TWI577270B - Heat exchange chamber and liquid cooling device - Google Patents

Description

Heat exchange chamber and liquid cooling device

The invention relates to a heat exchange chamber, in particular to a heat exchange chamber for fixing a cover body to a heat conductive substrate by using a fixing member and a liquid cooling device having the heat exchange chamber.

Heat sinks are closely related to the development of electronic products. Since the current in the circuit generates unnecessary heat due to the influence of the impedance when the electronic product is in operation, if the thermal energy cannot be effectively eliminated and accumulated on the electronic components inside the electronic product, the electronic component may be raised because of the rising The temperature is damaged. Therefore, the advantages and disadvantages of the heat sink have a great impact on the operation of electronic products.

At present, the most commonly used heat sink for electronic products is to heat the electronic components through the end of the heat pipe, the heat sink at the other end, and the heat sink to dissipate heat. However, the disturbing noise and high power consumption of the cooling fan at high speeds are often difficult for manufacturers to overcome. Therefore, the liquid cooling device is born.

In general, liquid cooling devices are mainly composed of a heat exchange chamber and a pump. When the liquid cooling device dissipates the electronic components, the cooling liquid is pumped into the heat exchange chamber, and the heat exchange chamber absorbs the heat generated by the electronic components, and then is cooled by the cooling liquid. The cover of the conventional heat exchange chamber is only placed on the heat conductive substrate, and the cover body has no fixed relationship with the heat conductive substrate, so that there is a large gap between the inner surface of the cover body and the heat sink of the heat conductive substrate. Since the above-mentioned gap has less resistance to the flow of the liquid, part of the coolant flows into the gap, so that the coolant cannot flow uniformly to each of the fins. Therefore, the coolant cannot effectively remove heat from each of the heat sinks, so that the electronic device affects its efficiency due to an increase in temperature.

The invention provides a heat exchange chamber for fixing a cover body on a heat conductive substrate by using a fixing member and a liquid cooling device having the heat exchange chamber to solve the above problems.

According to an embodiment, the heat exchange chamber of the present invention comprises a thermally conductive substrate, a cover, and a plurality of fasteners. The thermally conductive substrate has a plurality of heat sinks. The cover is disposed on the heat conductive substrate and covers the heat sink. The fixing member fixes the cover to the heat conductive substrate.

According to another embodiment, the liquid cooling apparatus of the present invention comprises a heat exchange chamber and a housing. The heat exchange cavity comprises a heat conducting substrate, a cover body and a plurality of fixing members. The thermally conductive substrate has a plurality of heat sinks. The cover is disposed on the heat conductive substrate and covers the heat sink. The fixing member fixes the cover to the heat conductive substrate. The housing is disposed on the thermally conductive substrate.

In summary, the heat exchange chamber of the present invention uses a fixing member to fix the cover to the heat conductive substrate. After the fixing member fixes the cover body to the heat conductive substrate, the inner surface of the cover body can be brought close to or even attached to the heat dissipation substrate of the heat conductive substrate to reduce or even eliminate the between the inner surface of the cover body and the heat dissipation plate of the heat conductive substrate. gap. Thereby, the coolant entering the heat exchange chamber can uniformly flow to each of the heat sinks, effectively taking away the heat of each heat sink, thereby improving the heat dissipation effect.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

1 to 7 , FIG. 1 is a perspective view of a liquid cooling device 1 according to an embodiment of the present invention, and FIG. 2 is a perspective view of the liquid cooling device 1 of FIG. 1 at another viewing angle, and FIG. The figure is an exploded view of the liquid cooling device 1 in Fig. 1, the fourth drawing is an exploded view of the liquid cooling device 1 in Fig. 1 from another angle of view, and Fig. 5 is the edge of the heat exchange chamber 10 in Fig. 3. A cross-sectional view of the AA line, Fig. 6 is an exploded view of the heat exchange chamber 10 in Fig. 3, and Fig. 7 is an exploded view of the heat exchange chamber 10 in Fig. 3 from another angle of view.

As shown in FIGS. 1 to 4, the liquid cooling device 1 includes a heat exchange chamber 10, a casing 12, and a pump 14. The housing 12 is disposed on the heat exchange chamber 10. The pump 14 is disposed in the housing 12 and is located on the heat exchange chamber 10. In this embodiment, the heat exchange chamber 10, the housing 12, and the pump 14 can be secured together using a plurality of screws 16.

