JPS6427250A - Manufacture of chip carrier - Google Patents
Manufacture of chip carrierInfo
- Publication number
- JPS6427250A JPS6427250A JP10521788A JP10521788A JPS6427250A JP S6427250 A JPS6427250 A JP S6427250A JP 10521788 A JP10521788 A JP 10521788A JP 10521788 A JP10521788 A JP 10521788A JP S6427250 A JPS6427250 A JP S6427250A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- arrow
- punch
- oblique
- oblique upper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To reduce the adhesion of plating to a mold, and to prevent even the generation of short circuits among leads by using the working method of the leads for a plastic chip carrier. CONSTITUTION:A freely rotatable nose-bending roller 19 vertically falling as shown in the arrow 42 is installed together with an oblique upper punch 16, the oblique upper punch 16 is lowered and leads 14 are held between the punch 16 and a die 17, and the leads 14 are worked in the oblique upper direction. The roots 44 of the leads 14 are held by a pad 22 to an oblique bending die 21 fixed, and the leads are molded in the skew downward direction by an oblique bend ing punch 24 vertically falling as shown in the arrow 43. The leads 14 are pushed down in the vertical direction by a roller 27 moving in the downward direction as shown in the arrow 46, and the noses 50 of the leads 14 are brought to the state in which the noses 50 are directed toward the base 2 of a package body 11. Accordingly, short circuits among the leads for a plastic carrier are not generated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63105217A JPH0682771B2 (en) | 1987-04-28 | 1988-04-26 | Chip carrier manufacturing method |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-107401 | 1987-04-28 | ||
JP10740187 | 1987-04-28 | ||
JP63105217A JPH0682771B2 (en) | 1987-04-28 | 1988-04-26 | Chip carrier manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6427250A true JPS6427250A (en) | 1989-01-30 |
JPH0682771B2 JPH0682771B2 (en) | 1994-10-19 |
Family
ID=26445550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63105217A Expired - Fee Related JPH0682771B2 (en) | 1987-04-28 | 1988-04-26 | Chip carrier manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0682771B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0322467A (en) * | 1989-06-19 | 1991-01-30 | Nec Kyushu Ltd | Molding die for lead of ic |
JPH04299559A (en) * | 1991-03-27 | 1992-10-22 | Yamada Seisakusho Co Ltd | Bending method of lead |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6112052A (en) * | 1984-06-27 | 1986-01-20 | Hitachi Ltd | Lead correcting process of flat packed parts |
JPS6151752U (en) * | 1984-09-10 | 1986-04-07 | ||
JPS61248457A (en) * | 1985-04-25 | 1986-11-05 | Seiko Epson Corp | Semiconductor device |
JPS6269651A (en) * | 1985-09-24 | 1987-03-30 | Hitachi Ltd | Lead forming method |
JPS6331145A (en) * | 1986-07-24 | 1988-02-09 | Nec Corp | Method and device for forming ic lead |
-
1988
- 1988-04-26 JP JP63105217A patent/JPH0682771B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6112052A (en) * | 1984-06-27 | 1986-01-20 | Hitachi Ltd | Lead correcting process of flat packed parts |
JPS6151752U (en) * | 1984-09-10 | 1986-04-07 | ||
JPS61248457A (en) * | 1985-04-25 | 1986-11-05 | Seiko Epson Corp | Semiconductor device |
JPS6269651A (en) * | 1985-09-24 | 1987-03-30 | Hitachi Ltd | Lead forming method |
JPS6331145A (en) * | 1986-07-24 | 1988-02-09 | Nec Corp | Method and device for forming ic lead |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0322467A (en) * | 1989-06-19 | 1991-01-30 | Nec Kyushu Ltd | Molding die for lead of ic |
JPH04299559A (en) * | 1991-03-27 | 1992-10-22 | Yamada Seisakusho Co Ltd | Bending method of lead |
Also Published As
Publication number | Publication date |
---|---|
JPH0682771B2 (en) | 1994-10-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |