CN116387209B - Chip packaging system and chip packaging method - Google Patents
Chip packaging system and chip packaging method Download PDFInfo
- Publication number
- CN116387209B CN116387209B CN202310659911.4A CN202310659911A CN116387209B CN 116387209 B CN116387209 B CN 116387209B CN 202310659911 A CN202310659911 A CN 202310659911A CN 116387209 B CN116387209 B CN 116387209B
- Authority
- CN
- China
- Prior art keywords
- chip
- platform
- substrate
- material taking
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 198
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 230000000007 visual effect Effects 0.000 claims abstract description 64
- 239000000463 material Substances 0.000 claims abstract description 48
- 238000007598 dipping method Methods 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 10
- 230000004907 flux Effects 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 230000007306 turnover Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 9
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention relates to the field of chip packaging, and provides a chip packaging system and a chip packaging method, wherein the chip packaging system comprises: a material taking platform; the chip hot-press bonding device comprises a rotary adjusting mechanism, a grabbing mechanism and a first cavity, wherein the rotary adjusting mechanism is connected with the grabbing mechanism, and the end part of the grabbing mechanism is arranged in the first cavity; the substrate platform is matched with the first cavity to form a vacuum cavity; the first visual recognition device is arranged between the material taking platform and the substrate platform and is electrically connected with the rotary adjusting mechanism. The chip packaging system provided by the invention is used for solving the defects of low packaging precision and high failure rate caused by batch packaging of a plurality of chips in the prior art, and the chip positions are identified through the first visual identification device and fed back to the rotation adjustment mechanism so as to adjust the rotation angle of the chips and improve the packaging precision; the first chamber is arranged on the chip hot-press bonding device to realize the vacuum bonding process of the independent chip, so that the oxidation of the chip bonding process is avoided.
Description
Technical Field
The present invention relates to the field of chip packaging technologies, and in particular, to a chip packaging system and a chip packaging method.
Background
Currently, the packaging of chips is often performed by thermocompression bonding, and the existing thermocompression bonding apparatus is performed for a plurality of chips in batches, for example, tens, hundreds, or even thousands of chips are placed in an oven, heated to a temperature at which the solder melts to complete the bonding, and then the subsequent steps, such as removing the flux residue and underfilling, are continued.
The packaging efficiency of such devices is high, but the entire package is composed of many different materials, which are caused to expand at different rates by heating in a reflow oven. As the chip and substrate expand and cool, the difference in thermal expansion coefficients can cause warpage. In addition, since the chip is re-soldered after placement, the solder balls may not be in perfect contact with each copper pad, resulting in a variation in chip gap, which may not be completely flat for placement, affecting the accuracy and lifetime of the chip.
Disclosure of Invention
The invention provides a chip packaging system and a chip packaging method, which are used for solving the defects of low packaging precision, high failure rate and short service life of a plurality of chips packaged in batches in the prior art, realizing vacuum bonding of the chips to improve bonding quality, arranging a first visual recognition device and a rotary adjusting mechanism to improve the alignment precision of the chips and a substrate, improving the packaging precision, reducing the failure rate and prolonging the service life.
The invention provides a chip packaging system, comprising:
the material taking platform is used for containing chips facing the correct direction;
the chip hot-press bonding device comprises a rotary adjusting mechanism, a grabbing mechanism and a first cavity, wherein the rotary adjusting mechanism is connected with the grabbing mechanism to adjust the rotation angle of the grabbing mechanism, the first cavity is arranged on the grabbing mechanism, and the end part of the grabbing mechanism is arranged in the first cavity;
the substrate platform or a substrate on the substrate platform is matched with the first chamber to form a vacuum cavity;
the first visual identification device is arranged between the material taking platform and the substrate platform and is electrically connected with the rotary adjusting mechanism so as to identify and adjust the angle of the grabbing mechanism.
According to the chip packaging system provided by the invention, the chip thermocompression bonding device further comprises a first temperature control mechanism, and the first temperature control mechanism is in heat transfer with the grabbing mechanism so as to control the temperature of the grabbing mechanism.
According to the chip packaging system provided by the invention, the chip thermocompression bonding device further comprises a vacuumizing mechanism, and the vacuumizing mechanism is communicated with the first cavity so as to vacuumize the first cavity.
According to the chip packaging system provided by the invention, the chip thermocompression bonding device further comprises an inflation mechanism which is communicated with the first chamber so as to inflate the first chamber with protective gas and/or reducing gas.
According to the chip packaging system provided by the invention, the substrate platform comprises a second temperature control mechanism, and the second temperature control mechanism is used for heat transfer with the substrate.
