CN220474597U

CN220474597U - Chip tilting mechanism

Info

Publication number: CN220474597U
Application number: CN202322133918.0U
Authority: CN
Inventors: 洪汉辉; 王晨光; 张岩; 杨洪亮
Original assignee: Guangdong Hangrui Intelligent Technology Co ltd
Current assignee: Guangdong Hangrui Intelligent Technology Co ltd
Priority date: 2023-08-09
Filing date: 2023-08-09
Publication date: 2024-02-09
Anticipated expiration: 2033-08-09

Abstract

The utility model relates to a chip turnover mechanism, comprising: the device comprises a rotating outer shaft, a rotating inner shaft, a connecting rod, a vacuum suction nozzle, a turnover support plate and a guide clamping plate; the rotating outer shaft is sleeved outside the rotating inner shaft, the rotating outer shaft is in rotating connection with the rotating inner shaft, and the rotating angle of the rotating inner shaft is smaller than that of the rotating outer shaft; one end of the connecting rod is fixedly connected with the side wall of the rotating outer shaft, the other end of the connecting rod is rotationally connected with the vacuum suction nozzle, two ends of the overturning support plate are respectively fixedly connected with the side wall of the rotating inner shaft and the guide clamping plate, the vacuum suction nozzle is positioned in the guide clamping plate, and the guide clamping plate is used for limiting the moving direction of the vacuum suction nozzle. The scheme provided by the utility model realizes the automatic overturning of the wafer chip, so that the wafer chip can be subjected to automatic flip-chip bonding.

Description

Chip tilting mechanism

Technical Field

The utility model relates to the technical field of chip manufacturing, in particular to a chip overturning mechanism.

Background

With the development of technology, many intelligent products are emerging on the market, and most of the intelligent products are provided with special chips, wherein the chips are electronic components commonly used in the electronic industry at present, and the manufacturing of the chips needs to undergo a plurality of flow steps, mainly: the method comprises the steps of depositing, photoresist coating, exposing, calculating photoetching, baking and developing, etching, calculating and inspecting, ion implantation and packaging chips, wherein the packaging of the chips comprises bonding processes, bonding refers to fixing a wafer chip on a substrate, the bonding processes can be divided into two types of traditional methods and advanced methods, the traditional methods adopt chip bonding (or chip mounting) and lead bonding, the advanced methods adopt flip chip bonding technology developed by IBM corporation in the later stage of 60 s, the flip chip bonding technology combines the chip bonding with the lead bonding and connects the chip and the substrate in a way of forming a bump on a chip bonding pad, the bonding technology realizes the electric connection between the chip and the outside by attaching the semiconductor chip on a lead frame or a printed circuit board, in order to realize the suction nozzle bonding of the wafer chip, the flip mechanism arranged in the wafer fixing equipment on the market is generally divided into two types, and the first method adopts a flip chip bonding technology which is controlled by a motor to flip the flip chip on a cantilever, and the flip chip can realize the flip chip on the wafer carrier, but the scheme can not realize the flip of the chip carrier of the wafer carrier; the second is to turn over the wafer chip by providing a multi-axis robot, but the cost of the solution is high, and the arrangement of the multi-axis robot requires a large space.

For example, the patent name of the Chinese patent with the publication number of "CN103367208B" is a flip bonding platform for high-density chips ", in order to realize the flip of the wafer chips, specifically, the flip unit of the scheme comprises a suction nozzle, a cantilever and a rotating motor, two ends of the cantilever are respectively fixedly connected with the suction nozzle and the rotating end of the rotating motor, the suction direction of the suction nozzle is vertical to the rotating direction of the rotating motor, the suction nozzle is driven to flip by rotating the cantilever through the rotating motor, so that the wafer chips can be realized, but the suction nozzle of the scheme does not have a lifting function, so that the flip unit of the scheme can not take the chips out of the loaded waffle box, if the chips are damaged by forced taking out, the application range of the device is relatively narrow, and the device is not suitable for popularization and use.

Therefore, how to realize the automatic flip of the wafer chips is a technical problem that needs to be solved by the technicians at present.

Disclosure of Invention

In order to overcome the problems in the related art, the utility model provides a chip overturning mechanism which can realize automatic overturning of a wafer chip so that the wafer chip can be subjected to automatic flip-chip bonding.

