BE855136A - SEMICONDUCTOR SYSTEM - Google Patents

SEMICONDUCTOR SYSTEM

Info

Publication number
BE855136A
BE855136A BE177989A BE177989A BE855136A BE 855136 A BE855136 A BE 855136A BE 177989 A BE177989 A BE 177989A BE 177989 A BE177989 A BE 177989A BE 855136 A BE855136 A BE 855136A
Authority
BE
Belgium
Prior art keywords
semiconductor system
semiconductor
Prior art date
Application number
BE177989A
Other languages
French (fr)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BE855136A publication Critical patent/BE855136A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
BE177989A 1976-06-01 1977-05-27 SEMICONDUCTOR SYSTEM BE855136A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762624593 DE2624593A1 (en) 1976-06-01 1976-06-01 SEMI-CONDUCTOR ARRANGEMENT

Publications (1)

Publication Number Publication Date
BE855136A true BE855136A (en) 1977-09-16

Family

ID=5979539

Family Applications (1)

Application Number Title Priority Date Filing Date
BE177989A BE855136A (en) 1976-06-01 1977-05-27 SEMICONDUCTOR SYSTEM

Country Status (6)

Country Link
JP (1) JPS52147072A (en)
BE (1) BE855136A (en)
DE (1) DE2624593A1 (en)
FR (1) FR2353958A1 (en)
IT (1) IT1079228B (en)
SE (1) SE7706258L (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226816C2 (en) * 1992-08-13 1996-08-22 Licentia Gmbh Device for heat dissipation from a housing of an integrated circuit
DE102005047547B4 (en) * 2005-09-30 2008-02-14 Siemens Ag Pressure concept for a substrate of a power module and power module
DE102009030017A1 (en) * 2009-06-23 2010-12-30 Bayerische Motoren Werke Aktiengesellschaft Device for supplying power to a motor vehicle with a radiator block
DE102009030016A1 (en) 2009-06-23 2010-12-30 Bayerische Motoren Werke Aktiengesellschaft Device for powering a motor vehicle with a radiator block

Also Published As

Publication number Publication date
FR2353958A1 (en) 1977-12-30
SE7706258L (en) 1977-12-02
JPS52147072A (en) 1977-12-07
DE2624593A1 (en) 1977-12-08
IT1079228B (en) 1985-05-08

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