JP6323051B2

JP6323051B2 - Evaporator, cooling device, information processing device

Info

Publication number: JP6323051B2
Application number: JP2014029764A
Authority: JP
Inventors: 中西　輝; 輝中西; 林　信幸; 信幸林
Original assignee: Fujitsu Ltd
Current assignee: Fujitsu Ltd
Priority date: 2014-02-19
Filing date: 2014-02-19
Publication date: 2018-05-16
Anticipated expiration: 2034-02-19
Also published as: JP2015154057A

Description

本願の開示する技術は、蒸発器、冷却装置、情報処理装置に関する。 The technology disclosed in the present application relates to an evaporator, a cooling device, and an information processing device.

発熱部品からの熱によって作動液を気化させる蒸発器と、気化した作動液を冷却して該作動液を液化させる凝縮器と、を有する冷却装置が知られている。 There is known a cooling device having an evaporator that vaporizes a working fluid by heat from a heat-generating component, and a condenser that cools the vaporized working fluid and liquefies the working fluid.

特開２００９−８８１２５号公報JP 2009-88125 A 特開２０１３−５５３５５号公報JP 2013-55355 A 特開２００１−２８４１６号公報JP 2001-28416 A

前述のような装置では、蒸発器内で蒸気が滞留すると、蒸気膜が蒸発器の受熱部分を覆って冷却性能が低下する場合がある。このため、蒸発器における蒸気の排出性を向上させることが望まれる。そこで、本願の開示する技術は、一つの側面として、蒸発器における蒸気の排出性を向上させることを目的とする。 In the apparatus as described above, when the vapor stays in the evaporator, the vapor film may cover the heat receiving portion of the evaporator and the cooling performance may be lowered. For this reason, it is desirable to improve the vapor | steam discharge | emission property in an evaporator. Then, the technique which this application discloses aims at improving the exhaustibility of the vapor | steam in an evaporator as one side surface.

上記課題を解決するために、本願の開示する技術によれば、筐体と、排出側流路と、流入側流路と、を備える蒸発器が提供される。筐体は、発熱体からの熱を受ける受熱壁部を含んで形成される。また、筐体は、流入口及び排出口を有する。排出側流路は、筐体の内部に形成される。また、排出側流路は、排出口と連通する。流入側流路は、筐体の内部に受熱壁部の内壁面に沿って形成される。また、流入側流路は、上流端部が流入口と連通すると共に下流端部が排出側流路と連通する。さらに、流入側流路は、発熱体と受熱壁部とが対向する対向方向に沿った流路高さが、排出側流路における流路高さよりも低い。流入側流路に接して受熱壁部に対向する対向壁は、対向方向を厚さ方向として形成される。 In order to solve the above problems, according to the technology disclosed in the present application, an evaporator including a housing, a discharge-side flow path, and an inflow-side flow path is provided. The housing is formed including a heat receiving wall portion that receives heat from the heating element. Further, the housing has an inflow port and a discharge port. The discharge side flow path is formed inside the housing. Moreover, the discharge side flow path communicates with the discharge port. The inflow side flow path is formed inside the housing along the inner wall surface of the heat receiving wall portion. Further, the upstream end portion of the inflow side flow passage communicates with the inflow port, and the downstream end portion thereof communicates with the discharge side flow passage. Furthermore, in the inflow side flow path, the flow path height along the facing direction in which the heating element and the heat receiving wall portion face each other is lower than the flow path height in the discharge side flow path. The facing wall that is in contact with the inflow side flow path and faces the heat receiving wall is formed with the facing direction as the thickness direction.

本願の開示する技術によれば、蒸発器における蒸気の排出性を向上させることができる。 According to the technology disclosed in the present application, it is possible to improve the vapor discharge performance in the evaporator.

本実施形態に係る情報処理装置を示す概略図である。It is the schematic which shows the information processing apparatus which concerns on this embodiment. 図１に示す情報処理装置の２−２線断面図である。FIG. 2 is a cross-sectional view of the information processing apparatus illustrated in FIG. 本実施形態に係る蒸発器の斜視図である。It is a perspective view of the evaporator concerning this embodiment. 本実施形態に係る蒸発器の平面図である。It is a top view of the evaporator concerning this embodiment. 本実施形態に係る板体の斜視図である。It is a perspective view of the plate which concerns on this embodiment. 流入側流路の流路高さと冷却性能との関係と示したグラフである。It is the graph which showed the relationship between the flow path height of an inflow side flow path, and cooling performance. 変形例に係る蒸発器を示す断面図である。It is sectional drawing which shows the evaporator which concerns on a modification. 変形例に係る蒸発器を示す斜視図である。It is a perspective view which shows the evaporator which concerns on a modification. 変形例に係る蒸発器を示す断面図である。It is sectional drawing which shows the evaporator which concerns on a modification. 変形例に係る蒸発器を示す断面図である。It is sectional drawing which shows the evaporator which concerns on a modification. 変形例に係る板体を示す平面図である。It is a top view which shows the board which concerns on a modification. 比較例に係る蒸発器の断面図である。It is sectional drawing of the evaporator which concerns on a comparative example.

以下、本願の開示する技術の一実施形態を説明する。 Hereinafter, an embodiment of the technology disclosed in the present application will be described.

（情報処理装置１０）
情報処理装置１０について説明する。図１は、情報処理装置１０を示す概略図である。図２は、図１に示す情報処理装置１０の２−２線断面図である。図中の矢印ＵＰは、鉛直方向上方を示す。なお、鉛直方向に対する情報処理装置１０の向きは、矢印ＵＰで示す向きに限られない。 (Information processing apparatus 10)
The information processing apparatus 10 will be described. FIG. 1 is a schematic diagram illustrating the information processing apparatus 10. 2 is a cross-sectional view of the information processing apparatus 10 shown in FIG. An arrow UP in the figure indicates the upward direction in the vertical direction. Note that the direction of the information processing apparatus 10 with respect to the vertical direction is not limited to the direction indicated by the arrow UP.

情報処理装置１０は、図１に示されるように、装置本体１２を有する。装置本体１２の内部には、基板としてのシステムボード１４が設けられる。システムボード１４上には、図２に示されるように、情報を処理する電子回路１６（発熱体の一例）が設けられる。電子回路１６は、冷却対象となる部品である。この電子回路１６は、一例として、直方体形状（板状）とされる。なお、冷却対象となる部品としては、電子回路１６に限られず、発熱する発熱体であればよい。 As illustrated in FIG. 1, the information processing apparatus 10 includes an apparatus body 12. A system board 14 as a substrate is provided inside the apparatus main body 12. On the system board 14, as shown in FIG. 2, an electronic circuit 16 (an example of a heating element) for processing information is provided. The electronic circuit 16 is a component to be cooled. For example, the electronic circuit 16 has a rectangular parallelepiped shape (plate shape). The component to be cooled is not limited to the electronic circuit 16 and may be any heat generating element that generates heat.

