TWM531608U - Water cooling equipment - Google Patents

Water cooling equipment Download PDF

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Publication number
TWM531608U
TWM531608U TW105207692U TW105207692U TWM531608U TW M531608 U TWM531608 U TW M531608U TW 105207692 U TW105207692 U TW 105207692U TW 105207692 U TW105207692 U TW 105207692U TW M531608 U TWM531608 U TW M531608U
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Taiwan
Prior art keywords
liquid
circuit board
water
heat exchange
cooling device
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TW105207692U
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Chinese (zh)
Inventor
Ching-Hang Shen
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Asia Vital Components Co Ltd
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Priority to TW105207692U priority Critical patent/TWM531608U/en
Publication of TWM531608U publication Critical patent/TWM531608U/en

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Description

水冷裝置 Water cooling device

本創作有關於一種水冷裝置,尤指一種具有達到薄型化的水冷裝置。 The present invention relates to a water-cooling device, and more particularly to a water-cooling device having a reduced thickness.

按,隨著電子設備計算效能日漸增強,其內部所設置之電子元件於運作時會產生大量熱量,通常需於電子元件上設置散熱器或散熱鰭片藉以增加散熱面積進而提升散熱效能,但由於散熱器與散熱鰭片所達到之散熱效果有限,故現行習知技術便有採用水冷裝置作為增強散熱效能之解決方式。 According to the increasing computing power of electronic devices, the electronic components installed in the internal device generate a large amount of heat during operation, and it is usually necessary to provide a heat sink or a heat dissipating fin on the electronic component to increase the heat dissipation area and thereby improve the heat dissipation performance, but The heat dissipation effect achieved by the heat sink and the heat sink fins is limited. Therefore, the current conventional technology has adopted a water cooling device as a solution for enhancing the heat dissipation performance.

而習知水冷裝置是可將吸收到發熱元件(處理器或圖形處理器)的熱量與水冷裝置內部的一冷卻液體熱交換,然後透過水冷裝置內部的一泵浦來循環冷卻液體,並該水冷裝置透過複數管體連接一散熱器,令冷卻液體可於散熱器與水冷裝置兩者間進行熱交換循環散熱,藉以對發熱元件快速散熱。 The conventional water-cooling device can exchange heat absorbed by the heating element (processor or graphics processor) with a cooling liquid inside the water-cooling device, and then circulates the cooling liquid through a pump inside the water-cooling device, and the water is cooled. The device is connected to a heat sink through a plurality of tubes, so that the cooling liquid can be heat-dissipated and cooled between the heat sink and the water-cooling device, thereby rapidly dissipating heat to the heat-generating components.

由上所知習知技術中,為了防止泵浦之定子組件因接受到液體而造成損壞,故將定子組件設置於水冷裝置之外側,而引導冷卻流體於水冷裝置中循環之轉子組件則設置於該水冷裝置之腔室內部,該兩者間透過該水冷裝置之外殼對應產生激磁而運轉,並由於水冷裝置之外殼必須考量本身結構體之強度,故具有一定厚度,因此該轉子組件與該定子組件間,則因該水冷模組之外殼厚度產生之間距而影響該泵浦之運轉效率,使得影響水冷模組之整體散熱效能及整體水冷裝置體積過大的問題者。 In the prior art, in order to prevent the pumped stator assembly from being damaged by receiving the liquid, the stator assembly is disposed on the outer side of the water cooling device, and the rotor assembly for guiding the cooling fluid to circulate in the water cooling device is disposed on The inside of the chamber of the water-cooling device runs between the two through the outer casing of the water-cooling device to generate excitation, and since the outer casing of the water-cooling device must take into consideration the strength of the structure itself, it has a certain thickness, so the rotor assembly and the stator Between the components, the operating efficiency of the pump is affected by the distance between the thicknesses of the water-cooling modules, which affects the overall heat dissipation performance of the water-cooling module and the excessive volume of the overall water-cooling device.

爰此,為有效解決上述之問題,本創作之一目的在提供一種達到薄型化的效果的水冷裝置。 Accordingly, in order to effectively solve the above problems, it is an object of the present invention to provide a water-cooling device that achieves a thinning effect.

本創作之另一目的在提供一種可減少定子與對應轉子彼此之間的厚度間距,及減少整體體積的水冷裝置。 Another object of the present invention is to provide a water cooling device which can reduce the thickness spacing between the stator and the corresponding rotor and reduce the overall volume.

本創作之另一目的在提供一種透過一水流通道具有的一第一傾斜面,與相鄰一熱交換腔室內壁上具有的一第二傾斜面連接,且該第一、二傾斜面呈高低差,藉此可達到緩流的效果,以及避免渦流(或絮流)產生的水冷裝置。 Another object of the present invention is to provide a first inclined surface through a water flow passage, and a second inclined surface on an inner wall of an adjacent heat exchange chamber, and the first and second inclined surfaces are at a high level. Poor, whereby a slow-flow effect can be achieved, as well as a water-cooling device that avoids eddy currents (or flocculation).

為達上述目的,本創作提供一種水冷裝置,包括一儲液殼體及一泵浦,該儲液殼體具有一液體室、一入口及一出口,該液體室連通該入口及出口,用以供一冷卻液體通過其內,該泵浦用以循環該冷卻液體,其包含一定子與一轉子,該定子具有一線圈組設於一電路板上且彼此電性連接,該電路板與其上該線圈組選擇設在該液體室的至少一內壁上或一體包射成型在該儲液殼體內,且該電路板與其上該線圈組跟該冷卻液體相隔離,該轉子與相對連接的一推動器容設於該液體室內且暴露在該冷卻液體中,並該推動器設有複數金屬材質構成的葉片,該每一葉片具有至少一磁極區從該葉片相對該線圈組的一位置上所充磁形成,且該每一葉片的磁極區與相對該線圈組感應激磁。 In order to achieve the above object, the present invention provides a water-cooling device comprising a liquid storage casing and a pump, the liquid storage casing having a liquid chamber, an inlet and an outlet, the liquid chamber communicating with the inlet and the outlet for Providing a cooling liquid therethrough, the pump is for circulating the cooling liquid, comprising a stator and a rotor, the stator having a coil set on a circuit board and electrically connected to each other, the circuit board and the circuit board The coil set is disposed on at least one inner wall of the liquid chamber or integrally formed in the liquid storage housing, and the circuit board is separated from the cooling liquid by the coil group, and the rotor is connected to the opposite connection The device is disposed in the liquid chamber and exposed to the cooling liquid, and the pusher is provided with blades made of a plurality of metal materials, each of the blades having at least one magnetic pole region filled from a position of the blade relative to the coil assembly Magnetically formed, and the magnetic pole regions of each of the blades are inductively excited with respect to the coil assembly.

在一實施,該每一葉片的一上緣部或一下緣部軸向充磁形成該磁極區,一保護膜包覆該電路板與該線圈組的外側,並包覆有該保護膜或鍍膜的該電路板與該線圈組一起設於該液體室內的一內壁頂側或一內壁底側上,且對應該等葉片的磁極區。 In one implementation, an upper edge portion or a lower edge portion of each blade is axially magnetized to form the magnetic pole region, and a protective film covers the circuit board and the outer side of the coil assembly, and is coated with the protective film or coating film. The circuit board is disposed together with the coil assembly on an inner wall top side or an inner wall bottom side of the liquid chamber, and corresponds to a magnetic pole region of the blade.

在一實施,該每一葉片的一前緣部徑向充磁形成該磁極區,並包覆有該保護膜的該電路板與該線圈組一起設於該液體室內的一內壁周側上,且對應該等葉片的磁極區。 In one implementation, a leading edge portion of each blade is radially magnetized to form the magnetic pole region, and the circuit board covered with the protective film is disposed on the inner peripheral side of the inner wall of the liquid chamber together with the coil assembly And corresponding to the magnetic pole region of the blade.