The chip packaging system provided by the invention further comprises a first linear moving mechanism, wherein the substrate platform is slidably arranged on the first linear moving mechanism, and the first linear moving mechanism enables the substrate platform to linearly approach to and separate from the chip thermocompression bonding device.
The chip packaging system provided by the invention further comprises a second linear moving mechanism, wherein the chip hot-press bonding device is slidably arranged on the second linear moving mechanism, and the second linear moving mechanism is arranged in an extending manner along the direction in which the material taking platform, the first visual recognition device and the substrate platform are sequentially arranged;
the second linear moving mechanism and the first linear moving mechanism are perpendicular to each other in the extending direction.
According to the chip packaging system provided by the invention, the first visual recognition device is electrically connected with the first linear moving mechanism and the second linear moving mechanism so as to adjust the positions of the substrate platform and the chip thermocompression bonding device.
The chip packaging system provided by the invention further comprises a glue dipping device, wherein soldering flux is held in the glue dipping device, and the glue dipping device is arranged between the first visual identification device and the substrate platform.
The invention also provides a chip packaging method based on the chip packaging system, which comprises the following steps:
the chip hot-pressing bonding device reaches the material taking platform, and a grabbing mechanism of the chip hot-pressing bonding device picks up the chip;
the chip hot-press bonding device reaches a first visual identification device, and the first visual identification device acquires the position information of the chip picked up by the chip hot-press bonding device and transmits the position information to a rotation adjusting mechanism of the chip hot-press bonding device;
the rotation adjusting mechanism receives the position information and adjusts the angle of the grabbing mechanism so as to align the position of the chip;
the chip hot-press bonding device is used for buckling the chip with the substrate of the substrate platform and performing vacuum hot-press bonding.
According to the chip packaging method of the invention, the step of performing vacuum thermocompression bonding comprises the following steps:
the first chamber of the chip hot-press bonding device is buckled with the substrate platform or the substrate of the substrate platform to form a vacuum chamber, and the vacuum chamber is vacuumized;
heating the chip and the substrate respectively;
the grabbing mechanism is used for pressing the chip and the substrate.
According to the chip packaging method of the invention, after vacuumizing the vacuum cavity, the method further comprises:
and filling protective gas and/or reducing gas into the vacuum cavity.
According to the chip packaging system provided by the invention, the first visual recognition device is arranged between the material taking platform and the substrate platform, the position of the chip is recognized through the first visual recognition device and fed back to the rotary adjusting mechanism, so that the rotation angle of the chip is adjusted, the alignment precision of the chip is improved, and the packaging precision is further improved; the first chamber is arranged on the chip hot-press bonding device to realize the vacuum bonding process of the independent chip, so that the oxidation of the chip bonding process is avoided.
Further, the chip packaging method provided by the invention is realized by adopting the chip packaging system, so that the chip packaging method also has various advantages as described above.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of a chip packaging system according to the present invention;
FIG. 2 is a schematic diagram of a second overall structure of the chip packaging system according to the present invention;
FIG. 3 is an enlarged view of a portion of the die thermocompression bonding apparatus of FIG. 2;
fig. 4 is a flowchart of a chip packaging method provided by the present invention.
Reference numerals:
100: a chip thermocompression bonding device; 101: a rotation adjustment mechanism; 102: a grabbing mechanism; 103: a housing; 104: a first temperature control mechanism; 105: a first vacuum line; 106: a lifting mechanism; 110: a second linear movement mechanism; 200: a substrate stage; 210: a first linear movement mechanism; 300: a first visual recognition device; 400: a material taking platform; 500: a glue dipping device; 600: an operating platform; 610: a material taking mechanism; 620: a feeding platform; 630: and a second visual recognition device.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In describing embodiments of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present invention will be understood in detail by those of ordinary skill in the art.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Embodiments of the present invention are described below with reference to fig. 1 to 4. It is to be understood that the following are only illustrative embodiments of the present invention and are not to be construed as limiting the invention.
As shown in fig. 1 to 3, the present invention provides a chip packaging system, comprising: the material taking platform 400, the chip hot-pressing bonding device 100, the substrate platform 200 and the first visual recognition device 300 are arranged on the material taking platform 400, and chips facing the correct direction are contained on the material taking platform 400; the chip thermocompression bonding device 100 comprises a rotation adjusting mechanism 101, a grabbing mechanism 102 and a first cavity, wherein the rotation adjusting mechanism 101 is connected with the grabbing mechanism 102 to adjust the rotation angle of the grabbing mechanism 102, the first cavity is arranged on the grabbing mechanism 102, and the end part of the grabbing mechanism 102 is arranged in the first cavity; the substrate platform 200 or a substrate on the substrate platform 200 is matched with the first chamber to form a vacuum cavity; the first visual recognition device 300 is disposed between the material taking platform 400 and the substrate platform 200, and the first visual recognition device 300 is electrically connected with the rotation adjustment mechanism 101 to recognize and adjust the angle of the gripping mechanism 102.
