DE1284506B - Traegerblech for temperature-sensitive electrical circuit parts - Google Patents

Traegerblech for temperature-sensitive electrical circuit parts

Info

Publication number
DE1284506B
DE1284506B DE1964G0041859 DEG0041859A DE1284506B DE 1284506 B DE1284506 B DE 1284506B DE 1964G0041859 DE1964G0041859 DE 1964G0041859 DE G0041859 A DEG0041859 A DE G0041859A DE 1284506 B DE1284506 B DE 1284506B
Authority
DE
Germany
Prior art keywords
traegerblech
temperature
electrical circuit
circuit parts
sensitive electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE1964G0041859
Other languages
German (de)
Inventor
Tajbl Franz Vinzenz
Regner Karl
Perlick
Dr Albert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linde AG
Standard Elektrik Lorenz AG
Vereinigte Deutsche Metallwerke AG
VER DEUTSCHE METALLWERKE AG
Original Assignee
Linde AG
Standard Elektrik Lorenz AG
Vereinigte Deutsche Metallwerke AG
VER DEUTSCHE METALLWERKE AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linde AG, Standard Elektrik Lorenz AG, Vereinigte Deutsche Metallwerke AG, VER DEUTSCHE METALLWERKE AG filed Critical Linde AG
Priority to DE1964G0041859 priority Critical patent/DE1284506B/en
Publication of DE1284506B publication Critical patent/DE1284506B/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE1964G0041859 1964-10-24 1964-10-24 Traegerblech for temperature-sensitive electrical circuit parts Pending DE1284506B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1964G0041859 DE1284506B (en) 1964-10-24 1964-10-24 Traegerblech for temperature-sensitive electrical circuit parts

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1964G0041859 DE1284506B (en) 1964-10-24 1964-10-24 Traegerblech for temperature-sensitive electrical circuit parts
GB4475765A GB1090628A (en) 1964-10-24 1965-10-22 Improvements in or relating to a heat sink for the mounting of temperature-sensitive electrical components

Publications (1)

Publication Number Publication Date
DE1284506B true DE1284506B (en) 1968-12-05

Family

ID=7126781

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1964G0041859 Pending DE1284506B (en) 1964-10-24 1964-10-24 Traegerblech for temperature-sensitive electrical circuit parts

Country Status (2)

