WO2010020438A1 - Cooling device - Google Patents

Cooling device Download PDF

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Publication number
WO2010020438A1
WO2010020438A1 PCT/EP2009/055817 EP2009055817W WO2010020438A1 WO 2010020438 A1 WO2010020438 A1 WO 2010020438A1 EP 2009055817 W EP2009055817 W EP 2009055817W WO 2010020438 A1 WO2010020438 A1 WO 2010020438A1
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WO
WIPO (PCT)
Prior art keywords
cooling device
cooling
base plate
plate
recess
Prior art date
Application number
PCT/EP2009/055817
Other languages
German (de)
French (fr)
Inventor
Bernd Brendel
Martin Helsper
Stephan Martin
Harald Ponath
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of WO2010020438A1 publication Critical patent/WO2010020438A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a cooling device for at least two power semiconductor modules, in particular IGBT power modules.
  • IGBT power modules also referred to as HV-IGBT modules, are semiconductor modules that use their
  • HV-IGBT modules have the following dimensions: 140x190 mm.
  • Such a HV-IGBT module is releasably connected to a cooling device with a maximum of six screws. With these screws, the entire base plate of the module must be mounted on the cooling device such that the entire base plate is thermally conductively connected to the cooling device.
  • a heat sink module with two power semiconductor modules is shown in the liquid cooling embodiment in FIG. 4 of DE 298 13 254 U1.
  • This heat sink module has at least one cooling channel which is connected to an inlet and outlet.
  • This cooling channel or the cooling channels run in the immediate vicinity of a mounting side of the heat sink module.
  • the heat sink module consists of an aluminum extruded profile, in which the or the cooling channels are introduced.
  • this heat sink or cooling device in two parts. These two parts are a cooling plate and a cover, also referred to as a lid.
  • a cooling plate In this cooling plate several adjacent grooves are milled, which open into a milled recess in the end regions. These milled recesses are connected by a bore with a connection. After this the milling work is completed, the lid is connected to the cooling plate. In this case, the lid can be welded or screwed to the cooling plate. In this connection, the lid must be mounted on the cooling plate so that the grooves are sealed liquid-tight. That is, these grooves together with the lid form one or more cooling channels.
  • a disadvantage of this two-part embodiment of a cooling device is that these cooling channels formed are not 100% liquid-tight. Coolant can escape through gaps formed by a groove wall and the lid. This leads to so-called crevice corrosion. Another disadvantage is that such a cooling device is expensive because of the many processing steps in the production.
  • this cooling block is composed of several extruded profiles, which are not detachably connected to each other. As a non-detachable connection is welded or glued.
  • This cooling block consists of an aluminum extruded profile and two U-section profiles.
  • This aluminum extruded profile has a region in which a plurality of coolant channels are arranged next to one another. In addition, this area has in each case on the narrow side an area which is provided for receiving fastening means of the semiconductor module (s) to be cooled.
  • This Alumniumstrangprofils are each provided with a recess. All coolant channels begin or end in a recess of the aluminum extruded profile. As a result, these coolant channels are connected in parallel in terms of liquid.
  • a U-extruded profile is slipped over these end portions of the aluminum extruded profile and welded to the aluminum extruded profile.
  • These U-strand profiles each have a connection means.
  • this recess forms together with a U-shaped extruded profile a coolant distributor or a coolant collector.
  • the coolant In the simplest case, the channels in the aluminum extruded profile were created by means of bores.
  • a further cooling device which is used as a cooling box for a thyristor.
  • This cooling device has as a central component to an aluminum extruded profile, which is cuboidal.
  • This aluminum extruded profile is provided from end to end with several holes. In each case two holes on one end face a groove-shaped recess are arranged in each case. These groove-shaped recesses are sealed liquid-tight with steel flakes to complete flow paths. This means that these steel plates are glued, soldered or welded to the groove-shaped recesses.
  • two holes are connected together in terms of coolant.
  • the invention is based on the object of specifying a cooling device which has an arbitrary cooling channel geometry and can nevertheless be produced inexpensively.
  • the cooling device is constructed in two parts, it is possible to provide the base plate with anydekanalgeometrie.
  • this cooling plate is designed as a casting, in particular as an aluminum casting.
  • a mold is needed, with which a plurality of base plates can be produced. Since a cooling channel geometry is no longer generated by means of milling and drilling, it can assume any shape that can be realized by casting.
  • this inventively cast base plate of the two-piece cooling device with respect to a base plate made of a machined aluminum extruded profile on a lower weight, since only there material is placed on the casting side, where cooling channels, one-day screwing points and stiffening make it necessary.