That is, the material taking platform 400, the first visual recognition device 300 and the substrate platform 200 are sequentially arranged, after the chip thermocompression bonding device 100 picks up a chip from the material taking platform 400, the chip position is recognized by the first visual recognition device 300, and the rotation adjustment mechanism 101 of the chip thermocompression bonding device 100 is controlled to adjust the angle of the grabbing mechanism 102, so that the chip is aligned, and the chip thermocompression bonding device 100 places the aligned chip on the substrate platform 200 to complete packaging. The first visual recognition device 300 is connected with a software visual system for recognition control.
The material taking platform 400 has a turnover function, and turns the chips with opposite directions so as to make the chips correctly oriented. For example, the material taking platform 400 includes a first table top and a second table top, the first table top and the second table top are disposed on two sides of an axis of the rotating shaft, the rotating shaft is connected with the second table top, the chips with opposite directions are disposed on the second table top, and the second table top is buckled with the first table top through rotation of the rotating shaft, so that the chips are turned to the first table top, and orientation adjustment of the chips is completed. The chip thermocompression bonding device 100 directly picks up the chip with the correct orientation placed directly on the first mesa.
As shown in fig. 3, for the thermocompression bonding device of the present invention, the rotation adjusting mechanism 101 includes a power portion and a rotation portion, the rotation portion is connected with the gripping mechanism 102, the power portion drives the rotation portion to rotate, thereby rotating the gripping mechanism 102, the gripping mechanism 102 is used for picking up the chip, and the rotation adjusting mechanism 101 is used for adjusting the rotation angle of the chip so as to make it more adapted to the substrate. For example, the power section may select a motor, the rotating section may select a bearing housing, and the gripping mechanism 102 may select a vacuum suction gripping mode. The housing 103 forming the first chamber is connected to the end of the gripping mechanism 102, and one side of the housing 103 facing the substrate platform 200 is an open side, and the gripping mechanism 102 picks up the chips and then places the chips in the first chamber, and is buckled with the substrate on the substrate platform 200 through the open side of the housing 103.
The opening side of the housing 103 contacts the plane of the substrate platform 200, and then the first chamber is sealed, the first chamber is vacuumized to form a vacuum cavity, and the chip and the substrate are thermally bonded in a vacuum environment, so that the packaging is completed. And (3) performing hot-press bonding of the chip in a vacuum low-oxygen environment, so that the oxidation of the chip is reduced, and the bonding quality is improved.
The rotation adjusting mechanism 101 receives an adjusting signal fed back by the first visual recognition device 300, for example, the chip packaging system includes a controller, the rotation adjusting mechanism 101 and the first visual recognition device 300 are respectively connected with the controller, the controller receives visual information of the first visual recognition device 300, determines whether the rotation angle of the chip needs to be adjusted and what the rotation angle is, and sends the adjusting signal to the rotation adjusting mechanism 101, and the rotation adjusting mechanism 101 executes the adjusting signal to keep unchanged or adjust to a proper angle; the feedback adjustment of the first visual recognition device 300 and the rotation adjustment mechanism 101 improves the packaging accuracy of the chip.
In addition, in order to ensure high-precision shooting, a motion axis can be added to the first visual recognition device 300, and multiple recognition on the chips sucked by the grabbing mechanism 102 of the chip thermocompression bonding device 100 can be realized through the motion of the motion axis, so that the recognition precision is improved.
With continued reference to fig. 3, in one embodiment of the present invention, the die thermocompression bonding apparatus 100 further includes a first temperature control mechanism 104, and the first temperature control mechanism 104 is in thermal communication with the grasping mechanism 102 to control the temperature of the grasping mechanism 102. Specifically, the first temperature control mechanism 104 includes a heater that heats the end of the gripping mechanism 102, i.e., specifically heats the chip picked up by the gripping mechanism 102.
In addition, the first temperature control mechanism 104 may further include a cooling component disposed at the other end of the gripping mechanism 102, i.e. the end opposite to the chip, to avoid overheating other components by the heater, thereby reducing the service life and the service accuracy.