さらに、システムボード１４上には、電子回路１６の熱を拡散させるスプレッダー２２が設けられる。スプレッダー２２は、システムボード１４側（下方側）が開放された直方体形の箱状とされる。スプレッダー２２には、熱伝導性に優れた材料が用いられる。具体的には、スプレッダー２２には、例えば、アルミニウム、銅などの金属が用いられる。 Furthermore, a spreader 22 that diffuses the heat of the electronic circuit 16 is provided on the system board 14. The spreader 22 has a rectangular parallelepiped box shape with the system board 14 side (lower side) open. A material having excellent thermal conductivity is used for the spreader 22. Specifically, for example, a metal such as aluminum or copper is used for the spreader 22.

電子回路１６の外面１６Ａとスプレッダー２２の内面２２Ｂとは、接合剤２３により接合される。接合剤２３としては、例えば、合金等の金属材料、グリス、エラストマーなどが用いられる。 The outer surface 16 A of the electronic circuit 16 and the inner surface 22 B of the spreader 22 are bonded by a bonding agent 23. As the bonding agent 23, for example, a metal material such as an alloy, grease, an elastomer, or the like is used.

さらに、情報処理装置１０は、図１に示されるように、電子回路１６を冷却する冷却装置７０を備える。冷却装置７０は、蒸発器３０と、液管７２と、ポンプ７４と、蒸気管７６と、凝縮器７８と、ファン８０と、を有する。 Furthermore, the information processing apparatus 10 includes a cooling device 70 that cools the electronic circuit 16 as illustrated in FIG. 1. The cooling device 70 includes an evaporator 30, a liquid pipe 72, a pump 74, a steam pipe 76, a condenser 78, and a fan 80.

液管７２は、液体の一例としての作動液２００（図２参照）を蒸発器３０へ送るための管である。具体的には、液管７２の上流端部は、凝縮器７８と連通する。液管７２の下流端部は、蒸発器３０の後述の流入口５３と連通する。このように、液管７２は、凝縮器７８と蒸発器３０とに接続される。 The liquid pipe 72 is a pipe for sending the working liquid 200 (see FIG. 2) as an example of the liquid to the evaporator 30. Specifically, the upstream end of the liquid pipe 72 communicates with the condenser 78. The downstream end of the liquid pipe 72 communicates with an inlet 53 described later of the evaporator 30. Thus, the liquid pipe 72 is connected to the condenser 78 and the evaporator 30.

ポンプ７４は、液管７２に配置される。このポンプ７４は、液管７２を通じて、凝縮器７８から蒸発器３０へ作動液２００を送る。作動液２００には、一例として、純水が用いられる。なお、作動液２００としては、純水に限られない。例えば、作動液２００として、アルコール、フッ化炭素などを用いてもよい。なお、冷却装置７０（蒸発器３０、液管７２、蒸気管７６及び凝縮器７８）の内部に作動液２００及び作動液２００の飽和蒸気のみが存在するように、作動液２００が冷却装置７０内に封入される。具体的には、作動液２００は、冷却装置７０の内部を一旦真空引きしてから、冷却装置７０内に封入される。 The pump 74 is disposed in the liquid pipe 72. The pump 74 sends the working liquid 200 from the condenser 78 to the evaporator 30 through the liquid pipe 72. For example, pure water is used for the hydraulic fluid 200. The hydraulic fluid 200 is not limited to pure water. For example, as the hydraulic fluid 200, alcohol, carbon fluoride, or the like may be used. The working fluid 200 is contained in the cooling device 70 so that only the working fluid 200 and the saturated vapor of the working fluid 200 exist inside the cooling device 70 (the evaporator 30, the liquid pipe 72, the steam pipe 76, and the condenser 78). Enclosed. Specifically, the working fluid 200 is evacuated once inside the cooling device 70 and then sealed in the cooling device 70.

蒸発器３０は、電子回路１６からの熱によって作動液２００を沸騰させて、蒸気を発生させる。なお、蒸発器３０の具体的な構造については、後述する。 The evaporator 30 boils the working fluid 200 with heat from the electronic circuit 16 and generates steam. The specific structure of the evaporator 30 will be described later.

蒸気管７６は、蒸発器３０で発生した蒸気を凝縮器７８へ送るための管である。具体的には、蒸気管７６の下流端部は、凝縮器７８と連通する。蒸気管７６の上流端部は、複数に分岐する。この蒸気管７６の上流端部は、蒸発器３０の後述の排出口５５の各々と連通する。このように、液管７２は、凝縮器７８と蒸発器３０とに接続される。これにより、排出口５５の各々から排出された蒸気は、蒸気管７６内で合流して、凝縮器７８へ送られる。 The steam pipe 76 is a pipe for sending the steam generated in the evaporator 30 to the condenser 78. Specifically, the downstream end of the steam pipe 76 communicates with the condenser 78. The upstream end of the steam pipe 76 branches into a plurality. The upstream end portion of the steam pipe 76 communicates with each of outlets 55 described later of the evaporator 30. Thus, the liquid pipe 72 is connected to the condenser 78 and the evaporator 30. Thereby, the steam discharged from each of the discharge ports 55 merges in the steam pipe 76 and is sent to the condenser 78.

凝縮器７８は、作動液２００の蒸気を冷却して当該蒸気を液体に変化させる。すなわち、凝縮器７８は、蒸発器３０からの蒸気を液体に戻す。この凝縮器７８は、ファン８０の風が当たることで放熱される。 The condenser 78 cools the vapor of the working fluid 200 and changes the vapor into a liquid. That is, the condenser 78 returns the vapor from the evaporator 30 to a liquid. The condenser 78 dissipates heat when the wind of the fan 80 hits it.

（蒸発器３０）
蒸発器３０について説明する。図３は、蒸発器３０の斜視図である。図４は、蒸発器３０の平面図である。図５は、蒸発器３０が有する板体４４の斜視図である。 (Evaporator 30)
The evaporator 30 will be described. FIG. 3 is a perspective view of the evaporator 30. FIG. 4 is a plan view of the evaporator 30. FIG. 5 is a perspective view of the plate body 44 included in the evaporator 30.

蒸発器３０は、図２及び図３に示されるように、液体の一例としての作動液２００が流入される筐体（容器）４０を備える。筐体４０は、板体４４側（下方側）が開放された箱状に形成された箱体５０と、板状に形成された板体４４と、を有する。 As shown in FIGS. 2 and 3, the evaporator 30 includes a housing (container) 40 into which a working fluid 200 as an example of a liquid flows. The housing 40 includes a box 50 formed in a box shape in which the plate body 44 side (lower side) is opened, and a plate body 44 formed in a plate shape.

箱体５０は、第１対向壁５２と、第２対向壁５４と、内周壁５６と、外周壁５８と、を有する。第１対向壁５２及び第２対向壁５４は、図２に示されるように、板体４４に対向する壁である。具体的には、第１対向壁５２及び第２対向壁５４は、筐体４０の天板部分とされる。 The box 50 has a first opposing wall 52, a second opposing wall 54, an inner peripheral wall 56, and an outer peripheral wall 58. As shown in FIG. 2, the first opposing wall 52 and the second opposing wall 54 are walls that face the plate body 44. Specifically, the first opposing wall 52 and the second opposing wall 54 are the top plate portion of the housing 40.