  • This cast base plate is closed by means of a cover plate, whereby the cooling channels arise.
  • These two parts of the two-part cooling device are not detachably connected to each other.
  • these two parts are brazed hard, wherein between the base plate and cover plate, a brazing sheet made of aluminum is arranged, which corresponds to the receiving side of the
  • Base plate is designed. That is, at locations where a cooling channel geometry is to be created by applying the cover plate, this solder sheet has recesses. By this brazing these two parts are baked together by means of the solder sheet.
  • 2 denotes a base plate, 4 a cover plate and 6 an insert.
  • the cover plate 4 consists of aluminum, in particular of rolled aluminum. This cover plate 4 is dimensioned such that it completely covers the base plate 2.
  • the base plate 2 is formed according to the invention as a casting.
  • the base plate 2 has a large-area recess 8 and a groove-shaped recess 10. Between this large-area recess 8 and the groove-shaped recess 10, a material surface 12 is provided, which is provided as an assembly area for the components to be cooled. In addition, this material surface 12 serves as a support of the cover plate 4.
  • This groove-shaped recess 10 and the large-scale recess 8 are each connected by a further groove-shaped recess 14 and 16 with an end face 18 of the base plate 2 of the two-piece cooling device.
  • An outer cooling circuit is connected to these connecting means.
  • a material surface 20 is likewise provided, which is provided as a mounting region and as a support of the cover plate 4.
  • These material regions 12 and 20 must be designed so that they each form a side wall for the groove-shaped recesses 10, 14 and 16 and the large-area recess 8. This means that these material areas 12 and 20 can be materially reduced in such a way that requirements imposed on these material areas 12 and 20 are met.
  • an insert 6 is provided which is arranged in the large-area recess 8.
  • This insert 6 serves to intensively swirl the cooling fluid flowing through the large-area recess 8. The resulting turbulences prevent laminar flows and thus ensure efficient heat transfer from the Cover plate 4 made of aluminum on the coolant.
  • this insert 6 can be configured and how this insert 6 is to be arranged in the large-area recess can be found in DE 41 31 739 A1. In Figures 5 to 7 of this DE 41 31 739 Al several embodiments of the insert 6 can be seen, in Figure 2 of this disclosure, the exact placement of the insert 6 is indicated in a large-scale recess 8.
  • a casting mold is produced. In this mold liquid aluminum is then poured. After cooling this mold, which is made in two parts (reuse), the cast base plate 2 is taken from this mold. Before this base plate 2 is soldered to a cover plate 4, if necessary, the surface which receives the solder sheet processed, for example, ground, be. Thereafter, the parts base plate 2, solder plate and cover plate 4 can be stacked and spatially fixed to each other and clamped. This tense
  • Cooling device is then housed in a furnace at a predetermined temperature and for a predetermined period of time. Due to the influence of temperature cover plate 4 and base plate 2 to a cooling device.
  • this base plate of this two-part cooling device according to the invention Due to the design of the base plate of this two-part cooling device according to the invention as a casting any cooling channel geometry can be realized, which could be realized with a processing machine in a base plate of extruded aluminum profile only with a lot of time.
  • this base plate of the two-part cooling device according to the invention is particularly inexpensive, so that the cooling device according to the invention has a significant cost saving compared with the cooling devices commercially available.
  • this cooling device according to the invention is weight-reduced, since only a material is provided there when a casting mold is produced, where it is molded in accordance with the invention. required requirements. This not only saves weight, but also saves resources.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a cooling device for at least two power semiconductor modules, particularly IGBT power modules. According to the invention, said cooling device comprises a base plate (2) and a cover plate (4), wherein the base plate (2) is designed as a cast part and comprises any cooling channel geometry, and wherein said base plate (2) and said cover plate (4) are permanently joined to each other. Consequently, a cooling device is obtained in which any cooling channel geometry can be inexpensively produced.

Description

Beschreibungdescription
Kühleinrichtungcooling device
Die Erfindung bezieht sich auf eine Kühleinrichtung für wenigstens zwei Leistungshalbleitermodule, insbesondere IGBT- Leistungsmodule .The invention relates to a cooling device for at least two power semiconductor modules, in particular IGBT power modules.
