JP2578934B2 - Die bonding equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus, and more particularly to a pin of a ejector for pushing up an electronic component on a wafer from below and a nozzle of a transfer head for picking up the pushed up electronic component. And a lifting drive mechanism.

(Prior Art) A die bonding apparatus pushes up an electronic component on a wafer by a pin of a die ejector, and picks up the pushed up electronic component by adsorbing it to a lower end portion of a nozzle of a transfer head and transfers the electronic component to a substrate. It has become.

(Problems to be Solved by the Invention) Meanwhile, while the die ejector is fixedly provided below the wafer, the nozzle picks up an electronic component and then transfers it to the substrate. It is provided movably in the XY direction by the device.
Therefore, it is difficult to perform the raising and lowering operation of the pin and the nozzle by driving the same motor. Therefore, conventionally, the pin and the nozzle are separately driven by different motors to perform the raising and lowering operation. This makes it difficult for the pin push-up timing and the nozzle pick-up timing to match. As a result, not only is it easy to cause a pick-up error, but also in some cases, when the nozzle is lowered for pick-up, its lower end is strongly attached to the electronic components. There was a problem that the electronic component was easily broken due to cracking or chipping.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a die bonding apparatus provided with a lifting / lowering driving means capable of performing a lifting / lowering operation of a pin and a nozzle at the best timing.

(Means for Solving the Problems) For this purpose, the present invention provides a first cam and a second cam which are driven by the same motor and rotate, and are provided in a moving device which moves in the X direction, which is a nozzle transfer means. A first cam follower that moves in contact with the first cam is disposed so as to be able to contact and separate from the cam by moving the cam in the X direction, and a second cam follower that moves in contact with the second cam is moved. The first transmission is driven by the movement of the first cam follower to move the pin up and down, and the second transmission is driven by the movement of the second cam follower. Is performed.

(Operation) In the above configuration, when the nozzle is lowered by driving the motor, the pin driven by the same motor is raised to push up the electronic component on the wafer from below, and the nozzle picks up the electronic component without delay.

Example Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 shows a die bonding apparatus.
1 is a table, 2 is a main body box installed on the table 1, 3 is a conveyor for loading and unloading a board 4 on which electronic components are mounted on the table, and 14 is a positioning portion of the board 4 composed of a clamp plate. It is. The substrate to which the electronic components are bonded may be a normal substrate or a substrate such as a lead frame. Numeral 5 designates a wafer arranged on a platform 15 in front of the conveyor 3, above which a nozzle 6 of a transfer head 12 for picking up electronic components on the wafer 5 and transferring it to the substrate 4, and below it. The pins 7 of the die ejector 13 which push up the electronic components on the wafer from below are respectively arranged to be able to move up and down. The ejector 13 is fixedly grounded to a floor or the like. 12a is a box of the transfer head. Note that the nozzle may be a die collet type nozzle having a box-shaped suction unit. Reference numerals 8 and 9 denote moving devices for moving the nozzle 6 in the X and Y directions. Reference numerals 10 and 11 denote drive motors. The moving device 9 moves in the X direction along the moving device 8. The transfer head 12 is mounted on the lower portion of the moving device 9 so as to be movable in the Y direction along the lower portion. Reference numeral 16 denotes a motor mounted on the rear portion of the moving device 9. As will be described later, rotation of the motor 16 is performed by a die via a first transmission device 26 including a swinging rod 22, a driving rod 24, and the like. The pin 7 is transmitted to the ejector 13 to move up and down, and the rotation of the motor 16
The nozzle 6 is moved up and down by being transmitted to the driving means in the box 12a through the second transmission device 27 including the connecting rod 38 and the like.

