JPS57124446A - Die bond apparatus - Google Patents

Die bond apparatus

Info

Publication number
JPS57124446A
JPS57124446A JP1097481A JP1097481A JPS57124446A JP S57124446 A JPS57124446 A JP S57124446A JP 1097481 A JP1097481 A JP 1097481A JP 1097481 A JP1097481 A JP 1097481A JP S57124446 A JPS57124446 A JP S57124446A
Authority
JP
Japan
Prior art keywords
adsorbing
lead frame
shaft
forth
needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1097481A
Other languages
Japanese (ja)
Other versions
JPS6325703B2 (en
Inventor
Toshio Yonemura
Kazuhiro Yoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1097481A priority Critical patent/JPS57124446A/en
Publication of JPS57124446A publication Critical patent/JPS57124446A/en
Publication of JPS6325703B2 publication Critical patent/JPS6325703B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To enable a single apparatus to perform die bonding for die pads in two lines on a lead frame by a method wherein a first cam drives a sliding guide shaft back and forth and a second cam determines the whereabouts of an adsorbing needle provided on the adsorbing head. CONSTITUTION:A guide shaft 31 sliding back and forth shaft-wise holds a supporting shaft 32 movable back and forth. A first plate cam 11 causes the supporting shaft 32 to travel relative to the guide shaft 31. A second plate cam 51 drives an adsorbing needle 19 installed in an adsorbing head 18 located at the forward end of the supporting shaft 32, causing said adsorbing needle 19 to travel between the semiconductor chip 2 adsorbing position and a first line die pad position in a lead frame and then between the semiconductor chip 2 adsorbing position and a second line die pad position in the lead frame. This setup allows a single apparatus to perform die bonding for die pads in two lines on a lead frame, thereby ensuring a large-scale increase in productivity.
JP1097481A 1981-01-26 1981-01-26 Die bond apparatus Granted JPS57124446A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1097481A JPS57124446A (en) 1981-01-26 1981-01-26 Die bond apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1097481A JPS57124446A (en) 1981-01-26 1981-01-26 Die bond apparatus

Publications (2)

Publication Number Publication Date
JPS57124446A true JPS57124446A (en) 1982-08-03
JPS6325703B2 JPS6325703B2 (en) 1988-05-26

Family

ID=11765124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1097481A Granted JPS57124446A (en) 1981-01-26 1981-01-26 Die bond apparatus

Country Status (1)

Country Link
JP (1) JPS57124446A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126842A (en) * 1983-12-14 1985-07-06 Marine Instr Co Ltd Die-bonding method
JPS60227428A (en) * 1984-04-26 1985-11-12 Shinkawa Ltd Chip bonding device
JPS61164035U (en) * 1985-03-29 1986-10-11

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0484507U (en) * 1990-11-29 1992-07-22

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588341A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Assembling device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588341A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Assembling device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126842A (en) * 1983-12-14 1985-07-06 Marine Instr Co Ltd Die-bonding method
JPS60227428A (en) * 1984-04-26 1985-11-12 Shinkawa Ltd Chip bonding device
JPH0548618B2 (en) * 1984-04-26 1993-07-22 Shinkawa Kk
JPS61164035U (en) * 1985-03-29 1986-10-11
JPH0451475Y2 (en) * 1985-03-29 1992-12-03

Also Published As

Publication number Publication date
JPS6325703B2 (en) 1988-05-26

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