Further, in another embodiment of the present invention, the die thermocompression bonding apparatus 100 further includes a vacuum pumping mechanism, which communicates with the first chamber to pump vacuum to the first chamber. The vacuum pumping mechanism may include a vacuum pump and a first vacuum pipeline 105, where one end of the first vacuum pipeline 105 is communicated with the first chamber, and the other end of the first vacuum pipeline is communicated with the vacuum pump, so as to form a vacuum cavity after the first chamber is in contact and sealed with the substrate platform 200.
In addition, the vacuumizing mechanism may further include a second vacuum pipeline, when the grabbing mechanism 102 of the chip thermocompression bonding device 100 adopts a vacuum adsorption structure, an adsorption hole is formed at an end of the grabbing mechanism 102 for adsorbing the chip, and the second vacuum pipeline is communicated with the adsorption hole to pick up the chip.
Specifically, in an alternative embodiment of the present invention, the die thermocompression bonding apparatus 100 further includes an inflation mechanism that communicates with the first chamber to inflate the first chamber with a shielding gas and/or a reducing gas, where the shielding gas may be an inert gas to increase the temperature rising rate.
Wherein, inflation mechanism can include air pump and inflation line, and inflation line's one end is connected with the air pump, and the other end is connected with first cavity. After the vacuum cavity is formed between the first cavity and the substrate platform 200 and the vacuum pumping is completed, a set amount of reducing gas is filled into the first cavity to reduce the oxidized parts of the chip, the substrate and the solder, so that the bonding quality is enhanced. For example, the introduction of formic acid reduces flux residue from the flux process and reduces post-cleaning steps.
In another alternative embodiment of the present invention, as shown in fig. 2, for the substrate stage 200 of the present invention, the substrate stage 200 includes a second temperature control mechanism for heat transfer with the substrate stage 200. For example, the second temperature control mechanism includes a heater that heats the substrate stage 200, thereby preheating the substrate stage 200 and improving the thermocompression bonding effect. The heaters are uniformly laid in the substrate stage 200, and the heater power gradually decreases from the periphery to the center area, so that the center area temperature is prevented from being too concentrated.
In addition, the second temperature control mechanism may further include a cooler that cools the thermally compression bonded chip and substrate stage 200. The cold zone device is arranged below the heater.
With continued reference to fig. 2, in one embodiment of the present invention, the chip packaging system further includes a first linear movement mechanism 210, the substrate stage 200 being slidably mounted on the first linear movement mechanism 210, the first linear movement mechanism 210 linearly moving the substrate stage 200 toward and away from the chip thermocompression bonding apparatus 100.
The first linear moving mechanism 210 may adopt a motor-driven rack-and-pinion structure, a telescopic cylinder structure, a motor-driven screw nut structure, or the like. The first linear moving mechanism 210 extends in the longitudinal direction, and the substrate stage 200 is close to the die thermocompression bonding device 100 or away from the die thermocompression bonding device 100 in the constraining direction of the die thermocompression bonding device 100 along the first linear moving mechanism 210.
In one embodiment of the present invention, the chip packaging system further includes a second linear movement mechanism 110, the chip thermocompression bonding device 100 is slidably mounted on the second linear movement mechanism 110, and the second linear movement mechanism 110 is arranged to extend along a direction in which the material taking platform 400, the first visual recognition device 300, and the substrate platform 200 are sequentially arranged; wherein, the extending directions of the second linear moving mechanism 110 and the first linear moving mechanism 210 are perpendicular to each other.
The second linear movement mechanism 110 may adopt a motor-driven rack-and-pinion structure, or may adopt a telescopic cylinder structure or a motor-driven screw-nut structure, etc. The second linear movement mechanism 110 extends in the lateral direction, and the die thermocompression bonding apparatus 100 reciprocates in the extending direction of the second linear movement mechanism 110, so that it is possible to achieve the arrival at the material taking stage 400, the first visual recognition apparatus 300, and the substrate stage 200, respectively. The second linear motion mechanism 110 is disposed perpendicular to the first linear motion mechanism 210, and the second linear motion mechanism 110 is disposed above the first linear motion mechanism 210. For example, the second linear-motion mechanism 110, the take-out stage 400, the first visual recognition device 300, and the substrate stage 200 are all disposed on the operation stage 600.
In some embodiments of the present invention, the first visual recognition device 300 is electrically connected with the first linear motion mechanism 210 and the second linear motion mechanism 110 to adjust the positions of the substrate stage 200 and the die thermocompression bonding device 100. For example, the first visual recognition device 300 includes a capturing end and a software visual system, the capturing end captures visual information and sends the visual information to the software visual system, and the software visual system is respectively connected to the first linear movement mechanism 210, the second linear movement mechanism 110 and the rotation adjustment mechanism 101, and controls the position of the substrate platform 200 on the first linear movement mechanism 210, the position of the die thermocompression bonding device 100 on the second linear movement mechanism 110 and the rotation angle of the rotation adjustment mechanism 101. As shown in fig. 1 and 2, the chip packaging system further includes a material taking mechanism 610, a material feeding platform 620, and a second visual recognition device 630, wherein the material taking mechanism 610 is slidably mounted on the second linear motion mechanism 110, the material feeding platform 620 and the second visual recognition device 630 are mounted on the operation platform 600, and the second visual recognition device 630 is disposed between the material taking platform 400 and the material feeding platform 620.