第１対向壁５２は、図３及び図４に示されるように、平面視にて矩形状に形成される。また、第１対向壁５２は、平面視にて、電子回路１６と重なる位置に配置される（図２参照）。第２対向壁５４は、平面視にて第１対向壁５２を囲む枠状に形成される。 As shown in FIGS. 3 and 4, the first opposing wall 52 is formed in a rectangular shape in plan view. Moreover, the 1st opposing wall 52 is arrange | positioned in the position which overlaps with the electronic circuit 16 by planar view (refer FIG. 2). The second opposing wall 54 is formed in a frame shape surrounding the first opposing wall 52 in plan view.

また、第２対向壁５４は、図２に示されるように、第１対向壁５２よりも高い位置に配置される。これにより、第２対向壁５４から板体４４までの距離は、第１対向壁５２から板体４４までの距離よりも長い。 Moreover, the 2nd opposing wall 54 is arrange | positioned in the position higher than the 1st opposing wall 52, as FIG. 2 shows. Accordingly, the distance from the second opposing wall 54 to the plate body 44 is longer than the distance from the first opposing wall 52 to the plate body 44.

第１対向壁５２の平面視における中央部には、図４に示されるように、作動液２００を筐体４０内へ流入させる流入口５３が形成される。枠状の第２対向壁５４の各辺には、蒸気を筐体４０から排出する排出口５５が形成される。すなわち、排出口５５は、第２対向壁５４の周方向に沿って４つ配置される。 As shown in FIG. 4, an inflow port 53 through which the working fluid 200 flows into the housing 40 is formed at the center of the first facing wall 52 in plan view. On each side of the frame-shaped second opposing wall 54, a discharge port 55 for discharging the steam from the housing 40 is formed. That is, four discharge ports 55 are arranged along the circumferential direction of the second opposing wall 54.

内周壁５６は、第２対向壁５４の内周側に配置された壁である。この内周壁５６は、平面視にて、第２対向壁５４の内周縁に沿って枠状に形成される。また、内周壁５６は、図２に示されるように、外周壁５８と対向する。 The inner peripheral wall 56 is a wall disposed on the inner peripheral side of the second opposing wall 54. The inner peripheral wall 56 is formed in a frame shape along the inner peripheral edge of the second opposing wall 54 in plan view. Moreover, the inner peripheral wall 56 faces the outer peripheral wall 58 as shown in FIG.

内周壁５６の下端部は、第１対向壁５２の外周部分と接続される。内周壁５６の上端部は、第２対向壁５４の内周部分と接続される。これにより、内周壁５６は、第１対向壁５２と第２対向壁５４とを連結する。この内周壁５６と第１対向壁５２によって、凹部５９が形成される。第１対向壁５２が凹部５９の底壁として機能する。 The lower end portion of the inner peripheral wall 56 is connected to the outer peripheral portion of the first opposing wall 52. The upper end portion of the inner peripheral wall 56 is connected to the inner peripheral portion of the second opposing wall 54. Thereby, the inner peripheral wall 56 connects the first opposing wall 52 and the second opposing wall 54. A recess 59 is formed by the inner peripheral wall 56 and the first opposing wall 52. The first opposing wall 52 functions as the bottom wall of the recess 59.

外周壁５８は、第２対向壁５４の外周側に配置された壁である。この外周壁５８は、平面視にて、第２対向壁５４の外周縁に沿って枠状に形成される。外周壁５８の下端部が、板体４４の外周部分と接続される。外周壁５８の上端部は、第２対向壁５４の外周部分と接続される。これにより、外周壁５８は、第２対向壁５４と板体４４とを連結する。 The outer peripheral wall 58 is a wall disposed on the outer peripheral side of the second opposing wall 54. The outer peripheral wall 58 is formed in a frame shape along the outer peripheral edge of the second opposing wall 54 in plan view. The lower end portion of the outer peripheral wall 58 is connected to the outer peripheral portion of the plate body 44. The upper end portion of the outer peripheral wall 58 is connected to the outer peripheral portion of the second opposing wall 54. Thereby, the outer peripheral wall 58 connects the second opposing wall 54 and the plate body 44.

板体４４は、具体的には、平板とされる。この板体４４の外壁面４４Ａ（下面）は、スプレッダー２２の外面２２Ａと、接合剤２５により接合される。これにより、板体４４は、電子回路１６からの熱を、スプレッダー２２を介して外壁面４４Ａで受ける。すなわち、板体４４は、電子回路１６からの熱を受ける壁部の一例として機能する。なお、接合剤２５としては、合金等の金属材料、グリス、エラストマー、などが用いられる。 Specifically, the plate 44 is a flat plate. The outer wall surface 44 A (lower surface) of the plate body 44 is bonded to the outer surface 22 A of the spreader 22 by the bonding agent 25. Thereby, the plate body 44 receives the heat from the electronic circuit 16 on the outer wall surface 44 A via the spreader 22. That is, the plate body 44 functions as an example of a wall portion that receives heat from the electronic circuit 16. As the bonding agent 25, a metal material such as an alloy, grease, an elastomer, or the like is used.

板体４４の内壁面４４Ｂ（上面）には、図５に示されるように、内壁面４４Ｂから第１対向壁５２側（上方側）へ突出する複数の突起４４Ｐが形成される。具体的には、図４に示されるように、突起４４Ｐは、所定の一方向（Ｙ方向）へ並んで配置された列が、該一方向（Ｙ方向）と直交する方向（Ｘ方向）に複数配列される。また、突起４４Ｐは、図５に示されるように、四角柱に形成される。なお、突起４４Ｐの形状は、四角柱に限られず、例えば、三角柱や円柱であってもよい。 On the inner wall surface 44B (upper surface) of the plate body 44, as shown in FIG. 5, a plurality of protrusions 44P projecting from the inner wall surface 44B to the first opposing wall 52 side (upper side) are formed. Specifically, as shown in FIG. 4, the protrusions 44 P are arranged in a direction (X direction) in which a row arranged in a predetermined direction (Y direction) is orthogonal to the one direction (Y direction). Multiple arrays. Further, the protrusion 44P is formed in a quadrangular prism as shown in FIG. The shape of the protrusion 44P is not limited to a quadrangular prism, and may be, for example, a triangular prism or a cylinder.

この複数の突起４４Ｐは、板体４４の平面視における中央部に配置される。具体的には、図２に示されるように、複数の突起４４Ｐは、第１対向壁５２に対向する位置に配置される。また、複数の突起４４Ｐは、第１対向壁５２との間に隙間を有する。さらに、複数の突起４４Ｐは、同じ高さで形成される。従って、各突起４４Ｐと第１対向壁５２との距離は一定である。 The plurality of protrusions 44 P are arranged at the center of the plate body 44 in plan view. Specifically, as shown in FIG. 2, the plurality of protrusions 44 P are arranged at positions facing the first facing wall 52. Further, the plurality of protrusions 44 P have gaps with the first opposing wall 52. Further, the plurality of protrusions 44P are formed at the same height. Accordingly, the distance between each protrusion 44P and the first opposing wall 52 is constant.

