JPS62162335A - Bonding device for semiconductor pellet - Google Patents

Abstract

PURPOSE:To enable the titled device to be adapted for the hybrid system satis factorily by a method wherein a bonding arm and a driving part are mounted on a shifting body to bond semiconductor pellets on multiple bonding positions on the shifting body or a substrate continuously at high speed. CONSTITUTION:Within an alignment device 9, pellet holders 15 positioned in the radial directions while pellets 2 are shifted by a sticking collet 10 are aligned with the pellets 2 held by the holders 15 after the pellets 2 are shifted. The aligned pellets 2 are held in sticking by a bonding arm 26 and another sticking collet 25 on a shifting body 21. Then a turntable 29 is turned to rotate a working arm 32 counterclockwise centered on a pin 31 operated by an operat ing pin 30 so that a bonding arm 26 may be advanced to position the collet 25 on an alignment base 14. Then the collet 25 is lowered and lifted by operat ing a lifting cam 28 to hold the aligned pellets 2 in sticking. Later, the collet 25 is lowered by operating the cam 28 to bond the pellets 2 held in sticking on the bonding positions of substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an apparatus for bonding semiconductor pellets, and more particularly to an apparatus that enables hybrid bonding.

[Technical background of the invention] Conventionally, one semiconductor pellet (
Hereinafter referred to as pellets, bonding was performed by adhesive or the like, but recently a hybrid method has been used in which a large number of different types of pellets are bonded to one lead frame or substrate.

By the way, the conventionally used bonding equipment is
A suction collet is held at one end of the honding arm,
The adsorbed cholera 1 was moved up and down via a bonding arm to adsorb and bond pellets, and was moved back and forth via the bonding arm to transfer the pellets.

[Problems with the Background Art] However, since the reciprocating movement of the bonding arm uses a cam as a drive source, the bonding position is limited to one location due to the shape of the cam, and the above-mentioned hybrid method is not suitable for this purpose. I couldn't do that. On the other hand, JP-A-56-103430 describes a technique that makes it possible to freely move the bonding head in the X and Y directions using a screw mechanism.
The movement speed is slow because all of the movement uses a screw machine.
The speed of bonding work was lacking. Furthermore, if the amount of movement is large, the screw shaft must be made long, which is impractical.

[Object of the Invention] The present invention has been made to eliminate the above-mentioned drawbacks, and makes it possible to bond semiconductor pellets continuously and blindly to multiple locations on one lead frame or substrate. The present invention aims to provide a bonding device for semiconductor pellets.

[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to the drawings. The figures show an embodiment of the bonding apparatus used to carry out the present invention, in which Fig. 1 is a plan view thereof, Fig. 2 is a sectional view of the pellet holder portion, and Fig. 3 is a bonding unit portion. A cross-sectional view is shown. As shown in FIG. 1, there are many types of semiconductor pellets 2 (hereinafter referred to as pellets) to be bonded to the substrate 1, and each type is housed in a separate pellet storage container 3, . . . . Each of the bellets 1 to storage container 3, . . . is placed on a pellet holder 4, forming a pellet supply section. As shown in FIG.
It is mounted so that it can move in the X direction, and the support stand 5
is attached to the base 7 with a dovetail joint 8.8 so as to be movable in the Y direction.
By moving the pellet holder 4 in the X and Y directions, it is possible to sequentially position desired pellets 2 to the supply position.

A first suction collet 10 is installed between the pellet holder 4 and a positioning device 9 installed in series with the pellet holder 4 and capable of positioning various types of pellets (described later). The pellet 2 positioned at the supply position is transferred to the positioning device 9 by one suction collet 10 . This suction collet 10 is fixed to an elevator pipe 12 that is connected to a vertically installed rotating shaft 11 that reciprocates in clockwise and counterclockwise directions by a predetermined angle and can be raised and lowered via a key (not shown). It is attached to the tip of the arm 13. And lift '? ? 12 is lowered and the pellet 2 positioned at the supply position is sucked and held by the suction collet 10, then the lift I ¥:12 is raised and the rotation axis 1
1 is rotated clockwise by a predetermined angle, the holding arm 13 is rotated together with the elevator pipe 12, and the elevator PF: 12 is lowered to transfer the pellet 2 onto the positioning table 14 of the positioning device 9. Thereafter, the suction collet 10 rises again, rotates counterclockwise, and waits at the supply position to suction and hold the next pellet 2.

The positioning device 9 is equipped with a plurality of pellet holders 15, . 2 to determine the mounting position. In this operation, the pellet 2 is placed on the positioning table 14.
After the adsorption collet 10 releases its holding, the pellet holding bodies 15, . . . slide to perform positioning.

A substrate holder (not shown) on which the substrate 1 is placed is located in series with the positioning device 9, and a bonding unit 16 is installed in series with this substrate holder. This bonding unit 16 will be explained in detail with reference to FIG.
9 is mounted so as to be movable in the X direction, and furthermore, a unit frame 21 constituting the moving body is mounted on this unit support base 19 by dovetail joints 20 and 20 so as to be movable in the Y direction. - The frame 21 is configured to be movable in the χ and Y directions relative to the unit base 17. An elevating guide member 23 that guides an elevating rod 22 is fixed to the unit frame 21 on one side (board 1 side), and a fork-shaped support member 24 is fixed to the upper surface of the elevating rod 22. At one end, the second
Bonding arm 26 with suction collet 25 attached
The guide slides freely. A cam follower 27 is rotatably mounted on the lower surface of the lifting rod 22, and is in constant contact with a lifting cam 28 rotatably mounted on the unit frame 21 to move the bonding arm 26 up and down via the lifting rod 22. It has become. Further, a rotary disk 29 is rotatably mounted on the other side of the unit frame 21 (the side opposite to the substrate 1), and an operating pin 30 protruding from a part of the rotary disk 29 is pivotally connected to the unit frame 21 by a pin 31. Actuation arm 32
It is designed to fit into a guide slot 33 provided in the. The free end of the operating arm 32 and the other end of the bonding arm 26 are connected via a connecting rod 34. As a result, the actuating pin 30 is displaced by the rotation of the rotary disk 29, and the actuating arm 3
The bonding arm 2 is attached by swinging the bonding arm 2 around the pin 31.
6 is moved forward and backward relative to the unit frame 21.

