FR2353958A1 - Disc type semiconductor with cooling system - includes disc elastically held between liq. or gas cooling system and body with high coefft. of conductivity - Google Patents

Disc type semiconductor with cooling system - includes disc elastically held between liq. or gas cooling system and body with high coefft. of conductivity

Info

Publication number
FR2353958A1
FR2353958A1 FR7716395A FR7716395A FR2353958A1 FR 2353958 A1 FR2353958 A1 FR 2353958A1 FR 7716395 A FR7716395 A FR 7716395A FR 7716395 A FR7716395 A FR 7716395A FR 2353958 A1 FR2353958 A1 FR 2353958A1
Authority
FR
France
Prior art keywords
cooling system
disc
liq
conductivity
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7716395A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2353958A1 publication Critical patent/FR2353958A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

The semiconductor system has a semiconductor component in the form of a disc (1) which is maintained elastically between two cooling devices. One device uses liquid or gas as the cooling medium. The second device uses a body (3) having a high coefficient of heat conduction. The semiconductor components, in the form of discs, may be disc thyristors, or disc divides. Whilst in many applications a single refrigerant is adequate for high power devices the double refrigerating system is necessary.
FR7716395A 1976-06-01 1977-05-27 Disc type semiconductor with cooling system - includes disc elastically held between liq. or gas cooling system and body with high coefft. of conductivity Withdrawn FR2353958A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762624593 DE2624593A1 (en) 1976-06-01 1976-06-01 SEMI-CONDUCTOR ARRANGEMENT

Publications (1)

Publication Number Publication Date
FR2353958A1 true FR2353958A1 (en) 1977-12-30

Family

ID=5979539

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7716395A Withdrawn FR2353958A1 (en) 1976-06-01 1977-05-27 Disc type semiconductor with cooling system - includes disc elastically held between liq. or gas cooling system and body with high coefft. of conductivity

Country Status (6)

Country Link
JP (1) JPS52147072A (en)
BE (1) BE855136A (en)
DE (1) DE2624593A1 (en)
FR (1) FR2353958A1 (en)
IT (1) IT1079228B (en)
SE (1) SE7706258L (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226816C2 (en) * 1992-08-13 1996-08-22 Licentia Gmbh Device for heat dissipation from a housing of an integrated circuit
DE102005047547B4 (en) * 2005-09-30 2008-02-14 Siemens Ag Pressure concept for a substrate of a power module and power module
DE102009030017A1 (en) 2009-06-23 2010-12-30 Bayerische Motoren Werke Aktiengesellschaft Device for supplying power to a motor vehicle with a radiator block
DE102009030016A1 (en) 2009-06-23 2010-12-30 Bayerische Motoren Werke Aktiengesellschaft Device for powering a motor vehicle with a radiator block

Also Published As

Publication number Publication date
SE7706258L (en) 1977-12-02
IT1079228B (en) 1985-05-08
BE855136A (en) 1977-09-16
DE2624593A1 (en) 1977-12-08
JPS52147072A (en) 1977-12-07

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Legal Events

Date Code Title Description
ST Notification of lapse