JPS5896739A - Hybrid bonding method of semiconductor pellet - Google Patents

Abstract

PURPOSE:To bond different kinds of pellets securely on a substrate, by a method wherein a pellet container is put on a XY table, a required pellet is absorbed up and moved to the fixed position on the other table, and this pellet is again absorbed up and moved to the fixed position on the substrate by a collet attached to a mount which is movable in the X-Y, up and down, and forward and backward directions. CONSTITUTION:A container 3 which contains different kinds of pellets classified according to the kind is put on a X-Y table 4. A required pellet 2 is moved to a supply position, and is absorbed up and moved onto a positioning table 14 by a collet 10 fixed to the end of an arm 13 which is rotatable and movable in up and down direction. Then, a member 15 clips the pellet 2 to position it. A table for a substrate 1 and a fitting device 16 are disposed in series with said positioning device 9. The fitting device 16 has a base 17, and a mount 21 which is movable in X-Y direction and is mounted on a pedestal 19 on the base 17. A mount 21 is provided with a cam structure so as to move a holding rod 26 up and down, and forward and backward. By the movement of the rod 26, a collet 25 which is fixed to the end of the rod attracted up, moves, and bonds the pellet at the fixed position. Thus, hybrid junction can be readily provided by this construction.

Description

[Detailed description of the invention] This is related to the ing method.

In the past, one semiconductor pellet was attached to one lead frame, but recently hybrids, in which many different types of semiconductor pellets are bonded to one substrate, have come into use. For this reason, it is difficult to adhere semiconductor pellets using conventional methods.

However, no such means have been proposed for hybrids.

As a result of various studies to easily and reliably perform hybrid bonding, the inventor of the present invention has developed a method of storing pellets of different types in a plurality of pellet storage containers and placing them on a pellet holder. The platform is moved in the X and Y directions to move the desired pellet to a predetermined position, and the pellet at the predetermined position is held in front of the eye by a suction collet that moves up and down and rotates, and is moved to a positioning device for positioning. The pellet is moved onto the substrate or lead frame by moving the holding bar equipped with the suction collet that has been sucked and held up and down and back and forth, and the unit frame that supports the holding bar is moved in the X and Y directions to position it on the board or lead frame. It was discovered that good results could be obtained by moving and adhering the pellets, and the present invention was proposed.

The method of the present invention will be explained in detail with reference to the drawings. As shown in FIG. 1, semiconductor pellets 2 (hereinafter referred to as pellets) to be adhered to a substrate 1 are arranged in a plurality of frames, each in a separate pellet storage container 3. ...They are each housed inside. Then, each pellet storage container 3° is placed on the pellet holder 4. This pellet holder 4 um 2
As shown in ff1l, dovetail joints 6, 6 are connected to the support stand 5.
The support stand 5 is attached to the base 7 so that it can be moved in the X direction.
The device is configured so that it can move in the Y direction using dovetail joints 8, 8. Then, the pellet holder 4 is moved in the X and X directions, respectively, to move the desired pellets 2 to the supply position.

Next, a suction collet was installed between the pellet holder 4 and a positioning device 9 installed in series with the pellet holder 4 and capable of positioning the shapes of various images described later]
0 moves the desired pellet 2 to the positioning device 9. This suction collet 10 is vertically installed and rotates clockwise and counterclockwise by a predetermined angle.
1III, the holding arm 13 is attached to the tip of the holding arm 13, which is connected to the elevator pipe 12 via a key (not shown) so that it can be raised and lowered freely. After the elevator tube 12 is lowered and the desired pellet 2 is suction-held by the suction collet 10, the elevator tube 12 is raised and the movable shaft 11 is rotated clockwise by a predetermined angle, so that the elevator tube 12 and the holding arm ] 3 to lower the elevator tube 12 and transfer the pellet 2 onto the positioning table 14 of the positioning device 9. After that, the suction collet 10
It then rises, rotates counterclockwise, and waits at a predetermined position to suck and hold the next pellet 2.

A known positioning device is used, and a plurality of pellet gripping bodies 15 are mounted so as to be slidable relative to the center of the positioning table 14. ...(4 in the example)
2), the pellet 2 transferred to the positioning table 14 is held between the pellets 2 and the mounting position is determined. This operation
After the pellet 2 is transferred to the positioning table 14 and released from the stratified collet 10, the pellet gripping body]5. ... slides to determine the position.

Further, in series with the positioning device 9 is located a board holder (not shown) on which a board is placed, and a mount unit 16 is installed in series with this board holder.