In order to achieve the above object, the present utility model provides a chip flipping mechanism, comprising: the device comprises a rotating outer shaft, a rotating inner shaft, a connecting rod, a vacuum suction nozzle, a turnover support plate and a guide clamping plate;

the rotating outer shaft is sleeved outside the rotating inner shaft, the rotating outer shaft is in rotating connection with the rotating inner shaft, and the rotating angle of the rotating inner shaft is smaller than that of the rotating outer shaft;

one end of the connecting rod is fixedly connected with the side wall of the rotating outer shaft, the other end of the connecting rod is rotationally connected with the vacuum suction nozzle, two ends of the overturning support plate are respectively fixedly connected with the side wall of the rotating inner shaft and the guide clamping plate, the vacuum suction nozzle is positioned in the guide clamping plate, and the guide clamping plate is used for limiting the moving direction of the vacuum suction nozzle.

Preferably, the rotating shaft comprises a rotating shaft body, a rotating shaft body and a rotating shaft body, wherein the rotating shaft body is provided with a rotating shaft inner shaft, the rotating shaft inner shaft is provided with a rotating shaft outer shaft, the rotating shaft inner shaft is provided with a rotating shaft inner shaft, and the rotating shaft inner shaft is provided with a rotating shaft inner shaft.

Preferably, the synchronous motor further comprises a synchronous tension spring and a synchronous wheel, wherein two ends of the synchronous tension spring are fixedly connected with the side wall of the rotating outer shaft and the side wall of the rotating inner shaft respectively, the center of the synchronous wheel is fixedly connected with one end of the rotating outer shaft, and the synchronous wheel is connected with the driving end of the driving motor through a synchronous belt.

Preferably, the guiding plate comprises a connecting plate, a first clamping plate and a second clamping plate, wherein two ends of the connecting plate are respectively and fixedly connected with the first clamping plate and the second clamping plate, the outer plate surface of the connecting plate is fixedly connected with the overturning support plate, the vacuum suction nozzle is positioned between the first clamping plate and the second clamping plate, an access through hole is formed in the first clamping plate, and the access through hole is matched with the vacuum suction nozzle.

Preferably, the vacuum suction nozzle further comprises a guide pulley, wherein the guide pulley is fixed on the inner plate surface of the connecting plate, and the guide pulley is in sliding connection with the vacuum suction nozzle.

Preferably, the vacuum suction nozzle further comprises a buffer spring, and two ends of the buffer spring are fixedly connected with the first clamping plate and the vacuum suction nozzle respectively.

Preferably, the rotating outer shaft is provided with a limiting through hole, the limiting through hole corresponds to the overturning support plate, the limiting support plate and the synchronous tension spring respectively, and the limiting through hole is used for limiting the maximum rotating angle difference between the rotating outer shaft and the rotating inner shaft.

The technical scheme provided by the utility model can comprise the following beneficial effects:

in the technical scheme, a rotating outer shaft, a rotating inner shaft, a connecting rod, a vacuum suction nozzle, a turnover support plate and a guide clamping plate are respectively arranged on the turnover mechanism; sleeving a rotating outer shaft outside the rotating inner shaft, enabling the rotating outer shaft to be in rotary connection with the rotating inner shaft, fixedly connecting one end of a connecting rod with the side wall of the rotating outer shaft, rotatably connecting the other end of the connecting rod with an extraction suction nozzle, fixedly connecting two ends of a turnover support plate with the side wall of the rotating inner shaft and a guide clamping plate respectively, enabling a vacuum suction nozzle to be positioned in the guide clamping plate, and limiting the moving direction of the vacuum suction nozzle by utilizing the guide clamping plate; for example, when the wafer chip needs to be overturned, the outer rotating shaft and the inner rotating shaft synchronously rotate, thereby driving the overturning support plate and the connecting rod to overturn, stopping rotating when the inner rotating shaft rotates to 180 degrees, at this time, the outer rotating shaft continuously drives the connecting rod to overturn, the connecting rod drives the vacuum suction nozzle positioned in the guide clamping plate to move, the vacuum suction nozzle is guided by the guide clamping plate to keep the longitudinal direction to descend, when the vacuum suction nozzle descends to the surface of the wafer chip, the vacuum suction nozzle utilizes negative pressure to generate adsorption force to suck the wafer chip, and finally, the outer rotating shaft reversely rotates, and when the vacuum suction nozzle returns to the guide clamping plate, the inner rotating shaft synchronously reversely rotates to the initial position, so that the overturning of the wafer chip is realized, the production efficiency is improved, and the scheme can realize the longitudinal lifting of the vacuum suction nozzle, can avoid the problem that the wafer chip cannot be taken out from the wafer box by the vacuum suction nozzle, and the adaptability of the device to the wafer chip carrier is improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed.

Drawings

The foregoing and other objects, features and advantages of the utility model will be apparent from the following more particular descriptions of exemplary embodiments of the utility model as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the utility model.

