JPS6129134A - Mounting apparatus - Google Patents

Abstract

PURPOSE:To simultaneously proceed in both dispensing and mounting steps by providing position recognizing steps in the both dispensing and mounting steps to accurately recognize the positions. CONSTITUTION:A mounting apparatus has the first X-axis-Y-axis drive table provided movably in X-axis and Y-axis directions integrally with a television camera 6 and a dispensing head 5, and the second X-axis-Y-axis drive table provided movably in X-axis and Y-axis directions integrally with a television camera 6 and a mounting head 8. When the dispensing position is detected, the image output of the camera 6 is reproduced, and when the mounting position is detected, the image output of the camera 9 is reproduced by a computer control.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention is directed to a mounting device that can automatically mount a variety of components onto one component. .

[Technical background of the invention and its problems]

An apparatus is known in which a dispense head drips adhesive onto a semiconductor-tube attachment location of a thick film circuit having a printed circuit, and a semiconductor chip is placed and mounted on the dripped adhesive. The number of thick film circuits that require automatic mounting with this Erica Marant device is rapidly increasing. For example, thick film circuits are becoming larger and the number and types of semiconductor chips to be mounted are increasing, and there is a demand for automatic mounting of, for example, about 40 types of components inserted onto one board.

[Purpose of the invention]

These four inventions have been made in view of the above points, and provide a mounting method that can automatically mount a wide variety of electronic components at high speed.

(Summary of the Invention) The transferred first component is imaged by a first television camera to detect its position, an adhesive material is attached to the first component by a dispensing head, and then the first component is transferred to a mounting position. ,
In the apparatus for capturing an image with a second television camera and detecting its position, the second component is transferred and attached onto the adhesive material by a mount head, in which the first television camera and the dispensing head are integrally mounted on the adhesive material. A first X-axis-Y-axis driving table is provided so as to be movable in the axial direction and the Y-axis direction, and the second television camera and the mount head are provided so as to be movable together in the X-axis direction and the Y-axis direction. second
The present invention provides a mounting device which is equipped with an X-axis and Y-axis drive table and is capable of performing dispensing work and mounting work at the same time.

[Embodiments of the invention]

Next, an embodiment in which the device of the present invention is applied to mounting a semiconductor chip will be described with reference to the drawings.

A first component, such as a thick film circuit board, such as a ceramic circuit board, on which a wiring pattern is formed. A CITL ceramic circuit board (not shown) having a size of, for example, 3 cm in width and 5 cm in length, is placed on a carrier (1) and placed in a magazine. (2) Loaded in multiple stages inside. When this magazine (2) is loaded, the magazine (2) is controlled by the loader (3) to move it downward so that it is pulled out one by one from the lower stage. That is,
Belts (4) placed at regular intervals on the lower stage of the magazine (2) are driven into a conveying state, and the magazine (2) is driven by the downward movement of the loader (3) to carry the carrier ( 1) is placed on the belt (4), the downward movement of the magazine (2) stops.

The carrier ( ) is linearly conveyed to the dispensing position below the dispensing head 5) and stopped there. In this position, the circuit board mounted on the carrier () is imaged by a television camera, for example a black and white television camera (6) mounted on the semiconductor chip automatically detect the part.

That is, the second component of the circuit board, for example, a semiconductor chip (7
) A standard pattern of attachment positions is manually stored in advance in a memory (not shown). Therefore, the mounting position of the semiconductor chip (7) on the circuit board arriving each time is imaged by the television camera (6), and the binarized signal of this image carrier output is compared with the standard pattern to determine the positional deviation amount. is calculated, and the actual mounting position of the semiconductor chip is recognized from this positional deviation amount.
Attach a material such as adhesive silver paste to the part of the semiconductor chip (for example, inject a material for fixing the force, for example, silver paste with adhesive properties.To carry out such a process, dispense head 5)
is placed on an X-Y axis drive table (not shown).

This completes the automated dispensing process. After this, the carrier (1) is conveyed by the belt (4) and stops at the mounting position. Simultaneously with the conveyance to this mounting position, the next carrier is driven below the magazine (2) and conveyed to the dispensing position. The arrival at the dispense position and the arrival at the mount position may be synchronized or time-shifted.

At the mounting position, an image is taken by a television camera (9) mounted on the mounting head (8), and the mounting position of the semiconductor chip (7) is automatically detected. The detection means automatically detects the dispensing work position using pattern recognition technology, similar to the above-mentioned detection of the dispensing work position.

>White I+ih I'hh Iff 1. 'r m building k 1 bird - A: m ma + strike -y h 7 k The head (d) picks up the θ tape /L/ Place the semiconductor chip (7) on the mounting position of the circuit board 1, and continue applying pressure to the head (8) to attach the semiconductor chip (7) to the circuit board.
The runt head (8) is placed on an X-Y4Q moving table (not shown). This completes the mounting process.

The mounting process and the dispensing process may be performed at the same time, and each process may be completed at the same time. The dispensing machine requires a longer time, that is, the carrier (1) that has completed the mounting process is transported and inserted into the receiving magazine (toward). This receiving magazine is first installed at the deepest position so that it is inserted from the top, and every time an operator is inserted, it is driven by the unloader and lifted upward to fly and wj. Intermittent driving is performed in which the motor stops at every first step of the apex position.

All intermittent operations of the loader and unloader (3)I are carried out under the control of the combination carrier (1).
Regarding transportation, dispense position, mounting position
Control programs such as stopping at e, -, and J-1, starting and ending each operation, and conveyance are all controlled by the combiator.

On the other hand, the semiconductor chips placed on the θ table αQ are transported in the following manner. That is, a large number of trays a9 each having a large number of recesses arranged in a predetermined arrangement according to the size of semiconductor chips (7), for example, IC chips, are arranged in a predetermined manner in the storage container α0. The ICs accommodated in each tray 0 may be of the same type or may be of different types.

Further, the IC is configured in a stocker manner so that the size and type of ICs may be different from those of the ICs accommodated in other trays←9. A mark is attached to the storage container ae, and by manually detecting this mark in advance and storing it in a memory (teaching), it is stored as the amount of positional deviation of the storage container (16). IC chips (7) are sequentially taken out from one tray α by a pickup head αη driven in the X-Y direction based on the amount of deviation from the tray. For example, it is attracted by a pickup head and placed on the θ table Ql. The θ table (10) is a circular plate provided with a large number of suction holes and whose rotational position can be adjusted. This θ table (101) is fixed to a rotating disk (I8) and is provided so as to be independently rotationally controlled. Therefore, the IC chip to which the storage container H is transferred rotates the θ table (10). Especially the JIC chip (which corrects the direction of force).

After this correction operation, the rotary disk U is rotationally transferred toward the mount head, for example, rotated by 180 degrees. In the case of this 180 degree rotation, two θ table frames are provided on a straight line passing through the center of the disk H. This is determined by the delivery position to the mounting position. θ tape for 120 degree rotation, /
I/(10) becomes 3 pieces. - The direction correction means for the IC chip calculates the amount of positional deviation by means of comparing the imaging output from the television camera (1!J) with pre-stored standard position information, and based on this amount of positional deviation, the The amount of rotation is calculated and corrected.Another way to calculate the amount of positional deviation is to binarize the output of the camera, scan it in the horizontal direction, and then detect the appearance of the object to be detected. After that, scan in the vertical direction at the detection position, detect the center position of the detected object by this vertical scanning, and repeat the procedure of horizontal scanning at this central position to find the center position of the detected object in advance. A method of detecting the amount of positional deviation from the stored position may also be used.Also, a television monitor (21+2) is installed, and the monitor (20) displays the imaging output of the television camera (11). (6) (9)
Switch and display the imaging output. That is, when detecting the dispense position, the imaging output of the television camera (6) is reproduced.

When the mount position is detected, the computer controls the camera to play back the image output from the television camera (9).

In this way, the dispensing work and the mounting work are automatically performed on the circuit board conveyance path, so that they can all be performed automatically, which is effective in reducing labor.

In the above embodiment, mounting of a semiconductor chip has been described, but it goes without saying that it is possible to mount not only semiconductor chips but also electronic components such as resistors, capacitors, and diodes.

〔Effect of the invention〕

LJ l-snow φEII3+, +-t-ra r great profit day 1/
417-d Since a position recognition means is provided in each of the dispensing process and the mounting process, the position can be accurately recognized and both processes can be performed simultaneously, which is highly effective in achieving high-speed mounting.

[Brief explanation of the drawing]

FIG. 1 is a perspective view for explaining an embodiment of the device of the present invention. 1...Carrier 4...Belt 6.9.19
...TV camera 7...Semiconductor chip agent Patent attorney Kensuke Chika and 1 other person

Claims (1)

[Claims] (1) The transferred first component is imaged with a first television camera to detect its position, adhesive material is attached to this first component by a dispensing head, and then transferred to the mounting position, and the second component is In the device, the first television camera and the dispensing head are integrally mounted in the X-axis direction, in which the first television camera and the dispensing head are integrally moved in the X-axis direction. A first X-axis-Y-axis driving table is provided so as to be movable in the Y-axis direction, and a first X-axis-Y-axis drive table is provided so as to be movable in the X-axis direction and the Y-axis direction. 1. A mounting device comprising two X-axis and Y-axis drive tables, which enables dispensing work and mounting work to be performed simultaneously.