在一實施,該電路板與該線圈組一體包射成型在該儲液殼體的一頂部或一底部內,且對應該等葉片的磁極區,並該電路板與該定子位於該液體室外,且該儲液殼體阻擋隔離該冷卻液體接觸該定子與該電路板。 In one implementation, the circuit board is integrally formed with the coil assembly in a top or a bottom of the liquid storage housing, and corresponds to a magnetic pole region of the blade, and the circuit board and the stator are located outside the liquid chamber. And the liquid storage housing blocks the isolation of the cooling liquid from contacting the stator and the circuit board.

在一實施,該電路板與該線圈組一體包射成型在該儲液殼體的一側周部內,且對應該等葉片的前緣部之磁極區,並該電路板與該定子位於該液體室外,且該儲液殼體阻擋隔離該冷卻液體接觸該定子與該電路板。 In one implementation, the circuit board is integrally formed with the coil assembly in a peripheral portion of one side of the liquid storage housing, and corresponds to a magnetic pole region of a leading edge portion of the blade, and the circuit board and the stator are located in the liquid Outdoor, and the liquid storage housing blocks isolation of the cooling liquid from contacting the stator and the circuit board.

在一實施,該轉子具有一軸心,該軸心的一端連接該推動器,其另一端則軸設在該液體室的內壁上,並該入口與出口分別設置在該儲液殼體的兩側邊。 In one implementation, the rotor has an axial center, one end of the shaft is connected to the pusher, and the other end is axially disposed on an inner wall of the liquid chamber, and the inlet and the outlet are respectively disposed in the liquid storage shell On both sides.

在一實施,該水冷裝置更包含一熱交換元件,該熱交換元件連接相對該儲液殼體,且該熱交換元件具有一熱接觸面與一熱交換面,該熱交換面與該液體室內的冷卻液體接觸。 In one implementation, the water cooling device further includes a heat exchange element coupled to the liquid storage housing, and the heat exchange element has a thermal contact surface and a heat exchange surface, the heat exchange surface and the liquid chamber The contact of the cooling liquid.

在一實施,該水冷裝置更包含一熱交換元件,該熱交換元件連接相對該儲液殼體,該儲液殼體更具有一間隔部、至少一貫孔及一水流通道,該間隔部形成在該儲液殼體內中央處,且與該儲液殼體及該熱交換元件共同界定前述液體室及一連通該出口的熱交換腔室,該貫孔係開設該間隔部上且連通該入口及該液體室,該液體室位於該熱交換腔室上方,該水流通道設於該液體室與該液體室內壁周側之間,且貫通該間隔部,以連通該熱交換腔室。 In one implementation, the water cooling device further includes a heat exchange element coupled to the liquid storage housing, the liquid storage housing further having a spacer portion, at least a consistent hole, and a water flow channel, the spacer portion being formed at a central portion of the liquid storage housing, and the liquid storage chamber and the heat exchange element together define the liquid chamber and a heat exchange chamber communicating with the outlet, the through hole opening the spacing portion and communicating with the inlet and The liquid chamber is located above the heat exchange chamber, and the water flow passage is disposed between the liquid chamber and a circumferential side of the liquid chamber wall and penetrates the partition portion to communicate with the heat exchange chamber.

在一實施,該水流通道具有一第一傾斜面,該第一傾斜面係從位於該液體室內的水流通道底側朝貫穿該間隔部處向下延伸傾斜所構成,該熱交換腔室相對 該水流通道的內壁上具有一第二傾斜面,該第二傾斜面相鄰連接相對該第一傾斜面。 In one implementation, the water flow channel has a first inclined surface, and the first inclined surface is formed by extending downward from the bottom side of the water flow channel located in the liquid chamber toward the partition portion, and the heat exchange chamber is opposite to The inner wall of the water flow channel has a second inclined surface adjacent to the first inclined surface.

1‧‧‧水冷裝置 1‧‧‧Water cooling unit

10‧‧‧儲液殼體 10‧‧‧Liquid housing

101‧‧‧液體室 101‧‧‧Liquid room

102‧‧‧入口 102‧‧‧ entrance

103‧‧‧出口 103‧‧‧Export

104‧‧‧間隔部 104‧‧‧Interval

1041‧‧‧貫孔 1041‧‧‧through hole

1042‧‧‧引導通道 1042‧‧‧ Guide channel

105‧‧‧頂蓋 105‧‧‧Top cover

106‧‧‧底蓋 106‧‧‧ bottom cover

107‧‧‧水流通道 107‧‧‧Water flow channel

1071‧‧‧第一傾斜面 1071‧‧‧First inclined surface

109‧‧‧墊圈 109‧‧‧Washers

20‧‧‧泵浦 20‧‧‧ pump

201‧‧‧定子 201‧‧‧ Stator

2011‧‧‧線圈組 2011‧‧‧ coil group

202‧‧‧轉子 202‧‧‧Rotor

2021‧‧‧軸心 2021‧‧‧Axis

203‧‧‧推動器 203‧‧‧ Pusher

2031‧‧‧葉片 2031‧‧‧ blades

2032‧‧‧上緣部 2032‧‧‧Top edge

2033‧‧‧下緣部 2033‧‧‧The lower edge

2034‧‧‧前緣部 2034‧‧‧ Front edge

204‧‧‧磁極區 204‧‧‧Magnetic pole area

30‧‧‧電路板 30‧‧‧ boards

31‧‧‧保護膜 31‧‧‧Protective film

40‧‧‧熱交換元件 40‧‧‧Heat exchange components

401‧‧‧熱接觸面 401‧‧‧Hot contact surface

402‧‧‧熱交換面 402‧‧‧Hot exchange surface

403‧‧‧熱交換腔室 403‧‧‧Heat exchange chamber

404‧‧‧散熱鰭片 404‧‧‧Heat fins

405‧‧‧第二傾斜面 405‧‧‧Second inclined surface

5‧‧‧散熱器 5‧‧‧heatsink

51‧‧‧可撓管 51‧‧‧ flexible tube

6‧‧‧風扇 6‧‧‧Fan

7‧‧‧發熱元件 7‧‧‧heating components

第1圖為本創作之第一實施例之立體分解圖。 Figure 1 is an exploded perspective view of the first embodiment of the present invention.

第2圖為本創作之第一實施例之立體組合圖。 Fig. 2 is a perspective assembled view of the first embodiment of the creation.

第2A圖為本創作之第一實施例之剖面圖。 Fig. 2A is a cross-sectional view showing the first embodiment of the creation.

第2B圖為本創作之第一實施例之局部剖面放大圖。 Fig. 2B is an enlarged partial cross-sectional view showing the first embodiment of the creation.

第3A圖為本創作之第一實施例之一實施剖面圖。 Figure 3A is a cross-sectional view showing one embodiment of the first embodiment of the creation.

第3B圖為本創作之第一實施例之另一實施剖面圖。 Figure 3B is a cross-sectional view showing another embodiment of the first embodiment of the creation.

第4A圖為本創作之第一實施例之另一實施剖面圖。 Figure 4A is a cross-sectional view showing another embodiment of the first embodiment of the present invention.

第4B圖為本創作之第一實施例之另一實施剖面圖。 Figure 4B is a cross-sectional view showing another embodiment of the first embodiment of the creation.

第4C圖為本創作之第一實施例之另一實施剖面圖。 Figure 4C is a cross-sectional view showing another embodiment of the first embodiment of the creation.

第5A圖為本創作之第二實施例之立體分解圖。 Fig. 5A is an exploded perspective view showing the second embodiment of the creation.

第5B圖為本創作之第二實施例之剖面圖。 Figure 5B is a cross-sectional view showing a second embodiment of the creation.

第6圖為本創作之第二實施例之實施態樣圖。 Figure 6 is a view showing an embodiment of the second embodiment of the creation.

