POSITIONED AT SAID COOLING SITES ARE COOLED.
US504895A 1965-10-24 1965-10-24 Heat exchanger Expired - Lifetime US3327776A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US504895A US3327776A (en) 1965-10-24 1965-10-24 Heat exchanger
GB21564/66A GB1114066A (en) 1965-10-24 1966-05-16 An improved cooling plate
BE681699D BE681699A (en) 1965-10-24 1966-05-27

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Cited By (76)

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US3650310A (en) * 1970-07-16 1972-03-21 Stewart & Stevenson Serv Inc Combination boat trim tab and heat exchanger
US3865183A (en) * 1973-10-23 1975-02-11 Control Data Corp Cooling systems for electronic modules
US4085728A (en) * 1976-08-16 1978-04-25 Tomchak Sigfrid A Solar energy heater
US4170220A (en) * 1976-10-29 1979-10-09 Smith Henry C Solar heat collector
US4270604A (en) * 1978-11-17 1981-06-02 Sumitomo Precision Products Co. Ltd. Heat sink
US4478277A (en) * 1982-06-28 1984-10-23 The Trane Company Heat exchanger having uniform surface temperature and improved structural strength
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
US4519447A (en) * 1980-08-04 1985-05-28 Fine Particle Technology Corporation Substrate cooling
US4631635A (en) * 1984-10-31 1986-12-23 The United States Of America As Represented By The Secretary Of The Air Force Vibration isolated cold plate assembly
US4697427A (en) * 1985-05-10 1987-10-06 Sundstrand Corporation Forced flow evaporator for unusual gravity conditions
US4753290A (en) * 1986-07-18 1988-06-28 Unisys Corporation Reduced-stress heat sink device
US4884168A (en) * 1988-12-14 1989-11-28 Cray Research, Inc. Cooling plate with interboard connector apertures for circuit board assemblies
US4922573A (en) * 1989-04-14 1990-05-08 Grumman Aerospace Corporation Compression fitted bushing installation
US4938280A (en) * 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
WO1992017040A1 (en) * 1991-03-15 1992-10-01 In-Touch Products Co. Parenteral fluid warmer cassette, system and methods
US5269146A (en) * 1990-08-28 1993-12-14 Kerner James M Thermoelectric closed-loop heat exchange system
US5275235A (en) * 1989-07-28 1994-01-04 Cesaroni Anthony Joseph Panel heat exchanger
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5343359A (en) * 1992-11-19 1994-08-30 Cray Research, Inc. Apparatus for cooling daughter boards
US5381510A (en) * 1991-03-15 1995-01-10 In-Touch Products Co. In-line fluid heating apparatus with gradation of heat energy from inlet to outlet
US5469915A (en) * 1992-05-29 1995-11-28 Anthony J. Cesaroni Panel heat exchanger formed from tubes and sheets
EP0706212A3 (en) * 1994-10-03 1997-02-12 Sumitomo Metal Ind Heat sink fin assembly for an LSI package
US5638900A (en) * 1995-01-27 1997-06-17 Ail Research, Inc. Heat exchange assembly
US5669437A (en) * 1990-02-05 1997-09-23 International Business Machines Corporation High efficiency thermal interposer
US5737387A (en) * 1994-03-11 1998-04-07 Arch Development Corporation Cooling for a rotating anode X-ray tube
US5804761A (en) * 1996-05-02 1998-09-08 Chrysler Corporation Water cooled DC bus structure
US5846224A (en) * 1996-10-01 1998-12-08 Baxter International Inc. Container for use with blood warming apparatus
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
US6047108A (en) * 1996-10-01 2000-04-04 Baxter International Inc. Blood warming apparatus
US6305463B1 (en) * 1996-02-22 2001-10-23 Silicon Graphics, Inc. Air or liquid cooled computer module cold plate
