JPH01129827U - - Google Patents

Info

Publication number
JPH01129827U
JPH01129827U JP2415888U JP2415888U JPH01129827U JP H01129827 U JPH01129827 U JP H01129827U JP 2415888 U JP2415888 U JP 2415888U JP 2415888 U JP2415888 U JP 2415888U JP H01129827 U JPH01129827 U JP H01129827U
Authority
JP
Japan
Prior art keywords
lead frame
slide table
guide
frame
external view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2415888U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2415888U priority Critical patent/JPH01129827U/ja
Publication of JPH01129827U publication Critical patent/JPH01129827U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例１を示す外観図、第２
図は本考案の実施例２を示す外観図、第３図は従
来のマウンタを示す外観図である。 １……リードフレーム、２……送り爪、３……
搬送レール、４……ソルダー供給ユニツト、５…
…ＸＹテーブル、６……チツプ、７……ボンデイ
ングアーム、８……コレツト、９……リードフレ
ーム供給マガジン、１０……真空吸着ユニツト、
１１……フレーム供給部、１２……スライドテー
ブル、１３……フレーム固定爪、１４……位置検
出用センサ、１５……ボールねじ、１６……リニ
アガイド、１７……ガイドレール、１８……フレ
ーム収納部、１９……収納側マガジン、２０……
供給側マガジン、２１……ヒータブロツク、２２
……上下動ユニツト、２３……フレーム押さえ。 Figure 1 is an external view showing Embodiment 1 of the present invention, Figure 2 is an external view showing Example 1 of the present invention;
The figure is an external view showing a second embodiment of the present invention, and FIG. 3 is an external view showing a conventional mounter. 1...Lead frame, 2...Feed claw, 3...
Conveyance rail, 4...Solder supply unit, 5...
...XY table, 6...chip, 7...bonding arm, 8...collect, 9...lead frame supply magazine, 10...vacuum suction unit,
11... Frame supply unit, 12... Slide table, 13... Frame fixing claw, 14... Position detection sensor, 15... Ball screw, 16... Linear guide, 17... Guide rail, 18... Frame Storage section, 19... Storage side magazine, 20...
Supply side magazine, 21... Heater block, 22
... Vertical movement unit, 23 ... Frame holder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレームの供給部と収納部との間にボン
デイングヘツド部を通して敷設されたガイドと、
該ガイドに沿つて往復動し、ボンデイング処理対
象となるリードフレームの搬送を行うスライドテ
ーブルと、該スライドテーブルに送りを与えるボ
ールねじとを有することを特徴とするマウンタ。 a guide installed through a bonding head between the supply section and the storage section of the lead frame;
A mounter comprising: a slide table that reciprocates along the guide to transport a lead frame to be bonded; and a ball screw that feeds the slide table.
JP2415888U 1988-02-25 1988-02-25 Pending JPH01129827U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2415888U JPH01129827U (en) 1988-02-25 1988-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2415888U JPH01129827U (en) 1988-02-25 1988-02-25

Publications (1)

Publication Number Publication Date
JPH01129827U true JPH01129827U (en) 1989-09-04

Family

ID=31243765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2415888U Pending JPH01129827U (en) 1988-02-25 1988-02-25

Country Status (1)

Country Link
JP (1) JPH01129827U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014069184A1 (en) * 2012-11-01 2014-05-08 株式会社新川 Extrusion device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834933A (en) * 1981-08-26 1983-03-01 Nec Corp Die-bonding unit
JPS59231827A (en) * 1983-06-14 1984-12-26 Toshiba Corp Wire bonding device
JPS61259531A (en) * 1985-05-14 1986-11-17 Tokyo Sokuhan Kk Bonding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834933A (en) * 1981-08-26 1983-03-01 Nec Corp Die-bonding unit
JPS59231827A (en) * 1983-06-14 1984-12-26 Toshiba Corp Wire bonding device
JPS61259531A (en) * 1985-05-14 1986-11-17 Tokyo Sokuhan Kk Bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014069184A1 (en) * 2012-11-01 2014-05-08 株式会社新川 Extrusion device

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