IE801200L - Semiconductor manufacture - Google Patents

Semiconductor manufacture

Info

Publication number
IE801200L
IE801200L IE120080A IE120080A IE801200L IE 801200 L IE801200 L IE 801200L IE 120080 A IE120080 A IE 120080A IE 120080 A IE120080 A IE 120080A IE 801200 L IE801200 L IE 801200L
Authority
IE
Ireland
Prior art keywords
stage
bonding
pellets
iii
pellet
Prior art date
Application number
IE120080A
Other versions
IE49684B1 (en
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of IE801200L publication Critical patent/IE801200L/en
Publication of IE49684B1 publication Critical patent/IE49684B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

A system for bonding pellets, for example semiconductor chips (1, 1n) to supports, for example lead frames (6), has a pellet supply stage (I), a bonding stage (II) and an intermediate stage (III). Pellets (1, 1n) are transferred from the supply stage (I) onto a table (3) of the intermediate stage (II). The position of the table (3) in the X-Y directions and the angular position of the X-Y plane are controlled by control means (13) to bring a pellet (1, 1n) on the table to a desired position for transfer to the bonding stage (III) for bonding to a support (6). <IMAGE> [GB2056766A]
IE120080A 1979-06-12 1980-06-11 Systems for bonding pellets,for example semiconductor chips,to supports IE49684B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7371979A JPS55165643A (en) 1979-06-12 1979-06-12 Device for bonding pellet

Publications (2)

Publication Number Publication Date
IE801200L true IE801200L (en) 1980-12-12
IE49684B1 IE49684B1 (en) 1985-11-27

Family

ID=13526306

Family Applications (1)

Application Number Title Priority Date Filing Date
IE120080A IE49684B1 (en) 1979-06-12 1980-06-11 Systems for bonding pellets,for example semiconductor chips,to supports

Country Status (3)

Country Link
JP (1) JPS55165643A (en)
GB (1) GB2056766B (en)
IE (1) IE49684B1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
JPS5896739A (en) * 1981-12-04 1983-06-08 Toshiba Seiki Kk Hybrid bonding method of semiconductor pellet
JPS59210647A (en) * 1983-05-14 1984-11-29 Matsushita Electric Ind Co Ltd Pellet bonding device
JPS61112336A (en) * 1984-11-07 1986-05-30 Nec Corp Die bonder
JPH0519953Y2 (en) * 1985-06-26 1993-05-25
JPS6237942A (en) * 1985-08-13 1987-02-18 Matsushita Electronics Corp Pellet positioning apparatus
JPS6362241A (en) * 1986-09-02 1988-03-18 Toshiba Corp Wire bonding method
JPS62162335A (en) * 1986-11-07 1987-07-18 Toshiba Seiki Kk Bonding device for semiconductor pellet
KR910006367B1 (en) * 1987-07-09 1991-08-21 스미도모덴기고오교오 가부시기가이샤 Chip package device
CH676695A5 (en) * 1988-05-19 1991-02-28 Bobst Sa
JPH027992A (en) * 1988-06-27 1990-01-11 Brother Ind Ltd Pattern registering machine
NL8900388A (en) * 1989-02-17 1990-09-17 Philips Nv METHOD FOR JOINING TWO OBJECTS
JPH02239637A (en) * 1989-03-14 1990-09-21 Nec Corp Manufacturing device for semiconductor device
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
JPH0450517U (en) * 1990-09-05 1992-04-28
JPH0521544A (en) * 1991-07-12 1993-01-29 Sumitomo Electric Ind Ltd Method and apparatus for measuring semiconductor element provided with bump
DE4228012C2 (en) * 1992-08-24 1996-08-22 Siemens Ag Method for spacing two components
JP2007158102A (en) * 2005-12-06 2007-06-21 Shibuya Kogyo Co Ltd Bonding equipment
WO2009072659A1 (en) * 2007-12-03 2009-06-11 Panasonic Corporation Chip mounting system
JP5065969B2 (en) * 2008-03-31 2012-11-07 株式会社日立ハイテクインスツルメンツ Component mounting equipment
CN116387209B (en) * 2023-06-06 2023-09-05 北京中科同志科技股份有限公司 Chip packaging system and chip packaging method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126268A (en) * 1973-04-04 1974-12-03
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPS52149070A (en) * 1976-06-07 1977-12-10 Toshiba Corp Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS5310968A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Pellet bonding method

Also Published As

Publication number Publication date
GB2056766B (en) 1984-04-26
JPS55165643A (en) 1980-12-24
IE49684B1 (en) 1985-11-27
GB2056766A (en) 1981-03-18
JPS6318326B2 (en) 1988-04-18

Similar Documents

Publication Publication Date Title
IE801200L (en) Semiconductor manufacture
JPS5272077A (en) Positioning system
CA2056897A1 (en) Automatically operable manufacturing and machining plant
JPS5218534A (en) Air fuel ration control system
JPS5332A (en) Memory redundance system
JPS56146242A (en) Positioning method of bonding position at fixed position on substrate
JPS5256287A (en) Original point compensating system in numerical control transfer machi ne
JPS55154611A (en) Control unit for positioning stop
JPS5338942A (en) Communication control unit
JPS5310968A (en) Pellet bonding method
JPS5371769A (en) Transfer command distribution system for numerical control device
JPS6425432A (en) Method of controlling table of semiconductor pellet mounting device
JPS54101267A (en) Lead frame
JPS524741A (en) Memory control system
JPS5276796A (en) Electric machine tool
JPS5347803A (en) Automatic focus controller
JPS5334431A (en) Memory unit
JPS5314288A (en) Flux control system
JPS5318932A (en) Program module coupling system
JPS5264932A (en) Automatic focus adjusting device
JPS5694638A (en) Method and device for bonding of pellet
JPS5371771A (en) Positioning control system
JPS5512723A (en) Electronic beam exposing method and device
JPS5336795A (en) Method for blocking lens blank
JPS53480A (en) Plate positioner/feeder

Legal Events

Date Code Title Description
MM4A Patent lapsed