WO2002042703A2 (en) * 2000-11-21 2002-05-30 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US20020189794A1 (en) * 2001-05-25 2002-12-19 Agilent Technologies, Inc. Cooler for electrical and/ or electronic components, linked to present cooling needs
US6508301B2 (en) * 2000-04-19 2003-01-21 Thermal Form & Function Cold plate utilizing fin with evaporating refrigerant
US6563709B2 (en) * 2000-07-21 2003-05-13 Mitsubishi Materials Corporation Liquid-cooled heat sink and manufacturing method thereof
US6615590B1 (en) * 1999-12-16 2003-09-09 Smc Corporation Heat exchanger for temperature control
US6648062B2 (en) * 2000-07-31 2003-11-18 Honda Giken Kogyo Kabushiki Kaisha Heat sink-type cooling device
US6729389B2 (en) * 2000-02-24 2004-05-04 Sts Corporation Heat transfer apparatus with zigzag passage
US20040182544A1 (en) * 2002-12-27 2004-09-23 Lee Hsieh Kun Cooling device utilizing liquid coolant
US6843310B1 (en) * 2004-03-03 2005-01-18 Chin-Ping Chen Semi-closed air cooling type radiator
US20050028967A1 (en) * 2003-08-06 2005-02-10 Albert Pedoeem Heat dissipating housing with interlocking chamfers and ESD resistance
US20050178533A1 (en) * 2004-02-16 2005-08-18 Rintaro Minamitani Liquid cooling system and an electronic apparatus having the same therein
US20050274505A1 (en) * 2004-06-11 2005-12-15 Risto Laurila Cooling element
US20050284609A1 (en) * 2004-05-28 2005-12-29 Ixys Corporation Heatsink for power devices
US20060118279A1 (en) * 2004-12-07 2006-06-08 Eric Stafford Water cooling system for computer components
US20060175043A1 (en) * 2005-02-07 2006-08-10 Hung-Tao Peng Temperature conductor and method of making same
US20060219388A1 (en) * 2005-03-31 2006-10-05 Shuichi Terakado Cooling jacket
US7134484B2 (en) * 2000-12-07 2006-11-14 International Business Machines Corporation Increased efficiency in liquid and gaseous planar device cooling technology
US20070023168A1 (en) * 2005-07-27 2007-02-01 Behr Industry Gmbh & Co. Kg Apparatus for cooling electronic components
US20070119581A1 (en) * 2003-09-30 2007-05-31 Soichi Kato Heat exchanger tube
US20070261830A1 (en) * 2006-05-12 2007-11-15 Seiko Epson Corporation Heat exchanger, light source apparatus, and projector
US20080029260A1 (en) * 2006-08-02 2008-02-07 Man Zai Industrial Co., Ltd. Liquid cooled heat sink
WO2008067429A2 (en) * 2006-11-29 2008-06-05 Raytheon Company Multi-orientation single or two phase coldplate with positive flow characteristics
US20090080159A1 (en) * 2005-01-14 2009-03-26 Mitsubishi Denki Kabushiki Kaisha Heat sink and cooling unit using the same
US20090107655A1 (en) * 2007-10-25 2009-04-30 Katsuyuki Kajiura Semiconductor cooling apparatus
US20100002392A1 (en) * 2008-07-07 2010-01-07 I-Ming Liu Assembled Heat Sink Structure
US20100101512A1 (en) * 2007-03-20 2010-04-29 Conti Temic Microelectronic Gmbh Control Appliance For Using In The Engine Compartment Or In The Transmission Of A Motor Vehicle And Cooling System For Such A Control Appliance
US20100147290A1 (en) * 2008-12-16 2010-06-17 Yan Krzysztof Kunczynski Solar Water Heater
US20100147289A1 (en) * 2008-12-16 2010-06-17 Yan Krzysztof Kunczynski Solar Water Heater
US20100172104A1 (en) * 2009-01-08 2010-07-08 Toyota Jidosha Kabushiki Kaisha Heat dissipation device and power module
US20100296247A1 (en) * 2009-05-22 2010-11-25 Ls Industrial Systems Co., Ltd. Water-cooling type cooler and inverter having the same
US20110149517A1 (en) * 2006-09-06 2011-06-23 Airbus Operations Gmbh Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System
US20110232879A1 (en) * 2010-03-29 2011-09-29 Zaffetti Mark A Compact two sided cold plate with transfer tubes