第7圖為本創作之第三實施例之立體分解圖。 Figure 7 is a perspective exploded view of the third embodiment of the creation.

第8A圖為本創作之第三實施例之立體組合圖。 Fig. 8A is a perspective assembled view of the third embodiment of the present invention.

第8B圖為本創作之第三實施例之剖面圖。 Figure 8B is a cross-sectional view showing a third embodiment of the present invention.

第8C圖為本創作之第三實施例之另一實施剖面圖。 Figure 8C is a cross-sectional view showing another embodiment of the third embodiment of the present invention.

本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

本創作係提供一種水冷裝置,請參閱第1、2、2A圖,係顯示本創作之第一實施例之立體分解與組合及剖面示意圖。前述水冷裝置1包括一儲液殼體10及一泵浦20,該儲液殼體10係以塑膠材質所構成,且該儲液殼體10具有一液體室101、一入口102、一出口103及一底蓋106,該儲液殼體10的底端係對接該底蓋106的一端面,以密封該液體室101,該液體室101連通該入口102及出口103,該液體室101用以供一冷卻液體通過其內,該入口102與出口103分別設置在該儲液殼體10的兩側邊上。該底蓋106與儲液殼體10之間具有一墊圈109,該墊圈109用以增加儲液殼體10與底蓋106之間的結合密度,防止液體室101內的冷卻液體滲漏。其中前述底蓋106為儲液殼體10本身的一部分,且兩者連接結合方式以嵌接方式做說明,但並不侷限於此,於具體實施時,也可選擇為黏接或螺鎖的結合方式。 The present invention provides a water-cooling device. Please refer to Figures 1, 2, and 2A for a perspective exploded view, a combination, and a cross-sectional view of the first embodiment of the present invention. The water-cooling device 1 includes a liquid storage casing 10 and a pump 20, and the liquid storage casing 10 is made of a plastic material, and the liquid storage casing 10 has a liquid chamber 101, an inlet 102, and an outlet 103. And a bottom cover 106, the bottom end of the liquid storage housing 10 is abutted against an end surface of the bottom cover 106 to seal the liquid chamber 101, the liquid chamber 101 is connected to the inlet 102 and the outlet 103, and the liquid chamber 101 is used for A cooling liquid is passed therethrough, and the inlet 102 and the outlet 103 are respectively disposed on both sides of the liquid storage casing 10. The bottom cover 106 and the liquid storage case 10 have a gasket 109 for increasing the bonding density between the liquid storage case 10 and the bottom cover 106 to prevent leakage of the cooling liquid in the liquid chamber 101. The bottom cover 106 is a part of the liquid storage shell 10 itself, and the connection manner of the two is described in the manner of engagement, but is not limited thereto. In specific implementation, the bottom cover 106 may also be selected as a glued or screwed lock. Combination method.

而該泵浦20用以循環該冷卻液體,該泵浦20包含一定子201與一轉子202及一推動器203,該定子201具有一線圈組2011,該線圈組2011在本實施例表示設置或佈線或蝕刻或印刷形成在一電路板30的一側上,且該線圈組2011設於該電路板30的一側上且彼此電性連接。於具體實施時,該線圈組2011可選擇以堆疊方式形成設於該電路板30的一側上,或是該線圈組2011佈設在該電路板30的一側上。並該電路板30與其上該線圈組2011在本實施例表示設在該液體室101的至少一內壁表面上,且該電路板30與其上該線圈組2011跟該冷卻液體相隔離。並該電路板30與該線圈組2011的外側包覆有一保護膜31(或鍍膜),藉由該保護膜31(或鍍膜)阻擋隔離該冷卻液體接觸該定子201與該電路板30。在本實施例第2A、2B圖中,包覆有該保護膜31的電路板30與該線圈組2011一起緊貼設於該液體室101內的一內壁頂側上。在替代實施例,如第3A圖,包覆有該保護膜31的電路板30與該線圈組2011一起緊貼設於該液體室101內的一內壁底側上。在替代實施例,如 第3B圖,包覆有該保護膜31的該電路板30與該線圈組2011一起緊貼設於該液體室101內的一內壁周側上。其中前述電路板30為軟性印刷電路板30(Flexible printed circuit board,FPCB)或印刷電路板30(PCB),且該電路板30電性連接一連接線組(圖中未示),該連接線組的一端電性連接在該電路板30上,其另一端則由該儲液室101內貫穿該儲液殼體10延伸出至外面,使該連接線組的另一端與對應的一主機板(或一電源供應器)相連接,其中該連接線組的另一端由該儲液室101內貫穿該儲液殼體10處是密封,以防止液體室101內的冷卻液體滲漏。在替代實施例,該連接線組的一端電性連接在電路板30上,其餘部分(即連接線組的一端與另一端之間的部分)則被包射一體成型在該儲液殼體10內,並留該連接線組的另一端裸露在儲液殼體10外與對應該主機板(或電源供應;圖中未示)相連接。並該連接線組在本實施例表示為電源線與控制訊號線,該電源線用以提供電源給該電路板其上電子零件及泵浦,該控制訊號線用以控制該泵浦運轉速度(或可同時控制泵浦開啟或關閉)。 The pump 20 is used to circulate the cooling liquid. The pump 20 includes a stator 201 and a rotor 202 and a pusher 203. The stator 201 has a coil set 2011. The coil set 2011 is shown in this embodiment. Wiring or etching or printing is formed on one side of a circuit board 30, and the coil group 2011 is disposed on one side of the circuit board 30 and electrically connected to each other. In a specific implementation, the coil group 2011 may be formed on one side of the circuit board 30 in a stacked manner, or the coil group 2011 may be disposed on one side of the circuit board 30. And the circuit board 30 and the coil assembly 2011 thereon are disposed on at least one inner wall surface of the liquid chamber 101 in this embodiment, and the circuit board 30 is separated from the coil group 2011 by the cooling liquid. The circuit board 30 and the outer side of the coil assembly 2011 are covered with a protective film 31 (or a coating film), and the protective film 31 (or coating film) blocks the cooling liquid from contacting the stator 201 and the circuit board 30. In the second and second embodiments of the present embodiment, the circuit board 30 covered with the protective film 31 is placed in close contact with the coil group 2011 on the top side of an inner wall in the liquid chamber 101. In an alternative embodiment, as shown in FIG. 3A, the circuit board 30 covered with the protective film 31 is placed in close contact with the coil assembly 2011 on the bottom side of an inner wall in the liquid chamber 101. In an alternative embodiment, such as In FIG. 3B, the circuit board 30 covered with the protective film 31 is placed in close contact with the coil group 2011 on an inner wall side of the liquid chamber 101. The circuit board 30 is a flexible printed circuit board (FPCB) or a printed circuit board 30 (PCB), and the circuit board 30 is electrically connected to a connection line group (not shown). One end of the group is electrically connected to the circuit board 30, and the other end of the liquid storage chamber 101 extends through the liquid storage housing 10 to the outside, so that the other end of the connection line group and a corresponding motherboard (or a power supply) is connected, wherein the other end of the connecting wire group is sealed by the liquid storage chamber 101 through the liquid storage casing 10 to prevent leakage of the cooling liquid in the liquid chamber 101. In an alternative embodiment, one end of the connecting wire group is electrically connected to the circuit board 30, and the remaining portion (ie, a portion between one end and the other end of the connecting wire group) is integrally molded in the liquid storage casing 10 . The other end of the connection line group is exposed outside the liquid storage case 10 and connected to the corresponding main board (or power supply; not shown). In the embodiment, the connection line group is represented as a power line and a control signal line, and the power line is used to supply power to the electronic components and the pump on the circuit board, and the control signal line is used to control the pump operation speed ( Or you can control the pump to turn on or off at the same time).

