JPS57113239A - Ultrasonic wire bonding apparatus - Google Patents

Ultrasonic wire bonding apparatus

Info

Publication number
JPS57113239A
JPS57113239A JP56000040A JP4081A JPS57113239A JP S57113239 A JPS57113239 A JP S57113239A JP 56000040 A JP56000040 A JP 56000040A JP 4081 A JP4081 A JP 4081A JP S57113239 A JPS57113239 A JP S57113239A
Authority
JP
Japan
Prior art keywords
bonding
samples
placing
wire bonding
station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56000040A
Other languages
Japanese (ja)
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Minoru Torihata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP56000040A priority Critical patent/JPS57113239A/en
Publication of JPS57113239A publication Critical patent/JPS57113239A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To fully automatically perform the wire bonding of a multiple pin lead frame by automatically correcting the displacement of the lead posts of samples. CONSTITUTION:Sample placing holes are formed at an equal interval at the center of a carrier 10 for placing samples 1. Carriers 10 supplied to a feeder 12 are fed at the pitch interval of the holes for placing the samples. A bonding tool 27 for holding a wire to be bonded to the sample 1 and a bonding head 21 capable of moving in X-Y directions is provided in the bonding station. Further, television cameras 31, 32 are provided above the detecting station and the bonding station to correct the position.
JP56000040A 1981-01-05 1981-01-05 Ultrasonic wire bonding apparatus Pending JPS57113239A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56000040A JPS57113239A (en) 1981-01-05 1981-01-05 Ultrasonic wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56000040A JPS57113239A (en) 1981-01-05 1981-01-05 Ultrasonic wire bonding apparatus

Publications (1)

Publication Number Publication Date
JPS57113239A true JPS57113239A (en) 1982-07-14

Family

ID=11463196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56000040A Pending JPS57113239A (en) 1981-01-05 1981-01-05 Ultrasonic wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPS57113239A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02214131A (en) * 1989-02-15 1990-08-27 Hitachi Ltd Wire bonder

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5080763A (en) * 1973-11-14 1975-07-01
JPS5174575A (en) * 1974-12-25 1976-06-28 Shinkawa Seisakusho Kk
JPS54121672A (en) * 1978-03-14 1979-09-20 Nichiden Kikai Kk Wire bonding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5080763A (en) * 1973-11-14 1975-07-01
JPS5174575A (en) * 1974-12-25 1976-06-28 Shinkawa Seisakusho Kk
JPS54121672A (en) * 1978-03-14 1979-09-20 Nichiden Kikai Kk Wire bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02214131A (en) * 1989-02-15 1990-08-27 Hitachi Ltd Wire bonder

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