JPS57160135A - Automatic bonding method for inner lead - Google Patents

Automatic bonding method for inner lead

Info

Publication number
JPS57160135A
JPS57160135A JP56044736A JP4473681A JPS57160135A JP S57160135 A JPS57160135 A JP S57160135A JP 56044736 A JP56044736 A JP 56044736A JP 4473681 A JP4473681 A JP 4473681A JP S57160135 A JPS57160135 A JP S57160135A
Authority
JP
Japan
Prior art keywords
inner lead
bonding
pitch
tape
feeder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56044736A
Other languages
Japanese (ja)
Other versions
JPS6227735B2 (en
Inventor
Seiichi Chiba
Akihiro Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP56044736A priority Critical patent/JPS57160135A/en
Publication of JPS57160135A publication Critical patent/JPS57160135A/en
Publication of JPS6227735B2 publication Critical patent/JPS6227735B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

PURPOSE:To make it possible to automatically correct the bonding position through detecting the offset of actual position from a predetermined set position, by providing a specific alignment mark on a tape carrier or by memorizing the shape of a part of the inner lead. CONSTITUTION:A carrier tape 1 provided with successive inner leads is fed intermittently at a pitch corresponding to the pitch of the inner leads, and the inner leads are successively located at bonding positions. Simultaneously, a wafer X-Y feeder 17 feeds and locate a substrate 14 at a pitch corresponding to the pitch of dies 15. Then, an ITV camera 19 picks up the image of the inner lead on the tape 1 at the bonding position and the image of the die 15 on the substrate 14, and the positional offset is detected by means of an alignment mark on the carrier tape 1 or the shape of a specific position characterizing the position of the inner lead. Subsequently, the feeder 17 is actuated to effect the aligning of the inner lead and then a bonding is conducted by a bonding device 18.
JP56044736A 1981-03-28 1981-03-28 Automatic bonding method for inner lead Granted JPS57160135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56044736A JPS57160135A (en) 1981-03-28 1981-03-28 Automatic bonding method for inner lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56044736A JPS57160135A (en) 1981-03-28 1981-03-28 Automatic bonding method for inner lead

Publications (2)

Publication Number Publication Date
JPS57160135A true JPS57160135A (en) 1982-10-02
JPS6227735B2 JPS6227735B2 (en) 1987-06-16

Family

ID=12699726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56044736A Granted JPS57160135A (en) 1981-03-28 1981-03-28 Automatic bonding method for inner lead

Country Status (1)

Country Link
JP (1) JPS57160135A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175132A (en) * 1983-03-23 1984-10-03 Nec Corp Manufacture of semiconductor device according to tape carrier system
JPS63173670A (en) * 1987-01-13 1988-07-18 Alps Electric Co Ltd Light-emitting diode array head and manufacture thereof
JPH01230240A (en) * 1987-06-10 1989-09-13 Hitachi Ltd Method and apparatus for bonding
US5059559A (en) * 1987-11-02 1991-10-22 Hitachi, Ltd. Method of aligning and bonding tab inner leads
JPH0520327U (en) * 1991-08-23 1993-03-12 安藤電気株式会社 TAB tape and electrode alignment mechanism

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910677A (en) * 1972-05-24 1974-01-30
JPS5214148A (en) * 1975-06-24 1977-02-02 Hitachi Ltd Operation method of the guide vane of the water wheel having the high head
JPS549583A (en) * 1977-06-24 1979-01-24 Shinkawa Seisakusho Kk Device for positioning pellets
JPS54134974A (en) * 1978-04-12 1979-10-19 Hitachi Ltd Method and device for bonding on tape carrier system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910677A (en) * 1972-05-24 1974-01-30
JPS5214148A (en) * 1975-06-24 1977-02-02 Hitachi Ltd Operation method of the guide vane of the water wheel having the high head
JPS549583A (en) * 1977-06-24 1979-01-24 Shinkawa Seisakusho Kk Device for positioning pellets
JPS54134974A (en) * 1978-04-12 1979-10-19 Hitachi Ltd Method and device for bonding on tape carrier system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175132A (en) * 1983-03-23 1984-10-03 Nec Corp Manufacture of semiconductor device according to tape carrier system
JPH0212025B2 (en) * 1983-03-23 1990-03-16 Nippon Electric Co
JPS63173670A (en) * 1987-01-13 1988-07-18 Alps Electric Co Ltd Light-emitting diode array head and manufacture thereof
JPH01230240A (en) * 1987-06-10 1989-09-13 Hitachi Ltd Method and apparatus for bonding
US5059559A (en) * 1987-11-02 1991-10-22 Hitachi, Ltd. Method of aligning and bonding tab inner leads
JPH0520327U (en) * 1991-08-23 1993-03-12 安藤電気株式会社 TAB tape and electrode alignment mechanism

Also Published As

Publication number Publication date
JPS6227735B2 (en) 1987-06-16

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