另者,前述轉子202連接該推動器203,該轉子202與推動器203容設於該液體室101內且暴露在該冷卻液體中,藉此該轉子202對應該定子201,以驅動轉子202帶動該推動器203轉動,進而使該推動器203擾動該液體室101內的冷卻液體,而由該入口102流入的冷卻液體被該推動器203帶動朝對應的出口103流出。並該轉子202具有一軸心2021,該軸心2021的一端連接該推動器203,其另一端則軸設在該液體室101的內壁頂側上。而前述推動器203設有複數葉片2031,該等葉片2031係以金屬材質所構成,該每一葉片2031具有至少一磁極區204,該磁極區204從該葉片2031相對該線圈組2011的一位置上所充磁形成,亦即本實施例在該等葉片2031的一上緣部2032軸向充磁形成該磁極區204,且每一相鄰的葉片2031的上緣 部2032各具有相異的磁極區204(N極或S極),並該等葉片2031的上緣部2032之磁極區204與相對該液體室101的內壁頂側上的線圈組2011相感應激磁,因而驅使該轉子202轉動。 In addition, the rotor 202 is connected to the pusher 203. The rotor 202 and the pusher 203 are accommodated in the liquid chamber 101 and exposed to the cooling liquid, whereby the rotor 202 corresponds to the stator 201 to drive the rotor 202. The pusher 203 rotates, thereby causing the pusher 203 to disturb the cooling liquid in the liquid chamber 101, and the cooling liquid flowing in from the inlet 102 is driven by the pusher 203 to flow out toward the corresponding outlet 103. The rotor 202 has a shaft center 2021. One end of the shaft core 2021 is connected to the pusher 203, and the other end thereof is axially disposed on the top side of the inner wall of the liquid chamber 101. The pusher 203 is provided with a plurality of blades 2031. The blades 2031 are made of a metal material. Each of the blades 2031 has at least one magnetic pole region 204. The magnetic pole region 204 is from a position of the blade 2031 relative to the coil assembly 2011. The magnetization is formed, that is, the magnetic pole region 204 is formed by axially magnetizing an upper edge portion 2032 of the blade 2031, and the upper edge of each adjacent blade 2031 is formed. The portions 2032 each have a different magnetic pole region 204 (N pole or S pole), and the magnetic pole regions 204 of the upper edge portion 2032 of the vanes 2031 are induced to the coil group 2011 on the top side of the inner wall of the liquid chamber 101. Excitation, thus driving the rotor 202 to rotate.

在替代實施例,如第3A圖,前述該等葉片2031的一下緣部2033軸向充磁形成該磁極區204,且每一相鄰的葉片2031的下緣部2033各具有相異的磁極區204(N極或S極),並該等葉片2031的下緣部2033之磁極區204與相對該液體室101的內壁底側上的線圈組2011相感應激磁。在替代實施例,如第3B圖,前述該等葉片2031的一前緣部2034徑向充磁形成該磁極區204,且每一相鄰的葉片2031的前緣部2034各具有相異的磁極區204(N極或S極),並該等葉片2031的前緣部2034之磁極區204與相對該液體室101的內壁周側上的線圈組2011相感應激磁。 In an alternative embodiment, as shown in FIG. 3A, the lower edge portion 2033 of the blade 2031 is axially magnetized to form the magnetic pole region 204, and the lower edge portion 2033 of each adjacent blade 2031 has a different magnetic pole region. 204 (N pole or S pole), and the magnetic pole region 204 of the lower edge portion 2033 of the vane 2031 is inductively excited with the coil group 2011 on the bottom side of the inner wall of the liquid chamber 101. In an alternative embodiment, as shown in FIG. 3B, a front edge portion 2034 of the blade 2031 is radially magnetized to form the magnetic pole region 204, and the leading edge portion 2034 of each adjacent blade 2031 has a different magnetic pole. The region 204 (N pole or S pole), and the magnetic pole region 204 of the leading edge portion 2034 of the vane 2031 is inductively excited with the coil group 2011 on the inner peripheral side of the liquid chamber 101.

在一實施例,前述該電路板30與其上該線圈組2011可設計一體包射成型在該儲液殼體10內,並該電路板30與定子201位於該液體室101外,藉由儲液殼體10阻擋隔離該冷卻液體接觸該定子201與電路板30。亦即如第4A圖,該電路板30與該線圈組2011一體包射成型在該儲液殼體10的一頂部內(近內壁表面),且該等葉片2031的上緣部2032之磁極區204與對應被包覆在該儲液殼體10的頂部內的線圈組2011相感應激磁。在一實施例,如第4B圖,該電路板30與該線圈組2011一體包射成型在該儲液殼體10的一底部內,且該等葉片2031的下緣部2033之磁極區204與對應被包覆在該儲液殼體10的底部內的線圈組2011相感應激磁。在一實施例,如第4C圖,該電路板30與該線圈組2011一體包射成型在該儲液殼體10的一側周部內,且該等葉片2031的前緣部2034之磁極區204與對應被包覆在該儲液殼體10的側周部內的線圈組2011相感應激磁。所以藉此電路板30與其上線圈組2011跟儲液殼體10一體包射成型的結構,使得可達到定子201與電路板30防水及保護定子201 與電路板30外,還能有效減少(或縮短)定子201與轉子202彼此之間的厚度間距,以達到薄型化的效果。 In an embodiment, the circuit board 30 and the coil assembly 2011 can be integrally formed in the liquid storage casing 10, and the circuit board 30 and the stator 201 are located outside the liquid chamber 101 by liquid storage. The housing 10 blocks isolation of the cooling liquid from contacting the stator 201 and the circuit board 30. That is, as shown in FIG. 4A, the circuit board 30 and the coil assembly 2011 are integrally formed in a top portion (near inner wall surface) of the liquid storage case 10, and the magnetic poles of the upper edge portion 2032 of the blade 2031 are formed. The region 204 is inductively excited with a coil group 2011 corresponding to being wrapped in the top of the liquid storage casing 10. In an embodiment, as shown in FIG. 4B, the circuit board 30 and the coil assembly 2011 are integrally formed in a bottom portion of the liquid storage casing 10, and the magnetic pole regions 204 of the lower edge portion 2033 of the blades 2031 are The coil group 2011 corresponding to the inside of the bottom of the liquid storage casing 10 is induction-excited. In an embodiment, as shown in FIG. 4C, the circuit board 30 and the coil assembly 2011 are integrally formed in one side of the liquid storage casing 10, and the magnetic pole region 204 of the front edge portion 2034 of the blades 2031. The excitation is performed by the coil group 2011 corresponding to the side peripheral portion of the liquid storage case 10. Therefore, the circuit board 30 and the upper coil group 2011 and the liquid storage housing 10 are integrally formed into a structure, so that the stator 201 and the circuit board 30 can be waterproofed and the stator 201 can be protected. In addition to the circuit board 30, it is also possible to effectively reduce (or shorten) the thickness interval between the stator 201 and the rotor 202 to achieve a thinning effect.

由於透過本創作在該等葉片2031的一位置(如上緣部2032或下緣部2033或前緣部2034)上進行充磁形成磁極區204,以對應該電路板30其上線圈組2011的結構設計,使得可取代習知轉子202上一個體積大的磁性元件(如磁鐵),進而便能省略放置習知磁性元件的空間,藉以減少儲液殼體10整體體積,以及達到薄型化的效果。 The magnetic pole region 204 is formed by magnetizing a position of the blades 2031 (such as the upper edge portion 2032 or the lower edge portion 2033 or the leading edge portion 2034) to correspond to the structure of the upper coil group 2011 of the circuit board 30. The design makes it possible to replace a large magnetic element (such as a magnet) on the conventional rotor 202, thereby omitting the space for placing the conventional magnetic element, thereby reducing the overall volume of the liquid storage case 10 and achieving the effect of thinning.

