JPH0732414A - Method and equipment for resin seal molding electronic component part - Google Patents

Abstract

PURPOSE:To obtain an equipment capable of easily and immediately corresponding to a small-lot production and a mass production in resin seal molding an electronic component part and molding a high-quality and-reliability product without forming a void or a defective part in/on a resin-sealed molded body. CONSTITUTION:To a molding device 5 of a resin seal molding equipment composed of minimum components in conbination for resin seal molding an electronic component part, another molding device 5 is appropriately added. In this manner, a resin seal molding equipment corresponding to a mass production is easily formed without increasing the size of a mold 28 per se. On the other hand, a resin seal molding equipment corresponding to a small-lot production is easily formed without reducing the size of the mold 28 per se by appropriately removing the added molding device 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulation molding method and a resin encapsulation molding apparatus for encapsulating electronic parts such as ICs, LSIs, diodes and capacitors mounted on a lead frame with a resin material. In particular, the present invention relates to an improved product capable of promptly responding to small-scale production and large-scale production, respectively.

[0002]

2. Description of the Related Art Conventionally, resin encapsulation molding of electronic components has been carried out by a transfer molding method. In this method, a resin encapsulation molding apparatus having the following basic structure is generally used. Is used.

That is, in this type of resin encapsulation molding apparatus, a pair of molds in which a fixed mold and a movable mold are arranged to face each other, a resin material supply pot arranged in the molds, and It is provided with a fitted resin pressure plunger, a cavity opposed to the mold surface of the mold, a resin passage arranged between the pot and the cavity, and the like. Then, while supplying the resin tablet in the pot, the electronic parts mounted on the lead frame are supplied and set in a predetermined position of the cavity portion to clamp the mold, and further, the resin tablet in the pot is heated. In addition, the electronic components fitted in the respective cavities by pressurizing and injecting the molten resin material in the pots into the required number of cavities arranged at the lateral positions of the pots through the resin passages. Are molded with resin. In addition, the mold in the above-mentioned conventional apparatus can be appropriately replaced in a normal case, so that a mold for small-scale production or a mold for large-scale production can be selected and used.
Therefore, in that sense, the configuration is capable of corresponding to the production amount.

[0004]

By the way, in the case of using a mold for mass production, which is attached to the above-mentioned conventional apparatus, there are the following problems.

For example, since the weight and shape of the mold are inevitably increased in size, not only is it troublesome to handle, but
It becomes difficult to maintain the machining accuracy of the mold uniform. For this reason, the resin molding conditions are different in each part of the mold, and in particular, when manufacturing a product that requires high quality and high reliability such as resin sealing molding of electronic parts, It was said that due to the difference in the sealing molding conditions, a resin unfilled state was generated in the cavity, and voids and defects were formed inside and outside the resin sealing molding, which markedly deteriorated the product quality. There is a serious problem in resin molding. Further, since it is necessary to use a high-grade die material or the like in order to keep the machining accuracy of the die uniform, there is also a problem that the die and the apparatus are expensive.

Further, since a large amount of resin burrs adheres to the die surface of the mold, it takes a lot of time to remove the resin burrs, the overall molding time becomes long, and the productivity is remarkably reduced. There is a problem mentioned.

In addition, since it is necessary to consider the enlargement of the mold clamping mechanism and the like in increasing the size of the mold, there is a limit when mounting the mold for mass production on the above-mentioned conventional apparatus, and the mold is limited. There is a problem that it is inevitably limited in size and production volume.

Therefore, the present invention is capable of easily responding to small-volume production and large-volume production of resin encapsulation molding of electronic parts, and is of high quality in which voids and defects are not formed inside and outside the resin encapsulation molding. It is an object of the present invention to provide a resin encapsulation molding method for an electronic component and an apparatus therefor capable of molding a product having high reliability and high reliability.

[0009]

In order to solve the above-mentioned technical problems, a method of resin-molding an electronic component according to the present invention is a method of molding an electronic component mounted on a lead frame using a molding unit into a resin material. A resin encapsulation molding method for an electronic component for encapsulating by molding, comprising the step of freely increasing or decreasing the number of molding units by installing another molding unit in a detachable state with respect to the molding unit. And, the resin encapsulation molding step of the electronic component is performed using the molding unit described above.

