CN115938970A - Sheet bonding alignment system - Google Patents
Sheet bonding alignment system Download PDFInfo
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- CN115938970A CN115938970A CN202110888275.3A CN202110888275A CN115938970A CN 115938970 A CN115938970 A CN 115938970A CN 202110888275 A CN202110888275 A CN 202110888275A CN 115938970 A CN115938970 A CN 115938970A
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- 238000010438 heat treatment Methods 0.000 claims abstract description 91
- 238000003825 pressing Methods 0.000 claims abstract description 79
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 238000001179 sorption measurement Methods 0.000 claims abstract description 53
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000012546 transfer Methods 0.000 claims description 50
- 238000007599 discharging Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 24
- 238000010521 absorption reaction Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 239000000758 substrate Substances 0.000 description 15
- 238000012937 correction Methods 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000002452 interceptive effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to a sheet bonding alignment system, which comprises an alignment mechanism; the alignment mechanism comprises a supporting platform and a pressing head; the supporting platform is provided with a supporting end face and a first vacuum adsorption hole penetrating through the supporting end face; the pressing head is provided with a pressing surface; the pressing surface faces the supporting end surface, and the distance between the pressing surface and the supporting end surface is adjustable; the first vacuum adsorption hole is used for adsorbing a sheet to be bonded, and the press-fit head is used for press-fitting the sheet adsorbed by the first vacuum adsorption hole. Wherein the first vacuum adsorption hole increases the bonding alignment precision. The pressing head and the heating element automatically move, and bonding efficiency is improved.
Description
Technical Field
The application relates to the technical field of bonding equipment, in particular to a sheet bonding alignment system.
Background
At present, a micro light-emitting diode (micro LED) display panel has the advantages of higher brightness, better light-emitting efficiency, lower power consumption and the like as a new generation display technology, so that the micro LED is widely used.
The Micro-LED display panel generally includes a plurality of pixel regions thereon, each pixel region including a red LED chip, a blue LED chip, and a green LED chip. In the process of preparing the display panel, three chips need to be transferred from the respective growth substrates to the display back panel. The currently adopted transfer mode is as follows: bonding the red LED chip to a temporary substrate by using the temporary substrate; then the growth substrate of the red light LED chip is stripped by laser, and the red light LED chip is transferred to a temporary substrate; and then transferring the red LED chips to the display back plate on the temporary substrate by using the transfer substrate. Blue LED chips and green LED chips were transferred separately in the same manner. And the LED chips are transferred to the display backboard through a plurality of bonding contraposition transfer processes, namely bulk transfer. However, in the current bonding alignment method, the alignment accuracy is difficult to ensure, and the bonding efficiency is low.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, an object of the present application is to provide a sheet bonding alignment system, which improves the alignment accuracy related to the bonding process in the bulk transfer process, such as the alignment accuracy of the LED chip and the display backplane, and can improve the bonding efficiency.
The application provides a sheet bonding counterpoint system includes: an alignment mechanism; the alignment mechanism comprises a supporting platform and a pressing head; the supporting platform is provided with a supporting end face and a first vacuum adsorption hole penetrating through the supporting end face; the pressing head is provided with a pressing surface; the pressing surface faces the supporting end surface, and the distance between the pressing surface and the supporting end surface is adjustable; the first vacuum adsorption hole is used for adsorbing a sheet to be bonded, and the pressing head is used for pressing the sheet adsorbed by the first vacuum adsorption hole.
The sheet bonding counterpoint system that this application embodiment provided sets up first vacuum adsorption hole on supporting platform, and this first vacuum adsorption hole can adsorb and place the needs bonding sheet on supporting the terminal surface, and first vacuum adsorption hole also can fix needs bonding sheet promptly, and when on range upon range of another sheet to adsorbed sheet, the adsorbed sheet can not take place to shift so, and the counterpoint precision of two sheets gets the guarantee.
In some embodiments, the supporting platform is provided with a plurality of first vacuum adsorption holes, and a plurality of heating members corresponding to the first vacuum adsorption holes one to one are arranged in the chamber. Because the huge transfer quantity is very huge, a plurality of first vacuum adsorption holes are correspondingly arranged, and each first vacuum adsorption hole correspondingly adsorbs one first sheet, so that batch processing can be carried out, and the efficiency is increased.
In some embodiments, the first vacuum suction holes are uniformly distributed on the supporting platform. From this, space utilization is higher, can set up as many as possible first vacuum adsorption holes on limited area to disposable can adsorb fixed more quantity of needs bonding sheet, can promote bonding efficiency.
In some embodiments, the support platform is further provided with a chamber communicated with the first vacuum adsorption hole; a heating element is arranged in the cavity and corresponds to the first vacuum adsorption hole, and the heating element can move towards the direction close to or far away from the first vacuum adsorption hole; the heating element is used for heating the sheets to be bonded. The heating element can heat the bonding sheet material, so that the sheet material can be smoothly bonded; in addition, the heating element is arranged in the cavity, so that the space of the supporting platform is reasonably utilized, the space utilization rate is improved, and the size of the whole equipment is reduced.
