JPS5797635A - Die bonding - Google Patents

Die bonding

Info

Publication number
JPS5797635A
JPS5797635A JP55175058A JP17505880A JPS5797635A JP S5797635 A JPS5797635 A JP S5797635A JP 55175058 A JP55175058 A JP 55175058A JP 17505880 A JP17505880 A JP 17505880A JP S5797635 A JPS5797635 A JP S5797635A
Authority
JP
Japan
Prior art keywords
works
die bonding
bonding position
work feeding
exist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55175058A
Other languages
Japanese (ja)
Inventor
Masayuki Shimura
Yoshimitsu Terakado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP55175058A priority Critical patent/JPS5797635A/en
Publication of JPS5797635A publication Critical patent/JPS5797635A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07331Connecting techniques
    • H10W72/07337Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To enable to perform die bonding of the fixed quality by a method wherein when works are fed and the bonding part of the works do not exist at the die bonding position, the works are made to stand still on the position thereof for the prescribed time. CONSTITUTION:At the die bonding position 3 wherein dice 2 are to be bonded to the works 1 (1A, 1B, 1C), a heater block 4 containing a built-in heater is extended from the die bonding position 3 toward the work feeding side, the works 1 are guided by guide rails, and are sent to the die bonding position 3 by a work feeding mechanism. The works 1A, 1B,...1W are sent as shown in the figure from (a) to (g), and when the works 1A, 1B... do not exist at the die bonding position 3 and die bonding operation is not performed, after work feeding operation is performed, the works 1A, 1B... are made to stand still in condition as they are for the prescribed time.
JP55175058A 1980-12-11 1980-12-11 Die bonding Pending JPS5797635A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55175058A JPS5797635A (en) 1980-12-11 1980-12-11 Die bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55175058A JPS5797635A (en) 1980-12-11 1980-12-11 Die bonding

Publications (1)

Publication Number Publication Date
JPS5797635A true JPS5797635A (en) 1982-06-17

Family

ID=15989489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55175058A Pending JPS5797635A (en) 1980-12-11 1980-12-11 Die bonding

Country Status (1)

Country Link
JP (1) JPS5797635A (en)

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