請參閱第5A、5B圖,係顯示本創作之第二實施例之立體分解與剖面示意圖。該本實施例之結構及連結關係及其功效大致與前述第一實施例的相同,故在此不重新贅述。本實施例主要是將前述第一實施例之儲液殼體10的底蓋106設計替換為一熱交換元件40與儲液殼體10相接,亦即該水冷裝置1更包含前述熱交換元件40,該熱交換元件40的一端面連接該儲液殼體10的底端,以密封該液體室101,並該儲液殼體10與熱交換元件40之間透過前述墊圈109增加儲液殼體10與熱交換元件40之間的結合密合度,防止液體室101內的冷卻液體滲漏。並該熱交換元件40由高導熱金屬如鋁、銅或金或銀等製成,且具有一熱接觸面401與一熱交換面402,該熱接觸面401緊貼設在相對的一發熱元件7(如中央處理器或圖形處理器)上,該熱接觸面401用以將接收到該發熱元件7產生的熱量傳導至熱交換面402上,該熱交換面402為於該液體室101內,且熱交換面402與液體室101內的冷卻液體接觸。 Please refer to FIGS. 5A and 5B for a perspective exploded view and a cross-sectional view of a second embodiment of the present invention. The structure and the connection relationship of the present embodiment and the functions thereof are substantially the same as those of the first embodiment described above, and therefore will not be further described herein. In this embodiment, the bottom cover 106 of the first embodiment is replaced with a heat exchange element 40 and the liquid storage housing 10, that is, the water cooling device 1 further includes the heat exchange component. 40. One end surface of the heat exchange element 40 is connected to the bottom end of the liquid storage case 10 to seal the liquid chamber 101, and the liquid storage case is inserted between the liquid storage case 10 and the heat exchange element 40 through the gasket 109. The degree of bonding between the body 10 and the heat exchange element 40 prevents leakage of the cooling liquid in the liquid chamber 101. The heat exchange element 40 is made of a highly thermally conductive metal such as aluminum, copper or gold or silver, and has a thermal contact surface 401 and a heat exchange surface 402, and the thermal contact surface 401 is closely attached to the opposite heating element. 7 (such as a central processing unit or a graphics processor), the thermal contact surface 401 is configured to conduct heat generated by the heating element 7 to the heat exchange surface 402, and the heat exchange surface 402 is in the liquid chamber 101. And the heat exchange surface 402 is in contact with the cooling liquid in the liquid chamber 101.

並前述熱交換元件40更具有複數散熱鰭片404,該等散熱鰭片404是放射狀的間隔排列設於熱交換面402上,但並不侷限於此。藉此透過該等散熱鰭片404設置在該熱交換面402上可有效大幅增加熱交換面402積的效果。另外,如第6圖所示, 該水冷裝置1連接一散熱器5構成一液冷系統,該散熱器5透過複數可撓管51分別連接且連通相對該水冷裝置1的入口102與出口103,以使該液體室101內的推動器203帶動該冷卻液體在液體室101與散熱器5內循環流動散熱。並該散熱器5上可連接一風扇6幫助該散熱器5快速散熱。 The heat exchange element 40 further includes a plurality of heat dissipation fins 404. The heat dissipation fins 404 are radially arranged at intervals on the heat exchange surface 402, but are not limited thereto. Therefore, the heat dissipating fins 404 are disposed on the heat exchange surface 402 to effectively increase the heat exchange surface 402. In addition, as shown in Figure 6, The water-cooling device 1 is connected to a radiator 5 to form a liquid cooling system. The radiator 5 is connected to and connected to the inlet 102 and the outlet 103 of the water-cooling device 1 through a plurality of flexible tubes 51 to push the liquid chamber 101. The 203 drives the cooling liquid to circulate and dissipate heat in the liquid chamber 101 and the heat sink 5. A fan 6 can be connected to the heat sink 5 to help the heat sink 5 to dissipate heat rapidly.

所以當所述熱交換元件40的熱接觸面401將吸收到發熱元件7的熱量傳導至熱交換面402上,令該熱交換面402會與液體室101內的冷卻液體進行熱交換後,使該冷卻液體便將該熱交換面402與該等散熱鰭片404上的熱量帶離並從該儲液殼體10之出口103流出,藉以達到散熱的效果。因此藉由本創作的水冷裝置1的設計,使得可達到薄型化及減少儲液殼體10整體體積的效果,進而還有效達到定子201防水及減少(或縮短)定子201與轉子202彼此之間的厚度間距。 Therefore, when the heat contact surface 401 of the heat exchange element 40 conducts heat absorbed to the heat generating element 7 to the heat exchange surface 402, the heat exchange surface 402 is exchanged with the cooling liquid in the liquid chamber 101, thereby The cooling liquid carries away the heat on the heat exchange surface 402 and the heat dissipation fins 404 and flows out from the outlet 103 of the liquid storage casing 10, thereby achieving the effect of heat dissipation. Therefore, by the design of the water-cooling device 1 of the present invention, the effect of thinning and reducing the overall volume of the liquid storage casing 10 can be achieved, and the stator 201 can be effectively waterproofed and reduced (or shortened) between the stator 201 and the rotor 202. Thickness spacing.

並本實施例的包覆有該保護膜31的電路板30與該線圈組2011一起緊貼設於該液體室101內的內壁頂側上,且該等葉片2031的前緣部2034之磁極區204與相對該液體室101的內壁頂側其上線圈組2011相感應激磁。在替代實施例,包覆有該保護膜31的電路板30與該線圈組2011一起緊貼設於該熱交換面(即前述液體室101內的內壁底側)上,且該等葉片2031的下緣部2033之磁極區204與相對該液體室101的內壁底側(即熱交換面)其上線圈組2011相感應激磁。在替代實施例,包覆有該保護膜31的電路板30與該線圈組2011一起緊貼設於該液體室101內的內壁周側上,且該等葉片2031的前緣部2034之磁極區204與相對該液體室101的內壁周側其上線圈組2011相感應激磁。 The circuit board 30 coated with the protective film 31 of the present embodiment is closely attached to the top side of the inner wall of the liquid chamber 101 together with the coil assembly 2011, and the magnetic poles of the front edge portion 2034 of the blades 2031. The region 204 is inductively excited with respect to the upper coil group 2011 on the top side of the inner wall of the liquid chamber 101. In an alternative embodiment, the circuit board 30 covered with the protective film 31 and the coil assembly 2011 are closely attached to the heat exchange surface (ie, the bottom side of the inner wall in the liquid chamber 101), and the blades 2031 The magnetic pole region 204 of the lower edge portion 2033 is inductively excited with the upper coil group 2011 with respect to the bottom side (i.e., heat exchange surface) of the inner wall of the liquid chamber 101. In an alternative embodiment, the circuit board 30 covered with the protective film 31 is in close contact with the coil assembly 2011 on the inner wall side of the liquid chamber 101, and the magnetic poles of the front edge portion 2034 of the blades 2031. The region 204 is inductively excited with respect to the upper coil group 2011 on the inner peripheral side of the liquid chamber 101.

在一實施例,該電路板30與該線圈組2011一體包射成型在該儲液殼體10的頂部內,且該等葉片2031的上緣部2032之磁極區204與對應被包覆在該儲液殼體10的頂部內的線圈組2011相感應激磁。在一實施例,該電路板30與該線圈組2011一體 包射成型在該儲液殼體10的側周部內,且該等葉片2031的前緣部2034之磁極區204與對應被包覆在該儲液殼體10的側周部內的線圈組2011相感應激磁。 In one embodiment, the circuit board 30 and the coil assembly 2011 are integrally formed in the top of the liquid storage housing 10, and the magnetic pole regions 204 of the upper edge portion 2032 of the blades 2031 are correspondingly wrapped therein. The coil group 2011 in the top of the liquid storage casing 10 is induction-excited. In an embodiment, the circuit board 30 is integrated with the coil assembly 2011. The injection molding is formed in the side peripheral portion of the liquid storage casing 10, and the magnetic pole regions 204 of the leading edge portions 2034 of the blades 2031 are corresponding to the coil group 2011 corresponding to the side peripheral portions of the liquid storage casing 10. Induction excitation.