Bei IGBT-Leistungsmodulen, auch als HV-IGBT-Module bezeich- net, handelt es sich um Halbleitermodule, die mit ihrerIGBT power modules, also referred to as HV-IGBT modules, are semiconductor modules that use their
Grundplatte auf eine Kühleinrichtung geschraubt werden. Diese HV-IGBT-Module haben beispielsweise folgende Abmessungen: 140x190 mm. Ein derartiges HV-IGBT-Modul wird mit höchstens sechs Schrauben mit einer Kühleinrichtung lösbar verbunden. Mit diesen Schrauben muss die gesamte Grundplatte des Moduls derart auf die Kühleinrichtung befestigt werden, dass die gesamte Grundplatte thermisch leitend mit der Kühleinrichtung verbunden ist.Base plate to be screwed onto a cooling device. For example, these HV-IGBT modules have the following dimensions: 140x190 mm. Such a HV-IGBT module is releasably connected to a cooling device with a maximum of six screws. With these screws, the entire base plate of the module must be mounted on the cooling device such that the entire base plate is thermally conductively connected to the cooling device.
Ein Kühlkörper-Baustein mit zwei Leistungshalbleitermodulen ist in der Ausführungsform Flüssigkeitskühlung in der Figur 4 der DE 298 13 254 Ul dargestellt. Dieser Kühlkörper-Baustein weist wenigstens einen Kühlkanal auf, der mit einem Zu- und Ablauf verbunden ist. Dieser Kühlkanal bzw. die Kühlkanäle verlaufen in unmittelbarer Nähe einer Montageseite des Kühlkörper-Bausteins. Der Kühlkörper-Baustein besteht aus einem Aluminium-Strangprofil, in dem der bzw. die Kühlkanäle eingebracht sind.A heat sink module with two power semiconductor modules is shown in the liquid cooling embodiment in FIG. 4 of DE 298 13 254 U1. This heat sink module has at least one cooling channel which is connected to an inlet and outlet. This cooling channel or the cooling channels run in the immediate vicinity of a mounting side of the heat sink module. The heat sink module consists of an aluminum extruded profile, in which the or the cooling channels are introduced.
Um die Herstellung eines derartigen Kühlkörpers zu vereinfachen, wird gemäß der Einleitung der DE 102 03 238 Al vorgeschlagen, diesen Kühlkörper bzw. diese Kühleinrichtung zweiteilig aufzubauen. Bei diesen beiden Teilen handelt es sich um eine Kühlplatte und um eine Abdeckung, auch als Deckel be- zeichnet. In diese Kühlplatte werden mehrere nebeneinander liegende Nuten gefräst, die in den Endbereichen in eine gefräste Ausnehmung münden. Diese gefrästen Ausnehmungen sind mittels einer Bohrung mit einem Anschluss verbunden. Nachdem die Fräsarbeiten abgeschlossen sind, wird der Deckel mit der Kühlplatte verbunden. Dabei kann der Deckel mit der Kühlplatte verschweißt oder verschraubt werden. Bei dieser Verbindung muss der Deckel derart auf der Kühlplatte befestigt sein, dass die Nuten flüssigkeitsdicht verschlossen sind. Das heißt, diese Nuten bilden zusammen mit dem Deckel einen bzw. mehrere Kühlkanäle. Ein Nachteil dieser zweiteiligen Ausführungsform einer Kühleinrichtung besteht darin, dass diese gebildeten Kühlkanäle nicht 100% flüssigkeitsdicht sind. Kühl- flüssigkeit kann durch Spalte, gebildet von einer Nutwand und dem Deckel, austreten. Dies führt zur so genannten Spaltkorrosion. Ein weiterer Nachteil besteht darin, dass eine derartige Kühleinrichtung wegen der vielen Bearbeitungsschritte in der Herstellung teuer ist.In order to simplify the production of such a heat sink, it is proposed, according to the introduction of DE 102 03 238 A1, to construct this heat sink or cooling device in two parts. These two parts are a cooling plate and a cover, also referred to as a lid. In this cooling plate several adjacent grooves are milled, which open into a milled recess in the end regions. These milled recesses are connected by a bore with a connection. After this the milling work is completed, the lid is connected to the cooling plate. In this case, the lid can be welded or screwed to the cooling plate. In this connection, the lid must be mounted on the cooling plate so that the grooves are sealed liquid-tight. That is, these grooves together with the lid form one or more cooling channels. A disadvantage of this two-part embodiment of a cooling device is that these cooling channels formed are not 100% liquid-tight. Coolant can escape through gaps formed by a groove wall and the lid. This leads to so-called crevice corrosion. Another disadvantage is that such a cooling device is expensive because of the many processing steps in the production.