CN103155142A (en) * 2010-08-23 2013-06-12 三樱工业株式会社 Cooling device
WO2014036476A2 (en) * 2012-08-31 2014-03-06 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University System and method for storing energy and purifying fluid
US20140069615A1 (en) * 2011-05-12 2014-03-13 Toyota Jidosha Kabushiki Kaisha Cooler and method for producing the same
US20140090824A1 (en) * 2012-09-28 2014-04-03 Behr Gmbh & Co. Kg Apparatus for conducting a fluid
US20150189789A1 (en) * 2013-12-30 2015-07-02 Samsung Display Co., Ltd. Heat radiation member for electronic device
US20150377562A1 (en) * 2013-06-27 2015-12-31 Dana Canada Corporation Fluid channels having performance enhancement features and devices incorporating same
US20160348980A1 (en) * 2015-05-28 2016-12-01 Hamilton Sundstrand Corporation Heat exchanger with improved flow at mitered corners
CN106705701A (en) * 2015-08-18 2017-05-24 珠海格力节能环保制冷技术研究中心有限公司 Heat dissipater and manufacturing method thereof
US20170186667A1 (en) * 2015-12-26 2017-06-29 Intel Corporation Cooling of electronics using folded foil microchannels
US20170234627A1 (en) * 2016-02-16 2017-08-17 Omron Automotive Electronics Co., Ltd. Cooler and flow path unit
US9743563B2 (en) 2007-03-20 2017-08-22 Conti Temic Microelectronic Gmbh Control appliance for using in the engine compartment or in the transmission of a motor vehicle and cooling system for such a control appliance
CN111477997A (en) * 2020-03-25 2020-07-31 安徽沃博源科技有限公司 Liquid cooling plate and liquid cooling device
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US3135321A (en) * 1960-03-07 1964-06-02 Trane Co Heat exchanger
FR1363913A (en) * 1963-02-25 1964-06-19 Ygnis Sa element traversed by a fluid in the longitudinal direction and intended to promote heat exchange

Cited By (110)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3650310A (en) * 1970-07-16 1972-03-21 Stewart & Stevenson Serv Inc Combination boat trim tab and heat exchanger
US3865183A (en) * 1973-10-23 1975-02-11 Control Data Corp Cooling systems for electronic modules
US4085728A (en) * 1976-08-16 1978-04-25 Tomchak Sigfrid A Solar energy heater
US4170220A (en) * 1976-10-29 1979-10-09 Smith Henry C Solar heat collector
US4270604A (en) * 1978-11-17 1981-06-02 Sumitomo Precision Products Co. Ltd. Heat sink
US4519447A (en) * 1980-08-04 1985-05-28 Fine Particle Technology Corporation Substrate cooling
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
US4478277A (en) * 1982-06-28 1984-10-23 The Trane Company Heat exchanger having uniform surface temperature and improved structural strength
US4631635A (en) * 1984-10-31 1986-12-23 The United States Of America As Represented By The Secretary Of The Air Force Vibration isolated cold plate assembly
US4697427A (en) * 1985-05-10 1987-10-06 Sundstrand Corporation Forced flow evaporator for unusual gravity conditions
US4753290A (en) * 1986-07-18 1988-06-28 Unisys Corporation Reduced-stress heat sink device
US4938280A (en) * 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
US4884168A (en) * 1988-12-14 1989-11-28 Cray Research, Inc. Cooling plate with interboard connector apertures for circuit board assemblies
US4922573A (en) * 1989-04-14 1990-05-08 Grumman Aerospace Corporation Compression fitted bushing installation
US5275235A (en) * 1989-07-28 1994-01-04 Cesaroni Anthony Joseph Panel heat exchanger
US5915462A (en) * 1990-02-05 1999-06-29 International Business Machines Corporation High efficiency thermal interposer
US5669437A (en) * 1990-02-05 1997-09-23 International Business Machines Corporation High efficiency thermal interposer
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5269146A (en) * 1990-08-28 1993-12-14 Kerner James M Thermoelectric closed-loop heat exchange system
US5245693A (en) * 1991-03-15 1993-09-14 In-Touch Products Co. Parenteral fluid warmer apparatus and disposable cassette utilizing thin, flexible heat-exchange membrane
US5381510A (en) * 1991-03-15 1995-01-10 In-Touch Products Co. In-line fluid heating apparatus with gradation of heat energy from inlet to outlet
WO1992017040A1 (en) * 1991-03-15 1992-10-01 In-Touch Products Co. Parenteral fluid warmer cassette, system and methods
US5469915A (en) * 1992-05-29 1995-11-28 Anthony J. Cesaroni Panel heat exchanger formed from tubes and sheets
US5343359A (en) * 1992-11-19 1994-08-30 Cray Research, Inc. Apparatus for cooling daughter boards
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5737387A (en) * 1994-03-11 1998-04-07 Arch Development Corporation Cooling for a rotating anode X-ray tube
EP0706212A3 (en) * 1994-10-03 1997-02-12 Sumitomo Metal Ind Heat sink fin assembly for an LSI package
EP1011140A2 (en) * 1994-10-03 2000-06-21 Sumitomo Metal Industries, Ltd. Heat sink fin assembly for cooling an LSI package
EP1028461A1 (en) * 1994-10-03 2000-08-16 Sumitomo Metal Industries, Ltd. Heat sink fin assembly for cooling an LSI package
EP1011140A3 (en) * 1994-10-03 2000-07-26 Sumitomo Metal Industries, Ltd. Heat sink fin assembly for cooling an LSI package
US5638900A (en) * 1995-01-27 1997-06-17 Ail Research, Inc. Heat exchange assembly
US6305463B1 (en) * 1996-02-22 2001-10-23 Silicon Graphics, Inc. Air or liquid cooled computer module cold plate
US5804761A (en) * 1996-05-02 1998-09-08 Chrysler Corporation Water cooled DC bus structure
US6047108A (en) * 1996-10-01 2000-04-04 Baxter International Inc. Blood warming apparatus
US5846224A (en) * 1996-10-01 1998-12-08 Baxter International Inc. Container for use with blood warming apparatus
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
US6615590B1 (en) * 1999-12-16 2003-09-09 Smc Corporation Heat exchanger for temperature control
US6729389B2 (en) * 2000-02-24 2004-05-04 Sts Corporation Heat transfer apparatus with zigzag passage
US6508301B2 (en) * 2000-04-19 2003-01-21 Thermal Form & Function Cold plate utilizing fin with evaporating refrigerant
US6563709B2 (en) * 2000-07-21 2003-05-13 Mitsubishi Materials Corporation Liquid-cooled heat sink and manufacturing method thereof
US6648062B2 (en) * 2000-07-31 2003-11-18 Honda Giken Kogyo Kabushiki Kaisha Heat sink-type cooling device
WO2002042703A2 (en) * 2000-11-21 2002-05-30 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
WO2002042703A3 (en) * 2000-11-21 2002-07-18 Thermal Corp Liquid cooled heat exchanger with enhanced flow
US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US6719039B2 (en) 2000-11-21 2004-04-13 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US7134484B2 (en) * 2000-12-07 2006-11-14 International Business Machines Corporation Increased efficiency in liquid and gaseous planar device cooling technology
US20020189794A1 (en) * 2001-05-25 2002-12-19 Agilent Technologies, Inc. Cooler for electrical and/ or electronic components, linked to present cooling needs
US6935412B2 (en) * 2001-05-25 2005-08-30 Agilent Technologies, Inc. Cooler for electrical and/ or electronic components, linked to present cooling needs
US20040182544A1 (en) * 2002-12-27 2004-09-23 Lee Hsieh Kun Cooling device utilizing liquid coolant
US20050028967A1 (en) * 2003-08-06 2005-02-10 Albert Pedoeem Heat dissipating housing with interlocking chamfers and ESD resistance