請參閱第7、8A圖,係顯示本創作之第三實施例之立體分解與組合示意圖,並搭配第8B圖。該本實施例之結構及連結關係及其功效大致與前述第一實施例的相同,故在此不重新贅述。該本實施例主要是將前述第二實施的水冷裝置1改設計為有上、下腔室(即液體室101、熱交換腔室403)及儲液殼體10的入口102與出口103改設計在一頂蓋105上。亦即前述儲液殼體10具有一頂蓋105、一間隔部104、至少一貫孔1041及一水流通道107,該儲液殼體10的頂端對接該頂蓋105的一端面,以密封該液體室101,並該儲液殼體10與頂蓋105之間透過另一墊圈109增加儲液殼體10與頂蓋105之間的結合密合度,防止液體室101內的冷卻液體滲漏。 Please refer to FIG. 7 and FIG. 8A for a perspective exploded view and a combination diagram of the third embodiment of the present invention, together with FIG. 8B. The structure and the connection relationship of the present embodiment and the functions thereof are substantially the same as those of the first embodiment described above, and therefore will not be further described herein. The present embodiment mainly redesigns the water-cooling device 1 of the second embodiment to have the upper and lower chambers (ie, the liquid chamber 101, the heat exchange chamber 403) and the inlet 102 and outlet 103 of the liquid storage housing 10 On a top cover 105. That is, the liquid storage case 10 has a top cover 105, a spacer portion 104, at least a constant hole 1041, and a water flow channel 107. The top end of the liquid storage case 10 abuts an end surface of the top cover 105 to seal the liquid. The chamber 101 and the other gasket 109 are passed between the liquid storage casing 10 and the top cover 105 to increase the degree of bonding between the liquid storage casing 10 and the top cover 105 to prevent leakage of the cooling liquid in the liquid chamber 101.

而該間隔部104形成在該儲液殼體10內中央處,該間隔部104與該儲液殼體10及該熱交換元件40共同界定一熱交換腔室403及前述液體室101位於熱交換腔室403上方,該間隔部104的上方為液體室101,其下方為該熱交換腔室403。前述貫孔1041在本實施例表示為1個貫孔1041開設在該間隔部104的中央處,且連通該儲液殼體10的入口102及液體室101。並前述間隔部104具有一引導通道1042,該引導通道1042形成在該間隔部104的內部,且位於該液體室101與熱交換腔室403之間,該引導通道1042連通該儲液殼體10的入口102及液體室101,用以將由入口102進入的冷卻液體引導通過該貫孔1041進入到上方的液體室101內。其中該間隔部104與頂蓋105為該儲液殼體10的一部分。 The spacer portion 104 is formed at the center of the liquid storage case 10. The spacer portion 104 and the liquid storage case 10 and the heat exchange element 40 together define a heat exchange chamber 403 and the liquid chamber 101 is located in the heat exchange. Above the chamber 403, above the partition 104 is a liquid chamber 101 below which is the heat exchange chamber 403. In the present embodiment, the through hole 1041 is defined as a through hole 1041 opened at the center of the spacer 104, and communicates with the inlet 102 and the liquid chamber 101 of the liquid storage case 10. The guiding portion 1042 has a guiding passage 1042 formed inside the spacing portion 104 and located between the liquid chamber 101 and the heat exchange chamber 403. The guiding passage 1042 communicates with the liquid storage housing 10. The inlet 102 and the liquid chamber 101 are used to guide the cooling liquid entering through the inlet 102 through the through hole 1041 into the liquid chamber 101 above. The spacer 104 and the top cover 105 are part of the liquid storage case 10.

前述水流通道107設於該液體室101與該液體室101的內壁周側之間,且貫通該間隔部104,以連通該熱交換腔室403,亦即如第7圖,該水流通道107沿著該液體室101與相對液體室101的內壁周側之間形成一呈弧形的水流通道107,該水流通 道107用以將被推動器203帶動液體室內的冷卻液體引導入該熱交換腔室403內,然後於該熱交換腔室403內的冷卻液體再朝對應的出口103流出。並所述水流通道107具有一第一傾斜面1071,該第一傾斜面1071係從位於該液體室101內的水流通道107底側朝貫穿該間隔部104處向下延伸傾斜所構成,該熱交換腔室403相對該水流通道107的內壁上具有一第二傾斜面405,該第二傾斜面405相鄰連接相對該第一傾斜面1071,該第一傾斜面1071的高度係高於第二傾斜面405,而使該第一、二傾斜面1071、405之間形成一高低差。並在本實施例的第一傾斜面1071與第二傾斜面405大致呈垂直,但並不侷限於此。 The water flow passage 107 is disposed between the liquid chamber 101 and the inner wall side of the liquid chamber 101, and penetrates the partition portion 104 to communicate with the heat exchange chamber 403, that is, as shown in FIG. 7, the water flow passage 107 An arc-shaped water flow passage 107 is formed along the liquid chamber 101 and the inner wall side of the opposite liquid chamber 101, and the water flows. The passage 107 is used to guide the cooling liquid carried by the pusher 203 into the liquid exchange chamber 403, and then the cooling liquid in the heat exchange chamber 403 flows out to the corresponding outlet 103. And the water flow channel 107 has a first inclined surface 1071, and the first inclined surface 1071 is formed by extending downward from the bottom side of the water flow channel 107 in the liquid chamber 101 toward the partition portion 104. The exchange chamber 403 has a second inclined surface 405 opposite to the inner wall of the water flow channel 107. The second inclined surface 405 is adjacently connected to the first inclined surface 1071. The height of the first inclined surface 1071 is higher than that of the first inclined surface 1071. The two inclined faces 405 form a height difference between the first and second inclined faces 1071 and 405. The first inclined surface 1071 and the second inclined surface 405 of the present embodiment are substantially perpendicular, but are not limited thereto.

所以藉由前述第一、二傾斜面1071、405可減緩該水流通道107內的冷卻液體引導入該熱交換腔室403內的流動速度(即透過第一、二傾斜面1071、405達到緩流的效果),且還促使該冷卻液體的流動順暢,進而還能避免剛進入到該熱交換腔室403內的冷卻液體產生渦流(或絮流),以及可減少剛進入到該熱交換腔室403內的冷卻液體撞擊所產生的氣泡。 Therefore, the flow velocity of the cooling liquid in the water flow channel 107 into the heat exchange chamber 403 can be slowed down by the first and second inclined faces 1071, 405 (ie, the first and second inclined faces 1071, 405 are slowed down). The effect of the cooling liquid is also smooth, thereby preventing vortex (or flocculation) of the cooling liquid just entering the heat exchange chamber 403, and reducing the entering of the heat exchange chamber. The cooling liquid in 403 hits the generated bubbles.

