JPS5187667U - - Google Patents
Info
- Publication number
- JPS5187667U JPS5187667U JP548275U JP548275U JPS5187667U JP S5187667 U JPS5187667 U JP S5187667U JP 548275 U JP548275 U JP 548275U JP 548275 U JP548275 U JP 548275U JP S5187667 U JPS5187667 U JP S5187667U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP548275U JPS5187667U (en) | 1975-01-10 | 1975-01-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP548275U JPS5187667U (en) | 1975-01-10 | 1975-01-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5187667U true JPS5187667U (en) | 1976-07-14 |
Family
ID=28068415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP548275U Pending JPS5187667U (en) | 1975-01-10 | 1975-01-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5187667U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0732414A (en) | 1993-07-22 | 1995-02-03 | Towa Kk | Method and equipment for resin seal molding electronic component part |
-
1975
- 1975-01-10 JP JP548275U patent/JPS5187667U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0732414A (en) | 1993-07-22 | 1995-02-03 | Towa Kk | Method and equipment for resin seal molding electronic component part |