In the working process, the material taking mechanism 610 grabs the chip from the material feeding platform 620, and the second visual recognition device 630 recognizes the front and back of the chip and the rotation angle of the chip, and places the chip on the material taking platform 400, for example, the second visual recognition device 630 recognizes the chip as the back, and places the chip on the second table top of the material taking platform 400, and after the rotation of the rotating shaft, the chip is placed on the first table top, and then is picked up by the chip thermocompression bonding device 100. That is, the take-out mechanism 610, the supply stage 620, the second visual recognition device 630, the take-out stage 400, the first visual recognition device 300, and the substrate stage 200 are sequentially arranged.
In addition, the die thermocompression bonding device 100 is further provided with a lifting mechanism 106, a pressure sensor and a displacement sensor, the lifting mechanism 106 of the die thermocompression bonding device 100 enables the gripping mechanism 102 to drive the housing 103 of the first chamber to approach and separate from the substrate platform 200 along the vertical direction, the housing 103 of the first chamber is telescopic relative to the gripping mechanism 102, in an initial state, the bottom of the gripping mechanism 102 is lower than the bottom of the housing 103 of the first chamber, and after the first chamber and the substrate platform 200 form a vacuum chamber, the bottom of the gripping mechanism 102 is placed in the housing 103 of the first chamber. The displacement sensor is used for identifying the distance between the chip thermocompression bonding device 100 and the substrate platform 200, the second visual identification device 630, and the material taking platform 400, and the pressure sensor is used for detecting the extrusion pressure between the grabbing mechanism 102 and the substrate platform 200. Similarly, the pick-up mechanism 610 includes a lift mechanism 106, a rotation adjustment mechanism 101, and a gripping mechanism 102 for gripping chips on the feed platform 620 and for adjusting the rotational angle of the chips.
Specifically, in some embodiments of the present invention, the chip packaging system further includes a glue dipping device 500, wherein the flux is contained in the glue dipping device 500, and the glue dipping device 500 is disposed between the first visual recognition device 300 and the substrate stage 200. The chip thermocompression bonding apparatus 100 dips a certain amount of soldering flux into the picked chip, and effectively removes the oxidized portion of the chip, so that the bonding effect is better.
As shown in fig. 4, the present invention further provides a chip packaging method based on the chip packaging system of the above embodiment, which includes:
s1: the die thermocompression bonding device 100 reaches the material taking platform 400, and the gripping mechanism 102 of the die thermocompression bonding device 100 picks up the die; specifically, the die thermocompression bonding apparatus 100 reaches the corresponding position of the pick-up platform 400 along the second linear movement mechanism 110, and descends to the height of the pick-up platform 400 by the lifting mechanism 106, and the gripper mechanism 102 picks up the die by vacuum suction.
S2: the chip thermocompression bonding device 100 reaches the first visual recognition device 300, and the first visual recognition device 300 acquires the positional information of the chip picked up by the chip thermocompression bonding device 100 and transmits the positional information to the rotation adjustment mechanism 101 of the chip thermocompression bonding device 100; specifically, after the die thermocompression bonding device 100 picks up the correctly oriented die, the second linear movement mechanism 110 reaches the position corresponding to the first visual recognition device 300, the first visual recognition device 300 recognizes the positional information of the rotational angle of the die on the gripping mechanism 102, and sends the positional information to the rotation adjustment mechanism 101.
In addition, the first visual recognition device 300 may also control the position of the substrate stage 200 on the first linear motion mechanism 210, and the position of the die thermocompression bonding device 100 on the second linear motion mechanism 110. That is, the angle and position are compensated.
S3: the rotation adjusting mechanism 101 receives the position information and adjusts the angle of the grabbing mechanism 102 to align the position of the chip; specifically, the first visual recognition device 300 may send the position information to the controller, and the controller determines whether the position information needs to be adjusted and the angle of adjustment, and feeds back the position information that needs to be adjusted to the rotation adjustment mechanism 101, where the rotation adjustment mechanism 101 performs the angle adjustment of the gripping mechanism 102, so that the chip can be directly opposite to the substrate.
