JPS61210641A - Manufacture apparatus for semiconductor part - Google Patents

Abstract

PURPOSE:To facilitate the trimming work of molded resin and to make it possible to automate molding, by constituting an apparatus by a trimming means, which trims remaining resin yielded in molding, and a means, which inverts molded leadframes and feeds them to the trimming means. CONSTITUTION:Leadframes, on which semiconductor devices are mounted, are supplied from a first container part 11. After the molding in a molding means 12, two leadframes, which are formed into a unitary body formed by molding resin, are held by a feeding means 17. When the feeding means 17 is inverted by 180 deg., the leadframes are turned over and fed to a trimming means 14. The remaining resin yielded in molding is trimmed. Then, the leadframes are enclosed in a second container part 15 under the turned-over state. Thus the molding process of the leadframe, on which the semiconductor devices are mounted, can be automated, and the trimming work is made easy.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor component manufacturing apparatus that automates the molding process of a lead frame on which a semiconductor device is mounted.

[Conventional technology]

For example, in tuner devices and the like, a plurality of variable capacitance diodes having the same characteristics are used. For this reason, conventionally, a semiconductor chip comprising a variable capacitance diode was mounted on a lead frame, and after molding, the characteristics were measured and variable capacitance diodes with the same characteristics were sorted.

The conventional molding process was performed as follows. First, a plurality of lead frames with semiconductor chips mounted thereon are manually placed on a predetermined table and inserted into a mold press device. Next, a resin tablet for molding is manually placed into a mold press and then molded. After molding, resin residues such as culls, runners, gates, etc. are removed by hand, and the molded lead frame is placed in a predetermined storage section. During the removal work of this resin residue (so-called trimming work), the lead frame often warps and deforms.

[Problem that the invention seeks to solve]

In the molding process for such lead frames,
Automation is desired. In addition, at that time, it is desired that the trimming work of the mold resin be performed well, and that the lead frame after molding be taken out in an arrangement that takes into account work in subsequent steps.

In view of the above-mentioned points, the present invention provides a semiconductor component manufacturing apparatus that enables automation of molding of a lead frame in which a semiconductor chip is molded.

[Means for solving problems]

The present invention includes a molding means (12) for molding a lead frame (3) on which a semiconductor device w(2) is mounted;
A trimming means (14) for trimming the resin residue generated by the molding, and a molded lead frame (
3) and a means (17) for turning it over and supplying it to the trimming means (14).

Two lead frames (3) are placed in parallel in the molding means (12). Further, the supply means (17) includes two lead frames (
3), and is formed so as to be able to be reversed (turned inside out) by 180 degrees around the shaft (48).

A first storage section (11) for storing a lead frame (3) on which a semiconductor device (2) is mounted is disposed upstream of the molding means (12). In addition, a trimming means (14
) A second storage section (15) is arranged after the trimmed lead frame.

[Effect]

A lead frame (3) on which a semiconductor device (2) is mounted is supplied from a first storage part (11), and molding means (12) with two lead frames (3) arranged in parallel.
sent to. After molding, the two lead frames (3) integrated with mold resin are held on the supply means (17). By inverting the supply means (17) by 180 degrees, the lead frame (3) is turned over, and in this state is supplied to the trimming means, where the resin residue produced by the molding is trimmed. This turning over facilitates the trimming operation. Thereafter, the lead frame is stored upside down in the second storage section (15).

〔Example〕

Embodiments of the semiconductor component manufacturing apparatus according to the present invention will be described below with reference to the drawings.

First, a molded lead frame will be explained using FIGS. 2 to 4. In the present invention, FIGS.
As shown in the figure, a large number of semiconductor elements such as variable capacitance diode chips (1) are formed on one semiconductor slice (1).
2) are mounted on the lead frame (3) in the order of the dotted arrows, that is, in the order of the closest C-■ curve characteristics. In this example, the number [
1] to number [50] (2) to the 11th J-
Chips (2) numbered from [51] to number (100) are mounted on the second lead frame (3b), and the chips (2) numbered from [51] to (100) are mounted on the second lead frame (3b).
) are mounted on the third, fourth, etc. lead frames (3). Adjacent chips have similar characteristics when viewed from one semiconductor slice+11. Therefore, if chips (2) are mounted on a lead frame (3) in the illustrated arrangement order, chips (2) with similar characteristics are mounted in order within the lead frame (3). Lead frame (3)
A relatively wide connecting portion (5) which also serves as reinforcement is provided for every five lead portions. (6) is a small hole. Then, as shown in Fig. 4, 40 lead frames (31 ((3a), (3b)) were mounted with chips in sequence.
...) are stored in the first magazine (4a) in order from the lower stage to the upper stage. In this example, semiconductor slice (1)
are stored in 18 magazines (4a) to (4r). These 18 magazines (4a) to (4r) are housed in a case and transported to each process.

