JPS57169250A - Bonding method for pellet - Google Patents

Bonding method for pellet

Info

Publication number
JPS57169250A
JPS57169250A JP5443281A JP5443281A JPS57169250A JP S57169250 A JPS57169250 A JP S57169250A JP 5443281 A JP5443281 A JP 5443281A JP 5443281 A JP5443281 A JP 5443281A JP S57169250 A JPS57169250 A JP S57169250A
Authority
JP
Japan
Prior art keywords
pellet
cavity
collet
recognized
corner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5443281A
Other languages
Japanese (ja)
Inventor
Makoto Ariga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5443281A priority Critical patent/JPS57169250A/en
Publication of JPS57169250A publication Critical patent/JPS57169250A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To bond the pellet by recognizing the position of the cavity of an IC package by a picture, controlling the position of a collet through the recognition and accurately positioning the pellet. CONSTITUTION:The first recognition visual field 17 of the cavity 3 is caught by means of a TV camera through mechanical operation. THe picture signals are processed, and the position 21 (X1, Y1) of the corner of the cavity is recognized. The position 22 (X2, Y2) of a corner is similarly recognized. The central position of the cavity is recognized from these value, and an error with the normal position (X0, Y0) of the cavity to a lead frame 1 is obtained. The quantity of displacement is fed back to a pellet bonder controller, the position of the collet is minutely adjusted by means of a servomotor, and the pellet and the collet are accurately positioned relatively.
JP5443281A 1981-04-13 1981-04-13 Bonding method for pellet Pending JPS57169250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5443281A JPS57169250A (en) 1981-04-13 1981-04-13 Bonding method for pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5443281A JPS57169250A (en) 1981-04-13 1981-04-13 Bonding method for pellet

Publications (1)

Publication Number Publication Date
JPS57169250A true JPS57169250A (en) 1982-10-18

Family

ID=12970549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5443281A Pending JPS57169250A (en) 1981-04-13 1981-04-13 Bonding method for pellet

Country Status (1)

Country Link
JP (1) JPS57169250A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018926A (en) * 1983-07-13 1985-01-31 Hitachi Ltd Pellet bonding apparatus
JPS6129134A (en) * 1984-07-19 1986-02-10 Toshiba Corp Mounting apparatus
JPH01183127A (en) * 1988-01-18 1989-07-20 Shinkawa Ltd Die bonding method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018926A (en) * 1983-07-13 1985-01-31 Hitachi Ltd Pellet bonding apparatus
JPH0566015B2 (en) * 1983-07-13 1993-09-20 Hitachi Ltd
JPS6129134A (en) * 1984-07-19 1986-02-10 Toshiba Corp Mounting apparatus
JPH01183127A (en) * 1988-01-18 1989-07-20 Shinkawa Ltd Die bonding method

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