Further, another molding method according to the present invention for solving the above-mentioned technical problem is to set a large number of lead frames before resin sealing, on which electronic parts are mounted, at predetermined positions in a lead frame supply unit. And a step of transferring a required number of pre-resin-sealed lead frames in the lead frame supply unit to the lead frame alignment unit side, and a pre-resin-sealed lead frame transferred to the lead frame alignment unit in a predetermined direction. The step of aligning, the step of supplying and aligning the required number of resin tablets, and the step of transferring the resin tablets aligned with the lead frame before resin sealing in the lead frame alignment unit between the fixed die and the movable die in the molding unit. The lead frame before resin encapsulation at the cavity The step of supplying the resin tablet to the position and supplying the resin tablet into the pot, and clamping both the fixed mold and the movable mold and heating and pressurizing the resin tablet in the pot to melt the molten resin material into a resin. A step of injecting and filling each of the cavities through the passages and resin-molding the electronic parts fitted in the cavities,
A step of taking out the resin-sealed lead frame that has undergone the resin molding step from the fixed die and the movable die to the outside, a step of cleaning the die surface of the fixed die and the movable die, and the resin A step of transferring the sealed lead frame to the position of the digating unit, a step of removing the gate portion of the resin-sealed lead frame in the digating unit, and a resin-sealed step through the gate removing step. The step of transferring the lead frame to the position of the lead frame accommodating unit, the step of separately attaching the resin-sealed lead frame that has undergone the gate removing step at the position of the lead frame accommodating unit, and the step of attaching each separately The step of separately accommodating each resin-sealed lead frame, and the other A step of arbitrarily increasing or decreasing the number of the molding units by mounting the molding units in a detachable state, and performing each step of the resin sealing molding of the electronic parts in the molding unit. To do.

Further, the resin encapsulation molding apparatus for electronic parts according to the present invention for solving the above technical problems encapsulates an electronic part mounted on a lead frame with a resin material by using a molding unit. A resin encapsulation molding apparatus for electronic parts, characterized in that another molding unit is detachably mounted on the molding unit so that the number of the molding units can be increased or decreased. To do.

Further, another molding apparatus according to the present invention for solving the above-mentioned technical problem is a supply unit of a large number of pre-resin-sealed lead frames on which electronic parts are mounted, and the above-mentioned resin-sealed units. A lead frame alignment unit that aligns the lead frame in a predetermined direction, a resin tablet supply unit, a resin tablet unloading unit that aligns and unloads the resin tablet, and the above-mentioned electronic components on the lead frame before resin encapsulation. A molding unit for encapsulation molding, a loader unit for transferring the pre-resin-sealing lead frame and the resin tablet aligned to the molding unit, an unloader unit for taking out the resin-sealed lead frame, and a mold cleaner. Unit and the transfer unit for the resin-sealed lead frame A gate unit for removing the gate of the resin-sealed lead frame, a pickup unit for individually attaching each resin-sealed lead frame with the gate removed, and each of the attached resin-sealed lead frames A lead frame accommodating unit for accommodating each separately, and a controller unit for continuously and automatically controlling each operation of each unit. On the other hand, the number of the molding units can be increased or decreased by installing another molding unit in a detachable state.

[0013]

According to the present invention, the electronic component can be used as a resin encapsulation molding apparatus having a minimum constitutional unit for resin encapsulation and at the same time, another molding unit can be removably added to the minimum constitutional unit. It can be used as a resin encapsulation molding apparatus having a plurality of structural units by a simple means of combining them. That is, the number of molding units in the molding apparatus can be arbitrarily and easily increased or decreased in accordance with the required production amount. Therefore, at the time of resin encapsulation molding of electronic parts, if necessary,
The small-scale production and the large-scale production can be easily and promptly responded to.

[0014]

Next, the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic plan view of a resin encapsulation molding apparatus for an electronic component according to the present invention, showing a combination of minimum structural units for resin encapsulation molding of an electronic component. FIG. 2 is a schematic plan view showing a state where one unit of another molding unit is added to and combined with the resin encapsulation molding apparatus corresponding to FIG. FIG. 3 is a schematic front view of the resin encapsulation molding apparatus corresponding to FIG. FIG. 4 is a schematic plan view showing a state where a plurality of units of other molding units are added to and combined with the resin encapsulation molding apparatus corresponding to FIG. 1. FIG. 5 is a schematic side view of the resin encapsulation molding apparatus corresponding to FIG. 1. FIG. 6 is an explanatory view of each step of taking out the resin-sealed lead frame after molding and storing it in the stock magazine. FIG. 7 is a schematic plan view showing a connecting portion between the resin encapsulation molding apparatus and another molding unit corresponding to FIG. 1 and an engaging means at the connecting portion between the molding units.

