GB1114066A - An improved cooling plate - Google Patents

An improved cooling plate

Info

Publication number
GB1114066A
GB1114066A GB21564/66A GB2156466A GB1114066A GB 1114066 A GB1114066 A GB 1114066A GB 21564/66 A GB21564/66 A GB 21564/66A GB 2156466 A GB2156466 A GB 2156466A GB 1114066 A GB1114066 A GB 1114066A
Authority
GB
United Kingdom
Prior art keywords
cooling plate
cooling
plates
strip
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB21564/66A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trane Co
Original Assignee
Trane Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trane Co filed Critical Trane Co
Publication of GB1114066A publication Critical patent/GB1114066A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0062—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements
    • F28D9/0068—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements with means for changing flow direction of one heat exchange medium, e.g. using deflecting zones
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

1,114,066. Heat exchange plate. TRANE CO. 16 May, 1966 [24 Oct., 1965], No. 21564/66, Heading F4S. A cooling plate 10, suitable for cooling a plurality of electronic components 18, comprises first and second aluminium plates, 12 and 14 resp., spaced apart and sealably connected along their edges by a metallic strip 13 so defining therebetween a fluid conducting space 15, each of said plates having four rows 16 of apertures 32 which are in alignment both with one another and with the bores 30 of aluminium columns 20 extending between said plates. A stud (60), to one end of which the component to be cooled is attached, passes through the cooling plate 10 to be engaged by a nut, (62, Fig. 2), thus ensuring good thermal contact between the cooling plate and component, the column 20 preventing stress deformation of said cooling plate. Disposed within the fluid conducting space 15 is a single piece of fin packing 34 comprising a corrugated and perforated metallic sheet said packing having apertures 38 for concentrically receiving columns 20 with a space 40 being left therebetween. An imperforate separating strip 42 extends between each adjacent pair of columns 20 of each row 16 of cooling sites, the opposite ends of adjacent rows having a further imperforate strip 44 extending from the end column of a row to a sealing strip 13a; Cooling fluid, supplied through duct 46, is thus caused to take a serpentine path, indicated by the heavy broken arrows, before entering the outlet duct 48, the space 40 between the packing and each column ensuring a complete flushing of the latter. During assembly, the contact surfaces of all components of the cooling plate are covered with a brazing alloy so that on heating of said plates bonding between components is achieved.
GB21564/66A 1965-10-24 1966-05-16 An improved cooling plate Expired GB1114066A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US504895A US3327776A (en) 1965-10-24 1965-10-24 Heat exchanger

Publications (1)

Publication Number Publication Date
GB1114066A true GB1114066A (en) 1968-05-15

Family

ID=24008162

Family Applications (1)

Application Number Title Priority Date Filing Date
GB21564/66A Expired GB1114066A (en) 1965-10-24 1966-05-16 An improved cooling plate

Country Status (3)

Country Link
US (1) US3327776A (en)
BE (1) BE681699A (en)
GB (1) GB1114066A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0296019A1 (en) * 1987-06-16 1988-12-21 Thomson-Csf Support for a printed circuit forming a heat sink with a controlled dilatation, and manufacturing process
WO1990007255A1 (en) * 1988-12-14 1990-06-28 Cray Research, Inc. Cooling plate with interboard connector apertures
FR2681757A1 (en) * 1991-09-24 1993-03-26 Behr Industrietechnik Gmbh Co COOLING DEVICE FOR ELECTRICAL COMPONENTS.
EP2610908B1 (en) * 2010-08-23 2021-05-05 Sanoh Industrial Co., Ltd. Cooling device

