JPS6427250A - Manufacture of chip carrier - Google Patents

Manufacture of chip carrier

Info

Publication number
JPS6427250A
JPS6427250A JP10521788A JP10521788A JPS6427250A JP S6427250 A JPS6427250 A JP S6427250A JP 10521788 A JP10521788 A JP 10521788A JP 10521788 A JP10521788 A JP 10521788A JP S6427250 A JPS6427250 A JP S6427250A
Authority
JP
Japan
Prior art keywords
leads
arrow
punch
oblique
oblique upper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10521788A
Other languages
Japanese (ja)
Other versions
JPH0682771B2 (en
Inventor
Hirofumi Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63105217A priority Critical patent/JPH0682771B2/en
Publication of JPS6427250A publication Critical patent/JPS6427250A/en
Publication of JPH0682771B2 publication Critical patent/JPH0682771B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To reduce the adhesion of plating to a mold, and to prevent even the generation of short circuits among leads by using the working method of the leads for a plastic chip carrier. CONSTITUTION:A freely rotatable nose-bending roller 19 vertically falling as shown in the arrow 42 is installed together with an oblique upper punch 16, the oblique upper punch 16 is lowered and leads 14 are held between the punch 16 and a die 17, and the leads 14 are worked in the oblique upper direction. The roots 44 of the leads 14 are held by a pad 22 to an oblique bending die 21 fixed, and the leads are molded in the skew downward direction by an oblique bend ing punch 24 vertically falling as shown in the arrow 43. The leads 14 are pushed down in the vertical direction by a roller 27 moving in the downward direction as shown in the arrow 46, and the noses 50 of the leads 14 are brought to the state in which the noses 50 are directed toward the base 2 of a package body 11. Accordingly, short circuits among the leads for a plastic carrier are not generated.
JP63105217A 1987-04-28 1988-04-26 Chip carrier manufacturing method Expired - Fee Related JPH0682771B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63105217A JPH0682771B2 (en) 1987-04-28 1988-04-26 Chip carrier manufacturing method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-107401 1987-04-28
JP10740187 1987-04-28
JP63105217A JPH0682771B2 (en) 1987-04-28 1988-04-26 Chip carrier manufacturing method

Publications (2)

Publication Number Publication Date
JPS6427250A true JPS6427250A (en) 1989-01-30
JPH0682771B2 JPH0682771B2 (en) 1994-10-19

Family

ID=26445550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63105217A Expired - Fee Related JPH0682771B2 (en) 1987-04-28 1988-04-26 Chip carrier manufacturing method

Country Status (1)

Country Link
JP (1) JPH0682771B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0322467A (en) * 1989-06-19 1991-01-30 Nec Kyushu Ltd Molding die for lead of ic
JPH04299559A (en) * 1991-03-27 1992-10-22 Yamada Seisakusho Co Ltd Bending method of lead

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112052A (en) * 1984-06-27 1986-01-20 Hitachi Ltd Lead correcting process of flat packed parts
JPS6151752U (en) * 1984-09-10 1986-04-07
JPS61248457A (en) * 1985-04-25 1986-11-05 Seiko Epson Corp Semiconductor device
JPS6269651A (en) * 1985-09-24 1987-03-30 Hitachi Ltd Lead forming method
JPS6331145A (en) * 1986-07-24 1988-02-09 Nec Corp Method and device for forming ic lead

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112052A (en) * 1984-06-27 1986-01-20 Hitachi Ltd Lead correcting process of flat packed parts
JPS6151752U (en) * 1984-09-10 1986-04-07
JPS61248457A (en) * 1985-04-25 1986-11-05 Seiko Epson Corp Semiconductor device
JPS6269651A (en) * 1985-09-24 1987-03-30 Hitachi Ltd Lead forming method
JPS6331145A (en) * 1986-07-24 1988-02-09 Nec Corp Method and device for forming ic lead

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0322467A (en) * 1989-06-19 1991-01-30 Nec Kyushu Ltd Molding die for lead of ic
JPH04299559A (en) * 1991-03-27 1992-10-22 Yamada Seisakusho Co Ltd Bending method of lead

Also Published As

Publication number Publication date
JPH0682771B2 (en) 1994-10-19

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees