JPS5778158A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS5778158A
JPS5778158A JP55154851A JP15485180A JPS5778158A JP S5778158 A JPS5778158 A JP S5778158A JP 55154851 A JP55154851 A JP 55154851A JP 15485180 A JP15485180 A JP 15485180A JP S5778158 A JPS5778158 A JP S5778158A
Authority
JP
Japan
Prior art keywords
chip
chips
main surface
heat
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55154851A
Other languages
Japanese (ja)
Inventor
Taichi Kon
Norio Matsui
Takashi Kawakami
Etsuro Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP55154851A priority Critical patent/JPS5778158A/en
Publication of JPS5778158A publication Critical patent/JPS5778158A/en
Pending legal-status Critical Current

Links

Classifications

    • H10W40/22—
    • H10W72/877—
    • H10W90/724—

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the heat dissipating efficiency of a semiconductor integrated circuit device and to stabilize the operation of the device by connecting a plurality of chips connected in face down to a printed circuit board common with one main surface independently to a heat radiator having thermal expansion coefficient equal to the chip to the other main surfaces of the chips. CONSTITUTION:An externally connecting electrode 2 is provided at one main surface 1a side of a plurality of chips 3 forming an IC, and each electrode 2 is thermally fusion-bonded to the prescribed position of the wire conductor 5 formed on a common printed circuit board 4. A heat radiator 10 having fins 9 made of material having thermal expansion coefficient approximately equal to the chip 3 is connected directly with an adhesive 11, e.g., solder or the like over the entire area at the other main surface 1b side of each chip 3. In this manner the heat from the respective chips 3 can be effectively radiated, the thermal stress can be reduced, and the circuit operation can be thus stabilized. Further, the exchanging work of defective chip can be simplified.
JP55154851A 1980-11-04 1980-11-04 Semiconductor integrated circuit device Pending JPS5778158A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55154851A JPS5778158A (en) 1980-11-04 1980-11-04 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55154851A JPS5778158A (en) 1980-11-04 1980-11-04 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5778158A true JPS5778158A (en) 1982-05-15

Family

ID=15593283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55154851A Pending JPS5778158A (en) 1980-11-04 1980-11-04 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5778158A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012038121A1 (en) * 2010-09-23 2012-03-29 Robert Bosch Gmbh Flip-chip assembly having a cooling element and method for producing a flip-chip assembly
CN109496055A (en) * 2017-09-13 2019-03-19 中兴通讯股份有限公司 A kind of assembly method of circuit structure part, equipment and circuit structure part

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48101085A (en) * 1972-03-31 1973-12-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48101085A (en) * 1972-03-31 1973-12-20

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012038121A1 (en) * 2010-09-23 2012-03-29 Robert Bosch Gmbh Flip-chip assembly having a cooling element and method for producing a flip-chip assembly
CN109496055A (en) * 2017-09-13 2019-03-19 中兴通讯股份有限公司 A kind of assembly method of circuit structure part, equipment and circuit structure part
CN109496055B (en) * 2017-09-13 2023-03-07 中兴通讯股份有限公司 Assembly method and equipment of circuit structural member and circuit structural member

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