CN213547942U - Multi-pressure head hot-pressing backflow device - Google Patents
Multi-pressure head hot-pressing backflow device Download PDFInfo
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- CN213547942U CN213547942U CN202022731903.0U CN202022731903U CN213547942U CN 213547942 U CN213547942 U CN 213547942U CN 202022731903 U CN202022731903 U CN 202022731903U CN 213547942 U CN213547942 U CN 213547942U
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Abstract
The utility model belongs to the technical field of chip hot pressing reflow soldering, a many pressure heads hot pressing reflux unit is disclosed, the on-line screen storage device comprises a base, a machine support, hot pressing mechanism and base platform, the frame is fixed on the base, hot pressing mechanism sets up the top in the frame, hot pressing mechanism includes the mounting panel, a plurality of pressure head units of array arrangement on the mounting panel and the drive unit that the drive mounting panel reciprocated, the upper end and the mounting panel of pressure head unit are connected, the lower extreme of pressure head unit is equipped with the plane pressure head, the base platform sets up between pressure head unit and base, and the plane pressure head is just right with the chip base plate of placing the processing of treating on the base platform. Adopt the utility model discloses, can reduce the whole roughness requirement to big plane clamp plate, make the chip keep unchangeable at the relative position of backward flow in-process, stopped backward flow in-process chip skew, short circuit, showy possibility, improved the roughness of chip simultaneously, improve luminous and display effect.
Description
Technical Field
The utility model belongs to the technical field of chip hot pressing reflow soldering, especially, relate to a many pressure heads hot pressing reflux unit.
Background
With the size of the flip chip becoming smaller and smaller, the number of IO pins to be packaged becomes larger and smaller, the packaging density also becomes higher and higher, and the problems of chip deviation, short circuit, floating and the like are easily caused due to different surface tensions of the positive electrode and the negative electrode in the free reflow process of the solder paste, so that the once-through rate of high-density packaging is limited, and the high-density packaging cost is always high. In addition, the problem of deformation and warpage of the large-plane pressing plate in the manufacturing and reflow processes is solved, and the material cost of the substrate and the control cost of the process are greatly increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a many pressure heads hot pressing reflux unit can reduce the whole roughness requirement to big plane clamp plate, makes the chip keep unchangeable at the relative position of backward flow in-process, has stopped backward flow in-process chip skew, short circuit, showy possibility, has still improved the roughness of chip simultaneously, improves luminous and display effect.
In order to solve the technical problem, the utility model provides a many pressure heads hot pressing reflux unit, it includes base, frame, hot pressing mechanism and base platform, the frame is fixed on the base, hot pressing mechanism sets up the top of frame, hot pressing mechanism includes that mounting panel, array are arranged a plurality of pressure head units and drive on the mounting panel the drive unit that the mounting panel reciprocated, the upper end of pressure head unit with the mounting panel is connected, the lower extreme of pressure head unit is equipped with the plane pressure head, the base platform sets up pressure head unit with between the base, just the plane pressure head is with placing the chip base plate of treating processing on the base platform is just right.
As the utility model discloses an optimal scheme, the below of pressure head unit is equipped with flexible buffer film, flexible buffer film sets up the plane pressure head with between the base platform, flexible buffer film is released and is retrieved by receipts spool mechanism drive.
As the utility model discloses a preferred scheme, the plane pressure head is made by high heat conduction, low heat altered shape material, be equipped with heater and cooler on the plane pressure head, the heater is located the one side that is close to pressure head hot pressing plane, the cooler is located the one side of keeping away from pressure head hot pressing plane.
As the preferred scheme of the utility model, the cladding has the heat insulation layer around the plane pressure head.
As the preferred scheme of the utility model, the pressure head unit is still including the pressure sensor who is used for detecting plane pressure head pressure and the temperature sensor who is used for detecting plane pressure head temperature.
As the utility model discloses an optimal scheme, the plane pressure head is made by transparent material, be equipped with laser emitter on the plane pressure head, the laser that laser emitter sent can see through the plane pressure head is direct to the chip heating.
As the preferred scheme of the utility model, the pressure head unit still includes the pressure head unit is equipped with the pressure sensor who is used for detecting plane pressure head pressure.
