JPS5881958U - Lead wire cutting device - Google Patents

Lead wire cutting device

Info

Publication number
JPS5881958U
JPS5881958U JP17600981U JP17600981U JPS5881958U JP S5881958 U JPS5881958 U JP S5881958U JP 17600981 U JP17600981 U JP 17600981U JP 17600981 U JP17600981 U JP 17600981U JP S5881958 U JPS5881958 U JP S5881958U
Authority
JP
Japan
Prior art keywords
workpiece
lead wire
transporter
wire cutting
cutter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17600981U
Other languages
Japanese (ja)
Other versions
JPS6225902Y2 (en
Inventor
正義 村瀬
伊藤 尚道
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP17600981U priority Critical patent/JPS5881958U/en
Publication of JPS5881958U publication Critical patent/JPS5881958U/en
Application granted granted Critical
Publication of JPS6225902Y2 publication Critical patent/JPS6225902Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Processing (AREA)
  • Shearing Machines (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はワークの一例である半導体装置の斜視図、第2
図及び第3図は本考案の一実施例を示す概略正面図及び
i=I線に沿う拡大断面図、第4図乃至第6図は第2図
要部の動作を説明する各動作時の正面図、第7図は第5
図の■−■線に沿う拡大断面図、第8図及び第9図は本
考案の他の実施例を示す概略正面図及び■−■線に沿う
拡大断面図、第10乃至第13図は第9図における動作
を説明する各動作時での断面図である。 3・・・リード線、4・・・ワーク(半導体装置)、6
・・・ワーク排出シ五−ト、7・・・ワーク搬送体、8
・・・可動カッター(偏心カッター)、10・・・スト
ッパ、13・・・ワーク搬送体、14・・・可動カッタ
ー(上下動カッター)、15・・・ストッパ。
Figure 1 is a perspective view of a semiconductor device, which is an example of a workpiece;
3 and 3 are a schematic front view and an enlarged sectional view taken along the i=I line showing one embodiment of the present invention, and FIGS. 4 to 6 illustrate the operation of the main parts in FIG. 2 during each operation. Front view, Figure 7 is the 5th
FIGS. 8 and 9 are schematic front views showing other embodiments of the present invention and enlarged sectional views taken along the line ■-■, and FIGS. 10 to 13 are FIG. 10 is a cross-sectional view of each operation for explaining the operation in FIG. 9; 3... Lead wire, 4... Work (semiconductor device), 6
... Work discharge seat, 7... Work conveyor, 8
... Movable cutter (eccentric cutter), 10... Stopper, 13... Workpiece carrier, 14... Movable cutter (vertical moving cutter), 15... Stopper.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 前工程のワーク排出シュートに連結され、リード線を導
出したワークをリード線の一部を側方に突出させて整送
する固定カッター兼用のワーク搬送体と、ワーク搬送体
の定位置の側方に回転動或は上下動自在に配置され、ワ
ークのリード線をワーク搬送体上の定位置で切断する可
動カッターと、可動カッターと連動してワーク搬送体上
のリード線切断位置にワークを一時停正させるストッパ
とを具備したことを特徴とするリード線切断装置。
A workpiece transporter that doubles as a fixed cutter connects to the workpiece discharge chute in the previous process and transports the workpiece with a lead wire drawn out with a part of the lead wire protruding to the side, and a workpiece transporter that also serves as a fixed cutter, and a workpiece transporter at a fixed position on the side of the workpiece transporter. A movable cutter is arranged to be rotatable or vertically movable, and cuts the lead wire of the workpiece at a fixed position on the workpiece carrier, and a movable cutter works in conjunction with the movable cutter to temporarily place the workpiece at the lead wire cutting position on the workpiece carrier. A lead wire cutting device characterized by comprising a stopper for stopping the lead wire.
JP17600981U 1981-11-25 1981-11-25 Lead wire cutting device Granted JPS5881958U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17600981U JPS5881958U (en) 1981-11-25 1981-11-25 Lead wire cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17600981U JPS5881958U (en) 1981-11-25 1981-11-25 Lead wire cutting device

Publications (2)

Publication Number Publication Date
JPS5881958U true JPS5881958U (en) 1983-06-03
JPS6225902Y2 JPS6225902Y2 (en) 1987-07-02

Family

ID=29968671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17600981U Granted JPS5881958U (en) 1981-11-25 1981-11-25 Lead wire cutting device

Country Status (1)

Country Link
JP (1) JPS5881958U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561552A (en) * 1979-06-18 1981-01-09 Seiko Instr & Electronics Ltd Apparatus for aligning and cutting lead wire

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561552A (en) * 1979-06-18 1981-01-09 Seiko Instr & Electronics Ltd Apparatus for aligning and cutting lead wire

Also Published As

Publication number Publication date
JPS6225902Y2 (en) 1987-07-02

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