As shown in FIG. 3, this mount unit 16 is mounted on a unit base 17 with dovetail joints 18, 18 so that the unit support stand 19 can be moved in the X direction, and on this unit support stand 19 there are dovetail joints 20. 20 so that the unit frame 21 can be moved in the Y direction. A lifting guide member 23 that guides the lifting rod 22 is fixed to this unit frame 21 on one side (board 1 side).
A fork-shaped support member 24 is identified on the upper surface of the support member 2, and a holding rod 26 having a suction collet 25 attached to the tip thereof is slidably passed through the support member 24. Further, a roller 27 is rotatably mounted on the lower surface of the lifting rod 22, and is in constant contact with a lifting cam 28 rotatably mounted on the unit frame 21, so that the holding rod 26 can be lifted and lowered via the lifting rod 22. It has become.

Further, a rotary disk 29 is rotatably mounted on the other side of the unit frame 21 (the side opposite to the substrate 1), and an operating pin 30 is provided protrudingly from a part of the rotary disk 29.
The actuating pin 30 is fitted into the guide slot 33 provided in the actuating arm 32 pivotally attached in step 1, and the free end of the actuating arm 32 is pivotally attached to the side of the holding rod 26 opposite to the suction collet 25 via the connecting rod 34. There is. Then, the operating pin 30 is rotated by 290 rotations of the rotary disk, the operating arm 32 is moved around the pin 31, and the holding rod 2 is moved.
6 to move forward and backward.

Using the mount unit 16 configured as described above, the holding rod 26 is advanced and lowered to the instep to attach the suction collet 25.
The pellet 2 positioned by the positioning device 9 is held by suction. After that, each pellet gripper 15.・・・・・・
moves away from the center and releases pellet 2. On the other hand, the holding rod 26 is raised and then retreated to position the suction collet 25 on the substrate 1. Then, the dovetail-coupled unit support stand 19 and unit frame 21 tX are moved in the Y direction, and the suction collet 25 is moved to a predetermined position on the substrate 1 . Thereafter, the holding rod 26 is lowered and the pellets 2 being sucked and held are adhered to a predetermined position on the substrate. After adhesion, the holding rod 26 is raised and stands by.

In the above embodiment, several pellets 2 are placed on the substrate 1.
Although it has been described that the adhesive is attached to the substrate 1, it is not limited to the substrate 1, and can also be attached to a lead frame.

Further, the mechanism for raising and lowering the holding rod 26 and for moving it back and forth is not limited to the above-mentioned embodiments, and any rod mechanism can be used.

The method of the present invention is configured as described above, and the plurality of pellet storage containers storing different types of pellets are
Since it is placed on a pellet holder that moves backward in the Y direction,
Necessary pellets can be reliably positioned below the suction collet 10 and transferred onto the positioning device 9.

Also, the pellets positioned by the positioning device are held by the holding rod 2.
It is held by suction by a suction collet 25 attached to 6, and this holding rod 26 is designed to be able to move up and down and move forward and backward.
Since the unit frame 21 with the holding rod 26 attached is configured to move in the XY direction, the board 1 or H'J-
move the suction collet 25 to a predetermined position on the deframe,
It is possible to reliably attach the layer to a predetermined position.

[Brief explanation of the drawing]

The figures show an embodiment of the hybrid bonding method for semiconductor pellets according to the present invention, in which Fig. 1 is a plan view thereof, Fig. 2 is a cross-sectional view of the pellet holder, and 3rd [C] is a mount unit. FIG. In the figure, 1 is a substrate, 2 is a pellet, 3 is a pellet storage container,
4 is a pellet holder, 9 is a positioning device, 10 is a suction collet, 21 is a unit frame, 25 is a suction collet,
26 is a holding rod. Cj′−≧

Claims (1)

[Claims] Pellets of different rod types are stored in a plurality of pellet storage containers and placed on a pellet holder, and the pellet holder is moved in the XY direction to move the desired pellet to a fixed position of 1'9. A pellet at a predetermined position is held by suction with a suction collet that moves up and down and rotates, and is moved to a positioning device for positioning, and a holding rod equipped with a suction collet that holds the positioned pellet by suction is moved up and down and back and forth. Move the pellet onto the substrate or lead frame,
A hybrid ponding method for semiconductor pellets, characterized in that a unit frame supporting a holding rod is moved in the X and Y directions to move the pellet to a predetermined position t on a substrate or lead frame and to receive the pellet.