JPS61153343U - - Google Patents
Info
- Publication number
- JPS61153343U JPS61153343U JP3796185U JP3796185U JPS61153343U JP S61153343 U JPS61153343 U JP S61153343U JP 3796185 U JP3796185 U JP 3796185U JP 3796185 U JP3796185 U JP 3796185U JP S61153343 U JPS61153343 U JP S61153343U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- view
- showing
- plan
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 4
- 210000000078 claw Anatomy 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案によるリードフレームの保持装
置を適用した半導体部品の製造装置の一例を示す
構成図、第２図は半導体スライスの例を示す平面
図、第３図は半導体チツプをマウントしたリード
フレームの例を示す平面図、第４図はリードフレ
ームを収納したマガジンを示す斜視図、第５図は
第１の収納部の一例を示す要部の略線的断面図、
第６図はワーキングアームの要部を示す斜視図、
第７図はワーキングアームのリードフレーム検出
部の要部の側面図、第８図はリードフレームと検
出部の位置関係を示す平面図、第９図Ａ及びＢは
第１のセパレータの動作状態を示す平面図、第１
０図はワーキングアームの動作状態を示す平面図
、第１１図はワークステーシヨンの動作状態を示
す一部斜視図を含む平面図、第１２図Ａ〜Ｃは第
２のセパレータの動作状態を示す平面図、第１３
図は第１及び第２の収納部のマガジンの配列状態
を示す略線的斜視図、第１４図はモールドした直
後のリードフレームを示す斜視図、第１５図はト
リミング後のリードフレームを示す斜視図である
。
２は半導体チツプ、３はリードフレーム、４は
マガジン、１１は第１の収納部、１３はモールド
金型、１４はトリミング金型、１５は第２の収納
部、１６はワーキングアーム、１７はワーキング
ステーシヨン、３２は樹脂タブレツト、３３ａ，
３３ｂは真空吸着手段、３４ａ，３４ｂは光検出
手段である。
Fig. 1 is a configuration diagram showing an example of a semiconductor component manufacturing apparatus to which the lead frame holding device according to the present invention is applied, Fig. 2 is a plan view showing an example of semiconductor slicing, and Fig. 3 is a lead on which a semiconductor chip is mounted. FIG. 4 is a perspective view showing a magazine storing lead frames; FIG. 5 is a schematic cross-sectional view of main parts showing an example of a first storage part;
Figure 6 is a perspective view showing the main parts of the working arm;
Fig. 7 is a side view of the main parts of the lead frame detection section of the working arm, Fig. 8 is a plan view showing the positional relationship between the lead frame and the detection section, and Fig. 9 A and B show the operating state of the first separator. Plan view shown, 1st
Fig. 0 is a plan view showing the operating state of the working arm, Fig. 11 is a plan view including a partial perspective view showing the operating state of the work station, and Figs. 12 A to C are plan views showing the operating state of the second separator. Figure, 13th
The figure is a schematic perspective view showing the arrangement of magazines in the first and second storage sections, Figure 14 is a perspective view showing the lead frame immediately after molding, and Figure 15 is a perspective view showing the lead frame after trimming. It is a diagram. 2 is a semiconductor chip, 3 is a lead frame, 4 is a magazine, 11 is a first storage section, 13 is a molding die, 14 is a trimming die, 15 is a second storage section, 16 is a working arm, and 17 is a working section. Station, 32 is a resin tablet, 33a,
33b is a vacuum suction means, and 34a and 34b are photodetection means.
Claims (1)
部を有するリードフレームの保持装置において、
真空吸着手段と光検出手段を備えた上記リードフ
レームの検出部を有して成るリードフレームの保
持装置。 A lead frame holding device having at least a pair of claws that clamps the lead frame,
A lead frame holding device comprising a detection section for the lead frame as described above, which includes a vacuum suction means and a light detection means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985037961U JPH0353500Y2 (en) | 1985-03-15 | 1985-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985037961U JPH0353500Y2 (en) | 1985-03-15 | 1985-03-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61153343U true JPS61153343U (en) | 1986-09-22 |
| JPH0353500Y2 JPH0353500Y2 (en) | 1991-11-22 |
Family
ID=30544524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985037961U Expired JPH0353500Y2 (en) | 1985-03-15 | 1985-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353500Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57167639A (en) * | 1981-04-08 | 1982-10-15 | Toshiba Corp | Feeder for lead frame in molding device for resin sealing |
-
1985
- 1985-03-15 JP JP1985037961U patent/JPH0353500Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57167639A (en) * | 1981-04-08 | 1982-10-15 | Toshiba Corp | Feeder for lead frame in molding device for resin sealing |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0353500Y2 (en) | 1991-11-22 |
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