JPH0353500Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a lead frame holding device for transporting a lead frame from one position to another in the process of manufacturing semiconductor components.

[Conventional technology]

In the manufacture of semiconductor components, there is a process of molding a lead frame on which a semiconductor chip is mounted. Conventionally, in such a molding process, the lead frame on which the semiconductor chip is mounted and the molding resin tablet are first manually placed into a mold, and after the molding is completed, the lead frame is manually removed from the mold. ing. Automation of such a molding process is desired in order to improve work efficiency.

[Problems that the invention attempts to solve] By the way, when automating the molding process,
In particular, when holding and transporting a lead frame on which a semiconductor chip is mounted, it is necessary to hold and transport the lead frame in the correct position and without warping or deformation.

The present invention provides a lead frame holding device that is capable of conveying a lead frame by determining whether the holding state of the lead frame is good or bad.

[Means for solving problems]

As shown in FIGS. 1 and 6 to 8, the present invention provides a lead frame holding device 16 having at least one pair of claws 30 for holding the lead frame 3.
In this embodiment, a detection section 35 of a lead frame is provided with vacuum suction means 33, 33a, 33b and photodetection means 34, 34a, 34b.

The lead frame 3 has a large number of lead parts,
It is constructed with a wide connecting part 5 that also serves as reinforcement in the middle part. At least two or more detection units 35 are provided in the longitudinal direction of the lead frame 3.
Each vacuum suction means 33 is provided so as to suction the center of the connecting portion 5 of the lead frame.
Further, each of the light detecting means 34 has a light emitting element and a light receiving element, and is arranged in a positional relationship such that they are displaced to opposite sides with respect to a reference line 35 passing through the center of the connecting portion 5.

[Effect]

The lead frame 3 is held in a pinching manner by the claw portions 30 from both sides. At this time, lead frame 3
If the lead frame 3 is held in the correct position, the light from the respective photodetecting means 34a and 34b is reflected by the connecting portion 5 of the lead frame 3, and the reflected light is detected. On the other hand, if the lead frame 3 is misaligned in the longitudinal direction, either one of the photodetecting means 34a
Alternatively, the light from 34b will not be reflected by the connecting portion 5, and the displacement will be detected. Further, if the lead frame 3 is not warped or deformed, the connecting portion 5 of the lead frame is completely vacuum-adsorbed. However, if the lead frame is warped or deformed, a vacuum leak will occur and a defect will be detected. In this way, it is determined whether the lead frame is held in a good or bad state, and only lead frames in good condition are transported.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a semiconductor component manufacturing apparatus to which a lead frame holding device according to the present invention is applied will be described below with reference to the drawings.

First, a molded lead frame will be explained using FIGS. 2 to 4. In the present invention, as shown in FIGS. 2 and 3, a large number of semiconductor elements, such as chips 2 of variable capacitance diodes, formed on one semiconductor slice 1 are arranged in the order of dotted arrows, that is, C
-Mount on lead frame 3 in order of closest V curve characteristics. In this example, number [1] to number [50]
Chips 2 from number [51] to number [100] are mounted on the second lead frame 3b, and chips 2 from numbers [51] to [100] are mounted on the second lead frame 3b. Mount it on the lead frame 3 of... When viewed from the perspective of one semiconductor slice 1, adjacent chips have similar characteristics to each other. Therefore, if the chips 2 are mounted on the lead frame 3 in the illustrated arrangement order, the chips 2 having similar characteristics will be mounted in order within the lead frame 3. The lead frame 3 is provided with a relatively wide connecting portion 5 that also serves as reinforcement for every five lead portions. 6 is a small hole. As shown in FIG. 4, 40 lead frames 3, 3a, 3b, . In this example, one semiconductor slice 1 has 18 magazines 4a.
It is stored in ~4r. These 18 magazines 4a~
4r is placed in a case and transported to each process.

