JPS57167639A - Feeder for lead frame in molding device for resin sealing - Google Patents

Feeder for lead frame in molding device for resin sealing

Info

Publication number
JPS57167639A
JPS57167639A JP5169181A JP5169181A JPS57167639A JP S57167639 A JPS57167639 A JP S57167639A JP 5169181 A JP5169181 A JP 5169181A JP 5169181 A JP5169181 A JP 5169181A JP S57167639 A JPS57167639 A JP S57167639A
Authority
JP
Japan
Prior art keywords
lead frame
molding device
track
holding
loading frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5169181A
Other languages
Japanese (ja)
Inventor
Teruo Kusakari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5169181A priority Critical patent/JPS57167639A/en
Publication of JPS57167639A publication Critical patent/JPS57167639A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/008—Handling preformed parts, e.g. inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To supply the lead frame automatically by mounting a loading frame holding the lead frame onto a track built between the elevator rising position of a preheater device and the fixed die of the molding device. CONSTITUTION:The loading frame 9 travels between the track 6 set up under the upper die 5 of the molding device 1 and the track 8 mounted under an arm 7 extended and attached toward the outside of the molding device 1. Chuck means 10 holding the upper and lower surfaces of the side sections of the lead frame and detecting means 12 confirming holding at a predetermined position by utilizing holes for positioning the lead frame are set up to the loading frame 9. The loading frame 9 is suspended and mounted to the track 8 by means of bearings 27, and travels on the tracks 8, 6 by means of a screw 29 for transport connected to a rotary driving means.
JP5169181A 1981-04-08 1981-04-08 Feeder for lead frame in molding device for resin sealing Pending JPS57167639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5169181A JPS57167639A (en) 1981-04-08 1981-04-08 Feeder for lead frame in molding device for resin sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5169181A JPS57167639A (en) 1981-04-08 1981-04-08 Feeder for lead frame in molding device for resin sealing

Publications (1)

Publication Number Publication Date
JPS57167639A true JPS57167639A (en) 1982-10-15

Family

ID=12893920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5169181A Pending JPS57167639A (en) 1981-04-08 1981-04-08 Feeder for lead frame in molding device for resin sealing

Country Status (1)

Country Link
JP (1) JPS57167639A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199340A (en) * 1984-10-19 1986-05-17 Rohm Co Ltd Mold frame checking mechanism
JPS61136237A (en) * 1984-12-07 1986-06-24 Toshiba Mach Co Ltd Frame set confirming device
JPS61153342U (en) * 1985-03-15 1986-09-22
JPS61153343U (en) * 1985-03-15 1986-09-22
EP0212994A2 (en) * 1985-08-28 1987-03-04 Seiei Kohsan Co.,Ltd. Method and apparatus for packaging semiconductor device and the like
JPS6249235U (en) * 1985-09-17 1987-03-26
JPS6270011A (en) * 1985-09-24 1987-03-31 Matsushita Electric Works Ltd Lead frame feeding-unloading device
JPS6270010A (en) * 1985-09-24 1987-03-31 Matsushita Electric Works Ltd Lead frame feeding-unloading device in encapsulation of electronic parts
JPS6270009A (en) * 1985-09-24 1987-03-31 Matsushita Electric Works Ltd Encapsulating device for electronic parts
JPS63240035A (en) * 1987-03-27 1988-10-05 Matsushita Electric Works Ltd Electronic component sealing and molding device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199340A (en) * 1984-10-19 1986-05-17 Rohm Co Ltd Mold frame checking mechanism
JPH043105B2 (en) * 1984-10-19 1992-01-22
JPS61136237A (en) * 1984-12-07 1986-06-24 Toshiba Mach Co Ltd Frame set confirming device
JPH0353500Y2 (en) * 1985-03-15 1991-11-22
JPS61153342U (en) * 1985-03-15 1986-09-22
JPS61153343U (en) * 1985-03-15 1986-09-22
JPH0353499Y2 (en) * 1985-03-15 1991-11-22
EP0212994A2 (en) * 1985-08-28 1987-03-04 Seiei Kohsan Co.,Ltd. Method and apparatus for packaging semiconductor device and the like
JPS6249235U (en) * 1985-09-17 1987-03-26
JPH043498Y2 (en) * 1985-09-17 1992-02-04
JPS6270011A (en) * 1985-09-24 1987-03-31 Matsushita Electric Works Ltd Lead frame feeding-unloading device
JPS6270009A (en) * 1985-09-24 1987-03-31 Matsushita Electric Works Ltd Encapsulating device for electronic parts
JPS6270010A (en) * 1985-09-24 1987-03-31 Matsushita Electric Works Ltd Lead frame feeding-unloading device in encapsulation of electronic parts
JPS63240035A (en) * 1987-03-27 1988-10-05 Matsushita Electric Works Ltd Electronic component sealing and molding device

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