The resin encapsulation molding apparatus includes a lead frame supply unit 1 on which electronic parts are mounted and which is not resin-encapsulated.
A lead frame alignment unit 2 for aligning the lead frame before resin encapsulation in a predetermined direction, a resin tablet supply unit 3, a resin tablet unloading unit 4 for aligning and ejecting the resin tablets, and an electronic component for resin encapsulation molding. The molding unit 5 and the aligned lead frame and resin tablet are attached to the molding unit 5
To the loader unit 6, an unloader unit 7 for taking out the resin-sealed lead frame after molding, a mold cleaner unit 8, a transfer unit 9 for transferring the resin-sealed lead frame, and a resin sealing unit. Each of the gated unit 10 for removing the gate of the stopped lead frame, the pickup unit 11 for individually engaging the resin-sealed lead frame from which the gate has been removed, and the individual resin-sealed lead frame for engagement The magazine is provided with a lead frame accommodating unit 12 that accommodates each in a magazine, a controller unit 13 that continuously and automatically controls each operation of each unit.

In the lead frame supply unit 1 described above, a set portion 16 of an in-magazine 15 containing a large number of pre-resin-sealed lead frames 14 on which electronic components are mounted.
And an appropriate pusher mechanism for individually transferring the resin-unsealed lead frame 14 in the in-magazine 15 at the predetermined set position to the lead frame alignment unit 2 side.
And 17 are provided.

Further, the lead frame alignment unit 2 is provided with an appropriate alignment mechanism 18 for aligning the lead frames 14 before resin sealing transferred from the lead frame supply unit 1 in a predetermined direction. There is. In the illustrated example, two lead frames 14 before resin encapsulation are aligned in parallel and one of the lead frames 14 before resin encapsulation is arranged in parallel in correspondence with the configuration of the die layout in the molding unit 5. However, in the case of a die layout of a type that supplies one lead frame 14 before resin encapsulation, the lead frame before resin encapsulation is reversed. It is not necessary to perform the above inversion action to align in the orientation.

Also, the resin tablet supply unit 3
The resin tablet supply members 19 corresponding to the number of pots of the molding unit 5 are provided in the container.
The resin tablet supply member 19 is arranged as a mode corresponding to the number of pots in the molding unit 5 and the arrangement interval thereof, and is housed integrally in a required resin tablet cassette 20 in consideration of handling convenience. There is. The resin tablet supply member 19 is
In the case where the die layout in the molding unit 5 is changed, etc., it is provided so that it can be changed appropriately and appropriately in accordance with the changed number of pots and the arrangement interval. ing.

Further, as shown in FIG. 3, in order to carry out the resin tablet 21 stored in the resin tablet supply member 19 of the resin tablet supply unit 3 in an aligned state to the resin tablet carry-out unit 4 described above. An appropriate pusher mechanism 22 is provided.

Further, the molding unit 5 described above
Includes a fixed platen 25 fixed to the upper part of the apparatus main body 23 through a tie bar 24, a fixed upper mold 26 mounted on the fixed platen 25, and a fixed mold which is disposed below the fixed upper mold 26 so as to face each other. Opening / closing mechanism 27
A movable lower die 28 that is driven up and down by the above, and a plurality of (7 in the illustrated example) pots 29 arranged on the movable lower die 28 side are provided. Further, a plunger for pressurizing the resin tablet is fitted in each of the pots 29 described above, and the upper and lower molds 26.2
A heating means such as a heater is installed at 8, and a required number of resin molding cavities are provided on the mold surfaces of the upper and lower molds, and the pots 29 and the cavities are connected to each other. A resin passage is provided between them (not shown). Therefore, when the resin tablets 21 in the pots 29 are heated and pressed while the upper and lower molds 26 and 28 are clamped, the molten resin material can be injected and filled into the cavities through the resin passages. Is configured.