S4: the die thermocompression bonding apparatus 100 locks the die to the substrate stage 200, and performs vacuum thermocompression bonding. For example, an adapting groove is formed on the substrate platform 200, and the grabbing mechanism 102 drops the chip into the adapting groove under the driving of the lifting mechanism 106, so as to perform thermocompression bonding.
In one embodiment of the present invention, the step of performing vacuum thermocompression bonding for step S4 includes:
s41: the first chamber of the chip thermocompression bonding device 100 is buckled with the substrate platform 200 to form a vacuum chamber, and the vacuum chamber is vacuumized; specifically, the housing 103 of the first chamber and the substrate platform 200 form a vacuum chamber, and the vacuum chamber is vacuumized by the vacuumizing mechanism. The protective gas can be used as a heat conducting medium to increase the temperature rising rate; the reducing gas is capable of removing oxides from the surface of the workpiece.
S42: heating the chip and the substrate respectively; specifically, the first temperature control mechanism 104 starts heating the chip to a preset temperature, and the second temperature control mechanism may heat the substrate stage 200 to the preset temperature at the same time, or preheat the substrate stage 200 in advance.
S43: the gripper 102 presses the chip onto the substrate stage 200. The gripping mechanism 102 continues to press down until the pressure sensor reaches a preset value, so that the chip and the substrate are thermally pressed and bonded.
After the thermocompression bonding is completed, the substrate platform 200 is cooled by the second temperature control mechanism, and is cooled to a preset preheating temperature, and the next bonding process is waited. The grabbing mechanism 102 and the housing 103 have a telescopic reset function, so that when the grabbing mechanism 102 is continuously pressed down, the housing 103 and the substrate platform 200 are positioned under a certain pressure, and no overpressure occurs. After the thermocompression bonding is completed, the housing 103 of the first chamber is retracted, and separated from the substrate stage 200.
According to the chip packaging system provided by the invention, the first visual recognition device 300 is arranged between the material taking platform 400 and the substrate platform 200, the position of a chip is recognized by the first visual recognition device 300 and fed back to the rotary adjusting mechanism 101, so that the rotation angle of the chip is adjusted, the alignment precision of the chip is improved, and the packaging precision is further improved; the die thermocompression bonding apparatus 100 is provided with a first chamber to realize an individual die vacuum bonding process, avoiding oxidation during the die bonding process.
Further, the chip packaging method provided by the invention is realized by adopting the chip packaging system, so that the chip packaging method also has various advantages as described above.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (11)
1. A chip packaging system, comprising:
the material taking platform is used for containing chips facing the correct direction;
the chip hot-press bonding device comprises a rotary adjusting mechanism, a grabbing mechanism and a first cavity, wherein the rotary adjusting mechanism is connected with the grabbing mechanism to adjust the rotation angle of the grabbing mechanism, the first cavity is arranged on the grabbing mechanism, and the end part of the grabbing mechanism is arranged in the first cavity;
the substrate platform or a substrate on the substrate platform is matched with the first chamber to form a vacuum cavity;
the chip hot-press bonding device further comprises a vacuumizing mechanism, wherein the vacuumizing mechanism is communicated with the first cavity so as to vacuumize the first cavity;
the vacuum pumping mechanism comprises a vacuum pump and a first vacuum pipeline, one end of the first vacuum pipeline is communicated with the first cavity, and the other end of the first vacuum pipeline is communicated with the vacuum pump;
the vacuumizing mechanism further comprises a second vacuum pipeline, an adsorption hole is formed in the end portion of the grabbing mechanism and used for adsorbing the chip, and the second vacuum pipeline is communicated with the adsorption hole to pick up the chip;
the first visual identification device is arranged between the material taking platform and the substrate platform and is electrically connected with the rotary adjusting mechanism so as to identify and adjust the angle of the grabbing mechanism;
the chip packaging system also comprises a second linear moving mechanism and an operation platform;
the chip packaging system further comprises a material taking mechanism, a feeding platform and a second visual identification device, wherein the material taking mechanism is slidably arranged on the second linear movement mechanism, the feeding platform and the second visual identification device are arranged on the operation platform, and the second visual identification device is arranged between the material taking platform and the feeding platform;
the material taking platform has a turnover function, and the chips with opposite directions are turned over to enable the chips to be correctly oriented;
the material taking platform comprises a first table top and a second table top, the first table top and the second table top are arranged on two sides of the axis of a rotating shaft, the rotating shaft is connected with the second table top, chips with opposite directions are arranged on the second table top, the second table top is buckled with the first table top through rotation of the rotating shaft, so that the chips are turned to the first table top, orientation adjustment of the chips is completed, and the chips with correct orientations are directly arranged on the first table top;
the material taking mechanism grabs the chips from the material feeding platform, and the chips are placed on the material taking platform through the positive and negative sides of the chips and the rotation angles of the chips identified by the second visual identification device;
when the second visual recognition device recognizes that the chip is the reverse side, the chip is placed on the second table top of the material taking platform, and is placed on the first table top through the overturning of the rotating shaft.
2. The chip packaging system of claim 1, wherein the chip thermocompression bonding device further comprises a first temperature control mechanism that is in thermal communication with the grasping mechanism to control a temperature of the grasping mechanism.
3. The chip packaging system according to claim 1, wherein the chip thermocompression bonding device further comprises an inflation mechanism in communication with the first chamber to inflate the first chamber with a shielding gas and/or a reducing gas.
4. The chip packaging system of claim 1, wherein the substrate stage includes a second temperature control mechanism for heat transfer with the substrate.
5. The chip packaging system according to claim 1 or 4, further comprising a first linear movement mechanism on which the substrate stage is slidably mounted, the first linear movement mechanism linearly approaching and moving the substrate stage away from the chip thermocompression bonding device.
6. The chip packaging system according to claim 5, wherein the chip thermocompression bonding device is slidably mounted on the second linear movement mechanism, and the second linear movement mechanism is arranged to extend in a direction in which the material taking platform, the first visual recognition device, and the substrate platform are sequentially arranged;
the second linear moving mechanism and the first linear moving mechanism are perpendicular to each other in the extending direction.
7. The chip packaging system according to claim 6, wherein the first visual recognition device is electrically connected to the first linear movement mechanism and the second linear movement mechanism to adjust positions of the substrate stage and the chip thermocompression bonding device.
8. The chip packaging system according to claim 1 or 2, further comprising a glue dipping device, wherein a flux is carried in the glue dipping device, and wherein the glue dipping device is disposed between the first visual recognition device and the substrate stage.
9. A chip packaging method based on the chip packaging system according to any one of claims 1 to 8, comprising:
the chip hot-pressing bonding device reaches the material taking platform, and a grabbing mechanism of the chip hot-pressing bonding device picks up the chip;
the chip hot-press bonding device reaches a first visual identification device, and the first visual identification device acquires the position information of the chip picked up by the chip hot-press bonding device and transmits the position information to a rotation adjusting mechanism of the chip hot-press bonding device;
the rotation adjusting mechanism receives the position information and adjusts the angle of the grabbing mechanism so as to align the position of the chip;
the chip hot-press bonding device is used for buckling the chip with the substrate of the substrate platform and performing vacuum hot-press bonding.
10. The method of claim 9, wherein the step of performing vacuum thermocompression bonding comprises:
the first chamber of the chip hot-press bonding device is buckled with the substrate platform or the substrate of the substrate platform to form a vacuum chamber, and the vacuum chamber is vacuumized;
heating the chip and the substrate respectively;
the grabbing mechanism is used for pressing the chip and the substrate.
11. The method of claim 10, further comprising, after the vacuum chamber is evacuated:
and filling protective gas and/or reducing gas into the vacuum cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310659911.4A CN116387209B (en) | 2023-06-06 | 2023-06-06 | Chip packaging system and chip packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310659911.4A CN116387209B (en) | 2023-06-06 | 2023-06-06 | Chip packaging system and chip packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116387209A CN116387209A (en) | 2023-07-04 |
| CN116387209B true CN116387209B (en) | 2023-09-05 |
Family
ID=86967912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310659911.4A Active CN116387209B (en) | 2023-06-06 | 2023-06-06 | Chip packaging system and chip packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116387209B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165643A (en) * | 1979-06-12 | 1980-12-24 | Fujitsu Ltd | Device for bonding pellet |
| CN1893009A (en) * | 2005-07-07 | 2007-01-10 | 松下电器产业株式会社 | Component mounting apparatus and component mounting method |
| JP2008077599A (en) * | 2006-09-25 | 2008-04-03 | Dainippon Printing Co Ltd | Method of manufacturing non-contact communication member and apparatus for manufacturing non-contact communication member, and method of manufacturing interposer and apparatus for manufacturing interposer |