In dieser DE 102 03 238 Al wird ein Kühlbaustein vorgestellt, der weniger Bearbeitungsschritte benötigt, so dass dieser Kühlbaustein gegenüber einem herkömmlichen wesentlich preiswerter ausfällt. Dies wird dadurch erreicht, dass dieser Kühlbaustein aus mehreren Strangprofilen aufgebaut ist, die miteinander nicht lösbar verbunden sind. Als nicht lösbare Verbindung wird geschweißt oder geklebt. Dieser Kühlbaustein besteht aus einem Aluminiumstrangprofil und zwei U-Strangpro- filen. Dieses Aluminiumstrangprofil weist einen Bereich auf, in dem mehrere Kühlmittelkanäle nebeneinander angeordnet sind. Außerdem weist dieser Bereich jeweils schmalseitig einen Bereich auf, der für die Aufnahme von Befestigungsmitteln des oder der zu kühlenden Halbleitermodule vorgesehen ist. Die Stirnbereiche dieses Alumniumstrangprofils sind jeweils mit einer Ausnehmung versehen. Alle Kühlmittelkanäle beginnen bzw. enden in einer Ausnehmung des Aluminiumstrangprofils. Dadurch sind diese Kühlmittelkanäle flüssigkeitsmäßig parallel geschaltet. Über diese Stirnbereiche des Aluminiumstrangprofils werden jeweils ein U-Strangprofil gestülpt und mit dem Aluminiumstrangprofil verschweißt. Diese U-Strangprofile weisen jeweils ein Anschlussmittel auf. Somit bildet diese Ausnehmung zusammen mit einem U-Strangprofil einen Kühlmittelverteiler bzw. einen Kühlmittelsammler. Die Kühlmittelka- näle im Aluminiumstrangprofil sind im einfachsten Fall mittels Bohrungen entstanden.In this DE 102 03 238 Al a cooling module is presented, which requires fewer processing steps, so that this cooling module fails compared to a conventional much cheaper. This is achieved in that this cooling block is composed of several extruded profiles, which are not detachably connected to each other. As a non-detachable connection is welded or glued. This cooling block consists of an aluminum extruded profile and two U-section profiles. This aluminum extruded profile has a region in which a plurality of coolant channels are arranged next to one another. In addition, this area has in each case on the narrow side an area which is provided for receiving fastening means of the semiconductor module (s) to be cooled. The end portions of this Alumniumstrangprofils are each provided with a recess. All coolant channels begin or end in a recess of the aluminum extruded profile. As a result, these coolant channels are connected in parallel in terms of liquid. In each case a U-extruded profile is slipped over these end portions of the aluminum extruded profile and welded to the aluminum extruded profile. These U-strand profiles each have a connection means. Thus, this recess forms together with a U-shaped extruded profile a coolant distributor or a coolant collector. The coolant In the simplest case, the channels in the aluminum extruded profile were created by means of bores.
Aus der DE 26 17 776 Al ist eine weitere Kühleinrichtung be- kannt, die als Kühldose für einen Thyristor eingesetzt wird. Diese Kühleinrichtung weist als zentrales Bauelement ein Aluminiumstrangprofil auf, das quaderförmig ausgebildet ist. Dieses Aluminiumstrangprofil ist von Stirnseite zu Stirnseite mit mehreren Bohrungen versehen. Jeweils um zwei Bohrungen einer Stirnseite sind jeweils eine nutförmige Ausnehmung angeordnet. Diese nutförmigen Ausnehmungen werden zur Vervollständigung von Strömungswegen jeweils mit Stahlplättchen flüssigkeitsdicht verschlossen. Das heißt, diese Stahlplättchen werden mit den nutförmigen Ausnehmungen verklebt, verlö- tet oder verschweißt. Mittels einer nutförmigen Ausnehmung und deren kühlmitteldichten Abschließens mit einem Stahlplättchen werden zwei Bohrungen kühlmittelmäßig miteinander verbunden. Somit entstehen aus den mehreren Bohrungen des Aluminiumstrangprofils erst durch die nutförmigen Ausnehmun- gen und deren kühlmitteldichtes Abschließen Kühlmittelkanäle. Die kühlmitteldichten Verbindungen treten nicht mehr wie bei einer zweiteiligen Kühleinrichtung im Inneren der Kühleinrichtung auf, sondern außen an den Stirnseiten der Kühleinrichtung. Somit tritt keine Spaltkorrosion mehr auf. Außerdem kann diese Kühldose in Serienfertigung preiswert hergestellt werden. Wegen der vielen Schweißhandlungen ist diese Kühldose immer noch zeitaufwändig in der Herstellung. Außerdem kann diese Kühldose nur Kühlkanäle aufweisen, die flüssigkeitsmäßig parallel oder gegenläufig betrieben werden.From DE 26 17 776 Al a further cooling device is known, which is used as a cooling box for a thyristor. This cooling device has as a central component to an aluminum extruded profile, which is cuboidal. This aluminum extruded profile is provided from end to end with several holes. In each case two holes on one end face a groove-shaped recess are arranged in each case. These groove-shaped recesses are sealed liquid-tight with steel flakes to complete flow paths. This means that these steel plates are glued, soldered or welded to the groove-shaped recesses. By means of a groove-shaped recess and its coolant-tight closing with a steel plate two holes are connected together in terms of coolant. Thus arise from the plurality of holes of the aluminum extruded profile only by the groove-shaped recesses and their coolant-tight closing coolant channels. The coolant-tight connections no longer occur in the interior of the cooling device, as in the case of a two-part cooling device, but on the outside of the end faces of the cooling device. Thus, crevice corrosion no longer occurs. In addition, this cooling box can be mass-produced inexpensively. Because of the many welding operations, this cooling box is still time-consuming to manufacture. In addition, this cooling box can only have cooling channels, which are liquid parallel or operated in opposite directions.
Der Erfindung liegt nun die Aufgabe zugrunde, eine Kühleinrichtung anzugeben, die eine beliebige Kühlkanalgeometrie aufweist und trotzdem preiswert hergestellt werden kann.The invention is based on the object of specifying a cooling device which has an arbitrary cooling channel geometry and can nevertheless be produced inexpensively.
Diese Aufgabe wird erfindungsgemäß mit den Merkmalen des Anspruchs 1 gelöst. Dadurch, dass die Kühleinrichtung zweiteilig aufgebaut ist, besteht die Möglichkeit, die Grundplatte mit einer beliebigen Kühlkanalgeometrie zu versehen. Damit diese Grundplatte mit einer beliebigen Kühlkanalgeometrie preiswert hergestellt werden kann, ist diese Kühlplatte als Gussteil, insbesondere als Aluminiumgussteil, ausgebildet. Für das Gießen einer derartigen Grundplatte wird eine Gießform benötigt, mit der eine Vielzahl von Grundplatten hergestellt werden kann. Da eine Kühlkanalgeometrie nicht mehr mittels Fräsen und Bohren er- zeugt wird, kann diese jede beliebige Gestalt annehmen, die gießtechnisch realisiert werden kann. Außerdem weist diese erfindungsgemäß gegossene Grundplatte der zweiteiligen Kühleinrichtung gegenüber einer Grundplatte aus einem bearbeiteten Aluminiumstrangprofil ein geringeres Gewicht auf, da nur dort Material gussseitig platziert wird, wo Kühlkanäle, mon- tageseitige Verschraubungspunkte und Versteifungselemente es erforderlich machen.This object is achieved with the features of claim 1. The fact that the cooling device is constructed in two parts, it is possible to provide the base plate with any Kühlkanalgeometrie. In order for this base plate can be inexpensively manufactured with any Kühlkanalgeometrie, this cooling plate is designed as a casting, in particular as an aluminum casting. For the casting of such a base plate, a mold is needed, with which a plurality of base plates can be produced. Since a cooling channel geometry is no longer generated by means of milling and drilling, it can assume any shape that can be realized by casting. In addition, this inventively cast base plate of the two-piece cooling device with respect to a base plate made of a machined aluminum extruded profile on a lower weight, since only there material is placed on the casting side, where cooling channels, one-day screwing points and stiffening make it necessary.
Diese gegossene Grundplatte wird mittels einer Deckplatte verschlossen, wodurch die Kühlkanäle entstehen. Diese beiden Teile der zweiteiligen Kühleinrichtung werden nicht lösbar miteinander verbunden. Bei einer vorteilhaften Ausführungsform werden diese beiden Teile hart verlötet, wobei zwischen Grundplatte und Deckplatte ein Lotblech aus Aluminium ange- ordnet wird, das korrespondierend zur Aufnahmeseite derThis cast base plate is closed by means of a cover plate, whereby the cooling channels arise. These two parts of the two-part cooling device are not detachably connected to each other. In an advantageous embodiment, these two parts are brazed hard, wherein between the base plate and cover plate, a brazing sheet made of aluminum is arranged, which corresponds to the receiving side of the
Grundplatte ausgestaltet ist. Das heißt, an Stellen, wo durch Aufbringen der Deckplatte eine Kühlkanalgeometrie entstehen soll, weist dieses Lotblech Ausnehmungen auf. Durch dieses Hartlöten werden diese beiden Teile mittels des Lotblechs miteinander verbacken.Base plate is designed. That is, at locations where a cooling channel geometry is to be created by applying the cover plate, this solder sheet has recesses. By this brazing these two parts are baked together by means of the solder sheet.
Zur näheren Erläuterung der Erfindung wird auf die Zeichnung Bezug genommen, in der eine vorteilhafte Ausführungsform einer erfindungsgemäßen Kühleinrichtung schematisch veranschau- licht ist.For a more detailed explanation of the invention, reference is made to the drawing, in which an advantageous embodiment of a cooling device according to the invention is schematically illustrated.
In dieser Figur sind mit 2 eine Grundplatte, mit 4 eine Deckplatte und mit 6 eine Einlage bezeichnet. Die Deckplatte 4 besteht aus Aluminium, insbesondere aus gewalztem Aluminium. Diese Deckplatte 4 ist derart bemessen, dass diese die Grundplatte 2 vollständig abdeckt. Die Grundplatte 2 ist erfindungsgemäß als Gussteil ausgebildet.In this figure, 2 denotes a base plate, 4 a cover plate and 6 an insert. The cover plate 4 consists of aluminum, in particular of rolled aluminum. This cover plate 4 is dimensioned such that it completely covers the base plate 2. The base plate 2 is formed according to the invention as a casting.
In der dargestellten Ausführungsform weist die Grundplatte 2 eine großflächige Ausnehmung 8 und eine nutförmige Ausnehmung 10 auf. Zwischen dieser großflächigen Ausnehmung 8 und der nutförmigen Ausnehmung 10 ist eine Materialfläche 12 vorgese- hen, die als Montagebereich für die zu kühlenden Bauelemente vorgesehen ist. Außerdem dient diese Materialfläche 12 als Stütze der Deckplatte 4. Diese nutförmige Ausnehmung 10 und die großflächige Ausnehmung 8 sind jeweils mittels einer weiteren nutförmigen Ausnehmung 14 und 16 mit einer Stirnseite 18 der Grundplatte 2 der zweiteiligen Kühleinrichtung verbunden. Diese beiden nutförmigen Ausnehmungen 14 und 16 bilden zusammen mit der Deckplatte 4 einen Kühlmittelzu- bzw. ab- lauf, die jeweils mit einem Anschlussmittel, die hier nicht explizit dargestellt sind, versehen sind. An diesen An- Schlussmitteln wird ein äußerer Kühlkreislauf angeschlossen. Zwischen der großflächigen Ausnehmung 8, den beiden nutförmigen Ausnehmungen 14 und 16 und der Stirnseite 18 der Grundplatte 2 ist ebenfalls eine Materialfläche 20 vorgesehen, die als Montagebereich und als Stütze der Deckplatte 4 vorgesehen ist. Diese Materialbereiche 12 und 20 müssen derart gestaltet sein, damit diese für die nutförmigen Ausnehmungen 10, 14 und 16 und die großflächige Ausnehmung 8 jeweils eine Seitenwand bilden. Das heißt, diese Materialbereiche 12 und 20 können materialmäßig derart reduziert werden, dass an diese Materi- albereiche 12 und 20 gestellte Anforderungen erfüllt werden.In the illustrated embodiment, the base plate 2 has a large-area recess 8 and a groove-shaped recess 10. Between this large-area recess 8 and the groove-shaped recess 10, a material surface 12 is provided, which is provided as an assembly area for the components to be cooled. In addition, this material surface 12 serves as a support of the cover plate 4. This groove-shaped recess 10 and the large-scale recess 8 are each connected by a further groove-shaped recess 14 and 16 with an end face 18 of the base plate 2 of the two-piece cooling device. These two groove-shaped recesses 14 and 16, together with the cover plate 4, form a coolant inlet or outlet which are each provided with a connection means which are not explicitly shown here. An outer cooling circuit is connected to these connecting means. Between the large-area recess 8, the two groove-shaped recesses 14 and 16 and the end face 18 of the base plate 2, a material surface 20 is likewise provided, which is provided as a mounting region and as a support of the cover plate 4. These material regions 12 and 20 must be designed so that they each form a side wall for the groove-shaped recesses 10, 14 and 16 and the large-area recess 8. This means that these material areas 12 and 20 can be materially reduced in such a way that requirements imposed on these material areas 12 and 20 are met.
In dieser vorteilhaften Ausführungsform der erfindungsgemäßen Kühleinrichtung ist eine Einlage 6 vorgesehen, die in die großflächige Ausnehmung 8 angeordnet wird. Diese Einlage 6 dient dazu, dass die durch die großflächige Ausnehmung 8 fließende Kühlflüssigkeit intensiv verwirbelt wird. Die dadurch entstehenden Turbulenzen verhindern laminare Strömungen und gewährleisten so einen effizienten Wärmeübergang von der Deckplatte 4 aus Aluminium auf die Kühlflüssigkeit. Wie diese Einlage 6 ausgestaltet werden kann und wie diese Einlage 6 in der großflächigen Ausnehmung anzuordnen ist, sind der DE 41 31 739 Al zu entnehmen. In den Figuren 5 bis 7 dieser DE 41 31 739 Al sind mehrere Ausführungsformen der Einlage 6 zu entnehmen, wobei in Figur 2 dieser Offenlegungsschrift die genaue Platzierung der Einlage 6 in einer großflächigen Ausnehmung 8 angegeben ist.In this advantageous embodiment of the cooling device according to the invention, an insert 6 is provided which is arranged in the large-area recess 8. This insert 6 serves to intensively swirl the cooling fluid flowing through the large-area recess 8. The resulting turbulences prevent laminar flows and thus ensure efficient heat transfer from the Cover plate 4 made of aluminum on the coolant. How this insert 6 can be configured and how this insert 6 is to be arranged in the large-area recess can be found in DE 41 31 739 A1. In Figures 5 to 7 of this DE 41 31 739 Al several embodiments of the insert 6 can be seen, in Figure 2 of this disclosure, the exact placement of the insert 6 is indicated in a large-scale recess 8.
Um nun die Grundplatte 2 mit einer beliebig geformten Kühlkanalgeometrie herstellen zu können, wird eine Gussform hergestellt. In dieser Gussform wird dann flüssiges Aluminium gegossen. Nach dem Abkühlen dieser Form, die zweiteilig ausgeführt ist (Wiederverwendung) , wird die gegossene Grundplatte 2 aus dieser Form genommen. Bevor diese Grundplatte 2 mit einer Deckplatte 4 verlötet wird, muss gegebenenfalls die Fläche, die das Lotblech aufnimmt, bearbeitet, beispielsweise geschliffen, werden. Danach können die Teile Grundplatte 2, Lötblech und Deckplatte 4 aufeinander gestapelt und räumlich zueinander fixiert und verspannt werden. Diese verspannteIn order to be able to produce the base plate 2 with an arbitrarily shaped cooling channel geometry, a casting mold is produced. In this mold liquid aluminum is then poured. After cooling this mold, which is made in two parts (reuse), the cast base plate 2 is taken from this mold. Before this base plate 2 is soldered to a cover plate 4, if necessary, the surface which receives the solder sheet processed, for example, ground, be. Thereafter, the parts base plate 2, solder plate and cover plate 4 can be stacked and spatially fixed to each other and clamped. This tense
Kühleinrichtung wird dann bei einer vorbestimmten Temperatur und für eine vorbestimmte Zeitspanne in einem Ofen untergebracht. Durch die Temperatureinwirkung verbacken Deckplatte 4 und Grundplatte 2 zu einer Kühleinrichtung.Cooling device is then housed in a furnace at a predetermined temperature and for a predetermined period of time. Due to the influence of temperature cover plate 4 and base plate 2 to a cooling device.
Durch die Ausgestaltung der Grundplatte dieser zweiteiligen erfindungsgemäßen Kühleinrichtung als Gussteil kann jede beliebige Kühlkanalgeometrie realisiert werden, die mit einer Bearbeitungsmaschine in einer Grundplatte aus Aluminium- Strangprofil nur mit sehr viel Zeitaufwand realisiert werden könnte. Dadurch ist diese Grundplatte der erfindungsgemäßen zweiteiligen Kühleinrichtung besonders preiswert, so dass die erfindungsgemäße Kühleinrichtung gegenüber den im Handel erhältlichen Kühleinrichtungen eine wesentliche Kosteneinspa- rung aufweist. Außerdem ist diese erfindungsgemäße Kühleinrichtung gewichtsreduziert, da bei der Erstellung einer Gussform nur dort Material vorgesehen wird, wo diese gemäß ge- stellter Anforderungen erforderlich ist. Dadurch wird nicht nur an Gewicht gespart, sondern auch Ressourcen eingespart. Due to the design of the base plate of this two-part cooling device according to the invention as a casting any cooling channel geometry can be realized, which could be realized with a processing machine in a base plate of extruded aluminum profile only with a lot of time. As a result, this base plate of the two-part cooling device according to the invention is particularly inexpensive, so that the cooling device according to the invention has a significant cost saving compared with the cooling devices commercially available. In addition, this cooling device according to the invention is weight-reduced, since only a material is provided there when a casting mold is produced, where it is molded in accordance with the invention. required requirements. This not only saves weight, but also saves resources.