As the preferred scheme of the utility model, the upper surface of base platform is equipped with the flexible high temperature resistant coating of one deck.
As the preferred scheme of the utility model, be equipped with the base plate fixed establishment who is used for the fixed chip base plate of treating processing on the base platform.
As the preferred scheme of the utility model, base platform is connected with and can sends into it or sees off pressure head unit with base platform moving mechanism between the base.
The embodiment of the utility model provides a pair of many pressure heads hot pressing reflux unit compares with prior art, and its beneficial effect lies in:
the utility model has the advantages that the area of a single plane pressure head is reduced by arranging a plurality of pressure head units, the pressure head with a single large area is prevented from being not smooth enough due to large thermal expansion deformation degree, and a plurality of plane pressure heads can be simultaneously hot-pressed without affecting the working efficiency; therefore, the scheme reduces the area of one-time hot pressing, and divides a large substrate plane into a plurality of small hot pressing planes, so that the requirement on the integral flatness of the large plane pressing plate is reduced, and large-area and high-precision hot pressing can be realized; in addition, the packaging mode with pressure backflow enables the relative position of the chip to be kept unchanged in the backflow process, the possibility of chip deviation, short circuit and floating in the backflow process is eliminated, meanwhile, the flatness of the flip chip is improved, and the light emitting and displaying effects are improved. The technology can be suitable for the fields of Mini/Micro LED display and backlight, is particularly suitable for packaging bonding processes of anisotropic conductive welding glue, solder paste, flip chip prefabricated solder bumps and the like, can obviously improve the one-time through rate of a large amount of packaging processes, is high in bonding yield, and reduces the production cost of products.
Drawings
Fig. 1 is a schematic structural view of a multi-pressure head hot-pressing backflow device provided by the present invention;
FIG. 2 is a schematic structural view (one) of the head unit;
fig. 3 is a schematic structural view (two) of the head unit;
in the figure:
1. a base;
2. a frame;
3. the device comprises a hot pressing mechanism 31, a mounting plate 32, a pressure head unit 33, a driving unit 321, a plane pressure head 322, a heat insulating layer 323, a heater 324, a cooler 325, a pressure sensor 326, a temperature sensor 327 and a laser emitter;
4. a base platform 41, a flexible high-temperature-resistant coating 42 and a substrate fixing mechanism;
5. a flexible buffer film;
6. receive and release spool mechanism.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In the description of the present invention, it is to be understood that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are used in a generic sense, e.g., fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, the embodiment of the utility model provides a pair of many pressure heads hot pressing reflux unit, it includes base 1, frame 2, hot pressing mechanism 3 and base platform 4, frame 2 is fixed on the base 1, hot pressing mechanism 3 sets up the top of frame 2, hot pressing mechanism 3 includes that mounting panel 31, array are arranged a plurality of pressure head units 32 and drive on the mounting panel 31 the drive unit 33 that mounting panel 31 reciprocated, pressure head unit 32's upper end with mounting panel 31 connects, pressure head unit 32's lower extreme is equipped with plane pressure head 321, base platform 4 sets up pressure head unit 32 with between the base 1, just plane pressure head 321 is with place the chip base plate of treating processing on the base platform 4 is just right.
Therefore, the embodiment of the present invention, by providing the plurality of pressing head units 32, reduces the area of the single plane pressing head 321, prevents the pressing head from being not flat enough due to large thermal expansion and deformation degree of the single large-area pressing head, and the plurality of plane pressing heads 321 can be hot pressed simultaneously without affecting the working efficiency; therefore, the scheme reduces the area of one-time hot pressing, and divides a large substrate plane into a plurality of small hot pressing planes, so that the requirement on the integral flatness of the large plane pressing plate is reduced, and large-area and high-precision hot pressing can be realized; in addition, the packaging mode with pressure backflow enables the relative position of the chip to be kept unchanged in the backflow process, the possibility of chip deviation, short circuit and floating in the backflow process is eliminated, meanwhile, the flatness of the flip chip is improved, and the light emitting and displaying effects are improved. The technology can be suitable for the fields of Mini/Micro LED display and backlight, is particularly suitable for packaging bonding processes of anisotropic conductive welding glue, solder paste, flip chip prefabricated solder bumps and the like, can obviously improve the one-time through rate of a large amount of packaging processes, is high in bonding yield, and reduces the production cost of products.