US7111674B2 (en) * 2003-08-06 2006-09-26 Fujitsu Limited Heat dissipating housing with interlocking chamfers and ESD resistance
US20070119581A1 (en) * 2003-09-30 2007-05-31 Soichi Kato Heat exchanger tube
US20050178533A1 (en) * 2004-02-16 2005-08-18 Rintaro Minamitani Liquid cooling system and an electronic apparatus having the same therein
US7624789B2 (en) * 2004-02-16 2009-12-01 Hitachi, Ltd. Liquid cooling system and an electronic apparatus having the same therein
US6843310B1 (en) * 2004-03-03 2005-01-18 Chin-Ping Chen Semi-closed air cooling type radiator
US20050284609A1 (en) * 2004-05-28 2005-12-29 Ixys Corporation Heatsink for power devices
US7243706B2 (en) * 2004-05-28 2007-07-17 Ixys Corporation Heatsink for power devices
US7059390B2 (en) * 2004-06-11 2006-06-13 Abb Oy Cooling element
US20050274505A1 (en) * 2004-06-11 2005-12-15 Risto Laurila Cooling element
US20060118279A1 (en) * 2004-12-07 2006-06-08 Eric Stafford Water cooling system for computer components
US8225854B2 (en) * 2005-01-14 2012-07-24 Mitsubishi Denki Kabushiki Kaisha Heat sink and cooling unit using the same
US20090080159A1 (en) * 2005-01-14 2009-03-26 Mitsubishi Denki Kabushiki Kaisha Heat sink and cooling unit using the same
US20060175043A1 (en) * 2005-02-07 2006-08-10 Hung-Tao Peng Temperature conductor and method of making same
US7516777B2 (en) * 2005-03-31 2009-04-14 Hitachi, Ltd. Cooling jacket
US20060219388A1 (en) * 2005-03-31 2006-10-05 Shuichi Terakado Cooling jacket
US20070023168A1 (en) * 2005-07-27 2007-02-01 Behr Industry Gmbh & Co. Kg Apparatus for cooling electronic components
US20070261830A1 (en) * 2006-05-12 2007-11-15 Seiko Epson Corporation Heat exchanger, light source apparatus, and projector
US7757752B2 (en) * 2006-05-12 2010-07-20 Seiko Epson Corporation Heat exchanger, light source apparatus, and projector
US20080029260A1 (en) * 2006-08-02 2008-02-07 Man Zai Industrial Co., Ltd. Liquid cooled heat sink
US8331093B2 (en) * 2006-09-06 2012-12-11 Airbus Operations Gmbh Aircraft electronics cooling apparatus for an aircraft having a liquid cooling system
US20110149517A1 (en) * 2006-09-06 2011-06-23 Airbus Operations Gmbh Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System
US9167720B2 (en) * 2006-09-06 2015-10-20 Airbus Operations Gmbh Aircraft electronics cooling apparatus for an aircraft having a liquid cooling system
US20130215572A1 (en) * 2006-09-06 2013-08-22 Airbus Operations Gmbh Aircraft electronics cooling apparatus for an aircraft having a liquid cooling system
US20080128117A1 (en) * 2006-11-29 2008-06-05 Wyatt William G Multi-orientation single or two phase coldplate with positive flow characteristics
US8833438B2 (en) 2006-11-29 2014-09-16 Raytheon Company Multi-orientation single or two phase coldplate with positive flow characteristics
WO2008067429A3 (en) * 2006-11-29 2008-11-13 Raytheon Co Multi-orientation single or two phase coldplate with positive flow characteristics
WO2008067429A2 (en) * 2006-11-29 2008-06-05 Raytheon Company Multi-orientation single or two phase coldplate with positive flow characteristics
US9743563B2 (en) 2007-03-20 2017-08-22 Conti Temic Microelectronic Gmbh Control appliance for using in the engine compartment or in the transmission of a motor vehicle and cooling system for such a control appliance
US20100101512A1 (en) * 2007-03-20 2010-04-29 Conti Temic Microelectronic Gmbh Control Appliance For Using In The Engine Compartment Or In The Transmission Of A Motor Vehicle And Cooling System For Such A Control Appliance
US20090107655A1 (en) * 2007-10-25 2009-04-30 Katsuyuki Kajiura Semiconductor cooling apparatus