Fig. 1 is a schematic structural view of a tilting mechanism according to an embodiment of the present utility model.

Fig. 2 is another schematic structural view of the tilting mechanism according to the embodiment of the present utility model.

Fig. 3 is a schematic structural view of a guide splint according to an embodiment of the present utility model.

In the figure: 01. rotating the outer shaft; 010. limiting through holes; 02. rotating the inner shaft; 03. a connecting rod; 04. a vacuum suction nozzle; 05. overturning the support plate; 06. a guide clamping plate; 060. a connecting plate; 061. a first clamping plate; 0610. an access through hole; 062. a second clamping plate; 07. limiting support plates; 08. fixing the side plates; 09. a positioning plate; 10. a synchronous tension spring; 11. a synchronizing wheel; 12. a guide pulley; 13. and a buffer spring.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments of the present utility model. All other embodiments obtained by those skilled in the art without making any inventive effort are within the scope of the present utility model. Preferred embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present utility model are shown in the drawings, it should be understood that the present utility model may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

In the description of the present utility model, it should be understood that the terms "thickness," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the utility model. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Referring to fig. 1 to 3, the tilting mechanism includes: the rotary outer shaft 01, the rotary inner shaft 02, the connecting rod 03, the vacuum suction nozzle 04, the overturning support plate 05 and the guide clamping plate 06;

the rotating outer shaft 01 is sleeved outside the rotating inner shaft 02, the rotating outer shaft 01 is rotationally connected with the rotating inner shaft 02, and the rotating angle of the rotating inner shaft 02 is smaller than that of the rotating outer shaft 01;

one end of the connecting rod 03 is fixedly connected with the side wall of the rotating outer shaft 01, the other end of the connecting rod is rotationally connected with the vacuum suction nozzle 04, two ends of the overturning support plate 05 are respectively fixedly connected with the side wall of the rotating inner shaft 02 and the guide clamping plate 06, the vacuum suction nozzle 04 is positioned in the guide clamping plate 06, and the guide clamping plate 06 is used for limiting the moving direction of the vacuum suction nozzle 04.

Preferably, the rotary shaft further comprises a limiting support plate 07, a fixed side plate 08 and a positioning plate 09, wherein the fixed side plate 08 is rotationally connected with the tail end of the rotary shaft 01, the limiting support plate 07 is fixedly connected with the side wall of the rotary shaft 02, the limiting support plate 07 is aligned with the overturning support plate 05, the positioning plate 09 is fixed on the fixed side plate 08, the positioning plate 09 corresponds to the limiting support plate 07, and the positioning plate 09 is used for limiting the rotation angle of the rotary shaft 02.

Preferably, the synchronous motor further comprises a synchronous tension spring 10 and a synchronous wheel 11, wherein two ends of the synchronous tension spring 10 are respectively and fixedly connected with the side wall of the rotating outer shaft 01 and the side wall of the rotating inner shaft 02, the center of the synchronous wheel 11 is fixedly connected with one end of the rotating outer shaft 01, and the synchronous wheel 11 is connected with the driving end of the driving motor through a synchronous belt.

Preferably, the guiding clamping plate 06 comprises a connecting plate 060, a first clamping plate 061 and a second clamping plate 062, wherein two ends of the connecting plate 060 are respectively and fixedly connected with the first clamping plate 061 and the second clamping plate 062, the outer plate surface of the connecting plate 060 is fixedly connected with the overturning supporting plate 05, the vacuum suction nozzle 04 is located between the first clamping plate 061 and the second clamping plate 062, an access through hole 0610 is formed in the first clamping plate 061, and the access through hole 0610 is matched with the vacuum suction nozzle 04.

Preferably, there is also a guide pulley 12, the guide pulley 12 is fixed on the inner plate surface of the connection plate 060, and the guide pulley 12 is slidingly connected with the vacuum nozzle 04.

Preferably, a buffer spring 13 is further included, and two ends of the buffer spring 13 are fixedly connected with the first clamping plate 061 and the vacuum nozzle 04 respectively.

Preferably, a limiting through hole 010 is provided on the rotating outer shaft 01, the limiting through hole 010 corresponds to the overturning support plate 05, the limiting support plate 07 and the synchronous tension spring 10, respectively, and the limiting through hole 010 is used for limiting the maximum rotating angle difference of the rotating outer shaft 01 and the rotating inner shaft 02.