| CN102683233A (en) * | 2011-03-18 | 2012-09-19 | 均华精密工业股份有限公司 | Die bonder |
| TW201344812A (en) * | 2012-04-25 | 2013-11-01 | D Tek Technology Co Ltd | Method for flattening solder bumps during reflowing on the flip chip substrate and reflow flattening equipment therefor |
| KR20140022582A (en) * | 2012-08-14 | 2014-02-25 | 한미반도체 주식회사 | Flip chip bonding apparatus and calibration method thereof |
| KR20160115192A (en) * | 2015-03-26 | 2016-10-06 | 주식회사 엘트린 | Apparatus and method for substrates bonding |
| CN107079619A (en) * | 2014-08-13 | 2017-08-18 | 株式会社新川 | Erecting device and measuring method |
| KR20200129358A (en) * | 2019-05-08 | 2020-11-18 | 주식회사 새너 | panel transferring module and panel attaching apparatus including the same |
| KR20210000210A (en) * | 2019-06-24 | 2021-01-04 | 이동철 | Led bonding system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11972968B2 (en) * | 2020-07-02 | 2024-04-30 | Sharpack Technology Pte. Ltd. | Fluxless gang die bonding arrangement |
-
2023
- 2023-06-06 CN CN202310659911.4A patent/CN116387209B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165643A (en) * | 1979-06-12 | 1980-12-24 | Fujitsu Ltd | Device for bonding pellet |
| CN1893009A (en) * | 2005-07-07 | 2007-01-10 | 松下电器产业株式会社 | Component mounting apparatus and component mounting method |
| JP2008077599A (en) * | 2006-09-25 | 2008-04-03 | Dainippon Printing Co Ltd | Method of manufacturing non-contact communication member and apparatus for manufacturing non-contact communication member, and method of manufacturing interposer and apparatus for manufacturing interposer |
| CN102683233A (en) * | 2011-03-18 | 2012-09-19 | 均华精密工业股份有限公司 | Die bonder |
| TW201344812A (en) * | 2012-04-25 | 2013-11-01 | D Tek Technology Co Ltd | Method for flattening solder bumps during reflowing on the flip chip substrate and reflow flattening equipment therefor |
| KR20140022582A (en) * | 2012-08-14 | 2014-02-25 | 한미반도체 주식회사 | Flip chip bonding apparatus and calibration method thereof |
| CN107079619A (en) * | 2014-08-13 | 2017-08-18 | 株式会社新川 | Erecting device and measuring method |
| KR20160115192A (en) * | 2015-03-26 | 2016-10-06 | 주식회사 엘트린 | Apparatus and method for substrates bonding |
| KR20200129358A (en) * | 2019-05-08 | 2020-11-18 | 주식회사 새너 | panel transferring module and panel attaching apparatus including the same |
| KR20210000210A (en) * | 2019-06-24 | 2021-01-04 | 이동철 | Led bonding system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116387209A (en) | 2023-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6518709B2 (en) | Mounting device | |
| CN105428266A (en) | Flip-chip eutectic bonding method for chip with medium bridge and obtained product | |
| CN111653494B (en) | Non-contact heating flip-chip welding process method | |
| CN114883223B (en) | Packaging device for semiconductor eutectic soldering | |
| CN116387209B (en) | Chip packaging system and chip packaging method | |
| KR101720627B1 (en) | High-speed and High-precision Apparatus for Bonding | |
| CN116053153A (en) | Die bonder and die bonding method | |
| US6070780A (en) | Bonding apparatus | |
| JP2007329306A (en) | Thermocompression bonding apparatus | |
| CN113895133A (en) | Chip laminating machine and film laminating method thereof | |
| JP2006303060A (en) | Bonding apparatus, bonding head, and bonding method of electronic component | |
| JP3246282B2 (en) | Display panel module manufacturing apparatus and display panel module manufacturing method | |
| JP5973753B2 (en) | Chip delivery jig and chip delivery method | |
| CN213547942U (en) | Multi-pressure head hot-pressing backflow device | |
| CN221668773U (en) | Hot-pressing bonding head and hot-pressing bonding equipment | |
| CN210040155U (en) | Wafer chip mounting and flattening mechanism | |
| CN112333932A (en) | Multi-pressure-head hot-pressing backflow device and operation method thereof | |
| CN217667093U (en) | Hot-press welding device applied to electrical connection of high-power chip | |
| CN115938970A (en) | Sheet bonding alignment system | |
| CN220312039U (en) | Chip welding platform | |
| CN220065639U (en) | Hot-pressing bonding head for chip packaging and hot-pressing bonding equipment | |
| CN220065638U (en) | Chip eutectic device | |
| JP2007208106A (en) | Thermocompression device, thermocompression tool attached thereto, and thermocompression method therefor | |
| WO2017169954A1 (en) | Bonding tool cooling device, bonding device provided with same, and bonding tool cooling method | |
| CN221573860U (en) | Quick cooling hot-pressing bonding head and hot-pressing bonding equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |