CN216880075U

CN216880075U - Die bonding equipment

Info

Publication number: CN216880075U
Application number: CN202122942537.8U
Authority: CN
Inventors: 雷伟庄
Original assignee: Weijian Intelligent Packaging Technology Shenzhen Co ltd
Current assignee: Weijian Intelligent Packaging Technology Shenzhen Co ltd
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2022-07-05
Anticipated expiration: 2031-11-26

Abstract

The utility model relates to the technical field of die bonding, in particular to die bonding equipment, which comprises a bonding assembly, a mechanical arm assembly and an operation table, wherein the bonding assembly comprises a glue supply device, the glue supply device comprises a glue supply disc and a first driving device, the glue supply disc is in transmission connection with the first driving device, and the first driving device drives the glue supply disc to move or rotate so that the mechanical arm assembly can be in interactive fit with each area of the glue supply disc and the operation table; it can be understood, at solid brilliant in-process, once accomplish and dip in glue, just let supply the plastic reel motion to change in order to take place certain position, let supply the plastic reel on leave the predetermined region of dipping in glue by the position of dipping in glue, let supply the position that is not dipped in glue on the plastic reel and get into the predetermined region of dipping in glue, this design can guarantee that mechanical arm component can dip in sufficient glue when dipping in the operation of gluing, avoid appearing dipping in the condition that the volume of gluing is not enough, do benefit to the assurance and dip in the uniformity of gluing the volume, reduce off-the-shelf defective rate.

Description

Die bonding equipment

[ technical field ] A method for producing a semiconductor device

The utility model relates to the technical field of die bonding, in particular to die bonding equipment.

[ background of the utility model ]

At present, die bonding of related electronic products is usually completed through die bonding equipment; the solid brilliant machine need dip in earlier glue before dipping in glue to the predetermined region of base plate and dip in glue the suction nozzle on, but the solid brilliant machine of current area bonding function is difficult to guarantee the suction nozzle when dipping in glue and is dipped in the uniformity of gluing the volume, appears easily the not enough condition of volume of gluing to the predetermined region, leads to off-the-shelf defective rate very high.

[ Utility model ] content

The utility model provides a die bonder for solving the problem that the consistency of glue dipping amount is difficult to ensure by the existing die bonder.

The utility model provides a die bonding device, which comprises a bonding assembly, a mechanical arm assembly and an operation table, wherein the bonding assembly comprises a glue supply device, the glue supply device comprises a glue supply disc and a first driving device, the glue supply disc and the first driving device are in transmission connection, and the first driving device drives the glue supply disc to move or rotate so that the mechanical arm assembly can be in interactive fit with each area of the glue supply disc and the operation table.

Preferably, the glue supply disc is disc-shaped, and the first driving device is in transmission connection with the middle area of the bottom surface of the glue supply disc so as to drive the glue supply disc to rotate.

Preferably, an annular glue supply groove is formed in the glue supply disc.

Preferably, the glue supply device further comprises a leveling device for leveling the glue in the glue supply tray after the glue is added.

Preferably, the glue supply device is detachably connected with the main body, and the glue supply disc is detachably connected with the first driving device.

Preferably, the operation table comprises a clamp, and a placing groove for placing the substrate is arranged on the clamp.

Preferably, the operation panel is a light curing panel, the operation panel includes a light curing lamp, the light curing lamp is close to the anchor clamps set up and shine at least some regions of anchor clamps.

Preferably, the operating table further comprises a second driving device, and the second driving device drives the clamp or the light curing lamp to move the clamp and the light curing lamp relatively.

Preferably, the glue supply device and the light curing table are arranged at intervals, and the glue supply device is arranged outside the irradiation range of the light curing lamp.

Preferably, the movable end of the mechanical arm assembly is provided with a universal binding head which can be adapted to various adhesive heads and suction heads.

Compared with the prior art, the die bonding equipment has the following advantages:

1. the glue supplying device with the driving device is arranged in the die bonding equipment, the glue supplying disc can move under the driving of the first driving device, and therefore the glue supplying disc can move to generate certain azimuth change every time glue dipping is completed in the die bonding process, the position on the glue supplying disc, which is dipped with glue, leaves the preset glue dipping area, and the position on the glue supplying disc, which is not dipped with glue, enters the preset glue dipping area.

2. The glue supply disc is disc-shaped, can rotate around the center of a circle of the glue supply disc only through the first driving device, can achieve the function of enabling the position dipped with the glue to be away from a preset glue dipping area, is simple in structure and small in occupied space, and is beneficial to reducing the overall size of the die bonder.

3. The design of the annular glue supply groove arranged on the glue supply disc is beneficial to controlling the glue dipping amount each time, and the glue dipping consistency is further ensured.

4. The glue supply device also comprises a leveling device, and the glue in the glue supply disc can be pushed or scraped by the leveling device after the glue is added, so that the consistency of glue dipping amount can be further ensured.

5. The glue supply device is detachably connected with the main body, so that later maintenance is facilitated, glue supply devices of different models or styles can be replaced according to actual requirements, and the universality is high; the glue supply disc is detachably connected with the first driving device, maintenance is facilitated, the glue supply disc for placing different glues can be replaced according to different curing processes, and the universality of the glue supply device can be further enhanced.

6. The clamp is provided with the placing groove, so that the substrate is convenient to limit, and the working stability is improved.

7. The operating platform is a light curing platform, has strong adaptability and is pollution-free.

8. The clamp and the light curing lamp can move relatively under the driving of the second driving device, the substrate which is subjected to light curing can be automatically sent out of the illumination range, the substrate to be cured is sent into the illumination range, and the automation degree is high.

9. The glue supply device and the light curing table are arranged at intervals, so that accidental curing of light curing glue in the glue supply device can be effectively avoided.

10. The mechanical arm assembly is provided with the universal binding head which can be adapted to various adhesive heads and suction heads, different adhesive heads and suction heads can be replaced according to actual requirements, and the universal binding head is high in universality.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a block diagram of a die bonding apparatus according to a first embodiment of the present invention.

Fig. 2 is a block diagram of a glue supply device of a die bonding apparatus according to a first embodiment of the utility model.

Fig. 3 is a block diagram of an operation table of the die bonding apparatus according to the first embodiment of the present invention.

Fig. 4 is a block diagram of a robot assembly of the die bonding apparatus according to the first embodiment of the present invention.

Fig. 5 is a block diagram of a die bonding method according to a second embodiment of the present invention.

Fig. 6 is a block diagram of step S3 of the die bonding method according to the second embodiment of the utility model.

The attached drawings indicate the following:

100. die bonding equipment;

1. a main body;

2. an operation table; 21. a clamp; 211. a placement groove; 22. a light curing lamp; 23. a second driving device;

3. bonding the assembly; 31. a glue supply device; 311. a glue supply disc; 312. a first driving device; 313. a leveling device; 32. a glue drawing device;

4. a mechanical arm assembly; 41. universal binding;

5. a downward-looking vision device; 6. a head-up vision device; 7. a control module.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the utility model and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used in other meanings besides orientation or positional relationship, for example, the term "upper" may also be used in some cases to indicate a certain attaching or connecting relationship. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

Referring to fig. 1 and fig. 2, a first embodiment of the present invention provides a die bonding apparatus 100, where the die bonding apparatus 100 includes a bonding assembly 3, a robot assembly 4, and an operation table 2, the bonding assembly 3 includes a glue supply device 31, the glue supply device 31 includes a glue supply tray 311 and a first driving device 312, which are in transmission connection, and the first driving device 312 drives the glue supply tray 311 to move or rotate, so that the robot assembly 4 can be in interactive fit with each area of the glue supply tray 311 and the operation table 2.