Further, the loader unit 6 described above includes
Two pre-resin-sealed lead frames 14 aligned by the lead frame alignment unit 2 and a plurality of aligned lead-outs (7 in the figure) by the resin tablet supply unit 3 and the resin tablet unloading unit 4 A loader 30 for simultaneously transferring the resin tablets 21 to the molding unit 5 side is provided. Also, the loader 30
Are provided so as to reciprocate between the position of the lead frame alignment unit 2 and the position of the molding unit 5. Then, at the position of the lead frame alignment unit 2, the two resin-unsealed lead frames 14 are attached via an appropriate engagement / disengagement mechanism (not shown) and are delivered by the resin tablet delivery unit 4. Each resin tablet 21 is provided so as to be attached and detached via an appropriate engagement / disengagement mechanism (not shown) (see FIG. 3). At this time, the manner in which the two resin pre-encapsulation lead frames 14 and the respective resin tablets 21 that are engaged with the loader 30 are the same as the die layout of the molding unit 5. Therefore,
In this state, the two are transferred to above the movable lower mold 28 in the molding unit 5, and at the position thereof, the engaged state of the both is released, so that the two lead frames 14 before resin encapsulation are moved to a predetermined position of the cavity. Further, each resin tablet 21 can be supplied into each pot 29, respectively. Since the loader 30 transfers the pre-resin-encapsulation lead frame 14 and the resin tablets 21 at the same time, such a structure simplifies the overall configuration of the device and reduces the overall structure. Although there is an advantage in that the molding time can be shortened, it is possible to adopt a configuration in which the transfer mechanisms for both of them are separately configured and each of the transfer mechanisms is operated individually. It doesn't matter.

The unloader unit 7 is provided with an unloader 31 for taking out the resin-sealed lead frame 14 resin-molded by the molding unit 5 to the outside of the upper and lower molds 26 and 28. ing. Also,
The unloader 31 is provided so as to reciprocate with respect to the position of the molding unit 5. Then, at the position of the molding unit 5, the two resin-sealed lead frames and the gate portion integrated between the resin-sealed lead frames are connected via an appropriate engaging / disengaging mechanism (not shown). At the same time, it is provided so that it can be taken out to the outside while being locked.

The above-mentioned cleaner unit 8 includes the upper and lower molds 26, 28 of the molding unit 5.
An air blow mechanism for blowing air to the mold surface and a vacuum mechanism (not shown) for sucking and removing dust on the mold surface are provided. Further, the cleaner unit 8 is integrated with the unloader 31 of the unloader unit 7. Therefore, the cleaner unit 8 is provided so as to reciprocate with respect to the position of the molding unit 5 at the same time as the unloader unit 7 reciprocates. The cleaner unit 8 is, for example, a lead frame in which the unloader unit 7 is resin-sealed.
It operates when 14 is engaged and retracts to the outside, and dust on the mold surface is separated and sucked by both the action of air blow and vacuum,
It is provided so as to be housed in an appropriate dust collecting portion 32. Therefore, by this, the mold surface cleaning before the next resin molding can be performed easily and efficiently. The integrated structure of the unloader unit 7 and the cleaner unit 8 described above has advantages that the overall configuration of the apparatus can be simplified and the overall molding time can be shortened. However, it is possible to adopt a configuration in which both of them are separately configured and individually operated. Further, the cleaner unit 8 may be provided with, for example, a brush member for forcibly peeling off resin burrs adhering to the mold surface and a vibrating mechanism thereof.

Further, as shown in FIGS. 6 (A), (B) and (D), the resin-sealed lead frame transfer unit 9 has the resin-sealed leads taken out by the unloader unit 7. An appropriate pallet 33 that reciprocates in order to transfer the frame 14 to the position of the degate unit 10 and the position of the lead frame accommodating unit 12 is provided.

Also, the above-mentioned degate unit
As shown in FIG. 6B, the transfer unit 9 includes
Resin-sealed lead frame transferred on pallet 33
A gate break mechanism 34 for removing the gate portion of 14 is provided. This gate break mechanism 34
For example, as shown in FIG. 1, two resin-sealed lead frames 14 which are connected and integrated via a gate portion 35 are attached via an appropriate engaging / disengaging mechanism (not shown). In addition, in this state, the gate portion 35 between the lead frames is pressed so that it can be cut and removed.

Further, as shown in FIGS. 6 (C) and 6 (D), the two pickup units 11 transferred from the degate unit 10 via the pallet 33 of the transfer unit 9 are transferred to the pickup unit 11. An engagement / disengagement mechanism 36 is provided for attaching / separating the resin-sealed lead frames 14 separately. This engagement / disengagement mechanism
As shown in FIG. 6C, 36 is provided so that the two resin-sealed lead frames 14 transferred by the pallet 33 of the transfer unit 9 can be separately attached to each other. There is.

In addition, two resin-sealed lead frames 14 are separately attached to the lead frame accommodating unit 12 via the engagement / disengagement mechanism 36 of the pickup unit 11.
There is provided a stock magazine 37 capable of separately storing the items. Engagement mechanism for the pickup unit 11
Two resin-sealed lead frames that are separately attached to 36
As shown in FIG. 6 (D), 14 is the engaging / disengaging mechanism 36 after the pallet 33 of the transfer unit 9 is retracted to its original position.
It is provided so that it can be separately housed in a predetermined stock magazine 37 installed at the lower position by releasing the engagement by the above.

In addition, the above-mentioned controller unit 13
Is for continuously and automatically controlling each operation of each unit, and the resin unit molding of the electronic component by the controller unit 13 is performed as follows, for example.

That is, the two resin-unsealed lead frames 14 in the in-magazine 15 of the lead frame supply unit 1 are individually transferred to the lead frame alignment unit 2 side by the pusher mechanism 17. Next, the two lead frames 14 before resin sealing are aligned in a predetermined direction by the alignment mechanism 18 in the lead frame alignment unit 2. Seven resin tablets are provided in the resin tablet supply unit 3 and the resin tablet unloading unit 4 following or in parallel with the steps of transferring and aligning the above-described two lead frames 14 before resin sealing. 21 is aligned and carried out. Next, the two unsealed lead frames 14 in the lead frame alignment unit 2 and the seven resin tablets 21 in the resin tablet supply unit 3 are transferred to the molding unit 5 via the loader 30 in the loader unit 6. And the upper and lower molds 26 and 28 of the movable lower mold 28 are moved to the predetermined position of the cavity of the movable lower mold 28, and the lead frame 14 before resin sealing is released. Each resin tablet 21 is supplied into each pot 29. Next, the mold opening / closing mechanism
The upper and lower molds 26 and 28 are clamped by 27, and each pot is
Resin tablet 21 in 29 is heated and pressurized to melt,
The molten resin material is injected and filled into the cavities through the resin passages, and the electronic components fitted in the cavities are resin-sealed. Next, the resin-molded resin-sealed lead frame 14 is taken out from the upper and lower molds 26 and 28 of the molding unit 5 to the outside via the unloader 31 of the unloader unit 7.
When the unloader 31 moves backward, the air blow mechanism and the vacuum mechanism of the cleaner unit 8 remove and remove the dust on the mold surfaces while air blowing and vacuuming the mold surfaces of the upper and lower molds 26, 28. Due to
Clean the mold surface. Next, the transfer unit 9
Unloader unit 7 via pallet 33 in
The resin-sealed lead frame 14 taken out at is transferred to the position of the degate unit 10. Next, the gate portion 35 of the resin-sealed lead frame 14 is cut and removed via the gate breaking mechanism 34 of the digating unit 10. Next, the two resin-sealed lead frames 14 separated by the gate removal are transferred to the position of the lead frame accommodating unit 12 via the pallet 33 in the transfer unit 9. Next, the two separated resin-sealed lead frames 14 are separately attached via the engagement / disengagement mechanism 36 of the pickup unit 11. Next, the pallet 33 of the transfer unit 9 is retracted and the engagement / disengagement mechanism 36 of the pickup unit 11 is released to accommodate the above-mentioned two resin-sealed lead frames 14 in each stock magazine 37. To do.

As described above, the resin encapsulation molding apparatus for electronic components shown in FIG. 1 is composed of a combination of the minimum structural units for resin encapsulation molding of electronic components. Further, a series of resin sealing molding steps using the molding apparatus are continuously and automatically performed by the controller unit 13.