FIG. 1 is a block diagram showing the entire manufacturing apparatus of the present invention in a molding process. In the same figure, (11)
For example, a semiconductor chip that constitutes a variable capacitance diode (
This is the first storage section that stores the lead frame (3) on which the lead frame (2) is mounted, that is, the magazine (4) of 1B (11i1) (see Fig. 4) that stores this lead frame (3). a mold press device (14) equipped with a mold die (13) for molding a lead frame (3);
) is a trimming mold for trimming the resin residue at the cull, runner, and gate of the molded lead frame (3), and (15) is the trimming mold for trimming the resin residue at the cull, runner, and gate of the molded lead frame (3).
) is stored in the magazine (4') again in an orderly manner. Further, (16) is a working arm used for feeding the lead frame (3) from the first storage part (11) to the molding die (13), and (17) is a working arm used to feed the lead frame (3) after molding. Trimming mold (14)
This is a workstation used for supplying equipment, etc.

In the first storage section (11), the lead frame (3
) containing 18 magazines (41 ((4a) to (4
r)) in the case (not shown) and the storage part (1
1) is stored in the upper stage, and after the lead frames (3) are sequentially sent out from the magazine (4), the empty magazine (4) is moved to the lower stage of the storage section (11). For example, as shown in FIG. 5, 18 magazines (4) stored in the upper part of the storage section (11) are pushed to the right in the figure by the push piece (18), and the magazines (4a) are moved to the cradle (] 9). ) on top. Next, the cylinder (20) moves the pedestal (19) to a predetermined position (solid line position), that is, the magazine (4
Lead frame (3) placed at the most -]/stage in )
When the magazine (4a) is lowered to the position corresponding to the guide part (21) (see Figure 1), the magazine (4a) is moved to the lowering table (22).
) on top. After that, the pedestal (19) escapes backward. Next, the descending platform (22) descends step by step and the lead frame (
3) are sent out one by one to the guide section (21). Then, when all the lead frames (3) in the magazine (4a) are fed out, the magazine (4a) is moved to the storage section (11).
When the cradle (19) returns to its original position aligned with the cradle (19), the empty magazine (4a) is moved to the lower tier of the storage section (11) by a member (23) that interlocks with the cradle (19). sent deep inside.

Guide part (21) arranged outside the first storage part (11)
A roller (24) is disposed in the lead frame (24), and the lead frame (3) on the guide part (21) is sent to the first separator (25) close to the guide part (21). This first separator (25) has two grooves (26a) into which two lead frames (3) can fit in parallel.
) (26b) and 180 centering on the axis (27)
° Constructed for rotation. That is, as shown in FIGS. 9A and 9B, in the original state, one groove (26a) faces the guide part (21), and when rotated 180 degrees, the other groove (26b) faces the guide part (21). made to face each other. In this first separator (25), when the lead frame (3) is sent from the guide part (21) and placed in a predetermined position, it forms a groove part (26a).

A pin (not shown) protrudes from (26b) and is inserted into the small hole (6) of the lead frame (3) to position the lead frame (3). (2B) is a notch into which the claw portion (30) of the working arm (16) can fit.

As shown in the enlarged view of FIG. 6, the working arm (16) has a pair of claws (30) at its tip that grips the lead frame (3) from both sides, and this tip is connected to the first separator. (25) and the workstation (17), in a direction perpendicular thereto (direction in and out of the mold (13)), and in the top direction. This tip has a resin tablet for molding) (
Five tablet compartments (31) are provided for storing tablets (32). This tablet storage part (31) is closed at the bottom when the resin tablet I (32) is inserted, and the resin tablet (32) is held in the tablet storage part.
The tip of the working arm <16) is attached to the mold die (1
3) The resin tablet (32) is configured to be opened when the resin tablet (32) is inserted into a predetermined portion of the mold (13). Furthermore, check whether the lead frame is correctly held at the tip of the working arm (16).
Vacuum suction means (33) ((3
3a) (33b)) and light detection means (34)
((34a) (34b)) A detecting section (35) is provided, which is equipped with a vacuum suction means (33) and a light detecting means (34) corresponding to each lead frame. Two or more suction means (two sets in this example) are provided for each.As shown in FIG.
3a) (33b) are lead frames (3) respectively.
The light detecting means (34a) (34b) has a light emitting element and a light receiving element, and a reference line (35) passing through the center of the connecting part (5). They are arranged in a positional relationship in which they are displaced from each other on opposite sides. Therefore, in FIG. 8, when the lead frame (3) is held by the working arm (16) with a displacement in the longitudinal direction (horizontal direction), the light from either one of the light detection means (34a) or (34b) will not be reflected by the connecting part (5), and the displacement will be detected. In this example, it is determined that there is no lead frame if the positional deviation is 0.3 cm or more. Furthermore, even if the lead frame (3) is placed in the correct position, the vacuum suction means (33a) and (
If a vacuum leak occurs during suction at step 33h), this is because the lead frame (3) is bent or deformed, and is determined to be defective.