FIG. 1 is a block diagram showing the entire manufacturing apparatus in the molding process. In the same figure, 1
Reference numeral 1 designates a first storage section that stores a lead frame 3 on which a semiconductor chip 2 constituting a variable capacitance diode is mounted, that is, 18 magazines 4 (see FIG. 4) storing lead frames 3. 12 is a mold press device equipped with a mold die 13 for molding the lead frame 3; 14;
15 is a trimming mold for trimming the resin residue at the cull, runner, and gate of the molded lead frame 3, and 15 is a second storage section for storing the trimmed lead frame 3 in order again in the magazine 4'. Further, 16 is a holding device or working arm according to the present invention used for supplying the lead frame 3 from the first storage part 11 to the molding die 13, and 17 is a working arm for supplying the lead frame 3 after molding to the trimming die 14. This is a workstation used for supplying, etc.

In the first storage section 11, the lead frame 3
The 18 magazines 4, 4a to 4r containing the lead frames 4, 4a to 4r are stored in a case (not shown) in the upper stage of the storage section 11, and after the lead frames 3 are sent out from the magazines 4 one after another, they become empty. The magazine 4 is configured to be moved to the lower stage of the storage section 11. For example, as shown in FIG. 5, the 18 magazines 4 stored in the upper stage of the storage section 11 are pushed to the right in the figure by the pushing piece 18, and the magazines 4a are placed on the pedestal 19. Next, the cylinder 20 moves the pedestal 19 to a predetermined position (solid line position), that is, the lead frame 3 disposed at the lowest stage in the magazine 4 is moved to the guide portion 21.
(See FIG. 1), the magazine 4a is placed on the lowering platform 22. Thereafter, the pedestal 19 escapes backward. Next, the descending platform 22 descends one step at a time and sends out the lead frames 3 one by one to the guide section 21 one by one. and magazine 4a
When all the lead frames 3 in the magazine 4a are sent out, the magazine 4a descends to the lower stage of the storage section 11, and then returns to its original position with the cradle 19 aligned at the upper stage.
The empty magazine 4 is
a is fed into the lower part of the storage section 11.

Guide part 21 arranged outside the first storage part 11
A roller 24 is disposed therein, and the lead frame 3 on the guide section 21 is sent to a first separator 25 close to the guide section 21 by this roller 24 . This first separator 25 has two grooves 26a and 2 into which two lead frames 3 can be inserted in parallel.
6b, and is configured to be able to rotate 180 degrees around an axis 27. That is, as shown in FIGS. 9A and 9B, one groove portion 26a faces the guide portion 21 in the original state, and the other groove portion 26b faces the guide portion 21 when rotated by 180 degrees. This first
In the separator 25, when the lead frame 3 is sent from the guide part 21 and placed in a predetermined position, the groove part 26
A pin (not shown) protrudes from a and 26b and is inserted into the small hole 6 of the lead frame 3 to position the lead frame 3. 28 is a notch into which the claw portion 30 of the working arm 16 can fit.

As shown in the enlarged view of FIG. 6, the working arm 16 has a pair of claws 30 at its tip that grips the lead frame 3 from both sides, and this tip is connected between the first separator 25 and the work station 17. It is disposed so as to be movable in one direction, in a direction perpendicular thereto (direction in and out of the mold 13), and in an up and down direction. Five tablet accommodating portions 31 into which resin tablets 32 for molding are placed are provided at this tip. This tablet storage section 3
1, when the resin tablet 32 is inserted, the lower part is closed to hold the resin tablet 32 in the tablet housing, and when the tip of the working arm 16 enters the molding die 13, it opens and the resin tablet 32 is molded. It is configured to be inserted into a predetermined portion of the mold 13. Further, at the tip of the working arm 16, a detection section is provided with vacuum suction means 33, 33a, 33b and photodetection means 34, 34a, 34b to detect whether or not the lead frame is correctly held. 35
is provided. This detection part 35 is a vacuum suction means 3
Two or more sets (in this example, two sets) are provided corresponding to each lead frame. Then, as shown in FIG. 8, the vacuum suction means 3
3a and 33b are connecting portions 5 of the lead frame 3, respectively.
The photodetecting means 34a and 34b have a light emitting element and a light receiving element, and are displaced toward opposite sides with respect to a reference line 35 passing through the center of the connecting part 5. It is also arranged. Therefore, in FIG.
is held by the working arm 16 with a displacement in the longitudinal direction (left-right direction), the light from either one of the light detection means 34a or 34b will not be reflected by the connecting portion 5, and the displacement will be detected. In this example, it is determined that there is no lead frame if the positional deviation is 0.3 mm or more. Also lead frame 3
Even if the vacuum suction means 33 is placed in the correct position,
If a vacuum leak occurs when suction is performed at a and 33b, this is because the lead frame 3 is bent or deformed, and is determined to be defective.