FIG. 2 shows details of the first transmission device 26 and the second transmission device 27 for raising and lowering the nozzle 6 and the pin 7 by the same motor 16, wherein 17 is a rotating shaft of the motor 16. The rotation shaft 17 has a first cam 18 and a second cam
19 is installed. A is the direction of rotation. In the figure, the ejector 13 and the like indicated by parentheses L are fixed and do not move, but the portion indicated by parentheses M is disposed in the moving device 9 and moves in the X direction as described above.
The nozzle 6 indicated by parentheses N and its driving means are as follows:
It is arranged on the transfer head 12 and, together with the moving device 9, X
In the Y direction along the moving device 9 as described above.
Moves in the XY direction, so that the nozzle 6 moves between the substrate 4 and the wafer 5.

Reference numeral 21 denotes a cam follower that contacts the first cam 18, reference numeral 22 denotes a swinging rod on which the cam follower 21 is pivotally mounted, and reference numeral 23 denotes a pivot pin.
The cam 18 moves toward and away from the cam follower 21 by the reciprocating movement of the moving device 9 in the X direction (see FIGS. 6A and 6B), but the cam 18 rotates while the cam 18 rotates in the contact state. The rod 22 swings in the B direction. Numeral 24 is a drive rod connected to the lower end of the swinging rod 22 via a hinge 25. By swinging of the swinging rod 22, the drive rod 24 reciprocates in its length direction C. The above-mentioned die ejector 13 is operated, and the pins 7 move up and down to push up the electronic components on the wafer 5.

In FIG. 2, reference numeral 30 denotes a cam follower that abuts on the second cam 19, 31 denotes a swinging rod on which the cam follower 30 is axially mounted,
Numeral 32 denotes a spring material for holding, and the swinging rod 31 is rotated by rotation of the cam 19.
Swings in the vertical direction D. 33 is a horizontal rod connected to the tip of the swinging rod 31; 34 is a swinging plate mounted on the side of the horizontal rod 33 via a plate 35; Rolls 37 and 38, which are in contact with each other by spring force, are connecting rods connected to the roll 36.
34 swings back and forth in the E direction, and the connecting rod 38 rotates in the F direction. Next, the driving means of the nozzle 6 will be described with reference to FIG.

The transfer head 12 is attached to the lower part of the moving device 9 so as to be swingable in its length direction (Y direction), and is driven by driving means such as the motor 11 and the timing belt 80 as shown in FIG. Then, it slides in the Y direction. In FIG. 3, reference numeral 41 denotes a rod connected to the connecting rod 38 via a swinging rod 42, and reference numeral 43 denotes a frame of an automatic pressing device 46 connected to the rod 41 via a plate 44. In the F direction, the rod 41 reciprocates in the G direction, and the frame 43 reciprocates in the H direction about the pin 45 (FIG. 4 (a),
(See also (b)). Reference numeral 40 denotes a spring for holding the swinging rod 42. The automatic pressurizing device 46 adjusts the pressing force of the nozzle 6 on the electronic component when the electronic component is picked up by moving the nozzle 6 up and down, or when the electronic component lands on the substrate 4. While referring to a) to (d) together,
The details of the automatic pressurizing device 46 will be described. Note that the parentheses R shown in FIG. 4 (a) and FIG. 7 are a head portion including the automatic pressurizing device 46, the nozzle 6, and the like.