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US3650310A (en) * 1970-07-16 1972-03-21 Stewart & Stevenson Serv Inc Combination boat trim tab and heat exchanger
US3865183A (en) * 1973-10-23 1975-02-11 Control Data Corp Cooling systems for electronic modules
US4085728A (en) * 1976-08-16 1978-04-25 Tomchak Sigfrid A Solar energy heater
US4170220A (en) * 1976-10-29 1979-10-09 Smith Henry C Solar heat collector
JPS6138237Y2 (en) * 1978-11-17 1986-11-05
US4519447A (en) * 1980-08-04 1985-05-28 Fine Particle Technology Corporation Substrate cooling
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
US4478277A (en) * 1982-06-28 1984-10-23 The Trane Company Heat exchanger having uniform surface temperature and improved structural strength
US4631635A (en) * 1984-10-31 1986-12-23 The United States Of America As Represented By The Secretary Of The Air Force Vibration isolated cold plate assembly
US4697427A (en) * 1985-05-10 1987-10-06 Sundstrand Corporation Forced flow evaporator for unusual gravity conditions
US4753290A (en) * 1986-07-18 1988-06-28 Unisys Corporation Reduced-stress heat sink device
US4938280A (en) * 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
US4922573A (en) * 1989-04-14 1990-05-08 Grumman Aerospace Corporation Compression fitted bushing installation
US5275235A (en) * 1989-07-28 1994-01-04 Cesaroni Anthony Joseph Panel heat exchanger
JPH0652747B2 (en) * 1990-02-05 1994-07-06 インターナショナル・ビジネス・マシーンズ・コーポレイション Heat insulation device
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5269146A (en) * 1990-08-28 1993-12-14 Kerner James M Thermoelectric closed-loop heat exchange system
US5245693A (en) * 1991-03-15 1993-09-14 In-Touch Products Co. Parenteral fluid warmer apparatus and disposable cassette utilizing thin, flexible heat-exchange membrane
US5381510A (en) * 1991-03-15 1995-01-10 In-Touch Products Co. In-line fluid heating apparatus with gradation of heat energy from inlet to outlet
GB9211413D0 (en) * 1992-05-29 1992-07-15 Cesaroni Anthony Joseph Panel heat exchanger formed from tubes and sheets
US5343359A (en) * 1992-11-19 1994-08-30 Cray Research, Inc. Apparatus for cooling daughter boards
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5737387A (en) * 1994-03-11 1998-04-07 Arch Development Corporation Cooling for a rotating anode X-ray tube
JP3158983B2 (en) * 1994-10-03 2001-04-23 住友精密工業株式会社 Corrugated radiator fin for cooling LSI package
US5638900A (en) * 1995-01-27 1997-06-17 Ail Research, Inc. Heat exchange assembly
US6305463B1 (en) * 1996-02-22 2001-10-23 Silicon Graphics, Inc. Air or liquid cooled computer module cold plate
US5804761A (en) * 1996-05-02 1998-09-08 Chrysler Corporation Water cooled DC bus structure
US6047108A (en) * 1996-10-01 2000-04-04 Baxter International Inc. Blood warming apparatus
US5846224A (en) * 1996-10-01 1998-12-08 Baxter International Inc. Container for use with blood warming apparatus
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
JP3479477B2 (en) * 1999-12-16 2003-12-15 Ｓｍｃ株式会社 Heat exchanger for temperature controller
JP4312339B2 (en) * 2000-02-24 2009-08-12 ナブテスコ株式会社 Heat transfer device with meandering passage
EP1148772B1 (en) * 2000-04-19 2009-12-23 Thermal Form & Function Inc. Cold plate utilizing fin with evaporating refrigerant
JP2002098454A (en) * 2000-07-21 2002-04-05 Mitsubishi Materials Corp Liquid-cooled heat sink and its manufacturing method
JP2002046482A (en) * 2000-07-31 2002-02-12 Honda Motor Co Ltd Heat sink type cooling device
US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US7134484B2 (en) * 2000-12-07 2006-11-14 International Business Machines Corporation Increased efficiency in liquid and gaseous planar device cooling technology
DE10125636B4 (en) * 2001-05-25 2004-03-25 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Cooler for electrical and / or electronic components
US20040182544A1 (en) * 2002-12-27 2004-09-23 Lee Hsieh Kun Cooling device utilizing liquid coolant
US7111674B2 (en) * 2003-08-06 2006-09-26 Fujitsu Limited Heat dissipating housing with interlocking chamfers and ESD resistance
JP2005106389A (en) * 2003-09-30 2005-04-21 Zexel Valeo Climate Control Corp Heat exchange tube
JP4234621B2 (en) * 2004-02-16 2009-03-04 株式会社日立製作所 Liquid cooling system and electronic device
US6843310B1 (en) * 2004-03-03 2005-01-18 Chin-Ping Chen Semi-closed air cooling type radiator
