JPS53126269A - Die bonding device - Google Patents

Die bonding device

Info

Publication number
JPS53126269A
JPS53126269A JP4179077A JP4179077A JPS53126269A JP S53126269 A JPS53126269 A JP S53126269A JP 4179077 A JP4179077 A JP 4179077A JP 4179077 A JP4179077 A JP 4179077A JP S53126269 A JPS53126269 A JP S53126269A
Authority
JP
Japan
Prior art keywords
die bonding
bonding device
die
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4179077A
Other languages
Japanese (ja)
Inventor
Yasunobu Suzuki
Yoshimitsu Kushima
Minoru Kawagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP4179077A priority Critical patent/JPS53126269A/en
Publication of JPS53126269A publication Critical patent/JPS53126269A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP4179077A 1977-04-11 1977-04-11 Die bonding device Pending JPS53126269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4179077A JPS53126269A (en) 1977-04-11 1977-04-11 Die bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4179077A JPS53126269A (en) 1977-04-11 1977-04-11 Die bonding device

Publications (1)

Publication Number Publication Date
JPS53126269A true JPS53126269A (en) 1978-11-04

Family

ID=12618125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4179077A Pending JPS53126269A (en) 1977-04-11 1977-04-11 Die bonding device

Country Status (1)

Country Link
JP (1) JPS53126269A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (en) * 1981-12-04 1983-06-08 Toshiba Seiki Kk Hybrid bonding method of semiconductor pellet

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828961A (en) * 1971-08-20 1973-04-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828961A (en) * 1971-08-20 1973-04-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (en) * 1981-12-04 1983-06-08 Toshiba Seiki Kk Hybrid bonding method of semiconductor pellet

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