Country Link
DE (1) DE1284506B (en)
GB (1) GB1090628A (en)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2947000A1 (en) * 1978-11-22 1980-07-17 Pioneer Electronic Corp Enclosure for electronic equipment generating heat losses - contains cooling ducts acting as heat exchanger and filled with evaporable medium
DE3044314A1 (en) * 1980-11-25 1982-06-24 Kabel Metallwerke Ghh Housing for generating heat electronic components mounted on a printed circuits
DE3244654A1 (en) * 1981-12-02 1983-06-09 Flaekt Ab An apparatus for cooling a Telecommunication equipment in a rack
US4793405A (en) * 1985-12-13 1988-12-27 Hasler Ag. Process and apparatus for dissipating the heat loss of at least one assembly of electrical elements
US5701951A (en) * 1994-12-20 1997-12-30 Jean; Amigo Heat dissipation device for an integrated circuit
DE19628545A1 (en) * 1996-07-16 1998-01-22 Abb Patent Gmbh Intensive cooling device for air-cooled current regulator
US5755278A (en) * 1993-12-08 1998-05-26 Fanuc, Ltd. Heat sink attached to a heat plate
US5937936A (en) * 1996-08-29 1999-08-17 Showa Aluminum Corporation Heat sink for portable electronic devices
US5937937A (en) * 1998-06-18 1999-08-17 Motorola, Inc. Heat sink and method for removing heat from a plurality of components
US6026890A (en) * 1995-06-29 2000-02-22 Actronics Kabushiki Kaisha Heat transfer device having metal band formed with longitudinal holes
WO2000070288A1 (en) * 1999-05-12 2000-11-23 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
DE19960840A1 (en) * 1999-12-16 2001-07-05 Siemens Ag Electronic power circuit with flat heat sink device
DE10053258A1 (en) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Heat sink for electronic device has evaporator and condenser heat exchangers connected in hermetically sealed heat sink circuit
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US6988315B2 (en) 1998-06-08 2006-01-24 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US7028760B2 (en) 1999-05-12 2006-04-18 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US7150312B2 (en) 2001-11-27 2006-12-19 Thermotek, Inc. Stacked low profile cooling system and method for making same
US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US10211125B2 (en) 2017-07-19 2019-02-19 Heatscape.Com, Inc. Configurable mounting hole structure for flush mount integration with vapor chamber forming plates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2947000A1 (en) * 1978-11-22 1980-07-17 Pioneer Electronic Corp Enclosure for electronic equipment generating heat losses - contains cooling ducts acting as heat exchanger and filled with evaporable medium
DE3044314A1 (en) * 1980-11-25 1982-06-24 Kabel Metallwerke Ghh Housing for generating heat electronic components mounted on a printed circuits
DE3244654A1 (en) * 1981-12-02 1983-06-09 Flaekt Ab An apparatus for cooling a Telecommunication equipment in a rack
US4793405A (en) * 1985-12-13 1988-12-27 Hasler Ag. Process and apparatus for dissipating the heat loss of at least one assembly of electrical elements
US5755278A (en) * 1993-12-08 1998-05-26 Fanuc, Ltd. Heat sink attached to a heat plate
US5701951A (en) * 1994-12-20 1997-12-30 Jean; Amigo Heat dissipation device for an integrated circuit
US6026890A (en) * 1995-06-29 2000-02-22 Actronics Kabushiki Kaisha Heat transfer device having metal band formed with longitudinal holes
DE19628545A1 (en) * 1996-07-16 1998-01-22 Abb Patent Gmbh Intensive cooling device for air-cooled current regulator
US5937936A (en) * 1996-08-29 1999-08-17 Showa Aluminum Corporation Heat sink for portable electronic devices
US6164368A (en) * 1996-08-29 2000-12-26 Showa Aluminum Corporation Heat sink for portable electronic devices
US7802436B2 (en) 1998-06-08 2010-09-28 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US6988315B2 (en) 1998-06-08 2006-01-24 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US8418478B2 (en) 1998-06-08 2013-04-16 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US7322400B2 (en) 1998-06-08 2008-01-29 Thermotek, Inc. Cooling apparatus having low profile extrusion
US7686069B2 (en) 1998-06-08 2010-03-30 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US5937937A (en) * 1998-06-18 1999-08-17 Motorola, Inc. Heat sink and method for removing heat from a plurality of components
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US7028760B2 (en) 1999-05-12 2006-04-18 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US7066240B2 (en) 1999-05-12 2006-06-27 Thermal Corp Integrated circuit heat pipe heat spreader with through mounting holes
US7100679B2 (en) 1999-05-12 2006-09-05 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US7100680B2 (en) 1999-05-12 2006-09-05 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
WO2000070288A1 (en) * 1999-05-12 2000-11-23 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
DE19960840A1 (en) * 1999-12-16 2001-07-05 Siemens Ag Electronic power circuit with flat heat sink device
DE10053258A1 (en) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Heat sink for electronic device has evaporator and condenser heat exchangers connected in hermetically sealed heat sink circuit
US7150312B2 (en) 2001-11-27 2006-12-19 Thermotek, Inc. Stacked low profile cooling system and method for making same
US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
US8621875B2 (en) 2001-11-27 2014-01-07 Thermotek, Inc. Method of removing heat utilizing geometrically reoriented low-profile phase plane heat pipes
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US9877409B2 (en) 2001-11-27 2018-01-23 Thermotek, Inc. Method for automotive battery cooling
US10211125B2 (en) 2017-07-19 2019-02-19 Heatscape.Com, Inc. Configurable mounting hole structure for flush mount integration with vapor chamber forming plates

Also Published As

Publication number Publication date
GB1090628A (en) 1967-11-08

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