US7307475B2 (en) * 2004-05-28 2007-12-11 Ixys Corporation RF generator with voltage regulator
FI117590B (en) * 2004-06-11 2006-11-30 Abb Oy Heat Sink
US20060118279A1 (en) * 2004-12-07 2006-06-08 Eric Stafford Water cooling system for computer components
JP4333587B2 (en) * 2005-01-14 2009-09-16 三菱電機株式会社 Heat sink and cooling unit
US20060175043A1 (en) * 2005-02-07 2006-08-10 Hung-Tao Peng Temperature conductor and method of making same
JP2006286767A (en) * 2005-03-31 2006-10-19 Hitachi Ltd Cooling jacket
DE102005034998B4 (en) * 2005-07-27 2016-06-23 Behr Industry Gmbh & Co. Kg Method for producing a device for cooling electronic components and device for cooling electronic components
US7757752B2 (en) * 2006-05-12 2010-07-20 Seiko Epson Corporation Heat exchanger, light source apparatus, and projector
TWM311234U (en) * 2006-08-02 2007-05-01 Man Zai Ind Co Ltd Water-cooling base
DE102006041788B4 (en) * 2006-09-06 2012-06-14 Airbus Operations Gmbh An aircraft electronics cooling device for an aircraft with a liquid cooling system
WO2008067429A2 (en) * 2006-11-29 2008-06-05 Raytheon Company Multi-orientation single or two phase coldplate with positive flow characteristics
US9743563B2 (en) 2007-03-20 2017-08-22 Conti Temic Microelectronic Gmbh Control appliance for using in the engine compartment or in the transmission of a motor vehicle and cooling system for such a control appliance
DE112008000230A5 (en) * 2007-03-20 2009-10-15 Conti Temic Microelectronic Gmbh Control unit for use in the engine compartment or in the transmission of a motor vehicle and cooling arrangement for such a control unit
JP4967988B2 (en) * 2007-10-25 2012-07-04 株式会社豊田自動織機 Semiconductor cooling device
US20100002392A1 (en) * 2008-07-07 2010-01-07 I-Ming Liu Assembled Heat Sink Structure
US20100147289A1 (en) * 2008-12-16 2010-06-17 Yan Krzysztof Kunczynski Solar Water Heater
US20100147290A1 (en) * 2008-12-16 2010-06-17 Yan Krzysztof Kunczynski Solar Water Heater
JP4737294B2 (en) * 2009-01-08 2011-07-27 トヨタ自動車株式会社 Heat dissipation device, power module, and method of manufacturing heat dissipation device
KR101289313B1 (en) * 2009-05-22 2013-07-24 엘에스산전 주식회사 Water-cooling type cooler and inverter having the same
US8991478B2 (en) * 2010-03-29 2015-03-31 Hamilton Sundstrand Space Systems International, Inc. Compact two sided cold plate with transfer tubes
JP5716825B2 (en) * 2011-05-12 2015-05-13 トヨタ自動車株式会社 Cooler and method for manufacturing cooler
WO2014036476A2 (en) * 2012-08-31 2014-03-06 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University System and method for storing energy and purifying fluid
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CA2914453A1 (en) * 2013-06-27 2014-12-31 Dana Canada Corporation Fluid channels having performance enhancement features and devices incorporating same
KR20150077673A (en) * 2013-12-30 2015-07-08 삼성디스플레이 주식회사 Heat radiation member for electronic device
US10088239B2 (en) * 2015-05-28 2018-10-02 Hamilton Sundstrand Corporation Heat exchanger with improved flow at mitered corners
CN106705701A (en) * 2015-08-18 2017-05-24 珠海格力节能环保制冷技术研究中心有限公司 Heat dissipater and manufacturing method thereof
US20170186667A1 (en) * 2015-12-26 2017-06-29 Intel Corporation Cooling of electronics using folded foil microchannels
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0296019A1 (en) * 1987-06-16 1988-12-21 Thomson-Csf Support for a printed circuit forming a heat sink with a controlled dilatation, and manufacturing process
FR2616997A1 (en) * 1987-06-16 1988-12-23 Thomson Csf SUPPORT FOR PRINTED CIRCUIT, FORMING THERMAL DRAIN WITH CONTROLLED EXPANSION, AND METHOD OF MANUFACTURE
US4878152A (en) * 1987-06-16 1989-10-31 Thomson-Csf Mounting for printed circuits forming a heat sink with controlled expansion
AU603450B2 (en) * 1987-06-16 1990-11-15 Thomson-Csf Mounting for printed circuit forming a heat sink with controlled expansion
WO1990007255A1 (en) * 1988-12-14 1990-06-28 Cray Research, Inc. Cooling plate with interboard connector apertures
FR2681757A1 (en) * 1991-09-24 1993-03-26 Behr Industrietechnik Gmbh Co COOLING DEVICE FOR ELECTRICAL COMPONENTS.
EP2610908B1 (en) * 2010-08-23 2021-05-05 Sanoh Industrial Co., Ltd. Cooling device

Also Published As

Publication number Publication date
US3327776A (en) 1967-06-27
BE681699A (en) 1966-10-31

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