Illustratively, a flexible buffer film 5 is arranged below the pressing head unit 32, and the flexible buffer film 5 is arranged between the plane pressing head 321 and the base platform 4. Wherein, this flexible buffer membrane 5 is preferred to be the teflon membrane, and this flexible buffer membrane 5 can cushion the size deviation of chip in the manufacture process, can prevent that welding material from gluing dirty to the lower surface of plane pressure head 321, can also play the effect of protection chip, avoids the chip to be damaged by the pressure head.
Further, in order to realize the automation of changing the flexible buffer film 5, the flexible buffer film 5 is driven by the winding and unwinding shaft mechanism 6 to be released and recovered. From this, flexible buffer film 5 is every time accomplished a hot pressing process after, through receive and release the flexible buffer film 5 of spool mechanism 6 drive and remove, packs up old flexible buffer film 5, exposes new flexible buffer film 5 simultaneously and carries out next hot pressing process.
Illustratively, to provide heat for the hot press reflow process, the indenter unit 32 of this embodiment provides two specific embodiments:
referring to fig. 2, in the first mode, a heating manner for heating the planar indenter 321 is adopted, specifically: the planar pressure head 321 is made of high-thermal-conductivity and low-thermal-deformation materials such as tungsten steel, silicon carbide ceramic, titanium alloy and copper, so that the flatness of the planar pressure head 321 is not affected by excessive deformation during heating; the periphery of the planar pressure head 321 is coated with the heat insulating layer 322 to reduce heat loss, so that the temperature on the hot pressing plane of the planar pressure head 321 is kept as consistent as possible, and the uneven heating of the chip on the substrate during hot pressing is avoided; the heat insulating layer 322 may be made of heat insulating rubber or other materials with good heat insulating effect; the plane pressure head 321 is provided with a heater 323, the heater 323 is positioned at one side close to a hot-pressing plane of the pressure head, so that heat can be better concentrated on the hot-pressing plane, and the heating mode can be a direct heating mode such as a heating rod, a heating wire and the like; the plane pressure head 321 is provided with a cooler 324, the cooler 324 is located on one side far away from the hot pressing plane of the pressure head to ensure that the plane pressure head 321 can be rapidly cooled after hot pressing, and the cooling mode can be air cooling, water cooling, air cooling and other forced convection heat exchange modes. Further, in order to precisely control the temperature and apply the pressure, the head unit 32 further includes a pressure sensor 325 for detecting the pressure of the flat indenter 321 and a temperature sensor 326 for detecting the temperature of the flat indenter 321.
Referring to fig. 3, the second heating method for heating the chip is specifically: the plane pressure head 321 is made of a transparent material, a laser emitter 327 is arranged on the plane pressure head 321, and laser emitted by the laser emitter 327 can directly heat the chip through the plane pressure head 321. Further, in order to apply the pressure precisely, the indenter unit 32 further includes a pressure sensor 325 provided to the indenter unit 32 for detecting the pressure of the planar indenter 321; and temperature control is controlled by the operating power and operating time of the laser transmitter 327.
Illustratively, the upper surface of the base platform 4 is provided with a layer of flexible high temperature-resistant coating 41, and the material of the flexible high temperature-resistant coating 41 may be rubber, teflon, silica gel, or the like, and is used for buffering size deviation in the chip substrate manufacturing process.
For example, in order to fix the chip substrate on the base platform 4, a substrate fixing mechanism 42 for fixing the chip substrate to be processed is provided on the base platform 4. The substrate fixing mechanism 42 may be a vacuum adsorption mechanism, a mechanical clamping mechanism, a steel mesh fixing mechanism, or the like.
Illustratively, the base platform 4 is connected to a base platform moving mechanism (not shown) capable of moving the base platform into and out of the space between the ram unit 32 and the base 1, such as: an existing robot.
