JPS5763834A - Frame carrying apparatus for semiconductor device - Google Patents
Frame carrying apparatus for semiconductor deviceInfo
- Publication number
- JPS5763834A JPS5763834A JP13948680A JP13948680A JPS5763834A JP S5763834 A JPS5763834 A JP S5763834A JP 13948680 A JP13948680 A JP 13948680A JP 13948680 A JP13948680 A JP 13948680A JP S5763834 A JPS5763834 A JP S5763834A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- press
- lead frames
- slack
- transferred
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000000465 moulding Methods 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent breakage of bonding wire and the like due to the slack of the wire, in the case lead frames having semiconductor chips are transferred to a metal mold press for resin sealing and automatically loaded, by holding both sides of the lead frames. CONSTITUTION:The lead frames wherein the semiconductor chips are attached are loaded in a magazine 7 and enclosed in a container 8. The lead frame is inserted between movable rails 24 and 25 of a moving plate 23 for transferring the frame to the molding press 15 by a loader (not shown). The movable rails 24 and 25 are rotated right and left, receive the frame, and hold it at accurate locations by positioning pins. The frame is transferred to the molding press 15, fixxed to accurate locations by positioning pins on the press, and a resin molding precoss is performed. Since the frame is held by the moving plate 23, the slack is not caused, the breakage of the bonding wire is not caused, and the accurate loading can be performed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13948680A JPS5763834A (en) | 1980-10-03 | 1980-10-03 | Frame carrying apparatus for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13948680A JPS5763834A (en) | 1980-10-03 | 1980-10-03 | Frame carrying apparatus for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5763834A true JPS5763834A (en) | 1982-04-17 |
JPH0212020B2 JPH0212020B2 (en) | 1990-03-16 |
Family
ID=15246366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13948680A Granted JPS5763834A (en) | 1980-10-03 | 1980-10-03 | Frame carrying apparatus for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5763834A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61501535A (en) * | 1984-03-22 | 1986-07-24 | モステック・コ−ポレイション | Gripping device for integrated circuit lead frames |
JPS61166136A (en) * | 1985-01-18 | 1986-07-26 | Toshiba Mach Co Ltd | Intermediate frame holder |
-
1980
- 1980-10-03 JP JP13948680A patent/JPS5763834A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61501535A (en) * | 1984-03-22 | 1986-07-24 | モステック・コ−ポレイション | Gripping device for integrated circuit lead frames |
JPS61166136A (en) * | 1985-01-18 | 1986-07-26 | Toshiba Mach Co Ltd | Intermediate frame holder |
Also Published As
Publication number | Publication date |
---|---|
JPH0212020B2 (en) | 1990-03-16 |
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