US20080029260A1 - Liquid cooled heat sink - Google Patents
Liquid cooled heat sink Download PDFInfo
- Publication number
- US20080029260A1 US20080029260A1 US11/701,022 US70102207A US2008029260A1 US 20080029260 A1 US20080029260 A1 US 20080029260A1 US 70102207 A US70102207 A US 70102207A US 2008029260 A1 US2008029260 A1 US 2008029260A1
- Authority
- US
- United States
- Prior art keywords
- casing
- heat sink
- cooled heat
- liquid
- fluid paths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
- F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a liquid cooled heat sink, more particularly to a liquid cooled heat sink including a fin unit having a wave-like structure of a multi-fold sheet.
- a conventional liquid cooled heat sink 1 generally includes a base 11 made from an aluminum alloy extrudate, a cover 12 for covering the base 11 , a pair of parallel side partition plates 13 , and a middle partition plate 14 disposed between the base 11 and the cover 12 .
- the base 11 includes a bottom wall 111 , a plurality of first and second side partition walls 112 extending uprightly from the bottom wall 111 , a plurality of middle partition walls 113 extending uprightly from the bottom wall 111 and disposed between the first and second side partition walls 112 , and an attaching protrusion 114 extending from the bottom wall 111 for attaching to an electronic component 15 (see FIG. 2 ).
- the area of the bottom wall 111 is larger than that of the attaching protrusion 114 for increasing the heat dissipating area.
- the length of each of the side partition walls 112 is shorter than that of the middle partition walls 113 .
- the side partition walls 112 have respectively rear edges that are aligned with rear edges of the middle partition walls 113 and that are spaced apart from a rear edge of the bottom wall 111 .
- the side partition walls 112 further have front edges that are disposed farther from a front edge of the bottom wall 111 than front edges of the middle partition walls 113 .
- the cover 12 is also made from an aluminum alloy extrudate, and includes a top wall 121 , a surrounding wall 122 extending downwardly from a periphery of the top wall 121 , and a flange wall 123 extending outwardly and transversely from the surrounding wall 122 .
- the top wall 121 is formed with a pair of through-holes 124 .
- a pair of conduits 16 extend respectively from peripheries of the through-holes 124 .
- the side and middle partition plates 13 , 14 are also made from an aluminum alloy extrudate, and are secured to the base 11 and the cover 12 .
- Each of the side partition plates 13 is disposed between an adjacent one of the first side partition walls 112 and an adjacent one of the middle partition walls 113 , and has a front edge connected to the cover 12 .
- the middle partition plate 14 is disposed at a middle position in the middle partition walls 113 , and has a rear edge connected to the cover 12 . In such a manner, a torturous fluid path 17 interconnecting the through-holes 124 is formed.
- heat generated by the electronic component 15 is conducted to the base 11 , and is then carried by the coolant along the fluid path 17 in directions as indicated by the arrow shown in FIG. 3 .
- the bottom wall 111 , the side partition walls 112 , the middle partition walls 113 , and the attaching protrusion 114 are integrally formed by extruding an aluminum alloy material.
- Each of the side and middle partition walls 112 , 113 is cut so as to have a desired length.
- the attaching protrusion 114 is cut so as to have a desired size that is suitable for attaching to the electronic component 15 .
- each of the side and middle partition walls 112 , 113 is relatively thick. As a consequence, the overall contact area between the side and middle partition walls 112 , 113 and the coolant is limited, thereby limiting the heat dissipating efficiency of the conventional heat sink 1 .
- the object of the present invention is to provide a liquid cooled heat sink that can overcome the aforesaid disadvantage associated with the prior art.
- a liquid cooled heat sink of the present invention is adapted to be attached to an electronic component and comprises: a casing having a liquid inlet and a liquid outlet; and a fin unit provided in the casing and having a wave-like structure of a multi-fold sheet that defines a plurality of fluid paths which are aligned in series in a transverse direction relative to the fluid paths.
- the liquid inlet of the casing is in fluid communication with the liquid outlet of the casing through the fluid paths.
- FIG. 1 is an exploded perspective view of a conventional liquid cooled heat sink
- FIG. 2 is a schematic sectional side view of the conventional liquid cooled heat sink
- FIG. 3 is a schematic sectional top view of the conventional liquid cooled heat sink
- FIGS. 4A to 4D are perspective views to illustrate consecutive steps for manufacturing the conventional liquid cooled heat sink
- FIG. 5 is an exploded perspective view of the first preferred embodiment of a liquid cooled heat sink according to the present invention.