並本實施例的包覆有該保護膜31的電路板30與該線圈組2011一起緊貼設於該儲液殼體10的頂蓋105內側(即液體室101內的內壁頂側)上,且該等葉片2031的上緣部2032之磁極區204與相對該液體室101的內壁頂側(即該儲液殼體10的頂蓋105內側)其上線圈組2011相感應激磁。在替代實施例,包覆有該保護膜31的電路板30與該線圈組2011一起緊貼設於該間隔部104相對該頂蓋105的一側(即前述液體室101內的內壁底側)上,且該等葉片2031的下緣部2033之磁極區204與相對該液體室101的內壁底側其上線圈組2011相感應激磁。在替代實施例,包覆有該保護膜31的電路板30與該線圈組2011一起緊貼設於該液體室101內的內壁周側上,且該 等葉片2031的前緣部2034之磁極區204與相對該液體室101的內壁周側其上線圈組2011相感應激磁。 The circuit board 30 coated with the protective film 31 of the present embodiment and the coil assembly 2011 are closely attached to the inner side of the top cover 105 of the liquid storage case 10 (ie, the top side of the inner wall of the liquid chamber 101). And the magnetic pole region 204 of the upper edge portion 2032 of the vane 2031 is inductively excited with the upper coil group 2011 opposite to the top side of the inner wall of the liquid chamber 101 (ie, the inner side of the top cover 105 of the liquid storage casing 10). In an alternative embodiment, the circuit board 30 covered with the protective film 31 and the coil assembly 2011 are closely attached to one side of the spacer 104 opposite to the top cover 105 (ie, the bottom side of the inner wall in the liquid chamber 101). The magnetic pole region 204 of the lower edge portion 2033 of the vane 2031 is inductively excited with the upper coil group 2011 on the bottom side of the inner wall of the liquid chamber 101. In an alternative embodiment, the circuit board 30 covered with the protective film 31 is closely attached to the inner wall side of the liquid chamber 101 together with the coil assembly 2011, and The magnetic pole region 204 of the leading edge portion 2034 of the equal blade 2031 is inductively excited with the upper coil group 2011 on the inner peripheral side of the liquid chamber 101.

在一實施例,如第8C圖,該電路板30與該線圈組2011一體包射成型在該儲液殼體10的頂部(即儲液殼體10的頂蓋105)內,且該等葉片2031的上緣部2032之磁極區204與對應被包覆在該儲液殼體10的頂蓋105內的線圈組2011相感應激磁。在一實施例,該電路板30與該線圈組2011一體包射成型在該儲液殼體10的間隔部104內,且該等葉片2031的下緣部2033之磁極區204與對應被包覆在該儲液殼體10的間隔部104內的線圈組2011相感應激磁。 In an embodiment, as shown in FIG. 8C, the circuit board 30 is integrally formed with the coil assembly 2011 in the top of the liquid storage housing 10 (ie, the top cover 105 of the liquid storage housing 10), and the blades are The magnetic pole region 204 of the upper edge portion 2032 of 2031 is inductively excited with the coil assembly 2011 corresponding to the cover 105 covered in the liquid storage casing 10. In one embodiment, the circuit board 30 and the coil assembly 2011 are integrally formed in the spacer portion 104 of the liquid storage case 10, and the magnetic pole regions 204 of the lower edge portion 2033 of the blades 2031 are correspondingly covered. The coil group 2011 in the spacer 104 of the liquid storage case 10 is induced to be excited.

因此藉由本創作的水冷裝置1的設計,使得可達到薄型化及減少儲液殼體10整體體積的效果,進而還有效達到定子201防水及減少(或縮短)定子201與轉子202彼此之間的厚度間距。 Therefore, by the design of the water-cooling device 1 of the present invention, the effect of thinning and reducing the overall volume of the liquid storage casing 10 can be achieved, and the stator 201 can be effectively waterproofed and reduced (or shortened) between the stator 201 and the rotor 202. Thickness spacing.

惟以上所述者,僅係本創作之較佳可行之實施例而已,舉凡利用本創作上述之方法、形狀、構造、裝置所為之變化,皆應包含於本案之權利範圍內。 However, the above descriptions are only preferred embodiments of the present invention, and variations of the methods, shapes, structures, and devices described above are intended to be included in the scope of the present invention.

1‧‧‧水冷裝置 1‧‧‧Water cooling unit

10‧‧‧儲液殼體 10‧‧‧Liquid housing

101‧‧‧液體室 101‧‧‧Liquid room

102‧‧‧入口 102‧‧‧ entrance

103‧‧‧出口 103‧‧‧Export

109‧‧‧墊圈 109‧‧‧Washers

20‧‧‧泵浦 20‧‧‧ pump

201‧‧‧定子 201‧‧‧ Stator

2011‧‧‧線圈組 2011‧‧‧ coil group

202‧‧‧轉子 202‧‧‧Rotor

2021‧‧‧軸心 2021‧‧‧Axis

203‧‧‧推動器 203‧‧‧ Pusher

2031‧‧‧葉片 2031‧‧‧ blades

2032‧‧‧上緣部 2032‧‧‧Top edge

2033‧‧‧下緣部 2033‧‧‧The lower edge

2034‧‧‧前緣部 2034‧‧‧ Front edge

204‧‧‧磁極區 204‧‧‧Magnetic pole area

30‧‧‧電路板 30‧‧‧ boards

31‧‧‧保護膜 31‧‧‧Protective film

Claims (14)