2 and 3 show another molding unit having the same function as that of the molding unit 5 in the resin encapsulation molding apparatus for electronic parts, which is composed of the combination of the minimum structural units shown in FIG. FIG. 4 shows a configuration in which units are added and combined, and FIG. 4 shows a configuration in which a plurality of units of other molding units are added and combined.

The other additional molding unit is the same as the above-mentioned molding unit 5, and is a molding in the resin encapsulation molding apparatus for electronic parts, which is composed of a combination of the minimum structural units shown in FIG. The unit 5 is configured to be detachably attached to the side portions of the unit 5. Therefore, FIG.
The resin encapsulation molding apparatus for electronic parts, which is composed of the combination of the minimum constitutional units shown in FIG. 1, substantially enlarges the mold by adding other molding units to the side of the molding unit 5 in sequence, thereby increasing the amount of molding. A resin encapsulation molding apparatus adapted for production can be configured. vice versa,
By sequentially removing other added molding units (or stopping the operation of the added other molding units), the resin mold molding device can be made substantially smaller in size to support small-volume production. Can be configured. That is, according to the required production volume,
Since the number of molding units 5 in the molding apparatus can be arbitrarily and easily increased / decreased, it is possible to easily and promptly respond to small-volume production and large-volume production, respectively, when resin-molding an electronic component with resin. Is configured.

In addition, in the resin encapsulation molding apparatus having a constitution in which the molding unit 5 is added and combined, most of the respective parts in the resin encapsulation molding apparatus for electronic parts, which is constituted by the combination of the minimum constituent units shown in FIG. It can also be used as a constituent member. That is, the controller unit 13
By changing each control condition in accordance with the number of molding units 5 to be increased or decreased, the lead frame supply unit before resin sealing 1, the lead frame alignment unit 2, the resin tablet supply unit 3, and the resin tablet unloading The unit 4, the loader unit 6, the unloader unit 7, the cleaner unit 8, the transfer unit 9, the degutting unit 10, the pickup unit 11, the lead frame housing unit 12, the controller unit 13, and the like are substantially included. Can be used for both.

Further, between the molding unit 5 in the resin encapsulation molding apparatus for electronic parts, which is composed of a combination of the minimum constitutional units shown in FIG. 1, and another molding unit 5 connected or detached thereto, Engaging means 38 for easily and surely connecting and positioning the both
Are provided respectively. The engagement means 38 is, for example, as shown in FIG.
Further, as shown in FIG. 7, it may be constituted by an uneven fitting portion or the like formed on the bottom base 39 of the molding unit 5.

When simultaneously molding products of the same kind using the resin encapsulation molding apparatus shown in FIGS. 2 to 4, it is basically the same as when the resin encapsulation molding apparatus shown in FIG. 1 is used. They are the same, except that the following steps are added in addition to the steps.

That is, in addition to the above-described steps of combining the minimum constituent units for resin-molding the electronic component, the steps of molding the same type of product in another increased molding unit 5 may be added. Therefore, by using the loader unit 6 described above, the lead frame 14 before resin encapsulation in the lead frame alignment unit 2 and the resin tablet 21 in the resin tablet supply unit 3 are transferred to another increased molding unit 5, and
Using the step of supplying and setting these to the predetermined position, the step of resin-molding the electronic component by the other molding unit 5, and the unloader unit 7 described above,
The step of taking out the resin-sealed lead frame 14, the step of cleaning the mold surface using the cleaner unit 8 described above, and the step of cleaning the resin-sealed lead frame 14 using the transfer unit 9 described above. Unit
The step of transferring to the position of 10, the step of cutting and removing the gate portion 35 of the resin-sealed lead frame 14 using the degate unit 10, and the step of removing the gate after using the transfer unit 9 described above. A step of transferring the resin-sealed lead frame 14 to the lead frame housing unit 12 position,
Using the pickup unit 11 described above, the resin-sealed lead frame 14 at the position of the lead frame housing unit 12 is used.
And the resin-sealed lead frame 14 attached to the pickup unit 11 is attached to the stock magazine 37.
Each process of accommodating inside may be added.

Further, in this case, as described above, most of the constituent members in the resin encapsulation molding apparatus for electronic parts, which is composed of the combination of the minimum constituent units shown in FIG. 1, are also used. The start timing of the resin encapsulation molding process of the electronic component in each molding unit 5 may be set at a predetermined time interval.