- FIG. 6 is a sectional side view of the first preferred embodiment
- FIG. 7 is a sectional top view of the first preferred embodiment
- FIGS. 8A to 8D are perspective views to illustrate consecutive steps for manufacturing the first preferred embodiment
- FIG. 9 is an exploded perspective view of the second preferred embodiment of a liquid cooled heat sink according to the present invention.
- FIG. 10 is a sectional top view of the third preferred embodiment of a liquid cooled heat sink according to the present invention.
- the first preferred embodiment of a liquid cooled heat sink according to the present invention is shown to be attached to an electronic component 5 for absorbing heat generated by the electronic component 5 .
- the liquid cooled heat sink includes: a casing having a liquid inlet 421 and a liquid outlet 422 ; and at least one fin unit 3 provided in the casing and having a wave-like structure of a multi-fold sheet 3 ′ that defines a plurality of fluid paths 30 which are aligned in series in a transverse direction relative to the fluid paths 30 .
- the liquid inlet 421 of the casing is in fluid communication with the liquid outlet 422 of the casing through the fluid paths 30 .
- two of the fin units 3 are provided in the casing.
- Each of the fluid paths 30 is defined by a path-defining wall 31 that is generally U-shaped and that has two opposite straight wall portions 313 and a folded portion 315 interconnecting the straight wall portions 313 . Moreover, each of the straight wall portions 313 of the path-defining wall 31 of each of the fluid paths 30 is formed with a plurality of slits 311 so as to permit fluid communication between each two adjacent ones of the fluid paths. 30 .
- the casing has a base 2 that is formed with an attaching protrusion 24 adapted to be attached to the electronic component 5 for absorbing heat from the electronic component 5 .
- the casing is made from an aluminum alloy extrudate, and the fin units 3 are mounted in the casing.
- the fin units 3 can be fixed to (e.g., by welding techniques) or detachably secured to the casing.
- the base 2 includes a bottom wall 21 , a pair of side walls 22 extending uprightly and respectively from lateral edges of the bottom wall 21 , and a partition wall 23 extending uprightly from the bottom wall 21 , disposed between and parallel to the side walls 22 , and dividing a space between the side walls 22 into two chambers 25 .
- the fin units 3 are respectively disposed in the chambers 25 .
- the partition wall 23 has a rear edge spaced apart from a rear edge of the bottom wall 21 . In practice, a plurality of the partition walls 23 can be employed.
- the multi-fold sheet 3 ′ of each fin unit 3 is made from an aluminum alloy foil.
- the casing further includes a cover 4 of aluminum alloy that covers the base 2 and that is connected to an external cooling device (not shown).
- the cover 4 includes a top wall 41 disposed opposite to the bottom wall 21 of the base 2 , and a pair of lateral walls 42 extending downwardly from opposite lateral edges of the top wall 21 to connect with the bottom wall 21 and the side walls 22 .
- the liquid inlet 421 and the liquid outlet 422 of the casing are formed in one of the lateral walls 42 and are provided with inlet and outlet conduits 61 , 62 for connecting to the external cooling device.
- the partition wall 23 is connected to said one of the lateral walls 42 of the cover 4 so as to form the chambers 25 into a tortuous fluid path.
- the liquid inlet 421 and the liquid outlet 422 of the casing can be formed on the top wall 41 of the cover 4 .
- the base 2 which includes the bottom wall 21 , the side walls 22 , the partition wall 23 , and the attaching protrusion 24 , is extruded from an aluminum alloy material.
- the middle partition wall 23 is cut into a desired length.
- Each fin unit 3 folded and punched from an aluminum alloy foil is disposed in the respective chamber 25 and is soldered to the bottom wall 21 .
- the second preferred embodiment of this invention differs from the previous embodiment in that: since the heat sink has a much smaller size, the partition wall 23 is dispensed with and only one chamber 25 is formed in the casing.
- the inlet and outlet conduits 61 , 62 of the casing are respectively formed in the lateral walls 42 of the cover 4 .
- the third preferred embodiment of this invention differs from the previous embodiments in that: the partition wall 23 is disposed on the bottom wall 21 such that the width of one of the chambers 25 in the transverse direction transverse to the fluid paths 30 is wider than that of the other.