In the first embodiment, in order to realize the overturning of the wafer chip, specifically, in this embodiment, a rotating outer shaft, a rotating inner shaft, a connecting rod, a vacuum suction nozzle, an overturning support plate and a guiding clamping plate are arranged; the rotary outer shaft is sleeved outside the rotary inner shaft, the rotary outer shaft is in rotary connection with the rotary inner shaft, one end of the connecting rod is fixedly connected with the side wall of the rotary outer shaft, the other end of the connecting rod is in rotary connection with the extraction suction nozzle, two ends of the overturning support plate are respectively fixedly connected with the side wall of the rotary inner shaft and the guide clamping plate, the vacuum suction nozzle is positioned in the guide clamping plate, and the guide clamping plate is used for limiting the moving direction of the vacuum suction nozzle.

For example, when the wafer chip needs to be overturned, the outer rotating shaft and the inner rotating shaft synchronously rotate, thereby driving the overturning support plate and the connecting rod to overturn, stopping rotating when the inner rotating shaft rotates to 180 degrees, at this time, the outer rotating shaft continuously drives the connecting rod to overturn, the connecting rod drives the vacuum suction nozzle positioned in the guide clamping plate to move, the vacuum suction nozzle is guided by the guide clamping plate to keep the longitudinal direction to descend, when the vacuum suction nozzle descends to the surface of the wafer chip, the vacuum suction nozzle utilizes negative pressure to generate adsorption force to suck the wafer chip, and finally, the outer rotating shaft reversely rotates, and when the vacuum suction nozzle returns to the guide clamping plate, the inner rotating shaft synchronously reversely rotates to the initial position, so that the overturning of the wafer chip is realized, the production efficiency is improved, and the scheme can realize the longitudinal lifting of the vacuum suction nozzle, can avoid the problem that the wafer chip cannot be taken out from the wafer box by the vacuum suction nozzle, and the adaptability of the device to the wafer chip carrier is improved.

In the second embodiment, in order to avoid that the inner rotating shaft cannot stop in time due to inertia when turning over, specifically, in this embodiment, a limiting support plate, a fixed side plate and a positioning plate are provided, the fixed side plate is rotationally connected with the tail end of the outer rotating shaft, then the limiting support plate is fixedly connected with the side wall of the inner rotating shaft, the limiting support plate is aligned with the turning support plate, then the positioning plate is fixed on the fixed side plate, the positioning plate corresponds to the limiting support plate, and the positioning plate is used for limiting the rotation angle of the inner rotating shaft; for example, when the rotating inner shaft needs to rotate, the rotating inner shaft drives the limiting support plate to turn over, and when the rotating inner shaft rotates to a preset stop angle, the limiting support plate is abutted with the positioning plate, so that the rotating inner shaft can not rotate continuously any more, and the movement direction of the vacuum suction nozzle is prevented from being offset due to excessive rotation of the rotating inner shaft.

It is noted that, in order to realize the rotation of the rotating outer shaft and the rotating inner shaft driven by a driving motor, specifically, in this embodiment, two ends of the synchronous tension spring are respectively and fixedly connected with the side wall of the rotating outer shaft and the side wall of the rotating inner shaft by arranging the synchronous tension spring and the synchronous wheel, then the center of the synchronous wheel is fixedly connected with one end of the rotating outer shaft, and the synchronous wheel is connected with the driving end of the driving motor through a synchronous belt; for example, when the rotating inner shaft and the rotating outer shaft need to rotate, the driving motor drives the rotating outer shaft to rotate through the synchronous belt, the rotating outer shaft pulls the rotating inner shaft to synchronously rotate through the synchronous tension spring, when the rotating inner shaft stops rotating through the abutting joint of the limiting support plate and the positioning plate, the synchronous wheel can further drive the rotating outer shaft to rotate, so that the vacuum suction nozzle can be lifted, the rotation of the rotating outer shaft and the rotating inner shaft driven by the driving motor is realized, the arrangement of one more motor is replaced by a simple structure, and the manufacturing and maintenance cost of the device is reduced.