As shown in FIGS. 5 to 7 , the heat exchange chamber 10 includes a heat conductive substrate 100 , a cover 102 , and a plurality of fixing members 104 . The thermally conductive substrate 100 may be made of copper, aluminum or other material having a high thermal conductivity. When the liquid cooling device 1 of the present invention is used to dissipate heat from an electronic component (not shown), the thermally conductive substrate 100 of the heat exchange chamber 10 is attached to the electronic component, and the coolant (not shown) is driven by the pump 14. The heat exchange chamber 10 absorbs heat generated by the electronic components and is cooled by the coolant.

The heat conductive substrate 100 has a plurality of heat sinks 106, and the heat sinks 106 are spaced apart. The heat sink 106 can be disposed on the heat conductive substrate 100 by adhesion, snapping, soldering, or the like. Further, the heat sink 106 may be formed on the heat conductive substrate 100 by a shoveling method, and integrally formed with the heat conductive substrate 100. Compared with the methods of adhesion, snapping, soldering, etc., the heat sink 106 is directly formed on the heat conductive substrate 100 by the cutting method, which can effectively reduce the thermal resistance between the heat sink 106 and the heat conductive substrate 100, thereby effectively improving the heat conduction efficiency.

The cover body 102 is disposed on the heat conductive substrate 100 and covers the heat sink 106. In this embodiment, the fixing member 104 can be a copper post, and the cover 102 can be made of plastic. Therefore, the fixing member 104 can be disposed on the corner of the cover body 102 via an insert molding process. In another embodiment, the fixing member 104 and the cover 102 can also be integrally formed through a plastic injection molding process. In another embodiment, the fixing member 104 and the cover 102 can also be integrally formed through a metal casting process.

The heat conductive substrate 100 has a plurality of fixing holes 108, wherein the fixing holes 108 correspond to the fixing members 104. In this embodiment, the fixing member 104 is first aligned with the fixing hole 108, and the fixing member 104 is pressed into the fixing hole 108 through the pressing process, so that the fixing member 104 is fixed in the fixing hole 108 in a tight fit manner. Thereby, the fixing member 104 can fix the lid body 102 to the heat conductive substrate 100. As shown in FIG. 5, after the fixing member 104 fixes the cover 102 to the heat conductive substrate 100, since the stamping process presses the cover 102 toward the heat conductive substrate 100, the inner surface of the cover 102 is close to or even attached. The heat sink 106 of the heat conductive substrate 100 is combined to reduce or even eliminate the gap between the inner surface of the cover 102 and the heat sink 106 of the heat conductive substrate 100. In this embodiment, the cover 102 has an inlet 1020 and an outlet 1022, wherein the inlet 1020 and the outlet 1022 are located above the heat sink 106. After the pump 14 pumps the coolant from the inlet 1020 into the heat exchange chamber 10, the coolant entering the heat exchange chamber 10 can flow uniformly to each of the fins 106 and out of the heat exchange chamber 10 from the outlet 1022, effectively each one The heat of the heat sink 106 is taken away, thereby enhancing the heat dissipation effect.

Please refer to FIG. 8. FIG. 8 is an exploded view of the heat exchange chamber 10' according to another embodiment of the present invention. The heat exchange chamber 10' is mainly different from the heat exchange chamber 10 described above in that the fixing member 104 of the heat exchange chamber 10' is integrally formed with the heat conductive substrate 100 as shown in FIG. In this embodiment, the fixing member 104 can be milled on the heat conductive substrate 100 via a computer numerical control (CNC) process. In addition, the cover body 102 has a plurality of fixing holes 110, wherein the fixing holes 110 correspond to the fixing members 104. In this embodiment, the fixing member 104 is first aligned with the fixing hole 110, and the fixing member 104 is pressed into the fixing hole 110 through the pressing process, so that the fixing member 104 is fixed in the fixing hole 110 in a tight fit manner. Thereby, the fixing member 104 can fix the lid body 102 to the heat conductive substrate 100.

It should be noted that the fixing member 104 illustrated in FIG. 8 can also be designed as a hook structure for engaging with the fixing hole 110 or the card slot (not shown) of the cover body 102 to fix the cover body 102 to the cover body 102. On the heat conductive substrate 100. In other words, the present invention can also fix the cover 102 to the heat-conductive substrate 100 by the engagement method, and is not limited to the above-described manner of fixing the fixing member 104 into the fixing hole 110 via the pressing process.