Mold die (1) in mold press device (12)
3) consists of a lower mold (13^) and an upper mold (13B), and the upper mold (13B) descends to form a lead frame (3).
) is configured to be molded. This mold press device (12) is movably provided with a mold cleaning means (41) equipped with a brush (40), so that after molding, the mold press device (12) enters into the mold mold (13) and cleans it. done to.

A tablet detection means (39) is arranged in front of this mold press device (12).

On the other hand, a tablet supply section (42) is disposed between the tablet supply section (42) and the working arm (16) for supplying resin tablets (32) to the tablet storage section (31) of the working arm (16). A tablet loader (43) is provided. This tablet loader (4
3) is a plurality of resin tablets (in this example, five resin tablets) (32
) is provided with a pair of claws M (44) that simultaneously hold the shaft (4
5), the tablet supply unit (42) and the working arm (16) are rotatably mounted between predetermined movement positions. In the tablet supply section (42), resin tablets (3
2) are housed in a magazine (46) in such a way that they are stacked in multiple rows of 5, and a plurality of these magazines (46) are arranged so that they can be moved intermittently one magazine at a time in the direction of the arrow A. . When all the resin tablets (32) in one magazine (46) have been supplied, the next magazine (46) is moved to a position corresponding to the tablet loader (43). In the magazine (46), 5 (11i+ resin tablets) (32) protrude from the upper end, and after the tablet loader (43) takes out the five resin tablets (32) at the upper end, the magazine (46)
It is constructed so that the following five resin tablets (32) protrude from the inside.

The workstation (17) has two pairs of claws (47) on the top surface that hold the two lead frames (3), respectively.
) and can be rotated 180° (flipped) around axis (48)
Possibly arranged. At the same time, this workstation (1
7) allows reciprocating movement between the trimming molds (14) from the fixed position and reciprocating movement between the trimming molds (14) and the second separator (50) from the fixed position, and allows vertical movement. configured.

The trimming mold (14) is configured such that residual resin such as culls, runners, gates, etc. on the lead frame (3) after molding is removed by lowering the upper mold.

The second separator (50) is the first separator (25)
Similarly, it has two grooves (51a) (51b) on which two lead frames (3) are placed, and a shaft (52).
) so that it can rotate 180°. (53) is a lead frame feeding means, which is formed to be able to reciprocate and move up and down along the guide keyaki (55) by means of a feed screw (54), and a bottle (56) is attached to the edge of the lead frame (3). One lead frame (3) is moved to the guide part (57) of the second storage part (15) by descending, touching the edge thereof, and moving.

The second storage section (15) is configured similarly to the first storage section (11). In this case, an empty magazine (4') is stored in the upper stage of the storage part (15), and a magazine (4') containing the lead frame (3) is stored in the lower stage. That is, the upper empty magazine (4') is lowered one step at a time in the cylinder (20), and the guide section (57) is moved down one by one from the bottom.
) is stored, and when a predetermined number (40 in this example) of lead frames (3) have been fully stored, the storage section (15
) will be stored at the bottom of the file.

Next, the operation of such a device will be explained. In addition, in FIG. 1, the FL arrow indicates the flow of the lead frame (3),
Also, the arrows in each part indicate the movement of each unit.

In the first storage part (11), a lead frame (3) with a chip (2) mounted thereon is stored in each magazine (4),
This magazine (4) is housed in the state shown in FIG.