It can be understood, at solid brilliant in-process, once dip in glue once accomplishing, can let to supply the motion of plastic reel 311 in order to take place certain position change through a drive arrangement 312, let to supply to leave the predetermined region of dipping in glue by the position of dipping in glue on the plastic reel 311, let to supply to get into the predetermined region of dipping in glue by the position of dipping in glue on the plastic reel 311, this design can guarantee that arm subassembly 4 can dip in sufficient glue when dipping in the gluey operation, avoid appearing dipping in the not enough condition that influences solid brilliant effect of volume, do benefit to the assurance and dip in the uniformity of gluing the volume, reduce off-the-shelf defective rate.

Further, the bonding assembly 3 further includes a glue drawing device 32, the glue drawing device 32 is disposed on the movable end of the mechanical arm assembly 4 in a liftable manner, and the die bonder 100 can selectively perform glue dispensing operation on the substrate and/or perform glue drawing operation on the substrate through the glue drawing device 32 according to actual chip bonding requirements through cooperation of the operating head and the glue supply device 31.

It can be understood that the die bonding apparatus 100 of the present invention can perform glue dipping and/or glue drawing according to the actual product requirements, and has strong versatility.

Further, the glue supplying plate 311 is disc-shaped, and the first driving device 312 is in transmission connection with the middle area of the bottom surface of the glue supplying plate 311 to drive the glue supplying plate 311 to rotate.

It can be understood that the function of leaving the predetermined glue dipping area at the glue dipping position can be realized only by rotating the first driving device 312 around the center of the circle, and the design structure is simple, the occupied space is small, and the whole volume of the die bonder 100 can be reduced.

Specifically, in this embodiment, the first driving device 312 is a motor.

Further, an annular glue supply groove is formed on the glue supply plate 311. The design is favorable for controlling the glue dipping amount every time, and the glue dipping consistency is further ensured.

Further, the glue supply device 31 is detachably connected with the main body 1, and the glue supply tray 311 is detachably connected with the first driving device 312.

It can be understood that the glue supply device 31 is detachably connected with the main body 1, so that later maintenance is facilitated, glue supply devices 31 of different types or styles can be replaced according to actual requirements, and the universality is high; supply that glue dish 311 and first drive arrangement 312 can dismantle and be connected, be convenient for maintain, and can change the supply glue dish 311 of placing different glue according to the difference of curing process, can further strengthen the commonality that supplies mucilage binding to put 31.

Further, the glue supply device 31 further comprises a leveling device 313 for leveling the glue in the glue supply tray 311 after the glue is added. The leveling device 313 can push or scrape the glue in the glue supply tray 311 after the glue is added, and the design can further ensure the consistency of glue dipping amount.

Specifically, in this embodiment, the leveling device 313 includes a boss, the boss is located above the glue supply tray 311, and when the glue supply tray 311 rotates, all areas of the glue supply tray 311 gradually pass under the boss, so that the glue accumulated too high in the glue supply tray 311 is pushed flat by the boss.

Referring to fig. 1, the die bonding apparatus 100 further includes a downward vision device 5 and an upward vision device 6, the downward vision device 5 is disposed on the robot assembly 4, and the upward vision device 6 is disposed on the main body 1. The top vision device 6 and the bottom vision device 5 are used for observing the chip and/or the substrate to acquire image information thereof.

Further, the die bonding apparatus 100 further includes a control module 7, and the robot assembly 4, the operation table 2, and the bonding assembly 3 are all electrically connected to the control module 7.

Referring to fig. 1 and 3, the operation table 2 includes a jig 21, and a placing groove 211 for placing a substrate is provided on the jig 21. The placing groove 211 can limit the substrate, and is favorable for improving the working stability during die bonding.

Specifically, in the present embodiment, the jig 21 is provided with a plurality of placing grooves 211, and the placing grooves are placed on the jig 21 in an equidistant arrangement.

Alternatively, the operation table 2 may be a thermal curing table or a photo curing table. Can be selected according to the actual product requirements.

Specifically, in this embodiment, the operation table 2 is a light curing table, the operation table 2 further includes a light curing lamp 22, and the light curing lamp 22 is disposed near the clamp 21 and irradiates at least a partial area of the clamp 21.

Further, the operation table 2 further includes a second driving device 23, and the second driving device 23 drives the clamp 21 or the light curing lamp 22 to relatively move the clamp 21 and the light curing lamp 22. Specifically, in the present embodiment, the second driving device 23 drives the reciprocating movement.

Further, the glue supply device 31 is disposed at an interval with the light curing table, and the glue supply device 31 is disposed outside the irradiation range of the light curing lamp 22. The design can effectively avoid the accidental curing of the light-cured adhesive in the adhesive supply device 31.

Referring to fig. 1 and 4, a universal binding head 41 adapted to various adhesive heads and suction heads is provided at the movable end of the robot arm assembly 4. Can change different viscose head and suction head according to actual demand when using, the commonality is strong.

Specifically, in this embodiment, the movable mechanical arm includes an X-axis guide rail, a Y-axis guide rail, a Z-axis guide rail, and a rotation axis R axis arranged in parallel with the Z-axis guide rail, and the movable end is located at the end of the Z-axis guide rail; in other embodiments, other styles of multi-axis robotic arm assemblies 4 may be used.

Further, a lifting device is arranged at the movable end of the mechanical arm assembly 4, and the glue painting device 32 is connected with the movable end through the lifting device.

It can be understood that when the painting device 32 on the robot arm assembly 4 needs to be used, the painting device 32 is lowered by the lifting device, and the painting device 32 is retracted after the use.

Referring to fig. 5 and fig. 6, a second embodiment of the present invention provides a die bonding method, including the following steps:

s1: providing a substrate of a chip to be bonded, wherein a preset bonding area on the substrate is used for bonding with the chip;

s2: acquiring image information of a substrate;

s3: carrying out gluing treatment on the substrate according to the acquired image information of the substrate;

s4: and adhering the chip corresponding to the preset position of the substrate.

Further, the acquired image information of the substrate includes area and orientation information of a predetermined bonding region on the substrate.

It will be appreciated that the acquired image information of the substrate includes the area of the predetermined bonding area, which can help in determining which sizing process to select. The acquired image information of the substrate includes orientation information of the predetermined bonding area, facilitating calibration of the orientation of the bonded chip.

Further, step S1 specifically includes the following steps:

s11, conveying the material box with the substrate to a preset area in the die bonding equipment;

s12: conveying the base plate in the material box into a placing groove of the clamp through the mechanical arm assembly;

further, step S2 specifically includes the following steps:

s21: moving a robot assembly over a substrate to be cured;

s22: image information of the substrate is acquired by a downward-looking vision assembly on the robot assembly.

Further, step S3 specifically includes the following steps:

s31: identifying a predetermined bonding area on the substrate;

s32: comparing the area size of the identified preset bonding area with a preset value;

s33 a: when the area of a preset bonding area on the substrate is smaller than a preset value, performing glue dipping treatment on the preset bonding area;

s33 b: and when the area of the preset bonding area on the substrate is larger than or equal to a preset value, performing glue painting treatment on the preset bonding area.

It is understood that the substrate may be dipped and painted when the shape of the substrate is complicated and/or there are a plurality of bonding regions on the substrate.

Further, the steps are as follows: the glue dipping treatment is carried out on the preset bonding area, and the method specifically comprises the following steps:

s33a 1: dipping glue on a specific area of the glue supply disc through a glue dipping head on the mechanical arm assembly;

s33a 2: and controlling the mechanical arm assembly to dip the glue on the glue dipping head to a preset bonding area on the substrate.

