JPS5691438A - Method for bonding pellet - Google Patents

Method for bonding pellet

Info

Publication number
JPS5691438A
JPS5691438A JP16835879A JP16835879A JPS5691438A JP S5691438 A JPS5691438 A JP S5691438A JP 16835879 A JP16835879 A JP 16835879A JP 16835879 A JP16835879 A JP 16835879A JP S5691438 A JPS5691438 A JP S5691438A
Authority
JP
Japan
Prior art keywords
scrubbing
amount
bonding
pellet
collet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16835879A
Other languages
Japanese (ja)
Other versions
JPS6257096B2 (en
Inventor
Kazuo Kudo
Shigetaka Kawai
Susumu Iizaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Hitachi Iruma Electronic Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Hitachi Iruma Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd, Hitachi Iruma Electronic Co Ltd filed Critical Hitachi Ltd
Priority to JP16835879A priority Critical patent/JPS5691438A/en
Publication of JPS5691438A publication Critical patent/JPS5691438A/en
Publication of JPS6257096B2 publication Critical patent/JPS6257096B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Abstract

PURPOSE:To automate bonding when bonding semiconductor pellets by a scrubbing (thermo compression bonding by scrubbing) technique, by storing the amount of scrubbing pellets in a microcomputer beforehand, moving an X-Y table with the output of the computer and scrubbing with a collet. CONSTITUTION:The data 10 of a pellet size and the amount of scrubbing the pellet are stored in a microcomputer 11 and are input to an arithmetic unit 12 as electric signals. On the other hand, information about the present position of a collect 7 is input to the arithmetic unit 12 and a moving amount 14 is determined: by inputting the amount to a D/A converter 15 while supplying a direction 16 to a DC motor M via an amplifier 17 to operate the motor, an X-Y table is set at a required position. The X-Y table is moved following this set scrubbing amount, scrubbing with the collet is carried out and a pellet 9 is bonded to a substrate 8. By so doing, bonding can be automated and working efficiency can be improved.
JP16835879A 1979-12-26 1979-12-26 Method for bonding pellet Granted JPS5691438A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16835879A JPS5691438A (en) 1979-12-26 1979-12-26 Method for bonding pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16835879A JPS5691438A (en) 1979-12-26 1979-12-26 Method for bonding pellet

Publications (2)

Publication Number Publication Date
JPS5691438A true JPS5691438A (en) 1981-07-24
JPS6257096B2 JPS6257096B2 (en) 1987-11-30

Family

ID=15866588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16835879A Granted JPS5691438A (en) 1979-12-26 1979-12-26 Method for bonding pellet

Country Status (1)

Country Link
JP (1) JPS5691438A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (en) * 1981-12-04 1983-06-08 Toshiba Seiki Kk Hybrid bonding method of semiconductor pellet
JPS62162335A (en) * 1986-11-07 1987-07-18 Toshiba Seiki Kk Bonding device for semiconductor pellet

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52143946A (en) * 1976-05-26 1977-11-30 Hitachi Ltd Mechanism for elevationally moving bonding arm
JPS5513964U (en) * 1978-07-10 1980-01-29

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52143946A (en) * 1976-05-26 1977-11-30 Hitachi Ltd Mechanism for elevationally moving bonding arm
JPS5513964U (en) * 1978-07-10 1980-01-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (en) * 1981-12-04 1983-06-08 Toshiba Seiki Kk Hybrid bonding method of semiconductor pellet
JPS62162335A (en) * 1986-11-07 1987-07-18 Toshiba Seiki Kk Bonding device for semiconductor pellet

Also Published As

Publication number Publication date
JPS6257096B2 (en) 1987-11-30

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