In some embodiments, a heat conducting member is further disposed in the chamber, the heat conducting member is fixedly connected to the heating member, and a second vacuum absorption hole corresponding to the first vacuum absorption hole is disposed on the heat conducting member; the heating element and the heat conducting element can move towards the direction close to or far away from the first vacuum adsorption hole at the same time; the second vacuum adsorption hole is used for adsorbing a sheet to be bonded, and the heat conducting member is used for transferring the heat of the heating member to the sheet to be bonded. The heat conducting member can transfer the heat emitted by the heating member to the sheet material, and the second vacuum absorption holes can strengthen the stability of the sheet material. Therefore, heat can be smoothly provided for sheet bonding, the stability of the sheet can be improved, and the alignment accuracy is ensured.
In some embodiments, the heating member is provided with a heating end face facing the first vacuum adsorption hole and parallel to the support end face; the heated end face is adapted to contact the first sheet. Through setting up the heating terminal surface for heating member can with sheet surface-to-surface contact, thereby increase area of contact, make the better transmission of heat of heating member to the sheet, promote the bonding reliability.
In some embodiments, the sheet bonding registration system further comprises: the transfer mechanism comprises a grabbing end face, and a third vacuum adsorption hole is formed in the grabbing end face; the third vacuum adsorption hole is used for adsorbing a sheet needing to be bonded to the grabbing end face, and the transfer mechanism is used for transferring the adsorbed sheet needing to be bonded to the supporting end face. The transfer mechanism can automatically transfer the bonding sheet to the supporting end face, so that automatic operation is realized, and the feasibility of mass production is high.
In some embodiments, the sheet bonding registration system further comprises: an image acquisition device; the image acquisition equipment is used for acquiring an image of the third vacuum adsorption hole adsorbing the sheet to be bonded, and the image is used for correcting the position of the transfer mechanism for placing the sheet to be bonded on the supporting end face. And the image acquisition equipment is arranged, so that the positions of the two sheets to be bonded can be corrected, and the alignment precision is improved.
In some embodiments, the aligning system further comprises: a lifter; the pressing head is connected with the lifter, and the lifter can drive the pressing head to move towards the direction of approaching to or keeping away from the supporting platform, so that the distance between the pressing surface and the supporting end surface is adjustable. Drive the pressfitting head through the riser and remove to make the pressfitting head can move towards or keep away from supporting platform, increase degree of automation, promote bonding efficiency.
In other embodiments, the alignment system further comprises: a lifter; the supporting platform is connected with the lifter, and the lifter can drive the supporting platform to move towards the direction of approaching to or keeping away from the pressing head, so that the distance between the pressing surface and the supporting end surface is adjustable. Drive supporting platform through the riser and remove to make supporting platform can move towards or keep away from the pressfitting head, increase degree of automation, promote bonding efficiency.
In still other embodiments, the alignment mechanism further comprises: a first lifter and a second lifter; the pressing head is connected with the first lifter, and the first lifter can drive the pressing head to move towards the direction close to or away from the supporting platform; the supporting platform is connected with the second lifter, and the second lifter can drive the supporting platform to move towards the direction close to or away from the pressing head; so that the distance between the pressing surface and the supporting end surface is adjustable. Therefore, when the pressing is needed, the distance between the pressing surface and the supporting end surface can be quickly shortened; after the completion pressfitting, the distance between pressfitting face and the support terminal surface can pull open fast to prevent that the pressfitting head from disturbing transport mechanism, thereby can accelerate production efficiency.
In some embodiments, the sheet bonding registration system further comprises: the device comprises a feeding table and a discharging table, wherein the feeding table is used for supporting sheets to be bonded; the blanking table is used for supporting the bonded sheet. The feeding table can support the bonding sheet before the bonding sheet is transferred to the supporting end face. The blanking table can temporarily store the bonded sheets after the bonding of the sheets is completed, so that the use convenience is improved, and the preparation efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of a sheet bonding and aligning system according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a support platform of a sheet bonding alignment system according to an embodiment of the present application.
Fig. 3 is a schematic view of an arrangement structure of a heating element and a heat-conducting element according to an embodiment of the present application.
Fig. 4 is a schematic structural diagram of a sheet bonding and aligning system according to another embodiment of the present application.
Description of reference numerals: 100-alignment mechanism, 110-supporting platform, 111-supporting end face, 112-first vacuum adsorption hole, 120-pressing head, 121-pressing surface, 130-heating element, 140-lifter, 150-base, 160-heat conducting element, 161-second vacuum adsorption hole, 200-transfer mechanism, 210-grabbing end face, 220-third vacuum adsorption hole, 300-image acquisition equipment, 400-feeding table and 500-discharging table.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Referring to fig. 1 to fig. 2, fig. 1 is a schematic structural diagram of a sheet bonding and aligning system according to an embodiment of the present application, and fig. 2 is a schematic structural diagram of a supporting platform of the sheet bonding and aligning system according to the embodiment of the present application. The embodiment of the present application provides a sheet bonding alignment system, including: an alignment mechanism 100; the alignment mechanism 100 includes a support platform 110 and a bonding head 120.
The supporting platform 110 is provided with a supporting end surface 111 and a first vacuum absorption hole 112 penetrating through the supporting end surface 111; the press-fit head 120 is provided with a press-fit surface 121; the pressing surface 121 faces the supporting end surface 111, and the distance between the pressing surface 121 and the supporting end surface 111 is adjustable. The first vacuum absorption hole 112 is used for absorbing a sheet to be bonded, and the stitching head 120 is used for stitching the sheet absorbed by the first vacuum absorption hole 112.