In addition, as shown in FIGS. 2 to 4, in the resin encapsulation molding apparatus in which other molding units 5 are additionally combined, when the die layouts of the respective molding units 5 are different, for example, When molding different products in the molding unit 5, the following may be done. That is, even in such a case, most of the constituent units in the resin encapsulation molding apparatus for electronic components, which is composed of the combination of the minimum constituent units shown in FIG. 1, can also be used. Also,
In this case, the lead frame supply unit 1 before resin encapsulation is provided with the number of in-magazines 15 corresponding to the number of different die layouts, and the lead frame accommodation unit
Stock magazine corresponding to the number of the in magazine 15 to 12
37 should be installed.

Further, when the number of pots 29 and the number and shape of lead frames 14 in each molding unit 5 are different from each other, the number of in-magazines 15 and stock magazines 37 corresponding to the number of different die layouts are set. In addition to the above, each of the above-mentioned constituent units may be provided with respective functions that can be changed and adjusted correspondingly. For example, the resin tablet supply unit 3, the resin tablet unloading unit 4, the loader unit 6, the unloader unit 7, the degate unit 10, the pickup unit 11, the number of pots 29, and the number of lead frames 14. It suffices to provide a function capable of changing and adjusting in response to changes in shape and the like. Further, in this case, each molding unit 5 may be configured by arranging a dedicated loader unit, a dedicated unloader unit, a dedicated degate unit, a dedicated pickup unit, etc., respectively.

The present invention is not limited to the above-mentioned embodiments, but may be arbitrarily and appropriately modified / selected as necessary within the scope of the gist of the present invention. Is.

[0041]

According to the present invention, another molding unit is appropriately added to the resin encapsulation molding apparatus for electronic parts, which is composed of a combination of the minimum structural units for resin encapsulation molding of electronic parts. Therefore, the resin encapsulation molding apparatus adapted for mass production can be easily configured without increasing the size of the mold itself. In addition, since the other added molding units can be appropriately removed and configured, a resin encapsulation molding apparatus adapted for small-volume production can be easily configured without downsizing the mold itself. . That is, the number of molding units in the molding apparatus can be arbitrarily and easily increased or decreased in accordance with the required production amount. Therefore, in the resin encapsulation molding of the electronic component, there is an excellent practical effect that the small-scale production and the large-scale production can be easily and promptly responded to as needed.

Further, according to the present invention, the resin encapsulation molding apparatus adapted for mass production can be simply constructed without enlarging the die itself, and therefore, the resin encapsulation molding of electronic parts is performed. It is possible to highly efficiently produce a product having high quality and high reliability in which voids and defects are not formed inside and outside the body. Therefore, it is possible to provide the resin encapsulation molding method for an electronic component and the molding apparatus for the same, which can surely eliminate the above-mentioned conventional adverse effects, which is an excellent practical effect.

[Brief description of drawings]

FIG. 1 is a schematic plan view of a resin encapsulation molding apparatus for an electronic component according to the present invention, showing a combination of minimum structural units.

FIG. 2 is a schematic plan view showing a state where one unit of another molding unit is added to and combined with the resin encapsulation molding apparatus corresponding to FIG.

3 is a schematic front view of the resin encapsulation molding apparatus corresponding to FIG.

FIG. 4 is a schematic plan view showing a state in which a plurality of units of another molding unit are added to and combined with the resin encapsulation molding apparatus corresponding to FIG.

5 is a schematic side view of the resin encapsulation molding apparatus corresponding to FIG.

FIG. 6 is an explanatory diagram of each process until the resin-sealed lead frame taken out from the molding unit is housed in the stock magazine.

7 is a schematic plan view showing a connecting portion between the resin encapsulation molding apparatus and another molding unit corresponding to FIG. 1, and a connecting portion between each molding unit.