さらに、複数の突起４４Ｐは、平面視にて、電子回路１６と重なる位置に配置される（図２参照）。すなわち、複数の突起４４Ｐは、板体４４の内壁面４４Ｂに対する法線方向に見て、電子回路１６と重なる位置に配置される。このように、複数の突起４４Ｐが形成されることにより、板体４４の内壁面４４Ｂの表面積が増大される。 Further, the plurality of protrusions 44P are arranged at positions overlapping the electronic circuit 16 in plan view (see FIG. 2). That is, the plurality of protrusions 44 P are arranged at positions overlapping the electronic circuit 16 when viewed in the normal direction to the inner wall surface 44 B of the plate body 44. Thus, the surface area of the inner wall surface 44B of the plate body 44 is increased by forming the plurality of protrusions 44P.

板体４４の内壁面４４Ｂは、第２対向壁５４と対向する部分では、突起４４Ｐが形成されておらず、平坦に形成される。 The inner wall surface 44 B of the plate body 44 is not formed with the protrusions 44 P at a portion facing the second opposing wall 54, and is formed flat.

そして、板体４４と箱体５０を有する筐体４０の内部には、流入側流路６２と、排出側流路６４と、が形成される。流入側流路６２の上流端部は、流入口５３と連通する。流入側流路６２の下流端部は、排出側流路６４の上流端部と連通する。排出側流路６４の下流端部は、４つの排出口５５と連通する。 An inflow side flow path 62 and a discharge side flow path 64 are formed in the housing 40 having the plate body 44 and the box body 50. The upstream end of the inflow channel 62 communicates with the inflow port 53. The downstream end of the inflow side flow path 62 communicates with the upstream end of the discharge side flow path 64. The downstream end portion of the discharge side flow path 64 communicates with the four discharge ports 55.

流入側流路６２は、板体４４と第１対向壁５２とに接する。すなわち、流入側流路６２は、板体４４と第１対向壁５２との間に形成される。そして、板体４４の内壁面４４Ｂにおける流入側流路６２と接する面において、突起４４Ｐが形成される。 The inflow side flow path 62 is in contact with the plate body 44 and the first opposing wall 52. That is, the inflow side flow path 62 is formed between the plate body 44 and the first opposing wall 52. A projection 44P is formed on the surface of the inner wall surface 44B of the plate body 44 that is in contact with the inflow channel 62.

また、排出側流路６４は、板体４４と第２対向壁５４と接する。すなわち、排出側流路６４は、板体４４と第２対向壁５４との間に形成される。そして、板体４４の内壁面４４Ｂにおける排出側流路６４と接する面において、内壁面４４Ｂが平坦に形成される。また、排出側流路６４は、図４に示されるように、平面視にて、流入側流路６２を囲む枠状に形成される。すなわち、排出側流路６４は、内周壁５６の内壁面５６Ｂ及び外周壁５８の内壁面５８Ｂに沿ってつながった環状に形成される。そして、流入側流路６２は、排出側流路６４の内側に配置される。 Further, the discharge side flow path 64 is in contact with the plate body 44 and the second opposing wall 54. That is, the discharge side flow path 64 is formed between the plate body 44 and the second opposing wall 54. The inner wall surface 44B is formed flat on the surface of the inner wall surface 44B of the plate body 44 in contact with the discharge-side flow path 64. Further, as shown in FIG. 4, the discharge side flow path 64 is formed in a frame shape surrounding the inflow side flow path 62 in plan view. That is, the discharge-side flow path 64 is formed in an annular shape that is connected along the inner wall surface 56B of the inner peripheral wall 56 and the inner wall surface 58B of the outer peripheral wall 58. The inflow side flow path 62 is disposed inside the discharge side flow path 64.

そして、流入側流路６２は、流入口５３を通じて流入された作動液２００を電子回路１６の熱によって沸騰させることで、作動液２００を蒸気に変化させて排出側流路６４に送る。このように、電子回路１６の熱によって作動液２００を沸騰させることで、電子回路１６から作動液２００への熱移動が生じる。 Then, the inflow side flow path 62 causes the working liquid 200 that has flowed in through the inflow port 53 to boil by the heat of the electronic circuit 16, thereby changing the working liquid 200 into steam and sending it to the discharge side flow path 64. In this way, by boiling the hydraulic fluid 200 with the heat of the electronic circuit 16, heat transfer from the electronic circuit 16 to the hydraulic fluid 200 occurs.

排出側流路６４は、流入側流路６２から送られた蒸気が集合される流路である。従って、蒸気を集合させるのに十分な空間を確保すべく、後述の流路高さＨ２が設定される。そして、排出側流路６４は、集合させた蒸気を排出口５５を通じて排出する。流入側流路６２で生成された蒸気は、具体的には、作動液２００と共に、排出側流路６４へ送られた後、排出口５５から排出される。 The discharge side flow path 64 is a flow path in which the steam sent from the inflow side flow path 62 is collected. Accordingly, a flow path height H2, which will be described later, is set in order to ensure a sufficient space for collecting steam. The discharge side flow path 64 discharges the collected steam through the discharge port 55. Specifically, the steam generated in the inflow side flow path 62 is sent to the discharge side flow path 64 together with the hydraulic fluid 200 and then discharged from the discharge port 55.

なお、流入口５３から流入された作動液２００は、第１対向壁５２の内壁面５２Ｂ及び板体４４の内壁面４４Ｂに沿って、流入側流路６２及び排出側流路６４を流通する。具体的には、流入口５３から流入された作動液２００は、図４に示されるように、流入口５３から各排出口５５へ向かう方向（矢印Ａ参照）へ流入側流路６２及び排出側流路６４を流通する。そして、排出側流路６４へ送られた蒸気及び作動液２００は、内周壁５６の内壁面５６Ｂ及び外周壁５８の内壁面５８Ｂに沿って、排出口５５へ上方に流通する。 The hydraulic fluid 200 that has flowed in from the inlet 53 flows through the inflow side flow path 62 and the discharge side flow path 64 along the inner wall surface 52B of the first facing wall 52 and the inner wall surface 44B of the plate body 44. Specifically, as shown in FIG. 4, the working fluid 200 that has flowed in from the inflow port 53 moves in the direction from the inflow port 53 toward each discharge port 55 (see arrow A) and the inflow side flow path 62 and the discharge side. The flow path 64 is circulated. Then, the steam and the working fluid 200 sent to the discharge side flow path 64 circulate upward to the discharge port 55 along the inner wall surface 56B of the inner peripheral wall 56 and the inner wall surface 58B of the outer peripheral wall 58.

ここで、本実施形態では、流入側流路６２の流路高さＨ１が、排出側流路６４の流路高さＨ２よりも低い。流路高さＨ１は、電子回路１６と板体４４とが対向する対向方向（具体的には、上下方向）に沿った寸法である。流入側流路６２の流路高さＨ１は、具体的には、突起４４Ｐから第１対向壁５２までの高さである。すなわち、流入側流路６２の流路高さＨ１は、第１対向壁５２と板体４４との間における最も低い高さ部分で把握される。 Here, in the present embodiment, the flow path height H1 of the inflow side flow path 62 is lower than the flow path height H2 of the discharge side flow path 64. The flow path height H1 is a dimension along the facing direction (specifically, the vertical direction) in which the electronic circuit 16 and the plate body 44 face each other. The flow path height H1 of the inflow side flow path 62 is specifically the height from the protrusion 44P to the first opposing wall 52. That is, the flow path height H 1 of the inflow side flow path 62 is grasped at the lowest height portion between the first opposing wall 52 and the plate body 44.