Taking the sheets to be bonded as a first sheet and a second sheet as an example, the following detailed steps are detailed:
step S100: placing a first sheet on the support end surface 111, the first sheet corresponding to the first vacuum suction hole 112; the first vacuum adsorption hole 112 pre-adsorbs the first sheet.
Step S110: a second sheet is laminated on the first sheet.
Step S120: the distance between the press-fit surface 121 and the support end surface 111 is shortened, and the first sheet and the second sheet are pressed.
The first sheet material can be an LED wafer, the second sheet material can be a display back plate, the display back plate is laminated on the LED wafer, and after heating and pressurizing, the LED wafer can be bonded on the display back plate, namely the bonding of the LED wafer and the display back plate is completed.
In another example, a micro-electro-mechanical system (MEMS) process is generally performed by using a silicon wafer bonding technique, and the silicon wafer is bonded to a sapphire wafer, which is one of the common silicon wafer bonding techniques. Therefore, the first sheet material can be a silicon wafer, and the second sheet material can be sapphire.
In yet another example, silicon wafer and silicon wafer bonding techniques are commonly used in integrated circuit fabrication. Therefore, the first sheet may be a silicon wafer, and the second sheet may be a silicon wafer.
In other examples, the bonding may be glass-glass bonding, silicon-silicon bonding, metal-metal bonding, silicon-glass bonding, silicon-metal bonding, or the like. The metal may be gold (Au). That is, the sheet bonding alignment system provided in the embodiment of the present application can be applied to any bonding process, and is not limited in the present application.
As can be seen from the above, in the sheet bonding alignment system provided in the embodiment of the present application, by providing the first vacuum suction hole 112 on the supporting platform 110, the first vacuum suction hole 112 can pre-suck the sheet to be bonded placed on the supporting end surface 111, that is, the first vacuum suction hole 112 can fix the sheet to be bonded, so that when another sheet is stacked on the sucked sheet, the sucked sheet is not displaced, and therefore, the alignment accuracy is ensured.
If the first sheet is an LED chip, the second sheet is a display back plate. Then, in the sheet bonding alignment system provided in the embodiment of the present application, the supporting platform 110 is provided with the first vacuum absorption hole 112, the first vacuum absorption hole 112 may pre-absorb the LED chip placed on the supporting end surface 111, that is, the first vacuum absorption hole 112 may fix the LED chip, so that when the display back plate is stacked onto the LED chip, the LED chip may not shift, and therefore, the alignment accuracy between the LED chip and the display back plate is ensured.
Illustratively, the support platform 110 has a plurality of first vacuum suction holes 112, and a plurality of heating members 130 corresponding to the plurality of first vacuum suction holes 112 are disposed in the chamber. Here, the number of the first vacuum suction holes 112 is two or more, and the number of the large transfer is very large, so that the first vacuum suction holes 112 are correspondingly provided, and each first vacuum suction hole 112 correspondingly sucks one first sheet, thereby performing batch processing and increasing efficiency. It will be appreciated that the chamber within the support platform 110 is in communication with all of the first vacuum chucking holes 112 and is relatively sealed, such that a vacuum source need only be connected to the chamber to provide chucking power to all of the first vacuum chucking holes 112.
Illustratively, the plurality of first vacuum suction holes 112 are uniformly distributed on the support end surface 111. Specifically, taking the supporting end surface 111 as a circle as an example, the plurality of first vacuum suction holes 112 may be distributed in two circles, three circles, and so on, and specifically set according to the area of the supporting end surface 111 and the size of the first vacuum suction holes 112. Take three circles of the first vacuum suction holes 112 as an example, wherein each circle of the first vacuum suction holes 112 is distributed at an equal angle. The distance from the middle ring of first vacuum suction holes 112 to the outer ring of first vacuum suction holes 112 is equal to the distance from the inner ring of first vacuum suction holes 112.
Taking the supporting end surface 111 as a square as an example, the plurality of first vacuum suction holes 112 may be arranged in a matrix, for example, 100 first vacuum suction holes 112 are arranged in 10 rows and 10 columns, and the distances between any two adjacent first vacuum suction holes 112 are equal.
Taking the supporting end surface 111 as a rectangle, the plurality of first vacuum suction holes 112 may be arranged in a matrix, for example, 80 first vacuum suction holes 112 arranged in 8 rows and 10 columns, and the distances between any two adjacent first vacuum suction holes 112 are equal.
Therefore, the first vacuum adsorption holes 112 can be arranged in a limited area as much as possible, so that a large number of sheets to be bonded can be adsorbed and fixed at one time, and the bonding efficiency can be improved.
In some embodiments, the supporting platform 110 further has a chamber communicated with the first vacuum suction hole 112, a heating element 130 is disposed in the chamber, the heating element 130 corresponds to the first vacuum suction hole 112, and the heating element 130 can move toward or away from the first vacuum suction hole 112; the heating member 130 can heat the sheets to be bonded.
The heating member 130 may heat the bonded sheets so that the sheets are smoothly bonded; in addition, the heating element 130 is arranged in the cavity, so that the space of the supporting platform 110 is reasonably utilized, the space utilization rate is improved, and the volume of the whole equipment is reduced. When bonding is performed, the LED chip is pre-sucked through the first vacuum suction hole 112, and the heating member 130 is also prevented from touching the first sheet when moving upward, which causes displacement of the first sheet and increases the positional accuracy of the LED chip.