The mold die 13 in the mold press device 12 includes a lower die 13A and an upper die 13B, and is configured such that the upper die 13B descends to perform molding on the lead frame 3. This mold press device 12 is movably provided with a mold cleaning means 41 having a brush 40, and is configured to enter the mold mold 13 and clean it after molding. In front of this mold press device 12 is a tablet detection means 39.
will be arranged.

On the other hand, a tablet supply section 42 is disposed, and a tablet loader 43 for supplying resin tablets 32 to the tablet storage section 31 of the working arm 16 is provided between the tablet supply section 42 and the working arm 16. This tablet loader 43 is equipped with a pair of claws 44 that simultaneously hold a plurality of resin tablets 32, five in this example, and moves between a predetermined moving position of the tablet supply section 42 and the working arm 16 around a shaft 45. Rotatably mounted. In the tablet supply section 42, five resin tablets 32 are stacked in multiple stages in a row and housed in a magazine 46, and a plurality of magazines 46 are arranged so that they can be moved intermittently one magazine at a time in the direction of the arrow A. Ru. When all the resin tablets 32 in one magazine 46 have been supplied, the next magazine 46 is loaded into the tablet loader 4.
It is moved to the position corresponding to 3. In the magazine 46, five resin tablets 3 are placed from its upper end.
2 protrudes, and the tablet loader 43 removes 5 at the top end.
After one resin tablet 32 is taken out, the next five resin tablets 32 are arranged to protrude from the magazine 46.

In the workstation 17, there are 2
It has two pairs of claws 47 that hold two lead frames 3, respectively, and is rotated 180 degrees around the shaft 48 (flipped).
Possibly arranged. At the same time, this work station 17 moves back and forth between the trimming mold 14 from the home position and from the home position to the second trimming mold 14.
The separator 50 is configured to allow reciprocating movement between the separators 50 and to be able to move up and down. Trimming mold 1
4, the upper mold is lowered to remove resin residues such as culls, runners, gates, etc. on the lead frame 3 after molding.

The second separator 50 is the first separator 25
Similarly, two lead frames 3 are placed 2
It has two groove parts 51a and 51b, and has two groove parts 51a and 51b, and has two groove parts 51a and 51b, and
It can be rotated 180°. 53 is a lead frame feeding means, which is configured to be movable reciprocatingly and vertically along a guide rod 55 by means of a feed screw 54;
The pin 56 descends at the edge of the lead frame 3, contacts the edge, and moves to move one lead frame 3 to the guide portion 57 of the second storage portion 15.
be transferred to.

The second storage section 15 is configured similarly to the first storage section 11. In this case, an empty magazine 4' is stored in the upper stage of the storage section 15, and a magazine 4' containing the lead frame 3 is stored in the lower stage. That is, the empty magazine 4' in the upper stage is lowered one stage at a time in the cylinder 20, and the lead frames 3 that have passed through the guide part 57 are stored in order from the bottom, and a predetermined number of lead frames 3 (40 in this example) are all stored. When the magazine 4' is finished, the storage section 1 is
It will be stored in the lower row of 5.

Next, the operation of such a device will be explained. In FIG. 1, the arrow FL indicates the flow of the lead frame 3, and the arrows at each part indicate the movement of each unit.

In the first storage section 11, a lead frame 3 with a chip 2 mounted thereon is stored in each magazine 4, and the magazines 4 are stored in the state shown in FIG. 13. Then, the first magazine 4a is connected to the cylinder 2.
0, the lead frames 3 in the magazine 4a are sent to the guide section 21 in order from the bottom as the lead frames 3 are intermittently lowered one step at a time. That is, first, the first lead frame 3a on which the chips 2 with numbers [1] to [50] are mounted passes through the guide portion 21 and reaches the first groove portion 27 of the first separator 25, as shown in FIG. 9A. sent to. Next, as shown in FIG. 9B, the first separator 25 is rotated 180 degrees, and the second lead frame 3b has the next numbered chips [51] to [100] mounted in the second groove 28.
will be sent. The lead frame 3 is attached to the grooves 27 and 28.
When the leads a and 3b are fed, the positioning pins of the separator 25 enter the small holes 6 of the lead frames 3a and 3b, and the lead frames 3a and 3b are positioned.