なお、板体４４の内壁面４４Ｂから第１対向壁５２の内壁面５２Ｂまでの流路高さも、排出側流路６４の流路高さＨ２より低い。排出側流路６４の流路高さＨ２は、具体的には、板体４４の内壁面４４Ｂから第２対向壁５４の内壁面５４Ｂまでの高さである。 The flow path height from the inner wall surface 44B of the plate body 44 to the inner wall surface 52B of the first opposing wall 52 is also lower than the flow path height H2 of the discharge side flow path 64. The flow path height H2 of the discharge side flow path 64 is specifically the height from the inner wall surface 44B of the plate body 44 to the inner wall surface 54B of the second opposing wall 54.

また、流路高さＨ１は、流入側流路６２の流通方向において、一定である。板体４４の内壁面４４Ｂから第１対向壁５２の内壁面５２Ｂまでの流路高さも、流入側流路６２の流通方向において、一定である。また、流路高さＨ２も、排出側流路６４の周方向に沿って一定である。 Further, the flow path height H 1 is constant in the flow direction of the inflow side flow path 62. The flow path height from the inner wall surface 44B of the plate body 44 to the inner wall surface 52B of the first opposing wall 52 is also constant in the flow direction of the inflow side flow path 62. Further, the flow path height H 2 is also constant along the circumferential direction of the discharge side flow path 64.

（本実施形態の作用）
本実施形態の作用について説明する。 (Operation of this embodiment)
The operation of this embodiment will be described.

本実施形態では、図１に示されるように、ポンプ７４が、液管７２を通じて、凝縮器７８から蒸発器３０へ作動液２００（図２参照）を送る。蒸発器３０へ送られた作動液２００は、流入口５３を通じて、図２に示されるように、筐体４０内の流入側流路６２へ流入する。流入側流路６２へ流入した作動液２００は、その一部が電子回路１６の熱によって蒸気に変化し、板体４４の内壁面４４Ｂに沿って排出側流路６４へ送られる。 In the present embodiment, as shown in FIG. 1, the pump 74 sends the working fluid 200 (see FIG. 2) from the condenser 78 to the evaporator 30 through the liquid pipe 72. The hydraulic fluid 200 sent to the evaporator 30 flows into the inflow side flow path 62 in the housing 40 through the inlet 53 as shown in FIG. A part of the hydraulic fluid 200 that has flowed into the inflow side flow path 62 is changed into vapor by the heat of the electronic circuit 16, and is sent to the discharge side flow path 64 along the inner wall surface 44 B of the plate body 44.

そして、排出側流路６４へ送られた作動液２００及び蒸気は、排出口５５を通じて蒸気管７６に排出される。蒸気管７６に排出された作動液２００及び蒸気は、図１に示されるように、凝縮器７８へ送られ、蒸気が凝縮器７８で冷却されて液体に戻される。 Then, the hydraulic fluid 200 and the steam sent to the discharge side flow path 64 are discharged to the steam pipe 76 through the discharge port 55. As shown in FIG. 1, the working fluid 200 and the steam discharged to the steam pipe 76 are sent to the condenser 78, and the steam is cooled by the condenser 78 and returned to the liquid.

ここで、本実施形態では、図２に示されるように、流入側流路６２の流路高さＨ１が、排出側流路６４の流路高さＨ２よりも低い。従って、筐体４０内の図２における奥行方向の寸法が同じ範囲において、流入側流路６２の流路断面積も、排出側流路６４の流路断面積よりも小さい。これにより、流入側流路６２での作動液２００の流速が、排出側流路６４での作動液２００の流速よりも速くなる。このため、作動液２００から変化した蒸気による気泡３００が、流入側流路６２で滞留せず、排出側流路６４へ流れる。 Here, in the present embodiment, as shown in FIG. 2, the flow path height H 1 of the inflow side flow path 62 is lower than the flow path height H 2 of the discharge side flow path 64. Therefore, the flow path cross-sectional area of the inflow side flow path 62 is also smaller than the flow path cross-sectional area of the discharge side flow path 64 within the same range in the depth direction in FIG. As a result, the flow rate of the hydraulic fluid 200 in the inflow channel 62 is faster than the flow rate of the hydraulic fluid 200 in the discharge channel 64. For this reason, the bubble 300 due to the vapor changed from the working fluid 200 does not stay in the inflow side flow path 62 but flows into the discharge side flow path 64.

そして、排出側流路６４へ流れた気泡３００は、排出側流路６４で集合して排出口５５から蒸気管７６へ排出される。このように、本実施形態の構造によれば、流入側流路６２での気泡３００の滞留が抑制されるので、流入側流路６２から排出側流路６４及び排出口５５への蒸気の流通が促進され、蒸気を排出口５５から排出する排出性が向上する。 Then, the bubbles 300 that have flowed to the discharge side flow path 64 gather in the discharge side flow path 64 and are discharged from the discharge port 55 to the steam pipe 76. As described above, according to the structure of the present embodiment, the bubbles 300 are prevented from staying in the inflow side flow path 62, so that the flow of steam from the inflow side flow path 62 to the discharge side flow path 64 and the discharge port 55. Is promoted, and the discharge performance of discharging steam from the discharge port 55 is improved.

一方、図１２に示されるように、流入口５３から排出口５５までの流路高さＨ３が一定である構造（比較例）では、流速も一定とされる。従って、図１２の構造では、平面視にて板体４４の電子回路１６と重なる部分に気泡３００が滞留して、作動液２００への伝熱が阻害される場合がある。 On the other hand, as shown in FIG. 12, in the structure (comparative example) in which the flow path height H3 from the inlet 53 to the outlet 55 is constant, the flow velocity is also constant. Therefore, in the structure of FIG. 12, the bubble 300 may stay in a portion overlapping the electronic circuit 16 of the plate body 44 in plan view, and heat transfer to the hydraulic fluid 200 may be hindered.

これに対して、本実施形態では、気泡３００が、流入側流路６２で滞留せず、作動液２００への伝熱が阻害されにくい。このため、冷却性能が向上する。 On the other hand, in this embodiment, the bubble 300 does not stay in the inflow side flow path 62, and the heat transfer to the working fluid 200 is not easily inhibited. For this reason, cooling performance improves.

図６は、排出側流路６４の流路高さＨ２が一定である場合における流入側流路６２の流路高さＨ１と冷却性能との関係と示したグラフである。図６に示されるように、排出側流路６４の流路高さＨ２が一定である場合に、流入側流路６２の流路高さＨ１を低くすると、冷却性能が高まることが分かる。 FIG. 6 is a graph showing the relationship between the channel height H1 of the inflow side channel 62 and the cooling performance when the channel height H2 of the discharge side channel 64 is constant. As shown in FIG. 6, it can be seen that when the flow path height H2 of the discharge side flow path 64 is constant, the cooling performance is improved if the flow path height H1 of the inflow side flow path 62 is lowered.

また、本実施形態では、板体４４の内壁面４４Ｂに突起４４Ｐが形成されることで、内壁面４４Ｂの表面積が増大される。これにより、突起４４Ｐが形成されていない構造に比べ、電子回路１６から作動液２００への伝熱が促進される。このため、冷却性能が向上する。 In the present embodiment, the protrusion 44P is formed on the inner wall surface 44B of the plate body 44, whereby the surface area of the inner wall surface 44B is increased. As a result, heat transfer from the electronic circuit 16 to the hydraulic fluid 200 is promoted compared to a structure in which the protrusions 44P are not formed. For this reason, cooling performance improves.