US8120914B2 (en) * 2007-10-25 2012-02-21 Kabushiki Kaisha Toyota Jidoshokki Semiconductor cooling apparatus
US20100002392A1 (en) * 2008-07-07 2010-01-07 I-Ming Liu Assembled Heat Sink Structure
WO2010077815A1 (en) * 2008-12-16 2010-07-08 Yan Kunczynski Solar water heater
US20100147290A1 (en) * 2008-12-16 2010-06-17 Yan Krzysztof Kunczynski Solar Water Heater
US20100147289A1 (en) * 2008-12-16 2010-06-17 Yan Krzysztof Kunczynski Solar Water Heater
US7961474B2 (en) * 2009-01-08 2011-06-14 Toyota Jidosha Kabushiki Kaisha Heat dissipation device and power module
US20100172104A1 (en) * 2009-01-08 2010-07-08 Toyota Jidosha Kabushiki Kaisha Heat dissipation device and power module
US20100296247A1 (en) * 2009-05-22 2010-11-25 Ls Industrial Systems Co., Ltd. Water-cooling type cooler and inverter having the same
US8339785B2 (en) * 2009-05-22 2012-12-25 Ls Industrial Systems Co., Ltd. Water-cooling type cooler and inverter having the same
EP2372760A3 (en) * 2010-03-29 2012-12-26 Hamilton Sundstrand Corporation Compact two sided cold plate suport assembly with transfer tubes
US8991478B2 (en) 2010-03-29 2015-03-31 Hamilton Sundstrand Space Systems International, Inc. Compact two sided cold plate with transfer tubes
US20110232879A1 (en) * 2010-03-29 2011-09-29 Zaffetti Mark A Compact two sided cold plate with transfer tubes
US20130153186A1 (en) * 2010-08-23 2013-06-20 Naoya Gotou Cooling Device
CN103155142A (en) * 2010-08-23 2013-06-12 三樱工业株式会社 Cooling device
US9562728B2 (en) * 2010-08-23 2017-02-07 Sanoh Industrial Co., Ltd. Cooling device with corrugated fins in communication with serpentine fluid passageway
US20140069615A1 (en) * 2011-05-12 2014-03-13 Toyota Jidosha Kabushiki Kaisha Cooler and method for producing the same
WO2014036476A2 (en) * 2012-08-31 2014-03-06 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University System and method for storing energy and purifying fluid
WO2014036476A3 (en) * 2012-08-31 2014-04-24 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University System and method for storing energy
US20140090824A1 (en) * 2012-09-28 2014-04-03 Behr Gmbh & Co. Kg Apparatus for conducting a fluid
US10222137B2 (en) * 2012-09-28 2019-03-05 Mahle International Gmbh Apparatus for conducting a fluid
US20150377562A1 (en) * 2013-06-27 2015-12-31 Dana Canada Corporation Fluid channels having performance enhancement features and devices incorporating same
US20150189789A1 (en) * 2013-12-30 2015-07-02 Samsung Display Co., Ltd. Heat radiation member for electronic device
US10088239B2 (en) * 2015-05-28 2018-10-02 Hamilton Sundstrand Corporation Heat exchanger with improved flow at mitered corners
US20160348980A1 (en) * 2015-05-28 2016-12-01 Hamilton Sundstrand Corporation Heat exchanger with improved flow at mitered corners
CN106705701A (en) * 2015-08-18 2017-05-24 珠海格力节能环保制冷技术研究中心有限公司 Heat dissipater and manufacturing method thereof
US20170186667A1 (en) * 2015-12-26 2017-06-29 Intel Corporation Cooling of electronics using folded foil microchannels
US20170234627A1 (en) * 2016-02-16 2017-08-17 Omron Automotive Electronics Co., Ltd. Cooler and flow path unit
CN111477997A (en) * 2020-03-25 2020-07-31 安徽沃博源科技有限公司 Liquid cooling plate and liquid cooling device
CN111477997B (en) * 2020-03-25 2022-01-11 安徽沃博源科技有限公司 Liquid cooling plate and liquid cooling device
DE102021208579A1 (en) 2021-08-06 2023-02-09 Zf Friedrichshafen Ag Transmission for a motor vehicle

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BE681699A (en) 1966-10-31

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