After the heating element 130 is disposed, the specific bonding steps are as follows: continuing with the example of the first sheet and the second sheet, after the first sheet is placed on the support end surface 111, the first vacuum suction hole 112 sucks the first sheet; after the second sheet is laminated on the sucked first sheet and the heating member 130 is moved to contact the first sheet in a direction approaching the first vacuum suction hole 112, the heating member 130 generates heat and the distance between the press-fit surface 121 and the support end surface 111 is shortened so that the press-fit surface 121 presses the second sheet.
The more detailed procedure is as follows:
s10: placing a first sheet on the support end surface 111, the first sheet corresponding to the first vacuum suction hole 112; the first vacuum adsorption hole 112 pre-adsorbs the first sheet.
S11: a second sheet is laminated on the first sheet.
S12: the heating member 130 is moved into contact with the first sheet.
S13: the heating member 130 starts to generate heat and shortens the distance between the press-fit surface 121 and the support end surface 111, thereby heating and pressing the first sheet and the second sheet. It is understood that after the heating member 130 is moved into contact with the first sheet and heat generation is started, the heating member 130 may be further controlled to continue moving upward to slightly protrude out of the first vacuum suction hole 112, so that the heating member 130 may function to support and press the first sheet and the second sheet. Of course, the heating member 130 can also move upward to extend out of the first vacuum absorption hole 112 by a large amount, so as to drive the first sheet material to move upward, so that the first sheet material can be quickly close to the pressing surface 121.
In the sheet bonding alignment system provided by this embodiment, the first vacuum adsorption hole 112 is disposed on the supporting platform 110, the first vacuum adsorption hole 112 can pre-adsorb the LED chip placed on the supporting end surface 111, that is, the first vacuum adsorption hole 112 can fix the LED chip, so that when the display back plate is stacked onto the LED chip, the LED chip does not shift, and therefore, the alignment accuracy of the LED chip and the display back plate is ensured. In addition, the LED chip is pre-absorbed by the first vacuum absorption hole 112, so that the heating element 130 is prevented from touching the first sheet when moving upwards, which causes the first sheet to shift, and the position accuracy of the LED chip is increased.
With reference to the direction of fig. 1, the heating member 130 can be moved into contact with the first sheet to heat the first sheet and the second sheet to be bonded, the pressing head 120 can be moved into contact with the second sheet, and when the pressing head 120 continues to move toward the close supporting end surface 111, the pressing head 120 and the heating member 130 cooperate with each other to press the first sheet and the second sheet, and at the same time, the heating member 130 heats the first sheet and the second sheet. Thereby, the bonding of the first sheet and the second sheet is completed.
As can be seen from the above, the sheet bonding alignment system provided in this embodiment increases the alignment accuracy of two sheets to be bonded by providing the first vacuum suction hole 112 on the supporting platform 110. By controlling the automatic movement of the pressing head 120 and the heating member 130, the sheets to be bonded are heated and pressurized, so that the bonding process is completed quickly, and the bonding efficiency is improved.
In some embodiments, the heating member 130 is provided with a heating end surface facing the first vacuum adsorption hole 112 and parallel to the support end surface 111; the heated end face is adapted to contact the first sheet. Through setting up the heating terminal surface for heating member 130 can with sheet surface-to-surface contact, thereby increase area of contact, make better transmission to the sheet of the heat of heating member 130, promote the bonding reliability. More specifically, through setting up the heating terminal surface, make heating member 130 can with first sheet face-to-face contact to increase area of contact, make the better transmission of heating member 130's heat to first sheet, and pass through second sheet and transmit to the second sheet, thereby make first sheet and second sheet be heated evenly, promote bonding reliability.
Referring to fig. 3, in conjunction with fig. 1 and fig. 2, fig. 3 is a schematic diagram of an arrangement structure of a heating element and a heat-conducting element according to an embodiment of the present application. In some embodiments, a heat conducting member 160 is further disposed in the chamber, the heat conducting member 160 is fixedly connected to the heating member 130, and a second vacuum absorption hole 161 corresponding to the first vacuum absorption hole 112 is disposed on the heat conducting member 160; the heating member 130 and the heat transfer member 160 can be simultaneously moved toward or away from the first vacuum adsorption hole 112. The second vacuum suction hole 161 is used for sucking the sheet to be bonded, and the heat-conducting member 160 is used for transferring the heat of the heating member to the sheet to be bonded.
Specifically, after stacking a second sheet on the first sheet to be adsorbed, the heating member 130 and the heat conduction member 160 move toward the first vacuum adsorption hole 112 at the same time until the heat conduction member 160 contacts the first sheet, and the second vacuum adsorption hole 161 adsorbs the first sheet; the heating member 130 then generates heat.
The heat-conducting member 160 may be made of a heat-conducting metal, the heat-conducting member 160 and the heating member 130 are fixed, and the heating member 130 may move up and down, so that the heat-conducting member 160 may move up and down simultaneously with the heating member 130, and when the heating member 130 needs to heat the first sheet and the second sheet for bonding, the heating member 130 and the heat-conducting member 160 may move up simultaneously until the heat-conducting member 160 contacts the first sheet, and the second vacuum absorption hole 161 absorbs the first sheet. At this time, the heat-conductive member 160 may transfer heat generated from the heating member 130 to the first sheet, and the second vacuum suction hole 161 enhances the stability of the first sheet. Therefore, heat can be smoothly provided for bonding of the first sheet and the second sheet, the stability of the first sheet can be improved, and therefore the alignment accuracy is ensured.
