DE8804742U1 - - Google Patents

Info

Publication number
DE8804742U1
DE8804742U1 DE8804742U DE8804742U DE8804742U1 DE 8804742 U1 DE8804742 U1 DE 8804742U1 DE 8804742 U DE8804742 U DE 8804742U DE 8804742 U DE8804742 U DE 8804742U DE 8804742 U1 DE8804742 U1 DE 8804742U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8804742U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE8804742U priority Critical patent/DE8804742U1/de
Publication of DE8804742U1 publication Critical patent/DE8804742U1/de
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/40Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE8804742U 1988-04-11 1988-04-11 Expired DE8804742U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8804742U DE8804742U1 (en) 1988-04-11 1988-04-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8804742U DE8804742U1 (en) 1988-04-11 1988-04-11

Publications (1)

Publication Number Publication Date
DE8804742U1 true DE8804742U1 (en) 1988-06-09

Family

ID=6822794

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8804742U Expired DE8804742U1 (en) 1988-04-11 1988-04-11

Country Status (1)

Country Link
DE (1) DE8804742U1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4131739A1 (en) * 1991-09-24 1993-04-01 Behr Industrietech Gmbh & Co Electric component cooler with cavity - receiving liq. stream and formed between two flat members, at least one being of metal
DE4301865A1 (en) * 1993-01-25 1994-07-28 Abb Management Ag Cooling box for electric component
DE4401607A1 (en) * 1994-01-20 1995-07-27 Siemens Ag Rectangular cooling tube for power semiconductors
DE4421025A1 (en) * 1994-06-16 1995-12-21 Abb Patent Gmbh Heat-sink for semiconductor power transistor in traffic engineering
WO1996013142A1 (en) * 1994-10-24 1996-05-02 Siemens Aktiengesellschaft Cooler for electrical subassemblies
DE19606972A1 (en) * 1996-02-24 1997-08-28 Daimler Benz Ag Heatsink for cooling power components
EP0810657A2 (en) * 1996-05-31 1997-12-03 R-Theta Inc. Heat sink with coolant accelerator
DE19747321A1 (en) * 1997-10-27 1999-05-06 Semikron Elektronik Gmbh Liquid cooler for power semiconductor components
DE19860415A1 (en) * 1998-12-28 2000-06-29 Abb Research Ltd Power semiconductor module, e.g. a diode or IGBT chip module, has a semiconductor element on a base element containing an electrically insulating element which forms a coolant channel
EP2684002A4 (en) * 2011-03-07 2015-03-11 Aavid Thermalloy Llc Thermal transfer device with spiral fluid pathways
WO2017029211A1 (en) * 2015-08-14 2017-02-23 Karlsruher Institut für Technologie Flow conducting elements in a channel
WO2018189009A1 (en) * 2017-04-12 2018-10-18 Abb Schweiz Ag Heat exchanging arrangement and subsea electronic system

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4131739A1 (en) * 1991-09-24 1993-04-01 Behr Industrietech Gmbh & Co Electric component cooler with cavity - receiving liq. stream and formed between two flat members, at least one being of metal
DE4301865A1 (en) * 1993-01-25 1994-07-28 Abb Management Ag Cooling box for electric component
DE4401607A1 (en) * 1994-01-20 1995-07-27 Siemens Ag Rectangular cooling tube for power semiconductors
US5526231A (en) * 1994-01-20 1996-06-11 Siemens Aktiengesellschaft Cooling unit for power semiconductors
DE4421025A1 (en) * 1994-06-16 1995-12-21 Abb Patent Gmbh Heat-sink for semiconductor power transistor in traffic engineering
DE4421025C2 (en) * 1994-06-16 1999-09-09 Abb Patent Gmbh Heatsink with at least one cooling channel
WO1996013142A1 (en) * 1994-10-24 1996-05-02 Siemens Aktiengesellschaft Cooler for electrical subassemblies
US5901036A (en) * 1994-10-24 1999-05-04 Siemens Aktiengesellschaft Cooling device for electrical assemblies
US6089314A (en) * 1996-02-24 2000-07-18 Daimler-Benz Aktiengesellschaft Cooling body for cooling power gates
DE19606972A1 (en) * 1996-02-24 1997-08-28 Daimler Benz Ag Heatsink for cooling power components
EP0810657A2 (en) * 1996-05-31 1997-12-03 R-Theta Inc. Heat sink with coolant accelerator
EP0810657A3 (en) * 1996-05-31 1999-09-15 R-Theta Inc. Heat sink with coolant accelerator
DE19747321C2 (en) * 1997-10-27 2002-08-01 Semikron Elektronik Gmbh Liquid cooler for power semiconductor components
DE19747321A1 (en) * 1997-10-27 1999-05-06 Semikron Elektronik Gmbh Liquid cooler for power semiconductor components
DE19860415A1 (en) * 1998-12-28 2000-06-29 Abb Research Ltd Power semiconductor module, e.g. a diode or IGBT chip module, has a semiconductor element on a base element containing an electrically insulating element which forms a coolant channel
EP2684002A4 (en) * 2011-03-07 2015-03-11 Aavid Thermalloy Llc Thermal transfer device with spiral fluid pathways
US9568257B2 (en) 2011-03-07 2017-02-14 Aavid Thermalloy, Llc Thermal transfer device with spiral fluid pathways
WO2017029211A1 (en) * 2015-08-14 2017-02-23 Karlsruher Institut für Technologie Flow conducting elements in a channel
WO2018189009A1 (en) * 2017-04-12 2018-10-18 Abb Schweiz Ag Heat exchanging arrangement and subsea electronic system

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