GB1090628A - Improvements in or relating to a heat sink for the mounting of temperature-sensitive electrical components - Google Patents

Improvements in or relating to a heat sink for the mounting of temperature-sensitive electrical components

Info

Publication number
GB1090628A
GB1090628A GB4475765A GB4475765A GB1090628A GB 1090628 A GB1090628 A GB 1090628A GB 4475765 A GB4475765 A GB 4475765A GB 4475765 A GB4475765 A GB 4475765A GB 1090628 A GB1090628 A GB 1090628A
Authority
GB
United Kingdom
Prior art keywords
plate
electrical components
mounting
systems
oct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4475765A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Publication of GB1090628A publication Critical patent/GB1090628A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

1,090,628. Mounting electrical equipment. INTERNATIONAL STANDARD ELECTRIC CORPORATION. Oct. 22, 1965 [Oct. 24, 1964], No. 44757/65. Heading H1R. [Also in Division F4] An angled mounting plate for temperaturesensitive electrical components comprises two channel systems 1 and 2 containing different evaporating and condensing refrigerants. A slot 5 is provided for minimizing thermal conduction between the systems. A further slot 8 minimizes thermal conduction to one of the channels of system 1 so that refrigerant condensing in the vertical limb of the plate can run down that channel without being impeded by rising vapour. Electrical components 6, e.g. electron tubes, power transistors and semiconductor rectifiers, are mounted on the plate which may also serve to conduct current. The plate may be formed of aluminium plated with silver and may be provided with integral or attached fins (Figs. 5 and 6, not shown). Further channel systems may be formed in the plate for connection to a source of cooling water. The refrigerants may comprise CFCl 3 and C 2 F 3 Cl 3 .
GB4475765A 1964-10-24 1965-10-22 Improvements in or relating to a heat sink for the mounting of temperature-sensitive electrical components Expired GB1090628A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1964G0041859 DE1284506B (en) 1964-10-24 1964-10-24 Support plate for temperature-sensitive electrical circuit parts

Publications (1)

Publication Number Publication Date
GB1090628A true GB1090628A (en) 1967-11-08

Family

ID=7126781

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4475765A Expired GB1090628A (en) 1964-10-24 1965-10-22 Improvements in or relating to a heat sink for the mounting of temperature-sensitive electrical components

Country Status (2)

Country Link
DE (1) DE1284506B (en)
GB (1) GB1090628A (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2947000C2 (en) * 1978-11-22 1985-04-18 Pioneer Electronic Corp., Tokio/Tokyo Housings for electronic devices
DE3044314C2 (en) * 1980-11-25 1986-08-14 kabelmetal electro GmbH, 3000 Hannover Housing for accommodating printed circuits equipped with heat-generating electronic components
FI78593C (en) * 1981-12-02 1989-08-10 Flaekt Ab Cooling device of telecommunication equipment
ES2024412B3 (en) * 1985-12-13 1992-03-01 Hasler Ag Ascom PROCEDURE AND DEVICE FOR THE EVACUATION OF LOST HEAT FROM AT LEAST ONE GROUP OF CONSTRUCTION OF ELECTRICAL ELEMENTS
US5755278A (en) * 1993-12-08 1998-05-26 Fanuc, Ltd. Heat sink attached to a heat plate
US5701951A (en) * 1994-12-20 1997-12-30 Jean; Amigo Heat dissipation device for an integrated circuit
JPH0914875A (en) * 1995-06-29 1997-01-17 Akutoronikusu Kk Porous flat metal tube heat pipe type heat exchanger
DE19628545A1 (en) * 1996-07-16 1998-01-22 Abb Patent Gmbh Intensive cooling device for air-cooled current regulator
TW346566B (en) * 1996-08-29 1998-12-01 Showa Aluminiun Co Ltd Radiator for portable electronic apparatus
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US5937937A (en) * 1998-06-18 1999-08-17 Motorola, Inc. Heat sink and method for removing heat from a plurality of components
US6302192B1 (en) 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6896039B2 (en) 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
DE19960840A1 (en) * 1999-12-16 2001-07-05 Siemens Ag Electronic power circuit with flat heat sink device
DE10053258A1 (en) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Heat sink for electronic device has evaporator and condenser heat exchangers connected in hermetically sealed heat sink circuit
US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US7198096B2 (en) 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
US10211125B2 (en) 2017-07-19 2019-02-19 Heatscape.Com, Inc. Configurable mounting hole structure for flush mount integration with vapor chamber forming plates

Also Published As

Publication number Publication date
DE1284506B (en) 1968-12-05

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