As shown in FIG. 10, the working arm 16 first moves from a fixed position (marked) to below the tablet loader 43 waiting at a predetermined position (marked) and loads the five resin tablets 32 into its tablet storage section. Receive within 31 days. Next, this working arm 16 moves to the first separator 25 and attaches the two lead frames 3a and 3b to the claw portion 3.
Hold by 0. With the two lead frames 3a and 3b sandwiched by the working arm 16, the photodetecting means 34a and 34b and the vacuum suction means 3
Lead frames 3a, 3b by 3a, 33b
The presence or absence and whether or not the state is correct are detected. If the condition is correct, the working arm 16 moves to the position indicated by the symbol. At this time, the presence or absence of the resin tablet 32 in the tablet storage section 31 at the tip of the arm is confirmed by the tablet detection means 39. If the presence of the resin tablet 32 is confirmed, the working arm 16 moves and carries the lead frames 3a, 3b into the mold 13 of the mold press device 12 (marked). After the two lead frames 3a and 3b are carried by the working arm 16, the first separator 25 is moved again.
Turn 180° and return to the original position. The working arm 16 descends within the molding die 13, places the resin tablet 32 and lead frames 3a, 3b in a predetermined position, then rises, exits the molding die 13, returns to the predetermined position, and waits during the molding operation. (sign). If the resin tablet 32 remains, an error signal is generated. In the mold press device 12, the upper mold 13b descends and the two lead frames 3
Mold each chip 2 of a and 3b. During this molding period, the next two lead frames 3 are sent from the magazine 4a of the first storage section 11 to the first separator 25 and are put on standby. Further, the tablet loader 43 also receives the resin tablets 32 from the tablet supply section 42 and waits at a predetermined position. next,
After the molding is completed, the working arm 16 enters the molding die 13 (indicated by reference numeral) and returns to the position indicated by reference numeral while holding the molded and integrated lead frames 3a and 3b therebetween. If any product cull remains here, an error signal is generated. The working arm 16 then moves to the working station 17 and places the lead frames 3a, 3b on the working station 17 (marked by reference numeral). During this time, cleaning means 4
1 is driven to clean the inside of the mold 13. Note that when the working arm 16 comes to the position indicated by the symbol, it is detected by the tablet detection means 39.
FIG. 14 shows two lead frames 3a and 3b in a molded state, and 60 is a semiconductor element part;
61 is a resin part. The working arm 16 is attached to the work station 17 with lead frames 3a, 3.
After placing the resin tablet 32, the resin tablet 32 is received from the tablet loader 43 waiting in the vicinity of the work station 17 (reference numeral), and the resin tablet 32 is moved directly to the first separator 25, and the same operations are repeated. It can be done. Note that the working arm 16 incorrectly pinched the lead frames 3a and 3b at the position indicated by the symbol (no lead frame or misaligned position).
When this happens, the working arm 16 stops in place and issues an alarm (error) signal.

At the workstation 17, the molded lead frames 3a, 3b are cooled for a certain period of time. Thereafter, as shown in FIG.
While holding lead frames 3a and 3b, the lead frames 3a and 3b are turned over by 180 degrees around the shaft 48. The reason for inverting is to facilitate trimming after molding, to print on the back side of the mold, and to allow leads led out to the front side to be bent to the front side of the mold. Next, the work station 17 moves to the trimming mold 14 (marked), places the lead frames 3a and 3b on the trimming mold 14, and returns to its original position (marked).
Then, the trimming mold 14 is operated, that is, the upper mold is lowered to remove resin residues such as culls, runners, gates, etc. FIG. 15 shows the lead frames 3a, 3b after trimming. After trimming, the work station 17 moves, takes out the lead frames 3a and 3b from the trimming mold 14 (marked), then moves to the second separator 50 (marked), and removes the lead frames 3a and 3b from the trimming mold 14 (marked).
Two lead frames 3a and 3b are placed on. Thereafter, the work station 17 returns to its original position (indicated by reference numeral), and at that position it is turned over 180 degrees so that the claw portion 47 is on the front side, and enters the next standby state.

