JPS5664447A - Resin sealing device for integrated circuit element - Google Patents
Resin sealing device for integrated circuit elementInfo
- Publication number
- JPS5664447A JPS5664447A JP14063479A JP14063479A JPS5664447A JP S5664447 A JPS5664447 A JP S5664447A JP 14063479 A JP14063479 A JP 14063479A JP 14063479 A JP14063479 A JP 14063479A JP S5664447 A JPS5664447 A JP S5664447A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- product
- resin
- integrated circuit
- sealing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C45/1468—Plants therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To form the resin sealing device compact by automatically supplying a lead frame placing integrated circuit elements onto one or two rails, positioning them in the lower die, lowering the upper die, then molding the resin in the mold, moving it on the rails, and separating the product and the unnecessary part from each other. CONSTITUTION:The lead frames 1 are isolated one by one by a stopper 6 from a case 5 and are thus supplied to the mold 8. The case 5 is elevationally driven by a drive unit 17. The frame 1 is set by the stopper 13 at a predetermined position, the upper die 9 is lowered thereby pressurizing the mold. Simultaneously, the resin 12 is charged from a cylinder 11, and the IC element 2 is thus sealed. After sealing, the mold 9 is raised, the product is moved, and the product 3 and the unnecessary part 4 are isolated by the movable cylinder 14 and are respectively contained in boxes 15 and 16, respectively. According to this configuration the device can be reduced in size and the mechanism can be simplified, and accordingly trouble is reduced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14063479A JPS5664447A (en) | 1979-10-30 | 1979-10-30 | Resin sealing device for integrated circuit element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14063479A JPS5664447A (en) | 1979-10-30 | 1979-10-30 | Resin sealing device for integrated circuit element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5664447A true JPS5664447A (en) | 1981-06-01 |
Family
ID=15273242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14063479A Pending JPS5664447A (en) | 1979-10-30 | 1979-10-30 | Resin sealing device for integrated circuit element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5664447A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61210640A (en) * | 1985-03-15 | 1986-09-18 | Sony Corp | Manufacturing apparatus for semiconductor part |
JPS61210641A (en) * | 1985-03-15 | 1986-09-18 | Sony Corp | Manufacture apparatus for semiconductor part |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5456657A (en) * | 1977-10-14 | 1979-05-07 | Iwatani & Co | Transfer mold press |
-
1979
- 1979-10-30 JP JP14063479A patent/JPS5664447A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5456657A (en) * | 1977-10-14 | 1979-05-07 | Iwatani & Co | Transfer mold press |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61210640A (en) * | 1985-03-15 | 1986-09-18 | Sony Corp | Manufacturing apparatus for semiconductor part |
JPS61210641A (en) * | 1985-03-15 | 1986-09-18 | Sony Corp | Manufacture apparatus for semiconductor part |
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