Specifically, the heat transfer member 160 may be located between the heating member 130 and the first vacuum suction hole 112, and the heat transfer member 160 is disposed away from the heating member 130, that is, a side facing the first vacuum suction hole 112 is provided with a second vacuum suction hole 161. The second vacuum suction hole 161 is communicated with a relatively sealed cavity of the heating member 130, and then connected to the cavity using a vacuum source, thereby providing a suction force to the second vacuum suction hole 161.
In some embodiments, referring to fig. 4, fig. 4 is a schematic structural diagram of a sheet bonding alignment system according to another embodiment of the present application. The sheet bonding alignment system further comprises a transfer mechanism 200, the transfer mechanism 200 comprises a grabbing end face 210, and a third vacuum adsorption hole 220 is formed in the grabbing end face 210; the third vacuum suction hole 220 is used for sucking the sheet to be bonded onto the grabbing end face 210, and the transferring mechanism 200 is used for placing the sucked sheet on the supporting end face 111.
Continuing with the first sheet material and the second sheet material as an example, the third vacuum suction holes 220 first suck the first sheet material onto the grabbing end surface 210, and then the transferring mechanism 200 places the sucked first sheet material on the supporting end surface 111, where the first sheet material corresponds to the first vacuum suction holes 112. Next, the third vacuum suction hole 220 sucks the second sheet again to the gripping end surface 210, and the transfer mechanism 200 stacks the sucked second sheet on the first sheet.
The transfer mechanism 200 may be a six-axis robot, and the mechanical arms of the six-axis robot may move in six dimensions. Specifically, the six-axis robot has six axes, each axis is driven by a motor equipped with a speed reducer, the motion modes and directions of the axes are different, and each axis simulates the motion of each joint of a human hand. It is thereby possible to more precisely grasp the first sheet and the second sheet, and to more precisely correspond the first sheet to the first vacuum adsorption holes 112, and to stack the second sheet to correspond to the first sheet.
The transfer mechanism 200 can automatically transfer the first sheet to the supporting end surface 111 and can automatically transfer the second sheet to be stacked on the first sheet, so that automatic operation is realized, and the feasibility of mass production is high.
Of course, it can be understood by those skilled in the art that the shapes of the grabbing end face 210 and the supporting end face 111 may be the same, and the distribution of the third vacuum suction holes 220 on the supporting end face 111 is the same as the distribution of the first vacuum suction holes 112 on the grabbing end face 210, so that when the grabbing end face 210 grabs the first sheet and aligns the grabbing end face 210 with the supporting end face 111, that is, when the projection of the grabbing end face 210 coincides with the supporting end face 111, the suction force of the first vacuum suction holes 112 is eliminated, and the first sheet is placed on the supporting end face 111, and at this time, the first sheet just corresponds to the third vacuum suction holes 220. The distribution of the first vacuum suction holes 112 and the third vacuum suction holes 220 includes shapes, sizes, intervals, and the like. The second sheet is laminated on the first sheet in the same manner. As can be seen from the above, by providing the same shape of the grabbing end face 210 and the supporting end face 111, and providing the distribution of the third vacuum suction holes 220 on the supporting end face 111 as the distribution of the first vacuum suction holes 112 on the grabbing end face 210, the alignment accuracy of the first sheet material and the second sheet material can be increased.
Of course, in other embodiments, the shapes of the grabbing end face 210 and the supporting end face 111 may be different.
It should be understood that when the transfer mechanism needs to place the first sheet on the support end surface 111 or stack the second sheet on the first sheet, a sufficient distance between the stitching head 120 and the support platform 110 is needed to prevent the stitching head 120 from interfering with the transfer mechanism. I.e. the distance between the bonding head 120 and the support platform 110 needs to be adjusted relatively far.
In the sheet alignment bonding system provided with the transfer mechanism 200, the bonding specifically comprises the following steps:
the detailed steps are as follows:
s20: the grasping end face 210 grasps the first sheet with the third vacuum suction hole 220.
S21: the transfer mechanism 200 places a first sheet on the supporting end surface 111, and the first sheet corresponds to the first vacuum adsorption hole 112; the first vacuum suction hole 112 sucks the first sheet.
S22: the grasping end face 210 grasps the second sheet with the third vacuum suction hole 220.
S23: the transfer mechanism 200 stacks the second sheet on the first sheet.
S24: the heating member 130 is moved into contact with the first sheet.
S25: the heating member 130 starts to generate heat, so that the distance between the press-fit surface 121 and the support end surface 111 is shortened, and the first sheet and the second sheet are heated and pressed.
In some embodiments, referring to fig. 3, the sheet bonding alignment system further includes an image capturing device 300, the image capturing device 300 is configured to capture an image of the third vacuum suction hole 220 sucking the sheet to be bonded, and the image is used to correct a position where the transfer mechanism 200 places the sheet to be bonded on the support end surface 111.