The second separator 50 from the trimming mold 14
Immediately after the lead frames 3a and 3b are sent to The lead frame 3b is stored in the lowermost stage of the magazine 4' of the second storage section 15, and then the second separator 50 is reversed by 180 degrees, and the lead frame 3b is stored in the magazine 4' through the guide section 57. At this time, the second storage section 1
Since the magazine 4' of No. 5 is lowered one stage by the cylinder 20, the lead frame 3b is stored in the upper stage of the lead frame 3a. This process was repeated and the lead frames 3a, which were molded in sequence,
3b are stored in the magazine 4' in order.

In this device, first the upper part of the first storage section 11 is
When the case containing 18 magazines 4a to 4r is arranged, that is, when the case is held in the hand as shown in FIG. If the lead frames 3 are arranged in such a way that the number [1] is on the front and the number [50] is on the back, then the lead frames 3 will be placed in the first storage part 11 more than the second storage part 15, as shown in the figure. They can be taken out in the same arrangement. Therefore, the 18 magazines 4 containing the lead frames 3 are stored in the first storage section 1 together with the case 58.
1 can be taken out from the second storage section 15 and transported to the next process. Furthermore, as shown in FIGS. 2 and 3, when chips 2 having similar characteristics are mounted next to each other on the lead frame 3 in order from the semiconductor slices 1,
Since chips with the same characteristics are arranged in order on the lead frame, a plurality of semiconductor elements with the same characteristics can be easily obtained without the need for special sorting operations. Further, since the lead frame 3 is stored upside down in the second storage section 15, subsequent operations such as printing on the back side are facilitated.

In the above example, the present invention is applied to a lead frame on which a variable capacitance diode is mounted, but it can also be applied to a mold for a lead frame on which other semiconductor elements are mounted.

[Effect of idea]

According to the present invention described above, while the lead frame 3 is held in a pinching manner by the claws 30, the positional deviation of the lead frame 3 is detected by the optical detection means 34, and the displacement of the lead frame 3 is detected by the vacuum suction means 33. Warpage and deformation of the lead frame 33 are detected. This allows the holding device 16 to transport only lead frames in good condition to the next process.

Therefore, the lead frame holding device of the present invention stores the lead frame on which a semiconductor chip is mounted in the first storage section, transports the lead frame to the molding device, and then transfers the molded lead frame to the second storage section. The present invention is suitable for application to a means for transporting lead frames in a semiconductor component manufacturing apparatus in which a series of processes for storing lead frames in a semiconductor component is automated.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram showing an example of a semiconductor component manufacturing apparatus to which the lead frame holding device according to the present invention is applied, Fig. 2 is a plan view showing an example of semiconductor slicing, and Fig. 3 is a lead on which a semiconductor chip is mounted. FIG. 4 is a perspective view showing a magazine storing lead frames; FIG. 5 is a schematic cross-sectional view of main parts showing an example of a first storage part;
Figure 6 is a perspective view showing the main parts of the working arm;
Fig. 7 is a side view of the main parts of the lead frame detection section of the working arm, Fig. 8 is a plan view showing the positional relationship between the lead frame and the detection section, and Fig. 9 A and B show the operating state of the first separator. Plan view shown, 1st
Fig. 0 is a plan view showing the operating state of the working arm, Fig. 11 is a plan view including a partial perspective view showing the operating state of the work station, and Figs. 12 A to C are plan views showing the operating state of the second separator. Figure, 1st
Fig. 3 is a schematic perspective view showing the arrangement of magazines in the first and second storage sections, Fig. 14 is a perspective view showing the lead frame immediately after molding, and Fig. 15 shows the lead frame after trimming. FIG. 2 is a semiconductor chip, 3 is a lead frame, 4 is a magazine, 11 is a first storage section, 13 is a molding die, 14 is a trimming die, 15 is a second storage section, 16 is a working arm, and 17 is a working section. Station, 32 is a resin tablet, 33a,
33b is a vacuum suction means, and 34a and 34b are photodetection means.

Claims (1)

[Scope of utility model registration request] A lead frame holding device having at least one pair of claws that clamps the lead frame,
The lead frame has two or more detection parts each having a vacuum suction means and a light detection means, and the light detection means of each of the detection parts is arranged to be displaced with respect to a reference line of the lead frame. Lead frame holding device.