JPS57160134A - Pellet bonding apparatus - Google Patents

Pellet bonding apparatus

Info

Publication number
JPS57160134A
JPS57160134A JP56044737A JP4473781A JPS57160134A JP S57160134 A JPS57160134 A JP S57160134A JP 56044737 A JP56044737 A JP 56044737A JP 4473781 A JP4473781 A JP 4473781A JP S57160134 A JPS57160134 A JP S57160134A
Authority
JP
Japan
Prior art keywords
pellet
fixed
semiconductor
rotary bed
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56044737A
Other languages
Japanese (ja)
Other versions
JPH0217936B2 (en
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP56044737A priority Critical patent/JPS57160134A/en
Publication of JPS57160134A publication Critical patent/JPS57160134A/en
Publication of JPH0217936B2 publication Critical patent/JPH0217936B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To improve the precision of bonding of semiconductor pellet to a lead frame while preventing breakdown of the pellet, by attaching a rotary bed to an X-Y table carrying the semiconductor pellet and detecting and aligning the pellet by means of a detection camera. CONSTITUTION:A bond sheet 14 to which a semiconductor pellet 13 is bonded is set on an X-Y table 12. The X-Y table 12 is fixed to a rotary bed 11 fixed to a base 10 and is fed at a predetermined pitch. As the semiconductor pellet 13 takes a position just under a detection camera 15, the camera 15 discriminates whether the pellet 13 is acceptable or not. If the pellet 13 is unacceptable, the rotary bed 11 and the X-Y table are driven to correct the posture and position of the pellet 13. Subsequently, a bonding head unit 19 is driven to permit a vacuum sucking collet 20 on the end of an arm 21 to attract and hold the pellet 13. The pellet 13 is then transferred and fixed to a lead frame 18.
JP56044737A 1981-03-28 1981-03-28 Pellet bonding apparatus Granted JPS57160134A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56044737A JPS57160134A (en) 1981-03-28 1981-03-28 Pellet bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56044737A JPS57160134A (en) 1981-03-28 1981-03-28 Pellet bonding apparatus

Publications (2)

Publication Number Publication Date
JPS57160134A true JPS57160134A (en) 1982-10-02
JPH0217936B2 JPH0217936B2 (en) 1990-04-24

Family

ID=12699753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56044737A Granted JPS57160134A (en) 1981-03-28 1981-03-28 Pellet bonding apparatus

Country Status (1)

Country Link
JP (1) JPS57160134A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS54158874A (en) * 1978-06-06 1979-12-15 Matsushita Electronics Corp Dies bonding unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS54158874A (en) * 1978-06-06 1979-12-15 Matsushita Electronics Corp Dies bonding unit

Also Published As

Publication number Publication date
JPH0217936B2 (en) 1990-04-24

Similar Documents

Publication Publication Date Title
CN113310535A (en) Detection apparatus for be used for COB automatic assembly
JPS57147247A (en) Automatic inspecting device for semiconductor chip
JPS57160134A (en) Pellet bonding apparatus
JPS5240063A (en) Lead frame
US5092031A (en) Method and apparatus for bonding external leads
JPS59186334A (en) Bonding apparatus
JPS57147245A (en) Positioning method and device for chip bonding
JPS6464334A (en) Apparatus for mounting semiconductor wafer
JPS6249986B2 (en)
JPS57160135A (en) Automatic bonding method for inner lead
JPS61210642A (en) Methoid and apparatus for die-bonding semiconductor element
JPS5715434A (en) Bonding apparatus
JPH0767025B2 (en) Outer lead bonding machine
JPS6471680A (en) Part feeder
JPH0213933B2 (en)
JPS55165642A (en) Method of assembling semiconductor device
JPS6410934B2 (en)
JPS5596644A (en) Method of bonding semiconductor device
JPS6048280A (en) Chuck in loader for electronic part
JPS55163856A (en) Apparatus for positioning semiconductor device enclosure
JPS5469963A (en) Detector for semiconductor chip bonder
JPH0131694B2 (en)
JPS5467768A (en) Detector for semiconductor chip bonder
JPS55130384A (en) Handle ring welding equipment to can top plate
JPS5744433A (en) Transfer apparatus for press