It will be understood by those skilled in the art that the transport mechanism 200, the image capture device 300, etc. require a control system for control, as described in more detail below: before the transfer mechanism 200 places the adsorbed first sheet on the supporting end surface 111, the image acquisition device 300 acquires a first image of the third vacuum adsorption hole 220 adsorbing the first sheet to the grasping end surface 210, and then sends the first image to the control system; after receiving the first image, the control system identifies a first coordinate of the first sheet in the first image, compares the first coordinate with the reference coordinate, and determines a first position correction coefficient based on the comparison result, wherein the first position correction coefficient is used for correcting the position of the transfer mechanism 200 for placing the first sheet on the supporting end surface 111.
Before the transfer mechanism 200 stacks the adsorbed second sheet on the first sheet, the image acquisition device 300 further acquires a second image of the third vacuum adsorption hole 220 adsorbing the second sheet to the grasping end face 210, and then sends the second image to the control system; the control system receives the second image, recognizes a second coordinate of the second sheet in the second image, compares the second coordinate with the reference coordinate, and determines a second position correction coefficient for correcting a position where the second sheet is stacked on the first sheet by the transfer mechanism 200 based on the comparison result.
The image capturing device 300 may be a camera, a video camera, a mobile phone with a camera, a tablet computer with a camera, or the like. And are not limiting in this application. The camera may be a Charge Coupled Device (CCD) camera.
The image acquisition device 300 is arranged, before the transfer mechanism 200 places the first sheet on the supporting end face, the transfer mechanism 200 firstly passes through the image acquisition device 300, so that the image acquisition device 300 photographs the grabbing end face 210 of the transfer mechanism 200, an image of the grabbing end face 210 adsorbed with the first sheet is acquired, after the image is sent to the control system, the control system can identify the coordinate of the first sheet relative to the grabbing end face 210, then the coordinate is compared with the reference coordinate, and if the coordinate is deviated, the position of the transfer mechanism 200 for placing the first sheet on the supporting end face 111 needs to be adjusted. Specifically, a first position correction coefficient may be calculated based on the comparison result, and the first position correction coefficient may be used to control the position of the transfer mechanism 200 when transferring the first sheet to the support end surface 111. The position of the second sheet is corrected in the same manner, and details are not repeated. Thereby, the alignment accuracy can be increased.
Taking the reference coordinate system as an X-Y coordinate system, the identified coordinates of the first sheet are 1.1X-1Y, whereas the reference coordinates are 1X-1Y, i.e., the coordinate error of the first sheet is 0.1X. Then, the first position correction coefficient may be-0.1X. More specifically, if 0.1X is the value of the rightward deviation of the first sheet, the first position correction coefficient is 0.1X leftward. Therefore, the position correction can be completed, and the alignment precision is increased.
As can be seen from the above, the image acquisition apparatus 300 is provided, which can correct the positions of the first sheet and the second sheet, and improve the alignment accuracy.
In the sheet alignment bonding system provided with the transfer mechanism 200 and the image acquisition device 300, the bonding specifically comprises the following steps:
the detailed steps are as follows:
s30: the grasping end face 210 grasps the first sheet with the third vacuum suction hole 220.
S31: the robot arm of the transfer mechanism 200 moves so that the grasping end face 210 faces the lens of the image pickup apparatus 300, and the image pickup apparatus 300 picks up an image of the grasping end face 210 to which the first sheet is adsorbed, and then sends the image to the control system.
S32: the control system receives the image, recognizes the coordinates of the first sheet, compares the recognized coordinates with the reference coordinates, and calculates a first position correction coefficient based on the comparison result.
S33: the control system controls the transfer mechanism 200 to place a first sheet on the supporting end surface 111 based on the first position correction coefficient, wherein the first sheet corresponds to the first vacuum adsorption hole 112; the first vacuum suction hole 112 sucks the first sheet.
S34: the grasping end face 210 grasps the second sheet with the third vacuum suction hole 220.
S35: the robot arm of the transfer mechanism 200 moves so that the grasping end face 210 faces the lens of the image pickup apparatus 300, and the image pickup apparatus 300 picks up an image of the grasping end face 210 to which the second sheet is adsorbed, and then sends the image to the control system.
S36: and after receiving the image, the control system identifies the coordinates of the second sheet, compares the identified coordinates with the reference coordinates, and calculates a second position correction coefficient according to the comparison result.
S37: the control system controls the transport mechanism 200 to stack the second sheet on the first sheet using the second position correction factor.
S38: the control system controls the heating member 130 to move into contact with the first sheet.
S39: the control system controls the heating member 130 to start heating and controls the distance between the press surface 121 and the support end surface 111 to be shortened, and heats and presses the first sheet and the second sheet.
The distance between the pressing surface 121 and the supporting end surface 111 is adjustable, and particularly, the pressing head 120 and the supporting platform 110 need to be moved for adjustment. In some embodiments, the alignment mechanism 100 further includes a lifter 140; the pressing head 120 is connected to the lifter 140, and the lifter 140 can drive the pressing head 120 to move toward or away from the supporting platform 110, so that the distance between the pressing surface 121 and the supporting end surface 111 is adjustable. When the pressing surface 121 needs to cooperate with the heating element 130 to press the first sheet and the second sheet, the lifter 140 may drive the pressing head 120 to move toward the supporting platform 110; when the pressing is completed, the lifter 140 may drive the pressing head 120 away from the supporting platform 110 to prevent the pressing head 120 from interfering with the operation of the transferring mechanism 200. That is, the bonding head 120 is driven to move by the lifter 140 so that the bonding head 120 can move toward or away from the support platform 110, increasing the degree of automation and improving the bonding efficiency.
In other embodiments, referring to fig. 3, the alignment mechanism 100 further includes a lifter 140; the supporting platform 110 is connected to the lifter 140, and the lifter 140 can drive the supporting platform 110 to move toward or away from the laminating head 120, so that the distance between the laminating surface 121 and the supporting end surface 111 is adjustable. When the pressing surface 121 needs to cooperate with the heating member 130 to press the first sheet and the second sheet, the lifter 140 may drive the supporting platform 110 to move toward the pressing head 120; after the pressing process is completed, the lifter 140 can drive the supporting platform 110 to move away from the pressing head 120, so as to prevent the pressing head 120 from interfering with the operation of the transferring mechanism 200. That is, the lifter 140 moves the supporting platform 110, so that the supporting platform 110 can move toward or away from the bonding head 120, thereby increasing the degree of automation and improving the bonding efficiency.
In still other embodiments, the alignment mechanism 100 further comprises a first lifter and a second lifter; the pressing head 120 is connected with a first lifter, and the first lifter can drive the pressing head 120 to move towards the direction close to or away from the supporting platform 110; the supporting platform 110 is connected with a second lifter, and the second lifter can drive the supporting platform 110 to move towards or away from the pressing head 120; so that the distance between the press-fit surface 121 and the support end surface 111 is adjustable. When the pressing surface 121 needs to cooperate with the heating member 130 to press the first sheet and the second sheet, the first lifter can drive the pressing head 120 to move towards the direction of closing the supporting platform 110, and the second lifter can drive the supporting platform 110 to move towards the direction of closing the pressing head 120; after the pressing process is completed, the first lifter can drive the pressing head 120 to be far away from the supporting platform 110, and the second lifter can drive the supporting platform 110 to be far away from the pressing head 120. Therefore, when the pressing is needed, the distance between the pressing surface 121 and the supporting end surface 111 can be shortened rapidly; after the pressing is completed, the distance between the pressing surface 121 and the supporting end surface 111 can be quickly pulled away, so that the pressing head 120 is prevented from interfering the transferring mechanism 200, and the production efficiency can be accelerated.
In some embodiments, referring to fig. 3, the sheet bonding and aligning system further includes a loading table 400, and the loading table 400 is used for placing the sheets to be bonded. Specifically, the method comprises the following steps: the feeding table 400 is used for supporting the first base material to which the first sheet is fixed before the first sheet is placed on the supporting end surface 111; the feeding table 400 is also used to support and secure the second sheet or a second substrate to which the second sheet is secured, before the second sheet is laminated to the first sheet. It can be understood that, when the second sheet is a display back plate, the display back plate may be directly fixed on the feeding table 400 without being supported by the second substrate. When the second sheet is other materials that are not conveniently fixed on the feeding table 400, a second substrate needs to be disposed for supporting.
The material loading platform 400 can be provided with a clamp, and when a first base material is placed on the material loading platform 400, the clamp can clamp the first base material, so that the first base material is fixed. The first substrate may be a transfer substrate carrying LED chips. For the same reason, when the second substrate is placed on the loading platform 400, the clamp can clamp the second substrate, so as to fix the second substrate. By providing the feeding table 400, the first sheet and the second sheet can be temporarily stored before being grabbed by the transfer mechanism 200, so that the convenience in use is increased, and the preparation efficiency is improved.
In some embodiments, referring to fig. 3, the sheet bonding alignment system further includes a blanking table 500, where the blanking table 500 is used for supporting the bonded sheet, and in particular, the blanking table 500 is used for supporting the bonded first sheet and the bonded second sheet after the bonding of the first sheet and the second sheet is completed by heating and pressing. After the first sheet and the second sheet are bonded, the transfer mechanism 200 may transfer the bonded finished product to the feeding table 500 for temporary storage by using the grabbing end surface 210 and the third vacuum absorption hole 220, so as to increase the convenience of operation.
In some embodiments, the stitching head 120 is provided with a pressure sensor for detecting a pressure value of the second sheet pressed by the stitching surface 121. The heating member 130 is provided with a temperature sensor for detecting a temperature value of the heating member 130 after heating. For example, the pressure sensor and the temperature sensor are electrically connected to the control system, the detected pressure value and temperature value can be fed back to the control system, and when the control system detects that the pressure value is within the reference pressure range, the control system can control the distance between the pressing head 120 and the supporting platform 110 to stop changing, that is, the elevator 140 to stop operating, or the first elevator and the second elevator to stop operating. When the control system detects that the temperature of the heating member 130 is within the reference temperature range, the control system controls the heating member 130 to stop heating. Thereby, it is possible to prevent the first sheet and the second sheet from being damaged by overheating or overpressure.
In some embodiments, the alignment mechanism 100 can further include a base 150, and the base 150 can be used to mount a control system, to carry the support platform 110, the lifter 140, and the stitching head 120, etc.
It should be understood that the application of the present application is not limited to the above examples, and that modifications or changes may be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims.