Claims

Patentansprüche claims
1. Kühleinrichtung für wenigstens zwei Leistungshalbleitermodule, insbesondere IGBT-Leistungsmodule, mit einer Grundplat- te (2) und einer Deckplatte (4), wobei die Grundplatte (2) als Gussteil ausgebildet ist und eine beliebige Kühlkanalgeometrie aufweist, und wobei diese Grundplatte (2) und die Deckplatte (4) miteinander nicht lösbar verbunden sind.1. Cooling device for at least two power semiconductor modules, in particular IGBT power modules, with a Grundplat- te (2) and a cover plate (4), wherein the base plate (2) is formed as a casting and has any Kühlkanalgeometrie, and wherein said base plate (2 ) and the cover plate (4) are not detachably connected to each other.
2. Kühleinrichtung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, dass die Kühlkanalgeometrie wenigstens eine Ausnehmung (8) und zwei nutför- mige Ausnehmungen (14, 16) aufweist, wobei diese nutförmigen Ausnehmungen (14, 16) jeweils mit einem Ende dieser großflä- chigen Ausnehmung (8) verknüpft sind.2. Cooling device according to claim 1, characterized in that the cooling channel geometry has at least one recess (8) and two groove-shaped recesses (14, 16), these groove-shaped recesses (14, 16) each having one end of this large-area recess (14). 8) are linked.
3. Kühleinrichtung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, dass die Grund¬ platte (2) ein Aluminiumgussteil ist.3. Cooling device according to claim 1, characterized in that the base ¬ plate (2) is an aluminum casting.
4. Kühleinrichtung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, dass die Deck¬ platte (4) ein Strangprofil ist.4. Cooling device according to claim 1, characterized in that the cover ¬ plate (4) is an extruded profile.
5. Kühleinrichtung nach einem der vorgenannten Ansprüche, d a d u r c h g e k e n n z e i c h n e t, dass die Deckplatte (4) mittels eines Lotblechs mit der Grundplatte (2) hart verlötet ist.5. Cooling device according to one of the preceding claims, characterized in that the cover plate (4) by means of a brazing sheet with the base plate (2) is brazed.
6. Kühleinrichtung nach Anspruch 5, d a d u r c h g e k e n n z e i c h n e t, dass das Lot¬ blech aus Aluminium besteht.6. Cooling device according to claim 5, characterized in that the solder sheet ¬ consists of aluminum.
7. Kühleinrichtung nach einem der vorgenannten Ansprüche, d a d u r c h g e k e n n z e i c h n e t, dass eine Einla¬ ge (6) in der Ausnehmung (8) der Grundplatte (2) angeordnet ist . 7. Cooling device according to one of the preceding claims, characterized in that an inlet ¬ ge (6) in the recess (8) of the base plate (2) is arranged.
8. Kühleinrichtung nach Anspruch 7, d a d u r c h g e k e n n z e i c h n e t, dass die Einlage (6) aus Aluminium besteht. 8. Cooling device according to claim 7, characterized in that the insert (6) consists of aluminum.
PCT/EP2009/055817 2008-08-22 2009-05-14 Cooling device WO2010020438A1 (en)

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US8938880B2 (en) 2012-02-20 2015-01-27 Wolverine Tube, Inc. Method of manufacturing an integrated cold plate for electronics
US9655294B2 (en) 2010-07-28 2017-05-16 Wolverine Tube, Inc. Method of producing electronics substrate with enhanced direct bonded metal
US9681580B2 (en) 2010-07-28 2017-06-13 Wolverine Tube, Inc. Method of producing an enhanced base plate
US9795057B2 (en) 2010-07-28 2017-10-17 Wolverine Tube, Inc. Method of producing a liquid cooled coldplate
US10531594B2 (en) 2010-07-28 2020-01-07 Wieland Microcool, Llc Method of producing a liquid cooled coldplate

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US9655294B2 (en) 2010-07-28 2017-05-16 Wolverine Tube, Inc. Method of producing electronics substrate with enhanced direct bonded metal
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