The first magazine (4a) is a cylinder (20).
As the magazine (4a) is intermittently lowered step by step, the lead frames (3) in the magazine (4a) are sent to the guide portion (21) in order from the bottom. That is, first from number [1] to [
As shown in FIG. 9A, the first lead frame (3a) on which the chip (2) of
) of the first separator (25).
7). Next, as shown in Fig. 9B, the first separator (25) is rotated 180 degrees to form the second groove part (28).
Then, the second lead frame (3b) on which chips numbered from [51] to (100) are mounted is sent.

Lead frame (3a) in groove (27) (28)
(3b) is fed, the positioning pins of the separator (25) are inserted into the small holes (6) of the lead frames (3a) and (3b).
The lead frames (3a) and (3b) are positioned.

As shown in Fig. 10, the working arm (16) first moves from its home position (symbol ■) to below the tablet loader (43) which is in a predetermined position (symbol ■) and loads five resin tablets (symbol ■). 32) in its tablet storage compartment (31)
Uke is received within. Next, this working arm (16) moves to the first separator (25) (symbol ■) and clamps the two lead frames (3a) (3b) with the claws (30). With the two lead frames (3a) and (3b) sandwiched between the working arm (16), the photodetection means (34a) (34b) and the vacuum suction means (3
Lead frame (3a) (33b)
a) The presence or absence of (3b) and whether it is in the correct state is detected. And if the condition is correct, the working arm (1
6) moves to the position marked with symbol ■.

Here, the tablet detection means (39) detects the resin tablet in the tablet storage section (31) at the tip of the arm.
- The presence or absence of (32) is confirmed. Resin tablet (32
), if the presence of the working arm (16) is confirmed.
moves and carries the lead frames (3a) and (3b) into the mold (13) of the mold press device (■2) (symbol ■). The first separator (25) is connected to the two lead frames (3a) by the working arm (16).
After (3b) is carried, it turns 180 degrees again and returns to its original state. The working arm (16) is the mold (13)
After lowering the resin tablet (32) and lead frames (3a) (3b) into the predetermined positions, they are lifted out of the mold (13) and returned to the predetermined positions to begin the molding process. Middle period slip (symbol ■). If there is any remaining resin tableno l-(32), an error signal will be generated. In the mold press device (12), the upper mold (13B) descends and molds each chip (2) of the two lead frames (3a) (3b). During this molding period, the next two lead frames (3) are sent from the magazine (4a) of the first storage section (11) to the first separator (25), and there is a waiting period.

Further, the tablet loader (43) also has a tablet supply section (43).
2) Take the resin tablet (32) from the receiver and wait in a predetermined position. Next, after the molding is completed, the working arm (16) enters the molding die (13) (symbol ■), and the molded and integrated lead frame (3a)
Hold (3b) and return to the position (■). If any product cull remains here, an error signal is generated. The working arm (16) then moves to the working station (17) and places the lead frames (3a) (3b) on the work station (17) (symbol ■). During this time, the cleaning means (41) is driven to clean the inside of the mold (13). The working arm (16) is marked ■■■
When the tablet reaches the position, it is detected by the tablet detection means (39).

FIG. 14 shows two lead frames (3a) and (3b) in a molded state, where (60) is a semiconductor element part and (61) is a resin part. Working arm (16)
is the lead frame (3a) on the workstation (17).
) (3b) '4;: After placing the resin tablet (32), the resin tablet (32) is received from the tablet loader (43) located near the work stage insert (17) (sign [
phase]), move as it is to the first separator (25),
Thereafter, similar operations ① to [phase] are repeated. In addition, if the working arm (16) makes a mistake in holding the lead frames (3a) (3b) (no lead frame or misalignment) at the position marked with symbol ■, the working arm (16)
6) stops on the spot and issues an alarm (error) signal.

At the workstation (17), the molded lead frames (3a) (3b) are cooled for a certain period of time. Thereafter, as shown in FIG. 11, the workstation (17) is attached to the lead frame (3a
) While holding (3b), center around the shaft (48).
Flip 180° and attach the lead frame (3a) (3b)
is turned inside out. The reason for inverting is to facilitate trimming after molding, to print on the back side of the mold, and to allow leads led out to the front side to be bent to the front side of the mold.

Next, the workstation (17) starts the trimming mold (1).
4) Move to code ■), lead frame (3a) (3
Place b) on the trimming mold (14) and return to the original position (symbol ■). Then, the trimming mold (14) is operated, that is, the upper mold is lowered to remove resin residues such as culls, runners, gates, etc.