Claims (10)
1. A sheet bonding alignment system, comprising: an alignment mechanism; the alignment mechanism comprises a supporting platform and a pressing head;
the supporting platform is provided with a supporting end face and a first vacuum adsorption hole penetrating through the supporting end face; the pressing head is provided with a pressing surface; the pressing surface faces the supporting end surface, and the distance between the pressing surface and the supporting end surface is adjustable;
the first vacuum adsorption hole is used for adsorbing a sheet to be bonded, and the press-fit head is used for press-fitting the sheet adsorbed by the first vacuum adsorption hole.
2. The sheet bonding alignment system of claim 1, wherein the support platform is provided with a plurality of the first vacuum suction holes.
3. The system as claimed in claim 2, wherein the first vacuum suction holes are uniformly distributed on the supporting platform.
4. The sheet bonding alignment system of claim 1, wherein the supporting platform further comprises a chamber in communication with the first vacuum suction hole; a heating element is arranged in the cavity and corresponds to the first vacuum adsorption hole, and the heating element can move towards the direction close to or far away from the first vacuum adsorption hole; the heating element is used for heating the sheets to be bonded.
5. The system of claim 4, wherein a heat-conducting member is further disposed in the chamber, the heat-conducting member is fixedly connected to the heating element, and a second vacuum-suction hole corresponding to the first vacuum-suction hole is disposed on the heat-conducting member; the heating element and the heat conducting element can move towards the direction close to or far away from the first vacuum adsorption hole at the same time;
the second vacuum adsorption hole is used for adsorbing a sheet to be bonded, and the heat conducting member is used for transferring the heat of the heating member to the sheet to be bonded.
6. The sheet bonding alignment system as claimed in claim 4, wherein the heating member has a heating end surface facing the first vacuum suction hole and parallel to the supporting end surface; the heating end face is used for contacting with the sheet to be bonded.
7. The sheet bonding registration system of claim 1, further comprising: the transferring mechanism comprises a grabbing end face, and a third vacuum adsorption hole is formed in the grabbing end face; the third vacuum adsorption hole is used for adsorbing a sheet needing to be bonded to the grabbing end face, and the transfer mechanism is used for transferring the adsorbed sheet needing to be bonded to the supporting end face.
8. The sheet bonding registration system of claim 7, further comprising: an image acquisition device; the image acquisition equipment is used for acquiring an image of the third vacuum adsorption hole adsorbing the sheet to be bonded, and the image is used for correcting the position of the transfer mechanism for placing the sheet to be bonded on the supporting end face.
9. The sheet bonding alignment system of any one of claims 1 to 8, further comprising: a lifter; the pressing head is connected with the lifter, and the lifter can drive the pressing head to move towards the direction close to or away from the supporting platform, so that the distance between the pressing surface and the supporting end surface is adjustable;
or, the alignment system further comprises: a lifter; the supporting platform is connected with the lifter, and the lifter can drive the supporting platform to move towards the direction close to or away from the pressing head, so that the distance between the pressing surface and the supporting end surface is adjustable;
or, the alignment mechanism further comprises: a first lifter and a second lifter; the pressing head is connected with the first lifter, and the first lifter can drive the pressing head to move towards the direction close to or away from the supporting platform; the supporting platform is connected with the second lifter, and the second lifter can drive the supporting platform to move towards the direction close to or away from the pressing head; so that the distance between the pressing surface and the supporting end surface is adjustable.
10. The sheet bonding registration system of any one of claims 1-8, further comprising: the device comprises a feeding table and a discharging table, wherein the feeding table is used for supporting sheets to be bonded; the blanking table is used for supporting the bonded sheet.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110888275.3A CN115938970A (en) | 2021-08-03 | 2021-08-03 | Sheet bonding alignment system |
| PCT/CN2022/103748 WO2023011080A1 (en) | 2021-08-03 | 2022-07-04 | Sheet bonding and alignment system and sheet bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110888275.3A CN115938970A (en) | 2021-08-03 | 2021-08-03 | Sheet bonding alignment system |
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| CN115938970A true CN115938970A (en) | 2023-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110888275.3A Pending CN115938970A (en) | 2021-08-03 | 2021-08-03 | Sheet bonding alignment system |
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| Country | Link |
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| CN (1) | CN115938970A (en) |
| WO (1) | WO2023011080A1 (en) |
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| CN116313838B (en) * | 2023-03-07 | 2023-07-28 | 天津中科晶禾电子科技有限责任公司 | Three-dimensional packaging method and three-dimensional packaging device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6894034B2 (en) * | 2016-07-25 | 2021-06-23 | 株式会社アドテックエンジニアリング | Work suction holding method, work stage and exposure equipment |
| CN206201541U (en) * | 2016-10-28 | 2017-05-31 | 深圳市标王工业设备有限公司 | Vacuum positioner suitable for heating pressing machine |
| CN206834159U (en) * | 2017-04-13 | 2018-01-02 | 深圳市铭德自动化设备有限公司 | A kind of accurate micro- dress bonding apparatus of submicron order |
| CN109001925A (en) * | 2018-08-22 | 2018-12-14 | 湖北优利迪显示科技股份有限公司 | A kind of liquid-crystalline glasses piece contraposition applying machine |
| CN110703473B (en) * | 2019-10-29 | 2022-05-31 | 武汉华星光电技术有限公司 | Equipment for binding vacuum adsorption base and display panel |
| CN111550481B (en) * | 2020-04-29 | 2021-08-17 | 四川大学 | Automatic precision alignment laminating system |
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