Please refer to FIG. 9. FIG. 9 is an exploded view of the heat exchange chamber 10" according to another embodiment of the present invention. The heat exchange chamber 10" is mainly different from the heat exchange chamber 10 described above in that the heat exchange chamber 10 is The fixing member 104 is a separate component, as shown in FIG. 9. In addition, the heat-conductive substrate 100 has a plurality of fixing holes 108, and the cover body 102 has a plurality of fixing holes 110, wherein the fixing holes 108 and 110 respectively correspond to the fixing members. 104. In this embodiment, the fixing holes 108 and 110 are aligned with each other, and the fixing member 104 is pressed into the fixing holes 108 and 110 through a stamping process, so that the fixing member 104 is fixed to the fixing hole 108 in a tight fit manner. Thus, the fixing member 104 can fix the lid body 102 to the heat conductive substrate 100.

In summary, the heat exchange chamber of the present invention uses a fixing member to fix the cover to the heat conductive substrate. After the fixing member fixes the cover body to the heat conductive substrate, the inner surface of the cover body can be brought close to or even attached to the heat dissipation substrate of the heat conductive substrate to reduce or even eliminate the between the inner surface of the cover body and the heat dissipation plate of the heat conductive substrate. gap. Thereby, the coolant entering the heat exchange chamber can uniformly flow to each of the heat sinks, effectively taking away the heat of each heat sink, thereby improving the heat dissipation effect.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1‧‧‧Liquid cooling device

10, 10', 10" ‧ ‧ heat exchange chamber

12‧‧‧ housing

14‧‧‧ pump

16‧‧‧ screws

100‧‧‧thermal substrate

102‧‧‧ cover

104‧‧‧Fixed parts

106‧‧‧ Heat sink

108, 110‧‧‧ fixing holes

1020‧‧‧Import

1022‧‧‧Export

A-A‧‧‧ hatching

Fig. 1 is a perspective view of a liquid cooling apparatus according to an embodiment of the present invention. Fig. 2 is a perspective view of the liquid cooling device in Fig. 1 from another perspective. Fig. 3 is an exploded view of the liquid cooling device in Fig. 1. Fig. 4 is an exploded view of the liquid cooling device in Fig. 1 from another angle of view. Fig. 5 is a cross-sectional view of the heat exchange chamber taken along line A-A in Fig. 3.

Figure 6 is an exploded view of the heat exchange chamber in Figure 3.

Figure 7 is an exploded view of the heat exchange chamber of Figure 3 from another perspective.

Figure 8 is an exploded view of a heat exchange chamber in accordance with another embodiment of the present invention.

Figure 9 is an exploded view of a heat exchange chamber in accordance with another embodiment of the present invention.

10‧‧‧Heat exchange chamber

100‧‧‧thermal substrate

102‧‧‧ cover

104‧‧‧Fixed parts

106‧‧‧ Heat sink

108‧‧‧Fixed holes

Claims (2)

A heat exchange chamber includes: a heat conducting substrate having a plurality of heat sinks; a cover disposed on the heat conductive substrate and covering the heat sink; and a plurality of fixing members fixed on the heat conductive substrate Wherein the fixing members are copper pillars, and the fixing members are disposed on the cover body through a burying and forming process, the heat conducting substrate has a plurality of fixing holes, and the fixing holes correspond to fixing members, and the fixing members are fixed. The pieces are fixed in the fixing holes in a tight fit manner. A liquid cooling device comprising: a heat exchange chamber comprising a heat conducting substrate, a cover body and a plurality of fixing members, the heat conducting substrate having a plurality of heat sinks, the cover body being disposed on the heat conducting substrate and covering the heat sink The fixing member fixes the cover body to the heat-conducting substrate, the cover body has an inlet and an outlet, the inlet and the outlet are located above the heat sink; a casing is disposed on the heat exchange cavity; a coolant; and a pump disposed in the housing and located on the heat exchange chamber, the pump driving the coolant from the inlet into the heat exchange chamber, and the coolant entering the heat exchange chamber is evenly distributed Flowing on each of the heat sinks and flowing out of the heat exchange chamber from the outlet; wherein the fixing members are copper pillars, and the fixing members are disposed on the cover body through a buried incident molding process, the heat conductive substrate having a plurality of fixings The holes, the fixing holes correspond to the fixing members, and the fixing members are fixed in the fixing holes in a tight fit manner.