また、本実施形態では、突起４４Ｐが、平面視にて、電子回路１６と重なる領域に配置される。このため、突起４４Ｐと電子回路１６とが重なっていない構造に比べ、電子回路１６から作動液２００の伝熱が促進される。このため、冷却性能が向上する。 In the present embodiment, the protrusion 44P is disposed in a region overlapping the electronic circuit 16 in plan view. For this reason, compared with the structure where the protrusion 44P and the electronic circuit 16 do not overlap, the heat transfer of the hydraulic fluid 200 from the electronic circuit 16 is promoted. For this reason, cooling performance improves.

また、本実施形態では、排出側流路６４における板体４４の内壁面４４Ｂは、平坦に形成される。このため、気泡３００が内壁面４４Ｂに引っ掛かりにくく、気泡３００の集合が促進される。これにより、蒸気を排出口５５から排出する排出性が向上する。 In the present embodiment, the inner wall surface 44B of the plate body 44 in the discharge side flow path 64 is formed flat. For this reason, the bubbles 300 are not easily caught on the inner wall surface 44B, and the aggregation of the bubbles 300 is promoted. Thereby, the discharge property which discharges | emits a vapor | steam from the discharge port 55 improves.

また、本実施形態では、流入側流路６２は、環状の排出側流路６４の内側に配置される。このため、流入側流路６２から排出側流路６４へ放射状に作動液２００を流通させることが可能となる。これにより、流入側流路６２での気泡３００の滞留が抑制できる。 Further, in the present embodiment, the inflow side channel 62 is disposed inside the annular discharge side channel 64. For this reason, it becomes possible to distribute the working fluid 200 radially from the inflow side flow path 62 to the discharge side flow path 64. Thereby, retention of the bubble 300 in the inflow side flow path 62 can be suppressed.

また、本実施形態では、排出口５５は、排出側流路６４の周方向に沿って複数配置される。このため、排出側流路６４から気泡３００を排出する経路が複数確保される。これにより、蒸気を排出口５５から排出する排出性が向上する。 In the present embodiment, a plurality of the discharge ports 55 are arranged along the circumferential direction of the discharge side flow path 64. For this reason, a plurality of paths for discharging the bubbles 300 from the discharge side flow path 64 are secured. Thereby, the discharge property which discharges | emits a vapor | steam from the discharge port 55 improves.

（変形例）
実施形態の変形例について説明する。 (Modification)
A modification of the embodiment will be described.

上記実施形態では、排出側流路６４が流入側流路６２を囲む環状に形成されていたが、これに限られない。例えば、図７及び図８に示されるように、排出側流路６４が流入側流路６２の片側に配置される構造とされてもよい。図７及び図８に示す構造では、排出口５５が一つ設けられる。 In the above embodiment, the discharge side flow path 64 is formed in an annular shape surrounding the inflow side flow path 62, but is not limited thereto. For example, as shown in FIGS. 7 and 8, the discharge side flow path 64 may be arranged on one side of the inflow side flow path 62. In the structure shown in FIGS. 7 and 8, one discharge port 55 is provided.

また、上記実施形態では、突起４４Ｐが形成されていたが、図９に示されるように、突起４４Ｐが形成されていない構造であってもよい。図９に示す構造では、流入側流路６２の流路高さＨ１は、板体４４の内壁面４４Ｂから第１対向壁５２の内壁面５２Ｂまでの高さとされる。 In the above embodiment, the protrusion 44P is formed. However, as shown in FIG. 9, a structure in which the protrusion 44P is not formed may be used. In the structure shown in FIG. 9, the flow path height H 1 of the inflow side flow path 62 is a height from the inner wall surface 44 B of the plate body 44 to the inner wall surface 52 B of the first opposing wall 52.

また、上記実施形態では、筐体４０は、板体４４までの距離が異なる第１対向壁５２及び第２対向壁５４を有していたが、これに限られない。例えば、筐体４０は、図１０に示されるように、板体４４の内壁面４４Ｂまでの距離が一定とされた対向壁１５０を有していてもよい。図１０に示す構造では、突起４４Ｐが形成された領域が、流入側流路６２とされる。そして、流入側流路６２の外周側が、排出側流路６４とされる。流入側流路６２の流路高さＨ１は、突起４４Ｐから対向壁１５０までの高さである。排出側流路６４の流路高さＨ２は、板体４４の内壁面４４Ｂから対向壁１５０の内壁面１５０Ｂまでの高さである。従って、流入側流路６２の流路高さＨ１が、排出側流路６４の流路高さＨ２よりも低い。 Moreover, in the said embodiment, although the housing | casing 40 had the 1st opposing wall 52 and the 2nd opposing wall 54 from which the distance to the board 44 differs, it is not restricted to this. For example, as shown in FIG. 10, the housing 40 may have an opposing wall 150 in which the distance to the inner wall surface 44 B of the plate body 44 is constant. In the structure shown in FIG. 10, the region where the protrusion 44 P is formed is the inflow side flow path 62. The outer peripheral side of the inflow side flow path 62 is the discharge side flow path 64. A flow path height H1 of the inflow side flow path 62 is a height from the protrusion 44P to the opposing wall 150. The flow path height H 2 of the discharge side flow path 64 is a height from the inner wall surface 44 B of the plate body 44 to the inner wall surface 150 B of the facing wall 150. Therefore, the flow path height H1 of the inflow side flow path 62 is lower than the flow path height H2 of the discharge side flow path 64.

また、上記実施形態では、突起４４Ｐは、図４及び図５に示されるように、所定の一方向（Ｙ方向）へ並んで配置された列が、該一方向（Ｙ方向）と直交する方向（Ｘ方向）に複数配列されていたが、これに限られない。例えば、突起４４Ｐは、図１１に示されるように、平面視にて、板体４４の中央部から放射状に配置されていてもよい。図１１に示す構造では、流入側流路６２から排出側流路６４に作動液２００が流通する際に、突起４４Ｐが流通抵抗となりにくい。このため、気泡３００が流入側流路６２から排出側流路６４への移動が促進される。これにより、蒸気を排出口５５から排出する排出性が向上する。 In the above embodiment, as shown in FIGS. 4 and 5, the protrusion 44 P is a direction in which a row arranged in a predetermined direction (Y direction) is orthogonal to the one direction (Y direction). Although it arranged in multiple numbers (X direction), it is not restricted to this. For example, as shown in FIG. 11, the protrusions 44 P may be arranged radially from the center of the plate body 44 in plan view. In the structure shown in FIG. 11, when the hydraulic fluid 200 flows from the inflow side flow path 62 to the discharge side flow path 64, the protrusions 44P are unlikely to become flow resistance. For this reason, the movement of the bubble 300 from the inflow side flow path 62 to the discharge side flow path 64 is promoted. Thereby, the discharge property which discharges | emits a vapor | steam from the discharge port 55 improves.

また、上記複数の変形例は、適宜、組み合わされて実施されても良い。 In addition, the plurality of modified examples may be implemented in combination as appropriate.