- the liquid inlet 421 of the casing is in fluid communication with said one of the chambers 25 having the larger width, and the liquid outlet 422 of the casing is in fluid communication with the other of the chambers 25 . As such, the pressure drop of the fluid flow between the liquid inlet 421 and the liquid outlet 422 can be reduced.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A liquid cooled heat sink includes: a casing having a liquid inlet and a liquid outlet; and a fin unit provided in the casing and having a wave-like structure of a multi-fold sheet that defines a plurality of fluid paths which are aligned in series in a transverse direction relative to the fluid paths. The liquid inlet of the casing is in fluid communication with the liquid outlet of the casing through the fluid paths.
Description
- 1. Field of the Invention
- The invention relates to a liquid cooled heat sink, more particularly to a liquid cooled heat sink including a fin unit having a wave-like structure of a multi-fold sheet.
- 2. Description of the Related Art
- As shown in
FIGS. 1 , 2 and 3, a conventional liquid cooled heat sink 1 generally includes abase 11 made from an aluminum alloy extrudate, acover 12 for covering thebase 11, a pair of parallelside partition plates 13, and amiddle partition plate 14 disposed between thebase 11 and thecover 12. Thebase 11 includes abottom wall 111, a plurality of first and secondside partition walls 112 extending uprightly from thebottom wall 111, a plurality ofmiddle partition walls 113 extending uprightly from thebottom wall 111 and disposed between the first and secondside partition walls 112, and an attachingprotrusion 114 extending from thebottom wall 111 for attaching to an electronic component 15 (seeFIG. 2 ). The area of thebottom wall 111 is larger than that of the attachingprotrusion 114 for increasing the heat dissipating area. The length of each of theside partition walls 112 is shorter than that of themiddle partition walls 113. Theside partition walls 112 have respectively rear edges that are aligned with rear edges of themiddle partition walls 113 and that are spaced apart from a rear edge of thebottom wall 111. Theside partition walls 112 further have front edges that are disposed farther from a front edge of thebottom wall 111 than front edges of themiddle partition walls 113. - The
cover 12 is also made from an aluminum alloy extrudate, and includes atop wall 121, a surroundingwall 122 extending downwardly from a periphery of thetop wall 121, and aflange wall 123 extending outwardly and transversely from the surroundingwall 122. Thetop wall 121 is formed with a pair of through-holes 124. A pair ofconduits 16 extend respectively from peripheries of the through-holes 124. - The side and
middle partition plates base 11 and thecover 12. Each of theside partition plates 13 is disposed between an adjacent one of the firstside partition walls 112 and an adjacent one of themiddle partition walls 113, and has a front edge connected to thecover 12. Themiddle partition plate 14 is disposed at a middle position in themiddle partition walls 113, and has a rear edge connected to thecover 12. In such a manner, atorturous fluid path 17 interconnecting the through-holes 124 is formed. - When the conventional heat sink 1 is in use, heat generated by the
electronic component 15 is conducted to thebase 11, and is then carried by the coolant along thefluid path 17 in directions as indicated by the arrow shown inFIG. 3 . - With reference to
FIG. 4 , manufacturing of the conventional heat sink 1 is described as below: - (1) The
bottom wall 111, theside partition walls 112, themiddle partition walls 113, and the attachingprotrusion 114 are integrally formed by extruding an aluminum alloy material. - (2) Each of the side and
middle partition walls - (3) The attaching
protrusion 114 is cut so as to have a desired size that is suitable for attaching to theelectronic component 15. - (4) The side and
middle partition plates bottom wall 111. - Since the
base 11 is made from an aluminum alloy extrudate, each of the side andmiddle partition walls middle partition walls - Therefore, the object of the present invention is to provide a liquid cooled heat sink that can overcome the aforesaid disadvantage associated with the prior art.
- Accordingly, a liquid cooled heat sink of the present invention is adapted to be attached to an electronic component and comprises: a casing having a liquid inlet and a liquid outlet; and a fin unit provided in the casing and having a wave-like structure of a multi-fold sheet that defines a plurality of fluid paths which are aligned in series in a transverse direction relative to the fluid paths. The liquid inlet of the casing is in fluid communication with the liquid outlet of the casing through the fluid paths.
- Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, of which:
-
FIG. 1 is an exploded perspective view of a conventional liquid cooled heat sink; -
FIG. 2 is a schematic sectional side view of the conventional liquid cooled heat sink; -
FIG. 3 is a schematic sectional top view of the conventional liquid cooled heat sink; -
FIGS. 4A to 4D are perspective views to illustrate consecutive steps for manufacturing the conventional liquid cooled heat sink; -
FIG. 5 is an exploded perspective view of the first preferred embodiment of a liquid cooled heat sink according to the present invention; -
FIG. 6 is a sectional side view of the first preferred embodiment; -
FIG. 7 is a sectional top view of the first preferred embodiment; -
FIGS. 8A to 8D are perspective views to illustrate consecutive steps for manufacturing the first preferred embodiment; -
FIG. 9 is an exploded perspective view of the second preferred embodiment of a liquid cooled heat sink according to the present invention; and -
FIG. 10 is a sectional top view of the third preferred embodiment of a liquid cooled heat sink according to the present invention. - Before the present invention is described in greater detail with reference to the accompanying preferred embodiments, it should be noted herein that like elements are denoted by the same reference numerals throughout the disclosure.
- Referring to
FIGS. 5 to 7 , the first preferred embodiment of a liquid cooled heat sink according to the present invention is shown to be attached to anelectronic component 5 for absorbing heat generated by theelectronic component 5. - The liquid cooled heat sink includes: a casing having a
liquid inlet 421 and aliquid outlet 422; and at least onefin unit 3 provided in the casing and having a wave-like structure of amulti-fold sheet 3′ that defines a plurality offluid paths 30 which are aligned in series in a transverse direction relative to thefluid paths 30. Theliquid inlet 421 of the casing is in fluid communication with theliquid outlet 422 of the casing through thefluid paths 30. In this embodiment, two of thefin units 3 are provided in the casing. - Each of the
fluid paths 30 is defined by a path-definingwall 31 that is generally U-shaped and that has two oppositestraight wall portions 313 and a foldedportion 315 interconnecting thestraight wall portions 313. Moreover, each of thestraight wall portions 313 of the path-definingwall 31 of each of thefluid paths 30 is formed with a plurality ofslits 311 so as to permit fluid communication between each two adjacent ones of the fluid paths.30. - The casing has a
base 2 that is formed with an attachingprotrusion 24 adapted to be attached to theelectronic component 5 for absorbing heat from theelectronic component 5. - In this embodiment, the casing is made from an aluminum alloy extrudate, and the
fin units 3 are mounted in the casing. Note that thefin units 3 can be fixed to (e.g., by welding techniques) or detachably secured to the casing. - The
base 2 includes abottom wall 21, a pair ofside walls 22 extending uprightly and respectively from lateral edges of thebottom wall 21, and apartition wall 23 extending uprightly from thebottom wall 21, disposed between and parallel to theside walls 22, and dividing a space between theside walls 22 into twochambers 25. Thefin units 3 are respectively disposed in thechambers 25. Thepartition wall 23 has a rear edge spaced apart from a rear edge of thebottom wall 21. In practice, a plurality of thepartition walls 23 can be employed. - In this embodiment, the
multi-fold sheet 3′ of eachfin unit 3 is made from an aluminum alloy foil. - The casing further includes a
cover 4 of aluminum alloy that covers thebase 2 and that is connected to an external cooling device (not shown). Thecover 4 includes atop wall 41 disposed opposite to thebottom wall 21 of thebase 2, and a pair oflateral walls 42 extending downwardly from opposite lateral edges of thetop wall 21 to connect with thebottom wall 21 and theside walls 22. Theliquid inlet 421 and theliquid outlet 422 of the casing are formed in one of thelateral walls 42 and are provided with inlet andoutlet conduits partition wall 23 is connected to said one of thelateral walls 42 of thecover 4 so as to form thechambers 25 into a tortuous fluid path. Alternatively, theliquid inlet 421 and theliquid outlet 422 of the casing can be formed on thetop wall 41 of thecover 4. - In use, the attaching