Next, the operation of the above configuration will be explained. =J.

First, by appropriately moving the pellet holder 4 or support 5 in the X or Y direction with respect to the base 7, the desired pellets 2 are positioned at the supply position. Next, as the holding arm 13 moves up and down, the first suction collet 10 suction-holds the pellet 2 positioned at the supply position and rises. Thereafter, the holding arm 13 rotates clockwise and then descends to transfer the pellet 2 to the positioning table 14 of the positioning device 9. In the positioning device 9, when the pellet 2 is transferred by the suction collet 10, the pellet clamping bodies 15, . . After the positioning of the pellet 2 is completed, the pellet holding bodies 15, . . . again slide in the anti-center direction and wait for the next positioning operation. The positioned pellet 2 is held by suction by the second suction collet 25.

That is, first, the positions of the unit support stand 19 with respect to the unit base 17 and the unit frame 21 with respect to the unit support stand 19 are initialized, and the positioning stand 14 is positioned on the extension of the bonding arm 26 as shown in FIG. This is then set as the origin position of the unit support stand 19 and unit frame 21). In this state, the rotary disk 29 is rotated, and the actuating arm 32 is moved to the pin 31 by the actuation of the actuating pin 30.
The bonding arm 26 swings counterclockwise around the
is advanced to position the suction collet 25 on the positioning table 14. Then, by the operation of the elevating cam 28, the suction collet 25 is lowered and raised to suction and hold the pellet 2 that has been positioned. Thereafter, the rotary disk 29 continues to rotate, and the actuating arm 32 swings clockwise around the pin 31. As a result, the bonding arm 26 retreats, and the pellet 2 held by the suction collet 25 is transferred toward the substrate 1. Then, if necessary, the unit support stand 19 or the unit frame 21 or both are moved in the X and Y directions as appropriate depending on the bonding position, and the suction collet 25 is moved.
is moved and adjusted onto the bonding position of the substrate 1. Thereafter, by the operation of the elevating cam 28, the suction collet 25 is lowered, and the beret 25 that was being suctioned and held by the suction collet 1 is moved downward.
-2 is bonded to the bonding position of the substrate 1.

After honding, the suction collet 25 is raised, the unit support stand 19 and the unit frame 21 are returned to the original position, and the above steps are repeated thereafter.

The direction and amount of movement of the pellet pedestal 4 and the bonding unit 16 can be easily controlled by, for example, sequence control, so the details thereof will be omitted.

According to the above embodiment, the plurality of pellet storage containers 3 storing different types of pellets 2 are placed on the pellet holder 4 that moves in the X and Y directions, so that the required types of pellets 2 can be The pellets 2 can be reliably positioned one after another at the supply position and transferred to the positioning device 9''. Further, the pellet 2 positioned by the positioning device is suctioned and held by a suction collet 25 attached to a bonding arm 26, but this bonding arm 26 is designed to be able to move up and down and reciprocate in the front and rear directions. The unit frame 21 on which the bonding arm 26 is arranged is
Since it can be moved in the Y direction, it is possible to perform continuous bonding by freely moving the suction collet 25 to multiple bonding locations on the substrate 1, which is sufficient for a hybrid method. We can respond. Further, in this embodiment, the bonding arm 26 holding the suction collet 25 is transferred between the positioning device 9 and the substrate 1 using a link mechanism, and the bonding position on the substrate 1 is adjusted by moving the unit frame 21
, Y direction, the pellet 2 can be transported by taking advantage of the high speed provided by the link AM, and the unit frame 21 can be moved in the X, Y direction.
The amount of movement in the Y direction is suppressed to a small amount, so the device can be made smaller.

In the above embodiment, the pellet 2 is bonded to the substrate 1, but the pellet 2 may also be bonded to a lead frame.

Further, the mechanism for raising/lowering and reciprocating the bonding arm 26 is not limited to the above-mentioned embodiment, and various mechanisms such as a cam mechanism or the like can be used.

[Effects of the Invention] As explained above, according to the present invention, it is possible to bond semiconductor pellets to multiple bonding locations on one lead frame or substrate continuously and at high speed, and it is possible to fully support the hybrid method. It becomes possible.

[BRIEF DESCRIPTION OF THE DRAWINGS] The figures show an embodiment of a bonding device used to carry out the present invention, and FIG. 1 is a plan view thereof, and FIG.
The figure shows a cross-sectional view of the pellet holder, and FIG. 3 shows a cross-sectional view of the bonding unit. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Semiconductor pellet, 3... Pellet storage container, 4... Pellet holder, 9... Positioning device, 10... First suction collet 16... Bonding Unit, 21... Unit frame (moving body), 25... Second suction collet, 26... Bonding arm. Patent applicant: Toshiba Seiki Co., Ltd.

Claims (1)

[Claims] (1) A bonding arm that has a suction collet at one end that can hold a semiconductor pellet by suction, and the suction collet can be moved up and down and reciprocated between the pick-up position of the semiconductor pellet and the lead frame or board via this bonding arm. What is claimed is: 1. A semiconductor pellet bonding apparatus having a drive section, characterized in that the bonding arm and the drive section are placed on a moving body.