以上、本願の開示する技術の実施形態について説明したが、本願の開示する技術は、上記に限定されるものでなく、上記以外にも、その主旨を逸脱しない範囲内において種々変形して実施可能であることは勿論である。 The embodiments of the technology disclosed in the present application have been described above. However, the technology disclosed in the present application is not limited to the above, and can be variously modified and implemented in a range not departing from the gist of the present invention. Of course.

なお、前述の実施形態に関し、更に以下の付記を開示する。
（付記１）
発熱体からの熱を受ける受熱壁部を含んで形成され、流入口及び排出口を有する筐体と、
前記筐体の内部に形成され、前記排出口と連通する排出側流路と、
前記筐体の内部に前記受熱壁部の内壁面に沿って形成され、上流端部が前記流入口と連通すると共に下流端部が前記排出側流路と連通し、前記発熱体と前記受熱壁部とが対向する対向方向に沿った流路高さが前記排出側流路における流路高さよりも低い流入側流路と、
を備える蒸発器。
（付記２）
前記流入側流路内には、前記受熱壁部の内壁面から突出する突起が形成される
付記１に記載の蒸発器。
（付記３）
前記突起は、平面視にて、前記発熱体と重なる領域に配置される
付記２に記載の蒸発器。
（付記４）
前記排出側流路は、前記受熱壁部の内壁面に沿って配置され、
前記受熱壁部における前記排出側流路と接する面は、平坦に形成される
付記１〜３のいずれか１つに記載の蒸発器。
（付記５）
前記排出側流路は、環状に形成され、
前記流入側流路は、前記排出側流路の内側に配置される
付記１〜４のいずれか１つに記載の蒸発器。
（付記６）
前記排出口は、前記排出側流路の周方向に沿って複数配置される
付記１〜５のいずれか１つに記載の蒸発器。
（付記７）
前記排出側流路は、前記受熱壁部の内壁面に沿って配置され、
前記筐体は、
前記流入側流路に接して前記受熱壁部に対向する第１対向壁と、
前記排出側流路に接して前記受熱壁部に対向し、前記第１対向壁と前記受熱壁部との間の距離よりも前記受熱壁部との間の距離が長い第２対向壁と、
を有する
付記１〜６のいずれか１つに記載の蒸発器。
（付記８）
前記排出口は、前記第２対向壁に形成される
付記７に記載の蒸発器。
（付記９）
前記流入口は、前記第１対向壁に形成される
付記７又は８に記載の蒸発器。
（付記１０）
前記筐体は、
前記受熱壁部としての板状の板体と、
前記第１対向壁と前記第２対向壁とを含み、前記板体側が開放された箱体と、
を有する
付記７〜９のいずれか１つに記載の蒸発器。
（付記１１）
前記筐体は、前記受熱壁部を鉛直方向下側に有する
付記１〜１０のいずれか１つに記載の蒸発器。
（付記１２）
前記排出側流路は、前記受熱壁部の内壁面に沿って配置され、
前記筐体は、
前記流入側流路及び前記排出側流路に接して前記受熱壁部に対向し、前記受熱壁部との距離が一定とされた対向壁
を有する付記１〜６のいずれか１つに記載の蒸発器。
（付記１３）
前記突起は、前記流入側流路から前記排出側流路に向かう放射状に配置される
付記２〜１２のいずれか１つに記載の蒸発器。
（付記１４）
蒸発器と、
液管及び蒸気管で前記蒸発器と接続され、前記蒸気管を通じて前記蒸発器から送られた蒸気を冷却して液体に変化させ、該液体が前記液管を通じて前記蒸発器に送られる凝縮器と、
を備え、
前記蒸発器は、
発熱体からの熱を受ける受熱壁部を含んで形成され、前記液管に連通する流入口と、前記蒸気管に連通する排出口と、を有する筐体と、
前記筐体の内部に形成され、前記排出口と連通する排出側流路と、
前記筐体の内部に前記受熱壁部の内壁面に沿って形成され、上流端部が前記流入口と連通すると共に下流端部が前記排出側流路と連通し、前記発熱体と前記受熱壁部とが対向する対向方向に沿った流路高さが前記排出側流路における流路高さよりも低い流入側流路と、
を有する
冷却装置。
（付記１５）
電子回路と、
蒸発器と、
液管及び蒸気管で前記蒸発器と接続され、前記蒸気管を通じて前記蒸発器から送られた蒸気を冷却して液体に変化させ、該液体が前記液管を通じて前記蒸発器に送られる凝縮器と、
を備え、
前記蒸発器は、
前記電子回路からの熱を受ける受熱壁部を含んで形成され、前記液管に連通する流入口と、前記蒸気管に連通する排出口と、を有する筐体と、
前記筐体の内部に形成され、前記排出口と連通する排出側流路と、
前記筐体の内部に前記受熱壁部の内壁面に沿って形成され、上流端部が前記流入口と連通すると共に下流端部が前記排出側流路と連通し、前記電子回路と前記受熱壁部とが対向する対向方向に沿った流路高さが前記排出側流路における流路高さよりも低い流入側流路と、
を有する
情報処理装置。 In addition, the following additional remarks are disclosed regarding the above-mentioned embodiment.
(Appendix 1)
A housing that includes a heat receiving wall that receives heat from the heating element and has an inlet and an outlet;
A discharge-side channel formed inside the housing and in communication with the discharge port;
The heat generating body and the heat receiving wall are formed inside the casing along the inner wall surface of the heat receiving wall portion, the upstream end portion communicates with the inflow port and the downstream end portion communicates with the discharge side flow path. An inflow side flow path whose flow path height along the facing direction facing the portion is lower than the flow path height in the discharge side flow path;
With an evaporator.
(Appendix 2)
The evaporator according to claim 1, wherein a protrusion protruding from an inner wall surface of the heat receiving wall portion is formed in the inflow side flow path.
(Appendix 3)
The evaporator according to claim 2, wherein the protrusion is disposed in a region overlapping the heating element in plan view.
(Appendix 4)
The discharge side flow path is disposed along the inner wall surface of the heat receiving wall portion,
The evaporator according to any one of appendices 1 to 3, wherein a surface of the heat receiving wall portion that is in contact with the discharge-side flow path is formed flat.
(Appendix 5)
The discharge side channel is formed in an annular shape,
The evaporator according to any one of appendices 1 to 4, wherein the inflow channel is disposed inside the discharge channel.
(Appendix 6)
The evaporator according to any one of appendices 1 to 5, wherein a plurality of the discharge ports are arranged along a circumferential direction of the discharge-side flow path.
(Appendix 7)
The discharge side flow path is disposed along the inner wall surface of the heat receiving wall portion,
The housing is
A first opposing wall in contact with the inflow side flow channel and facing the heat receiving wall portion;
A second opposing wall that is in contact with the discharge-side flow path and faces the heat-receiving wall part, and a distance between the heat-receiving wall part is longer than a distance between the first opposing wall and the heat-receiving wall part;
The evaporator according to any one of appendices 1 to 6.
(Appendix 8)
The evaporator according to claim 7, wherein the discharge port is formed in the second opposing wall.
(Appendix 9)
The evaporator according to appendix 7 or 8, wherein the inflow port is formed in the first opposing wall.
(Appendix 10)
The housing is
A plate-like plate as the heat receiving wall;
A box body including the first opposing wall and the second opposing wall, wherein the plate body side is opened;
The evaporator according to any one of appendices 7 to 9.
(Appendix 11)
The said housing | casing has the said heat receiving wall part in the perpendicular direction lower side. The evaporator as described in any one of Additional remarks 1-10.
(Appendix 12)
The discharge side flow path is disposed along the inner wall surface of the heat receiving wall portion,
The housing is
The supplementary wall according to any one of appendices 1 to 6, further comprising a facing wall that is in contact with the inflow side flow path and the discharge side flow path and opposes the heat receiving wall part, and has a constant distance from the heat receiving wall part. Evaporator.
(Appendix 13)
The evaporator according to any one of appendices 2 to 12, wherein the protrusions are arranged radially from the inflow side flow path to the discharge side flow path.
(Appendix 14)
An evaporator,
A condenser connected to the evaporator by a liquid pipe and a vapor pipe, cooling the vapor sent from the evaporator through the vapor pipe to change into a liquid, and the liquid being sent to the evaporator through the liquid pipe; ,
With
The evaporator is
A housing that includes a heat receiving wall that receives heat from the heating element, and that has an inlet that communicates with the liquid pipe, and an outlet that communicates with the steam pipe;
A discharge-side channel formed inside the housing and in communication with the discharge port;
The heat generating body and the heat receiving wall are formed inside the casing along the inner wall surface of the heat receiving wall portion, the upstream end portion communicates with the inflow port and the downstream end portion communicates with the discharge side flow path. An inflow side flow path whose flow path height along the facing direction facing the portion is lower than the flow path height in the discharge side flow path;
Having a cooling device.
(Appendix 15)
Electronic circuit,
An evaporator,
A condenser connected to the evaporator by a liquid pipe and a vapor pipe, cooling the vapor sent from the evaporator through the vapor pipe to change into a liquid, and the liquid being sent to the evaporator through the liquid pipe; ,
With
The evaporator is
A housing that includes a heat receiving wall that receives heat from the electronic circuit, and that has an inlet that communicates with the liquid pipe, and an outlet that communicates with the steam pipe;
A discharge-side channel formed inside the housing and in communication with the discharge port;
Formed along the inner wall surface of the heat receiving wall in the housing, the upstream end communicates with the inflow port and the downstream end communicates with the discharge side flow path, and the electronic circuit and the heat receiving wall An inflow side flow path whose flow path height along the facing direction facing the portion is lower than the flow path height in the discharge side flow path;
An information processing apparatus.

