JPS5797635A - Die bonding - Google Patents
Die bondingInfo
- Publication number
- JPS5797635A JPS5797635A JP55175058A JP17505880A JPS5797635A JP S5797635 A JPS5797635 A JP S5797635A JP 55175058 A JP55175058 A JP 55175058A JP 17505880 A JP17505880 A JP 17505880A JP S5797635 A JPS5797635 A JP S5797635A
- Authority
- JP
- Japan
- Prior art keywords
- works
- die bonding
- bonding position
- work feeding
- exist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE:To enable to perform die bonding of the fixed quality by a method wherein when works are fed and the bonding part of the works do not exist at the die bonding position, the works are made to stand still on the position thereof for the prescribed time. CONSTITUTION:At the die bonding position 3 wherein dice 2 are to be bonded to the works 1 (1A, 1B, 1C), a heater block 4 containing a built-in heater is extended from the die bonding position 3 toward the work feeding side, the works 1 are guided by guide rails, and are sent to the die bonding position 3 by a work feeding mechanism. The works 1A, 1B,...1W are sent as shown in the figure from (a) to (g), and when the works 1A, 1B... do not exist at the die bonding position 3 and die bonding operation is not performed, after work feeding operation is performed, the works 1A, 1B... are made to stand still in condition as they are for the prescribed time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55175058A JPS5797635A (en) | 1980-12-11 | 1980-12-11 | Die bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55175058A JPS5797635A (en) | 1980-12-11 | 1980-12-11 | Die bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5797635A true JPS5797635A (en) | 1982-06-17 |
Family
ID=15989489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55175058A Pending JPS5797635A (en) | 1980-12-11 | 1980-12-11 | Die bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5797635A (en) |
-
1980
- 1980-12-11 JP JP55175058A patent/JPS5797635A/en active Pending
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