protrusion 24 is attached to theelectronic component 5 so that heat generated by theelectronic component 5 is conducted to thebottom wall 21 of thebase 2 and thefin units 3, and is then carried by the coolant along thefluid paths 30 in directions as indicated by the arrow signs inFIG. 7 to be transferred to the external cooling device for heat dissipation. It should be noted that the structure of the heat sink of this invention can be varied based on actual requirements, such as a horizontal or vertical position relative to theelectronic component 5. - With reference to
FIG. 8 , manufacturing of the heat sink is described as below: - (1) The
base 2, which includes thebottom wall 21, theside walls 22, thepartition wall 23, and the attachingprotrusion 24, is extruded from an aluminum alloy material. - (2) The
middle partition wall 23 is cut into a desired length. - (3) The attaching
protrusion 24 is then cut into a desired size. - (4) Each
fin unit 3 folded and punched from an aluminum alloy foil is disposed in therespective chamber 25 and is soldered to thebottom wall 21. - As shown in
FIG. 9 , the second preferred embodiment of this invention differs from the previous embodiment in that: since the heat sink has a much smaller size, thepartition wall 23 is dispensed with and only onechamber 25 is formed in the casing. In this embodiment, the inlet andoutlet conduits lateral walls 42 of thecover 4. - As shown in
FIG. 10 , the third preferred embodiment of this invention differs from the previous embodiments in that: thepartition wall 23 is disposed on thebottom wall 21 such that the width of one of thechambers 25 in the transverse direction transverse to thefluid paths 30 is wider than that of the other. Theliquid inlet 421 of the casing is in fluid communication with said one of thechambers 25 having the larger width, and theliquid outlet 422 of the casing is in fluid communication with the other of thechambers 25. As such, the pressure drop of the fluid flow between theliquid inlet 421 and theliquid outlet 422 can be reduced. - With the inclusion of the fin unit(s) 3 in the heat sink of this invention, the aforesaid drawback associated with the prior art can be eliminated.
- While the present invention has been described in connection with what are considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Claims (5)
1. A liquid cooled heat sink adapted to be attached to an electronic component, said liquid cooled heat sink comprising:
a casing having a liquid inlet and a liquid outlet; and
a fin unit provided in said casing and having a wave-like structure of a multi-fold sheet that defines a plurality of fluid paths which are aligned in series in a transverse direction relative to said fluid paths;
wherein said liquid inlet of said casing is in fluid communication with said liquid outlet of said casing through said fluid paths.
2. The liquid cooled heat sink as claimed in claim 1 , wherein each of said fluid paths is defined by a path-defining wall that is generally U-shaped and that has two opposite straight wall portions and a folded portion interconnecting said straight wall portions, each of said straight wall portions of said path-defining wall of each of said fluid paths being formed with a plurality of slits so as to permit fluid communication between each two adjacent ones of said fluid paths.
3. The liquid cooled heat sink as claimed in claim 1 , wherein said casing has a base that is formed with an attaching protrusion adapted to be attached to the electronic component.
4. The liquid cooled heat sink as claimed in claim 1 , wherein said casing is made from an aluminum alloy extrudate.
5. The liquid cooled heat sink as claimed in claim 1 , wherein said fin unit is detachably mounted in said casing.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095213611 | 2006-08-02 | ||
TW095213611U TWM311234U (en) | 2006-08-02 | 2006-08-02 | Water-cooling base |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080029260A1 true US20080029260A1 (en) | 2008-02-07 |
Family
ID=38742372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/701,022 Abandoned US20080029260A1 (en) | 2006-08-02 | 2007-01-31 | Liquid cooled heat sink |
Country Status (2)
Country | Link |
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US (1) | US20080029260A1 (en) |
TW (1) | TWM311234U (en) |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090040723A1 (en) * | 2007-08-06 | 2009-02-12 | Man Zai Industrial Co., Ltd. | Heat-dissipating device with high heat-dissipating efficiency |
US20140305619A1 (en) * | 2013-04-11 | 2014-10-16 | Solid State Cooling Systems | High efficiency thermal transfer plate |
