JPS57113238A - Ultrasonic wire bonding apparatus - Google Patents

Ultrasonic wire bonding apparatus

Info

Publication number
JPS57113238A
JPS57113238A JP56000039A JP3981A JPS57113238A JP S57113238 A JPS57113238 A JP S57113238A JP 56000039 A JP56000039 A JP 56000039A JP 3981 A JP3981 A JP 3981A JP S57113238 A JPS57113238 A JP S57113238A
Authority
JP
Japan
Prior art keywords
sample
placing
detecting
detector
station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56000039A
Other languages
Japanese (ja)
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Minoru Torihata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP56000039A priority Critical patent/JPS57113238A/en
Publication of JPS57113238A publication Critical patent/JPS57113238A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Abstract

PURPOSE:To fully automatically bond a wire to a multiple pin lead frame sample by detecting and correcting a detecting station in mutual direction of respective lead posts of a sample. CONSTITUTION:Sample placing holes are formed at an equal interval at the center of a carrier 10 for placing the sample 1, and reference holes for feeding and positioning carriers are formed at both side ends. The carriers 10 supplied to a feeder 12 are transferred at the pitch interval of the hole for placing the sample. The samples are secured to a stationary base 10 disposed at ahe detecting station and a stationary base 21 disposed at a bonding station, and are positioned by a detector having a television camera 26 and an X-Y drive unit 30 and a detector having a television camera 27 and an X-Y drive unit 34, and is bonded by a bonding tool 32.
JP56000039A 1981-01-05 1981-01-05 Ultrasonic wire bonding apparatus Pending JPS57113238A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56000039A JPS57113238A (en) 1981-01-05 1981-01-05 Ultrasonic wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56000039A JPS57113238A (en) 1981-01-05 1981-01-05 Ultrasonic wire bonding apparatus

Publications (1)

Publication Number Publication Date
JPS57113238A true JPS57113238A (en) 1982-07-14

Family

ID=11463171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56000039A Pending JPS57113238A (en) 1981-01-05 1981-01-05 Ultrasonic wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPS57113238A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006111097A1 (en) * 2005-04-20 2006-10-26 Itm (Shenzhen) Limited An ultrasonic wire bonding method and bonding apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54121672A (en) * 1978-03-14 1979-09-20 Nichiden Kikai Kk Wire bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54121672A (en) * 1978-03-14 1979-09-20 Nichiden Kikai Kk Wire bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006111097A1 (en) * 2005-04-20 2006-10-26 Itm (Shenzhen) Limited An ultrasonic wire bonding method and bonding apparatus

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