[Explanation of symbols]

 1 Lead frame supply unit before resin sealing 2 Lead frame alignment unit 3 Resin tablet supply unit 4 Resin tablet unloading unit 5 Molding unit 6 Loader unit 7 Unloader unit 8 Cleaner unit 9 Resin sealed lead frame transfer unit 10 Deguting Unit 11 Pickup unit 12 Lead frame housing unit 13 Controller unit 14 Lead frame before resin encapsulation 15 In-magazine 16 Set section 17 Pusher mechanism 18 Alignment mechanism 19 Resin tablet supply member 20 Resin tablet cassette 21 Resin tablet 22 Pusher mechanism 23 Machine body 24 Tie bar 25 Fixed plate 26 Fixed upper mold 27 Mold opening / closing mechanism 28 Movable lower mold 29 Pot 30 Loader 31 Unloader 32 Dust collector 33 Pallet 34 Gate break mechanism 35 Gate Part 36 Engagement mechanism 37 Stock magazine 38 Engaging means 39 Bottom base

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Claims (4)

[Claims] 1. A resin encapsulation molding method for an electronic component, wherein an electronic component mounted on a lead frame is encapsulated with a resin material by using the molding unit, wherein another molding unit is provided for the molding unit. An electronic device characterized by performing a process of arbitrarily increasing or decreasing the number of the molding units by mounting the resin unit in a detachable state and a resin sealing molding process of the electronic component using the molding unit described above. Resin encapsulation molding method for parts. 2. A step of supplying and setting a large number of lead frames before resin encapsulation on which electronic parts are mounted at a predetermined position in a lead frame supply unit, and a required number of lead frames before resin encapsulation in the lead frame supply unit. To a lead frame alignment unit side, a step of aligning the lead frame before resin sealing transferred to the lead frame alignment unit in a predetermined direction, and a step of supplying and aligning a required number of resin tablets. , The lead frame before resin sealing in the lead frame alignment unit, and the aligned resin tablet,
A step of transferring the lead frame before resin encapsulation to a predetermined position of the cavity portion and transferring the resin tablet into the pot while transferring between the fixed die and the movable die in the molding unit, and the fixed die and the movable die. Both parts of the mold are clamped, and the resin tablet in the pot is heated and pressed to be melted, and the molten resin material is injected and filled into the cavity through the resin passage, and the electronic component fitted in the cavity. And a step of taking out the resin-sealed lead frame that has undergone the resin sealing molding step from both the fixed mold and the movable mold to the outside, and a mold in the fixed mold and the movable mold. The step of cleaning the surface, the step of transferring the resin-sealed lead frame to the position of the degutting unit, In the mounting unit, the step of removing the gate portion of the resin-sealed lead frame, the step of transferring the resin-sealed lead frame that has undergone the gate removal step to the position of the lead frame housing unit, and the lead frame A step of separately attaching the resin-sealed lead frames that have undergone the gate removal step at the position of the storage unit, a step of separately storing the resin-sealed lead frames that have been separately attached, A step of arbitrarily increasing or decreasing the number of the molding units by installing another molding unit in a detachable state with respect to the molding unit; A resin encapsulation molding method for an electronic component, comprising performing each step. 3. A resin encapsulation molding apparatus for an electronic component, which encapsulates an electronic component mounted on a lead frame with a resin material using the molding unit, wherein another molding unit is attached to the molding unit. A resin encapsulation molding apparatus for electronic parts, characterized in that the number of the molding units can be increased or decreased by being installed in a detachable state. 4. A supply unit for a large number of lead frames before resin encapsulation on which electronic components are mounted, a lead frame alignment unit for aligning the lead frames before resin encapsulation in a predetermined direction, and a supply unit for resin tablets. A resin tablet unloading unit that aligns and carries out the resin tablet, a molding unit that resin-molds the electronic component on the lead frame before resin sealing, and the lead frame before resin sealing and the resin that are aligned A loader unit for transferring the tablet to the molding unit, an unloader unit for taking out the resin-sealed lead frame, a mold cleaner unit, and a transfer unit for the resin-sealed lead frame,
A gate unit for removing the gate of the resin-sealed lead frame, a pickup unit for individually attaching each resin-sealed lead frame from which the gate is removed, and each of the attached resin-sealed leads A resin encapsulation molding apparatus for an electronic component, comprising: a lead frame accommodating unit accommodating a frame separately; and a controller unit that continuously and automatically controls each operation of each unit, which is the molding unit described above. On the other hand, a resin encapsulation molding apparatus for electronic parts, characterized in that another molding unit is detachably mounted so that the number of the molding units can be increased or decreased.