WO2016040546A1 (en) * | 2014-09-11 | 2016-03-17 | Chen, Chung-Chin | Thermal energy exchanger for bathing shower water |
FR3030708A1 (en) * | 2014-12-22 | 2016-06-24 | Airbus Operations Sas | COLD PLATE, IN PARTICULAR A STRUCTURAL PART OF A HEAT-GENERATING COMPONENT EQUIPMENT |
US20160216048A1 (en) * | 2015-01-28 | 2016-07-28 | Cooler Master Co., Ltd. | Liquid cooling heat sink structure and cooling circulation system thereof |
US20170051986A1 (en) * | 2014-10-02 | 2017-02-23 | E E T Energie-Effizienz Technologie GmbH | Heat exchanger |
US10314203B1 (en) * | 2018-05-10 | 2019-06-04 | Juniper Networks, Inc | Apparatuses, systems, and methods for cooling electronic components |
US20190239389A1 (en) * | 2016-09-23 | 2019-08-01 | Sumitomo Precision Products Co., Ltd. | Cooling Device |
US10409341B2 (en) | 2016-02-15 | 2019-09-10 | Cooler Master Co., Ltd. | Cooling apparatus |
US10443960B2 (en) * | 2017-08-02 | 2019-10-15 | Man Zai Industrial Co., Ltd. | Phase change material evaporator and heat dissipating apparatus using the same |
US20190364694A1 (en) * | 2018-05-24 | 2019-11-28 | Coretronic Corporation | Liquid-cooling device |
US10509446B2 (en) | 2015-12-30 | 2019-12-17 | Cooler Master Co., Ltd. | Cooling apparatus for electronic components |
US10542636B2 (en) * | 2014-12-05 | 2020-01-21 | International Business Machines Corporation | Cooling structure for electronic boards |
US20200079178A1 (en) * | 2018-09-06 | 2020-03-12 | Robert Bosch Gmbh | Sensor unit of a vehicle |
US10739084B2 (en) | 2015-01-28 | 2020-08-11 | Cooler Master Co., Ltd. | Liquid cooling heat sink structure and cooling circulation system thereof |
US10834847B1 (en) * | 2018-03-26 | 2020-11-10 | Juniper Networks, Inc | Apparatus, system, and method for increasing the cooling efficiency of cold plate devices |
US10975876B2 (en) | 2019-04-19 | 2021-04-13 | Cooler Master Co., Ltd. | Cooling device |
US10976116B2 (en) * | 2018-05-28 | 2021-04-13 | Coretronic Corporation | Liquid cooled heat dissipation device |
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US11160191B2 (en) * | 2019-05-10 | 2021-10-26 | Cooler Master Co., Ltd. | Flow-rate adjustment component and liquid cooling device |
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US11402157B2 (en) * | 2016-09-02 | 2022-08-02 | Acer Incorporated | Lattice boiler evaporator |
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US20220408589A1 (en) * | 2021-06-16 | 2022-12-22 | Inventec (Pudong) Technology Corporation | Liquid-cooling heat sink |
US20230180430A1 (en) * | 2020-09-14 | 2023-06-08 | Shenzhen Microbt Electronics Technology Co., Ltd. | Liquid cooling plate radiator and computing device |
US12099385B2 (en) | 2022-04-25 | 2024-09-24 | Cooler Master Co., Ltd. | Cooling apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3327776A (en) * | 1965-10-24 | 1967-06-27 | Trane Co | Heat exchanger |
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
US6305463B1 (en) * | 1996-02-22 | 2001-10-23 | Silicon Graphics, Inc. | Air or liquid cooled computer module cold plate |
US6508301B2 (en) * | 2000-04-19 | 2003-01-21 | Thermal Form & Function | Cold plate utilizing fin with evaporating refrigerant |
US6615910B1 (en) * | 2002-02-20 | 2003-09-09 | Delphi Technologies, Inc. | Advanced air cooled heat sink |
US6648062B2 (en) * | 2000-07-31 | 2003-11-18 | Honda Giken Kogyo Kabushiki Kaisha | Heat sink-type cooling device |
US6719039B2 (en) * | 2000-11-21 | 2004-04-13 | Thermal Corp. | Liquid cooled heat exchanger with enhanced flow |
US6729389B2 (en) * | 2000-02-24 | 2004-05-04 | Sts Corporation | Heat transfer apparatus with zigzag passage |
-
2006
- 2006-08-02 TW TW095213611U patent/TWM311234U/en not_active IP Right Cessation
-
2007
- 2007-01-31 US US11/701,022 patent/US20080029260A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3327776A (en) * | 1965-10-24 | 1967-06-27 | Trane Co | Heat exchanger |
US6305463B1 (en) * | 1996-02-22 | 2001-10-23 | Silicon Graphics, Inc. | Air or liquid cooled computer module cold plate |
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
US6729389B2 (en) * | 2000-02-24 | 2004-05-04 | Sts Corporation | Heat transfer apparatus with zigzag passage |
US6508301B2 (en) * | 2000-04-19 | 2003-01-21 | Thermal Form & Function | Cold plate utilizing fin with evaporating refrigerant |
US6648062B2 (en) * | 2000-07-31 | 2003-11-18 | Honda Giken Kogyo Kabushiki Kaisha | Heat sink-type cooling device |
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