Further, the following steps are also included between step S33a1 and step S33a 2:

s33 aa: rotating the glue supplying disc, wherein the position on the glue supplying disc, which is dipped with glue, leaves the preset glue dipping area, and the position on the glue supplying disc, which is not dipped with glue, enters the preset glue dipping area;

it can be understood that, the condition that the glue dipping amount is not enough can be effectively avoided in the follow-up glue dipping process by the aid of the design, and the defect rate of finished products is favorably reduced.

Further, the steps are as follows: the glue drawing treatment is carried out on the preset bonding area, and the glue drawing treatment method specifically comprises the following steps:

s33b 1: generating a glue drawing line according to the identified preset bonding area;

s33b 2: and painting glue in the preset bonding area of the substrate according to the generated glue painting route.

It can be understood that in the die bonding method of the utility model, the glue drawing path is generated according to the identified preset bonding area, the adaptability is strong, and the bonding effect is good.

It is understood that in other embodiments, the dispensing direction and/or the dispensing route of the chip may be preset before die bonding; thus, in step S3, only the predetermined mark point needs to be identified, and the mark point may include the dispensing point and/or the starting point of the glue line; then, glue dipping treatment can be carried out on the preset mark points; or, performing glue drawing treatment on the substrate by taking the preset mark point as a starting point according to a preset glue drawing route.

Further, step S4: the method specifically comprises the following steps:

s41: conveying the chip with the adhesive to a preset adhesive area on the substrate after the adhesive is applied;

s42: and curing the substrate with the chip.

Optionally, the curing process comprises a thermal curing process or a photo-curing process;

specifically, in this embodiment, the curing process is a photo-curing process.

Further, step S42 specifically includes the following steps:

step S421: moving the substrate with the chip placed in the irradiation area for photocuring;

step S422: the substrate with the chip placed thereon stays in the irradiation area for a preset time;

step S423: and removing the irradiated substrate, and simultaneously making the next substrate enter the irradiation range of photocuring.

4. The glue supply device also comprises a leveling device, and the glue in the glue supply disc can be pushed or scraped by the leveling device after being added with glue.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit of the present invention are intended to be included within the scope of the present invention.

Claims

1. A die bonding device is characterized in that: the die bonder comprises a bonding assembly, a mechanical arm assembly and an operation table, wherein the bonding assembly comprises a glue supply device, the glue supply device comprises a glue supply disc and a first driving device which are in transmission connection, and the first driving device drives the glue supply disc to move or rotate so that the mechanical arm assembly can be in interactive fit with each area of the glue supply disc and the operation table.

2. The die bonding apparatus according to claim 1, wherein: the glue supply disc is disc-shaped, and the first driving device is in transmission connection with the middle area of the bottom surface of the glue supply disc to drive the glue supply disc to rotate.

3. The die bonding apparatus according to claim 2, wherein: and an annular glue supply groove is formed in the glue supply disc.

4. The die bonding apparatus according to claim 1, wherein: the glue supply device also comprises a leveling device for processing the glue in the glue supply disc to be smooth after the glue is added.

5. The die bonding apparatus according to claim 1, wherein: the glue supply device is detachably connected with the main body, and the glue supply disc is detachably connected with the first driving device.

6. The die bonding apparatus according to claim 1, wherein: the operation platform comprises a clamp, and a placing groove for placing the substrate is arranged on the clamp.

7. The die bonding apparatus according to claim 6, wherein: the operation panel is the photocuring platform, the operation panel includes the photocuring lamp, the photocuring lamp is close to anchor clamps set up and shine at least partly regional of anchor clamps.

8. The die bonding apparatus according to claim 7, wherein: the operating platform further comprises a second driving device, and the second driving device drives the clamp or the light curing lamp to enable the clamp and the light curing lamp to move relatively.

9. The die bonding apparatus according to claim 7, wherein: the glue supply device and the light curing table are arranged at intervals, and the glue supply device is arranged outside the irradiation range of the light curing lamp.

10. The die bonding apparatus according to claim 1, wherein: the movable end of the mechanical arm component is provided with a universal binding head which can be adapted to various adhesive heads and suction heads.