In the third embodiment, in order to realize the lifting guide of the vacuum nozzle, specifically, the guide clamping plate of the embodiment is composed of a connecting plate, a first clamping plate and a second clamping plate, wherein two ends of the connecting plate are fixedly connected with the first clamping plate and the second clamping plate respectively, then the plate surface of the connecting plate, which is close to the outer side, is fixedly connected with the overturning support plate, the vacuum nozzle is positioned between the first clamping plate and the second clamping plate, and then an access through hole is formed in the first clamping plate, so that the access through hole is matched with the vacuum nozzle; the guide clamping plate is also provided with a guide pulley and a buffer spring, the guide pulley is fixed on the inner plate surface of the connecting plate, and the guide pulley is in sliding connection with the vacuum suction nozzle, so that the two ends of the buffer spring are respectively and fixedly connected with the first clamping plate and the vacuum suction nozzle; for example, when the vacuum suction nozzle is driven to turn over, the second clamping plate supports the bottom of the vacuum suction nozzle and the connecting rod to drive the vacuum suction nozzle to turn over together, when the rotating inner shaft stops rotating, the rotating outer shaft drives the connecting rod to continue turning over, so that the vacuum suction nozzle descends to the surface of the wafer chip from the in-out through hole, wherein the descending direction of the vacuum suction nozzle can be kept vertical by the guide pulley, the contact friction with the vacuum suction nozzle can be reduced by the guide way of the guide pulley, the load of the driving motor is reduced, the buffer spring can slowly reduce the descending speed of the vacuum suction nozzle, and the wafer chip is prevented from being collided by the excessively fast descending speed.

It should be noted that, in order to realize that the rotating inner shaft drives the overturning support plate, the limiting support plate and the synchronous tension spring to overturn, specifically, the limiting through hole is formed in the rotating outer shaft, the limiting through hole corresponds to the overturning support plate, the limiting support plate and the synchronous tension spring respectively, the overturning support plate, the limiting support plate and the synchronous tension spring pass through the limiting through hole to be fixedly connected with the rotating inner shaft, the limiting through hole enables the rotating inner shaft to rotate relatively with the rotating outer shaft under the condition of being fixedly connected with the overturning support plate, the limiting support plate and the synchronous tension spring, and the limiting through hole can be used for limiting the maximum rotation angle difference of the rotating outer shaft and the rotating inner shaft.

The aspects of the present utility model have been described in detail hereinabove with reference to the accompanying drawings. In the foregoing embodiments, the descriptions of the embodiments are focused on, and for those portions of one embodiment that are not described in detail, reference may be made to the related descriptions of other embodiments. Those skilled in the art will also appreciate that the acts and modules referred to in the specification are not necessarily required for the present utility model. In addition, it can be understood that the steps in the method of the embodiment of the present utility model may be sequentially adjusted, combined and pruned according to actual needs, and the structure in the apparatus of the embodiment of the present utility model may be combined, divided and pruned according to actual needs.

The foregoing description of embodiments of the utility model has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the improvement of technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A chip tilting mechanism, characterized by comprising:

the device comprises a rotating outer shaft, a rotating inner shaft, a connecting rod, a vacuum suction nozzle, a turnover support plate and a guide clamping plate;

2. The chip turnover mechanism of claim 1, further comprising a limiting support plate, a fixed side plate and a positioning plate, wherein the fixed side plate is rotatably connected with the end of the rotating outer shaft, the limiting support plate is fixedly connected with the side wall of the rotating inner shaft, the limiting support plate is aligned with the turnover support plate, the positioning plate is fixed on the fixed side plate, the positioning plate corresponds to the limiting support plate, and the positioning plate is used for limiting the rotation angle of the rotating inner shaft.

3. The chip overturning mechanism according to claim 2, further comprising a synchronous tension spring and a synchronous wheel, wherein two ends of the synchronous tension spring are fixedly connected with the side wall of the rotating outer shaft and the side wall of the rotating inner shaft respectively, the center of the synchronous wheel is fixedly connected with one end of the rotating outer shaft, and the synchronous wheel is connected with the driving end of the driving motor through a synchronous belt.

4. The chip turnover mechanism according to claim 1, wherein the guide clamping plate comprises a connecting plate, a first clamping plate and a second clamping plate, two ends of the connecting plate are fixedly connected with the first clamping plate and the second clamping plate respectively, the outer plate surface of the connecting plate is fixedly connected with the turnover supporting plate, the vacuum suction nozzle is located between the first clamping plate and the second clamping plate, and an access through hole is formed in the first clamping plate and is matched with the vacuum suction nozzle.

5. The chip flipping mechanism of claim 4, further comprising a guide pulley, wherein the guide pulley is fixed to the inner plate surface of the connecting plate, and wherein the guide pulley is slidably coupled to the vacuum nozzle.

6. The chip turnover mechanism of claim 4, further comprising a buffer spring, wherein two ends of the buffer spring are fixedly connected with the first clamping plate and the vacuum nozzle respectively.

7. A chip turnover mechanism according to claim 3, wherein the rotating outer shaft is provided with a limiting through hole, the limiting through hole corresponds to the turnover support plate, the limiting support plate and the synchronous tension spring respectively, and the limiting through hole is used for limiting the maximum rotation angle difference between the rotating outer shaft and the rotating inner shaft.