47 is a gear shaft-mounted on the frame 43, 48 is a gear engaged with the gear 47, 50 is a carrier 51, a timing belt 52, and a gear 53.
And a control device such as a computer for controlling the motor 50. Reference numeral 55 denotes an arm serving as a rotating member having one end pivotally mounted on the pin 45, and a roll 57 contacting the upper surface of the rotary plate 56 at the other end.
Is mounted on the shaft. Reference numeral 58 denotes a rotating member attached to the end face of the gear 48 and rotating together with the gear 48. This rotating material
58 and the arm 55 are connected by a pressure spring material 59,
The arm 55 is urged by a spring force of the spring material 59 in a direction to press the roll 57 against the upper surface of the rotating plate 56. The members 47, 48, 55, 57, 58 and 59 constitute driving means driven by the motor 50 to drive the nozzle 6 up and down. Here, the further the motor 50 is driven and the rotating member 58 is rotated in the counterclockwise direction in FIG. 4, the more strongly the roll 57 is pressed against the upper surface of the rotating rod 56, and the nozzle 6 is moved to the upper surface of the electronic component P. Press strongly. Therefore, the nozzles 6 to be adjusted in advance in the computer 54 according to the thickness, material, and the like of each electronic component.
By storing the magnitude of the pressing force on the electronic component as a parameter of the number of rotations of the motor 50, the nozzle 6 can be pressed against each electronic component with the best pressing force. It is possible to prevent the lower end portion of the electronic component from being pressed too hard against the electronic component, thereby damaging the electronic component, or the pick-up mistake caused by the nozzle 6 not landing on the upper surface of the electronic component. Such control is performed by moving the electronic component sucked to the lower end of the nozzle 6 onto the substrate 4.
Similarly, the electronic component lands on the substrate 4 with the best pressing force. In FIG. 2, reference numeral 60 denotes a storage box for the motor 50 and the like.

In FIG. 4 (a), reference numeral 62 denotes an arm extending from the frame 43, and a roll 63 which is in contact with the lower surface of the rotary plate 56 is pivotally mounted at the tip of the arm. Numeral 64 denotes a rotary shaft of the rotary plate 56, from which the nozzle 6 protrudes vertically from its lower end. Reference numeral 65 denotes a spring material for reducing the weight of the nozzle 6 and the like connected to the rotary plate 56 via the rotary plate 56 and the shaft 64. In FIG. 3, reference numeral 66 denotes a gear mounted coaxially with the rotating plate 56, and meshes with the gear 67. The gear 67 is driven and rotated by a motor 68 housed in the box 12a via a transmission means (not shown), whereby the rotating plate 56 rotates in the θ direction about the shaft 64 as a rotation axis. The angle in the θ direction of the electronic component P sucked by the unit is corrected. When the rotating plate 56 rotates, the roll 57 rolls on the rotating plate 56. The gear 67 is long in the vertical direction, and the gear 66 meshing with the gear 67 moves up and down along the gear 67. Reference numeral 69 denotes a drive box for the nozzle 6 disposed between the nozzle 6 and the rotary plate 56, in which a well-known drive means is housed.

In FIG. 3, reference numeral 70 denotes an elevating means for the head portion R, which comprises link means such as an oscillating rod 71, an elevating rod 72, and an oscillating rod 73.
When the transfer head 12 moves forward along the moving device 9, the head portion R is lowered to bring the nozzle 6 closer to the wafer 5. Next, the operation will be described with reference to FIGS. I do.

The rear end of the swinging rod 71 is supported by a pin 74, and a roller 75 is mounted on the swinging rod 71. This roller 75
Is grounded to a guide 76 having a step d (see also FIG. 3). The tip of the swinging rod 73 is
Attached to 69. Therefore, when the transfer head 12 advances in the Y1 direction along the moving device 9, the roller 75 descends along the step d, so that each of the rods 71 to 73 rotates clockwise around the pin 74 and swings. The head R supported by the tip of the rod 73 descends. That is, as shown in FIG. 5 (a), the nozzle 6 is raised and lowered by a large stroke S1 by the lifting means 70, and is raised and lowered by a relatively small stroke S2 by rotation of the frame 43 around the pin 45. As shown in (b), the vertical stroke S3 is raised and lowered by the automatic pressurizing device 46.

The present apparatus is configured as described above, and its operation will be described next.

In picking up electronic components on the wafer 5, the transfer head 12 is advanced and the nozzle 6 is moved to the wafer 5
Move up. Then, as described above, the head portion R is lowered by the stroke S1 by the elevating means 70, and the nozzle 6 approaches the wafer 5 greatly. Next, the motor 16 is driven to rotate the frame 43 downward through the second transmission 27 so that the lower end of the nozzle 6 lands on the electronic component P on the wafer 5 (see FIG. a), (b)). Almost simultaneously with the landing, the automatic pressurizing device 46 operates to press the lower end of the nozzle 6 against the upper surface of the electronic component P with the best pressing force. FIG. 5A shows strokes S1 and S2 by the lifting / lowering means 70 and the frame 43 until the nozzle 6 lands on the electronic component P. FIG. 3B shows a state in which the nozzle 6 is slightly lowered by the stroke S3 by the operation of the automatic pressurizing device 46, and the lower end is pressed against the upper surface of the electronic component P. Further, at this time, the first transmission 26 is also driven by the same motor 16 to operate, and the pins 7 are raised, and the electronic components P on the wafer 5 are started to be pushed up. Then, the pin 7 further rises and pushes up the electronic component P. At this time, the frame 43 starts to rotate in the opposite direction and the nozzle 6 starts to rise, so that the electronic component P is pushed up by the pin 7. It is picked up by the nozzle 6 (see FIGS. 4 (c) and 5 (c)). Next, transfer head 12
Is retracted in the Y2 direction (see FIG. 7), the roller 75 of the lifting / lowering means 70 rides on the step d, and each of the rods 71 to 73 is rotated upward, so that the electronic component P is largely lifted by the stroke S1. Then, when the nozzle 6 moves in the XY direction, the electronic component P is transferred to and mounted on the substrate 4 (see FIG. 5 (d)). At this time, the landing force when the electronic component P lands on the substrate 4 is also adjusted by the automatic pressing device 46 as described above, and the electronic component P lands on the substrate 4 with the best pressing force.

(Effects of the Invention) As described above, the present invention relates to a die bonding apparatus of this type which is driven by the same motor to rotate the first motor.
And a second cam are provided in a moving device that moves in the X direction, and a first cam follower that moves in contact with the first cam is disposed so as to be able to contact and separate from the cam by moving the cam in the X direction. At the same time, a second cam follower that moves in contact with the second cam is provided movably with this cam,
The first gear is driven by the movement of the first cam follower to move the pin up and down, and the movement of the second cam follower drives the second gear to move the nozzle up and down. As a result, the operation of raising and lowering the pins of the die ejector fixed below the wafer and the operation of raising and lowering the nozzles of the transfer head moving in the XY direction can be performed by driving the same motor. Electronic components on the wafer can be reliably picked up without the timing of the raising and lowering operations of the nozzles and pins being disturbed.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is an overall perspective view of a die bonding apparatus, FIGS. 2 and 3 are perspective views of driving means, and FIGS. 4 (a) and 4 (b). , (C),
(D) is a side view of the automatic pressurizing device from pickup to mounting, FIGS. 5 (a), (b), and (c) are side views of main parts during pickup, and FIGS. 6 (a) and (b). FIG. 7 is a perspective view of the moving device during operation, and FIG. 7 is a side view. 5 Wafer 6 Nozzle 7 Pin 9 Moving device 12 Transfer head 13 Die ejector 16 Motor 18 First cam 19 Second cam 21 First The cam follower 30 The second cam follower 26 The first transmission device 27 The second transmission device P Electronic components

Claims (1)

(57) [Claims] 1. A die ejector having a pin for pushing up an electronic component on a wafer from below, a pick-up by sucking the pushed-up electronic component to a lower end portion of a nozzle, and moving the electronic component in a XY direction to a substrate. In a die bonding apparatus provided with a transfer head for transferring and mounting on a first cam, a first cam and a second cam that are driven by the same motor and rotate are provided in a moving device that moves in the X direction, and are brought into contact with the first cam. A first cam follower that moves is disposed so as to be able to contact and separate from the cam by moving the cam in the X direction, and a second cam follower that moves in contact with the second cam is movably provided together with the cam. The first transmission is driven by the movement of the first cam follower to move the pin up and down, and the second transmission is moved by the movement of the second cam follower. The driven die bonding apparatus is characterized in that so as to perform the elevating operation of the nozzle.