Figure 15 shows the lead frame (3a) (3) after trimming.
b). After trimming, place the workstation (
17) moves and takes out the lead frame (3a) (3b) from the trimming mold (14) (code ■), then moves to the second separator (50) (code ■),
Two lead frames (3a) (3b) are placed on this second separator (50). Thereafter, the workstation (17) returns to its original position (symbol ■), and at that position is turned over by 180 degrees so that the claw part (47) is on the front side, and enters the next period state.

The second separator (50) from the trimming mold (14)
When the lead frame (3a) (3h) is sent to
Immediately, the second separator (50) rotates 180° (FIG. 12A-B), and the lead frame (3a) first passes through the guide part (57) via the lead frame feeding means (53) and is moved to the second storage. The top of the magazine (4') in section (15)
The second separator (50) is stored in the upper stage, and then the second separator (50)
The lead frame (3b) is rotated 0 degrees and the guide part (57
) and is stored in the magazine (4'). At this time, the magazine (4') of the second storage section (15) is inserted into the cylinder (
20), the lead frame (
3b) is stored in the upper stage of the lead frame (3a).

This process is repeated and the molded lead frames (3a) (3b) are sequentially stored in the magazine (4').

In this device, first the 18
(When the case containing the fixed magazines (4a) to (4r) is arranged, that is, when the case is held in the hand as shown in Fig. 13, for example, the magazine (4a) is on the right side and the magazine (4r) is on the left side. is located, and inside the magazine (4a), the lead frame (3) has number [1] on the front and number [50] on the back.
If you set it in such an arrangement, the second storage part (
15), they can be taken out in the same arrangement as the first storage part (11) as shown in the figure. Therefore, the 18 magazines (4) containing the lead frames (3) are taken out from the second storage part (15) together with the case (58) in a flat arrangement in the first storage part (11). It can be transported to the next process. Also, Figures 2 and 3
As shown in the figure, the lead frame (
3), since chips with the same characteristics are arranged in order on the lead frame, a plurality of semiconductor elements with the same characteristics can be easily obtained without the need for special sorting work. Furthermore, since the lead frame (3) is stored upside down in the second storage section (15), subsequent operations such as printing on the back side are facilitated.

Although the present invention is applied to a lead frame on which a variable capacitance diode is mounted on the upper side, it can also be applied to a mold for a lead frame on which other semiconductor elements are mounted.

〔Effect of the invention〕

According to the present invention, the molding process for the lead frame (3) on which the semiconductor device 1Iv (21 is mounted) is automated. In particular, when supplying the molded lead frame (3) to the trimming means (14), (17)
is reversed and the lead frame (3) is supplied upside down to the trimming means (14), thereby facilitating subsequent trimming work. Furthermore, since the lead frame (3) is stored upside down in the second storage section (15), subsequent processes, such as printing on the back side of the element, can be performed smoothly.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram showing an example of a semiconductor component manufacturing apparatus according to the present invention, and FIG. 2 is a plan view showing an example of semiconductor slicing.
Fig. 3 is a plan view showing an example of a lead frame on which a semiconductor chip is mounted, Fig. 4 is a perspective view showing a magazine storing the lead frame, and Fig. 5 shows an example of the first storage part, including the main parts. Fig. 6 is a perspective view of the main part of the working arm, Fig. 7 is a side view of the main part of the lead frame detection section of the working arm, and Fig. 8 is a cross-sectional view of the main part of the lead frame of the working arm. Fig. 9 is a plan view showing the operating state of the first separator, Fig. 10 is a plan view showing the operating state of the working arm, and Fig. 11 is a plan view showing the operating state of the work stage. Fig. 12A-C is a plan view showing the operating state of the second separator, and Fig. 13 shows the arrangement state of the magazines in the first and second storage sections. FIG. 14 is a perspective view showing the lead frame immediately after molding, and FIG. 15 is a perspective view showing the lead frame after trimming. (2) is a semiconductor chip, (3) a beam frame, (4
) is the magazine, (11) is the first storage section, (13) is the mold die, (14) is the trimming die, (15) is the second storage section, (16) is the working arm, (17) is a working station, (32) is a resin tablet,
(33a) (33b) are vacuum adsorption means, (34
a) (34b) is a light detection means. 8th A Force V ID part I KAID IKU b Lead frame %1tRノYI, -ri 1st Mrf) Storage part dam p 3 Figure 2nd storage part 4〆Mabiji〉

Claims (1)

[Scope of Claims] A molding means for molding a lead frame on which a semiconductor device is mounted, a trimming means for trimming residual resin generated by the molding, and a means for turning over the molded lead frame and supplying it to the trimming means. Manufacturing equipment for semiconductor parts.