一種水冷裝置,包括:一儲液殼體,具有一液體室、一入口及一出口,該液體室連通該入口及出口,用以供一冷卻液體通過其內;及一泵浦,用以循環該冷卻液體,其包含一定子與一轉子,該定子具有一線圈組設於一電路板上且彼此電性連接,該電路板與其上該線圈組選擇設在該液體室的至少一內壁上或一體包射成型在該儲液殼體內,且該電路板與其上該線圈組跟該冷卻液體相隔離,該轉子與相對連接的一推動器容設於該液體室內且暴露在該冷卻液體中,並該推動器設有複數金屬材質構成的葉片,該每一葉片具有至少一磁極區從該葉片相對該線圈組的一位置上所充磁形成,且該每一葉片的磁極區與相對該線圈組感應激磁。 A water cooling device comprising: a liquid storage casing having a liquid chamber, an inlet and an outlet, the liquid chamber communicating the inlet and the outlet for a cooling liquid to pass therethrough; and a pump for circulating The cooling liquid comprises a stator and a rotor, the stator has a coil set on a circuit board and is electrically connected to each other, and the circuit board and the coil set thereon are selectively disposed on at least one inner wall of the liquid chamber Or integrally formed in the liquid storage casing, and the circuit board and the coil assembly thereon are separated from the cooling liquid, and the rotor and the oppositely connected pusher are accommodated in the liquid chamber and exposed to the cooling liquid. And the pusher is provided with blades made of a plurality of metal materials, each of the blades having at least one magnetic pole region formed by magnetization from a position of the blade relative to the coil assembly, and the magnetic pole region of each blade and the opposite pole The coil set senses excitation. 如申請專利範圍第1項所述之水冷裝置,其中該每一葉片的一上緣部或一下緣部軸向充磁形成該磁極區,一保護膜包覆該電路板與該線圈組的外側,並包覆有該保護膜的該電路板與該線圈組一起設於該液體室內的一內壁頂側或一內壁底側上,且對應該等葉片的磁極區。 The water-cooling device of claim 1, wherein an upper edge portion or a lower edge portion of each blade is axially magnetized to form the magnetic pole region, and a protective film covers the circuit board and the outer side of the coil assembly. And the circuit board covered with the protective film is disposed on the inner wall top side or the inner wall bottom side of the liquid chamber together with the coil group, and corresponds to the magnetic pole region of the blade. 如申請專利範圍第1項所述之水冷裝置,其中該每一葉片的一前緣部徑向充磁形成該磁極區,一保護膜包覆該電路板與該線圈組的外側,並包覆有該保護膜的該電路板與該線圈組一起設於該液體室內的一內壁周側上,且對應該等葉片的磁極區。 The water-cooling device of claim 1, wherein a front edge portion of each of the blades is radially magnetized to form the magnetic pole region, and a protective film covers the circuit board and the outer side of the coil assembly, and is covered The circuit board having the protective film is provided on the inner peripheral side of the inner wall of the liquid chamber together with the coil group, and corresponds to the magnetic pole region of the blade. 如申請專利範圍第1項所述之水冷裝置,其中該每一葉片的一上緣部或一下緣部軸向充磁形成該磁極區,該電路板與該線圈組一體包射 成型在該儲液殼體的一頂部或一底部內,且對應該等葉片的磁極區,並該電路板與該定子位於該液體室外,且該儲液殼體阻擋隔離該冷卻液體接觸該定子與該電路板。 The water-cooling device of claim 1, wherein an upper edge portion or a lower edge portion of each of the blades is axially magnetized to form the magnetic pole region, and the circuit board is integrally packaged with the coil assembly. Forming in a top or a bottom of the liquid storage shell, and corresponding to the magnetic pole region of the blade, and the circuit board and the stator are located outside the liquid, and the liquid storage housing blocks the cooling liquid from contacting the stator With the board. 如申請專利範圍第1項所述之水冷裝置,其中該每一葉片的一前緣部徑向充磁形成該磁極區,該電路板與該線圈組一體包射成型在該儲液殼體的一側周部內,且對應該等葉片的前緣部之磁極區,並該電路板與該定子位於該液體室外,且該儲液殼體阻擋隔離該冷卻液體接觸該定子與該電路板。 The water-cooling device of claim 1, wherein a front edge portion of each of the blades is radially magnetized to form the magnetic pole region, and the circuit board is integrally formed with the coil assembly in the liquid storage casing. In one side of the circumference, and corresponding to the magnetic pole region of the leading edge portion of the blade, and the circuit board and the stator are located outside the liquid chamber, and the liquid storage housing blocks the cooling liquid from contacting the stator and the circuit board. 如申請專利範圍第1項所述之水冷裝置,其中該轉子具有一軸心,該軸心的一端連接該推動器,其另一端則軸設在該液體室的內壁上,並該入口與出口分別設置在該儲液殼體的兩側邊。 The water-cooling device of claim 1, wherein the rotor has an axial center, one end of the shaft is connected to the pusher, and the other end is axially disposed on an inner wall of the liquid chamber, and the inlet is The outlets are respectively disposed on both sides of the liquid storage casing. 如申請專利範圍第1項所述之水冷裝置,該水冷裝置更包含一熱交換元件,該熱交換元件連接相對該儲液殼體,且該熱交換元件具有一熱接觸面與一熱交換面,該熱交換面與該液體室內的冷卻液體接觸。 The water-cooling device according to claim 1, wherein the water-cooling device further comprises a heat exchange element connected to the liquid storage case, and the heat exchange element has a thermal contact surface and a heat exchange surface. The heat exchange surface is in contact with the cooling liquid in the liquid chamber. 如申請專利範圍第1項所述之水冷裝置,其中該水冷裝置更包含一熱交換元件,該熱交換元件連接相對該儲液殼體,該儲液殼體更具有一間隔部、至少一貫孔及一水流通道,該間隔部形成在該儲液殼體內中央處,且與該儲液殼體及該熱交換元件共同界定前述液體室及一連通該出口的熱交換腔室,該貫孔係開設該間隔部上且連通該入口及該液體室,該液體室位於該熱交換腔室上方,該水流通道設於該液體室與該液體室內壁周側之間,且貫通該間隔部,以連通該熱交換腔室。 The water-cooling device of claim 1, wherein the water-cooling device further comprises a heat exchange element connected to the liquid storage housing, the liquid storage housing further having a spacing portion, at least a consistent hole And a water flow passage formed at a center of the liquid storage casing, and cooperating with the liquid storage casing and the heat exchange element to define the liquid chamber and a heat exchange chamber communicating with the outlet, the through hole system Opening the partition portion and communicating the inlet and the liquid chamber, the liquid chamber is located above the heat exchange chamber, and the water flow passage is disposed between the liquid chamber and the circumferential side of the liquid chamber wall, and penetrates the partition portion to The heat exchange chamber is connected. 如申請專利範圍第8項所述之水冷裝置,其中該熱交換元件具有一熱接觸面與一熱交換面,該熱交換面與該熱交換腔室內的冷卻液體接觸。 The water-cooling device of claim 8, wherein the heat exchange element has a thermal contact surface and a heat exchange surface, the heat exchange surface being in contact with a cooling liquid in the heat exchange chamber. 如申請專利範圍第8項所述之水冷裝置,其中該水流通道具有一第一傾斜面,該第一傾斜面係從位於該液體室內的水流通道底側朝貫穿該間隔部處向下延伸傾斜所構成,該熱交換腔室相對該水流通道的內壁上具有一第二傾斜面,該第二傾斜面相鄰連接相對該第一傾斜面。 The water-cooling device of claim 8, wherein the water flow passage has a first inclined surface that extends downward from a bottom side of the water flow passage located in the liquid chamber toward the partition portion. The heat exchange chamber has a second inclined surface opposite to the inner wall of the water flow passage, and the second inclined surface is adjacently connected to the first inclined surface. 如申請專利範圍第10項所述之水冷裝置,其中該第一傾斜面的高度係高於該第二傾斜面,使該第一、二傾斜面之間形成一高低差,並該的第一傾斜面與第二傾斜面大致呈垂直。 The water-cooling device of claim 10, wherein the height of the first inclined surface is higher than the second inclined surface, so that a height difference is formed between the first and second inclined surfaces, and the first The inclined surface is substantially perpendicular to the second inclined surface. 如申請專利範圍第8項所述之水冷裝置,其中該每一葉片的一上緣部或一下緣部軸向充磁形成該磁極區,一保護膜包覆該電路板與該線圈組的外側,並包覆有該保護膜的該電路板與該線圈組一起設於該液體室內的一內壁頂側或一內壁底側上,且對應該等葉片的磁極區。 The water-cooling device of claim 8, wherein an upper edge portion or a lower edge portion of each blade is axially magnetized to form the magnetic pole region, and a protective film covers the circuit board and the outer side of the coil assembly. And the circuit board covered with the protective film is disposed on the inner wall top side or the inner wall bottom side of the liquid chamber together with the coil group, and corresponds to the magnetic pole region of the blade. 如申請專利範圍第8項所述之水冷裝置,其中該每一葉片的一上緣部或一下緣部軸向充磁形成該磁極區,該電路板與該線圈組一體包射成型在該儲液殼體的一頂部或該間隔部內,且對應該等葉片的磁極區,並該電路板與該定子位於該液體室外,且該儲液殼體阻擋隔離該冷卻液體接觸該定子與該電路板。 The water-cooling device of claim 8, wherein an upper edge portion or a lower edge portion of each of the blades is axially magnetized to form the magnetic pole region, and the circuit board is integrally formed with the coil assembly in the storage. a top portion of the liquid housing or the spacing portion, and corresponding to the magnetic pole region of the blade, and the circuit board and the stator are located outside the liquid chamber, and the liquid storage housing blocks the cooling liquid from contacting the stator and the circuit board . 如申請專利範圍第1項所述之水冷裝置,其中該線圈組選擇以一印刷方式或一堆疊方式或蝕刻或佈線方式形成設於該電路板上。 The water-cooling device of claim 1, wherein the coil set is selected to be formed on the circuit board in a printing manner or a stacking manner or etching or wiring.
TW105207692U 2016-05-25 2016-05-25 Water cooling equipment TWM531608U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI687152B (en) * 2018-10-19 2020-03-01 技嘉科技股份有限公司 Liquid cooling block and liquid cooling heatdissipation system
CN111081657A (en) * 2018-10-19 2020-04-28 技嘉科技股份有限公司 Liquid cooling head and liquid cooling type heat dissipation system
TWI718903B (en) * 2020-03-13 2021-02-11 兆勤科技股份有限公司 Heat dissipation device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI687152B (en) * 2018-10-19 2020-03-01 技嘉科技股份有限公司 Liquid cooling block and liquid cooling heatdissipation system
CN111081657A (en) * 2018-10-19 2020-04-28 技嘉科技股份有限公司 Liquid cooling head and liquid cooling type heat dissipation system
CN111081657B (en) * 2018-10-19 2021-07-27 技嘉科技股份有限公司 Liquid cooling head and liquid cooling type heat dissipation system
TWI718903B (en) * 2020-03-13 2021-02-11 兆勤科技股份有限公司 Heat dissipation device

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