１０情報処理装置
１６電子回路（発熱体の一例）
３０蒸発器
４０筐体
４４Ｐ突起
４４Ｂ内壁面
４４板体（受熱壁部の一例）
５３流入口
５５排出口
６２流入側流路
６４排出側流路
７０冷却装置
７２液管
７６蒸気管
７８凝縮器
２００作動液（液体の一例）
Ｈ１流路高さ
Ｈ２流路高さ 10 Information Processing Device 16 Electronic Circuit (Example of Heating Element)
30 Evaporator 40 Housing 44P Projection 44B Inner Wall 44 Plate (Example of Heat Receiving Wall)
53 Inlet 55 Outlet 62 Inlet side channel 64 Outlet side channel 70 Cooling device 72 Liquid pipe 76 Steam pipe 78 Condenser 200 Working fluid (an example of liquid)
H1 Channel height H2 Channel height

Claims

A housing that includes a heat receiving wall that receives heat from the heating element and has an inlet and an outlet;
A discharge-side channel formed inside the housing and in communication with the discharge port;
The heat generating body and the heat receiving wall are formed inside the casing along the inner wall surface of the heat receiving wall portion, the upstream end portion communicates with the inflow port and the downstream end portion communicates with the discharge side flow path. An inflow side flow path whose flow path height along the facing direction facing the portion is lower than the flow path height in the discharge side flow path;
Equipped with a,
The facing wall that is in contact with the inflow side flow path and faces the heat receiving wall portion is formed with the facing direction as a thickness direction.
Evaporator.

The evaporator according to claim 1, wherein a protrusion protruding from an inner wall surface of the heat receiving wall portion is formed in the inflow side flow path.

The evaporator according to claim 2, wherein the protrusion is disposed in a region overlapping the heating element in plan view.

The discharge side flow path is disposed along the inner wall surface of the heat receiving wall portion,
The evaporator according to any one of claims 1 to 3, wherein a surface of the heat receiving wall portion that is in contact with the discharge-side flow path is formed flat.

The discharge side channel is formed in an annular shape,
The evaporator according to any one of claims 1 to 4, wherein the inflow channel is disposed inside the discharge channel.

The evaporator according to any one of claims 1 to 5, wherein a plurality of the discharge ports are arranged along a circumferential direction of the discharge-side flow path.

The discharge side flow path is disposed along the inner wall surface of the heat receiving wall portion,
The housing is
A first opposing wall in contact with the inflow side flow channel and facing the heat receiving wall portion;
A second opposing wall that is in contact with the discharge-side flow path and faces the heat-receiving wall part, and a distance between the heat-receiving wall part is longer than a distance between the first opposing wall and the heat-receiving wall part;
The evaporator according to any one of claims 1 to 6.

An evaporator,
A condenser connected to the evaporator by a liquid pipe and a vapor pipe, cooling the vapor sent from the evaporator through the vapor pipe to change into a liquid, and the liquid being sent to the evaporator through the liquid pipe; ,
With
The evaporator is
A housing that includes a heat receiving wall that receives heat from the heating element, and that has an inlet that communicates with the liquid pipe, and an outlet that communicates with the steam pipe;
A discharge-side channel formed inside the housing and in communication with the discharge port;
The heat generating body and the heat receiving wall are formed inside the casing along the inner wall surface of the heat receiving wall portion, the upstream end portion communicates with the inflow port and the downstream end portion communicates with the discharge side flow path. An inflow side flow path whose flow path height along the facing direction facing the portion is lower than the flow path height in the discharge side flow path;
Have,
The facing wall that is in contact with the inflow side flow path and faces the heat receiving wall portion is formed with the facing direction as a thickness direction.
Cooling system.

Electronic circuit,
An evaporator,
A condenser connected to the evaporator by a liquid pipe and a vapor pipe, cooling the vapor sent from the evaporator through the vapor pipe to change into a liquid, and the liquid being sent to the evaporator through the liquid pipe; ,
With
The evaporator is
A housing that includes a heat receiving wall that receives heat from the electronic circuit, and that has an inlet that communicates with the liquid pipe, and an outlet that communicates with the steam pipe;
A discharge-side channel formed inside the housing and in communication with the discharge port;
Formed along the inner wall surface of the heat receiving wall in the housing, the upstream end communicates with the inflow port and the downstream end communicates with the discharge side flow path, and the electronic circuit and the heat receiving wall An inflow side flow path whose flow path height along the facing direction facing the portion is lower than the flow path height in the discharge side flow path;
Have,
The facing wall that is in contact with the inflow side flow path and faces the heat receiving wall portion is formed with the facing direction as a thickness direction.
Information processing device.