Implement the utility model provides a pair of many pressure heads hot pressing reflux unit, it includes following step:
the method comprises the following steps: placing the chip substrate with the mounted chip on the base platform 4, fixing the chip substrate in position by the substrate fixing mechanism 42, and then conveying the base platform 4 to the position right below the pressure head unit 32 by the base platform moving mechanism, so that the plane pressure head 321 is opposite to the chip substrate to be processed;
step two: a layer of flexible buffer film 5 is arranged between the chip substrate to be processed and the plane pressure head 321;
step three: the planar pressure head 321 is directly heated by the heater 323, a temperature change curve and a pressure change curve of the planar pressure head 321 are set according to actual requirements, and then the planar pressure head is pressed down;
or, the chip is directly heated by the laser transmitter 327, and the power of the laser, the working time of the laser, and the pressure change curve are set according to actual requirements, and then the chip is pressed down;
step four: hot-pressing and reflowing for a period of time (the specific time depends on the performance of the welding material), so that the chip electrode and the pad electrode are rapidly bonded;
step five: after the hot-pressing reflux is completed, the planar pressure head 321 is cooled by the cooler 324 or stops laser heating, and after the planar pressure head 321 is cooled to a certain temperature, the planar pressure head 321 is lifted; taking the chip substrate off the base platform 4 and cooling in the air; the winding and unwinding shaft mechanism 6 drives the flexible buffer film 5 to move, a new flexible buffer film 5 is exposed, and a new round of hot pressing operation is prepared.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.
Claims (10)
1. The utility model provides a many pressure heads hot pressing reflux unit, its characterized in that, includes base, frame, hot pressing mechanism and base platform, the frame is fixed on the base, hot pressing mechanism sets up the top of frame, hot pressing mechanism includes mounting panel, array arrangement a plurality of pressure head units and drive on the mounting panel the drive unit that the mounting panel reciprocated, the upper end of pressure head unit with the mounting panel is connected, the lower extreme of pressure head unit is equipped with the plane pressure head, the base platform sets up pressure head unit with between the base, just the plane pressure head is in the chip base plate of treating processing on the base platform is just right.
2. The multi-press-head hot-pressing backflow device according to claim 1, wherein a flexible buffer film is arranged below the press head unit, the flexible buffer film is arranged between the plane press head and the base platform, and the flexible buffer film is driven to release and recover by a winding and unwinding shaft mechanism.
3. The multi-ram hot-pressing reflow apparatus according to claim 1 or 2, wherein the planar ram is made of a high thermal conductivity and low thermal deformation material, and the planar ram is provided with a heater and a cooler, the heater is located at a side close to the hot-pressing plane of the ram, and the cooler is located at a side far from the hot-pressing plane of the ram.
4. The multi-ram hot-press reflow apparatus of claim 3, wherein the planar ram is surrounded by a thermal insulation layer.
5. The multi-ram hot-press reflow apparatus of claim 3, wherein the ram unit further comprises a pressure sensor for detecting a planar ram pressure and a temperature sensor for detecting a planar ram temperature.
6. The multi-pressure head hot-pressing reflow device according to claim 1 or 2, wherein the planar pressure head is made of a transparent material, a laser emitter is disposed on the planar pressure head, and laser emitted by the laser emitter can directly heat the chip through the planar pressure head.
7. The multi-ram hot-press reflow apparatus of claim 6, wherein the ram unit further comprises a pressure sensor provided with the ram unit for detecting a planar ram pressure.
8. The multi-ram hot-press reflow apparatus of claim 1, wherein the upper surface of the base platform is provided with a flexible high temperature resistant coating.
9. The multi-head hot-press reflow apparatus of claim 1, wherein the base platform is provided with a substrate fixing mechanism for fixing a chip substrate to be processed.
10. The multi-ram hot-press reflow apparatus of claim 1, wherein the base platen is connected with a base platen moving mechanism that can move it in and out between the ram unit and the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022731903.0U CN213547942U (en) | 2020-11-23 | 2020-11-23 | Multi-pressure head hot-pressing backflow device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022731903.0U CN213547942U (en) | 2020-11-23 | 2020-11-23 | Multi-pressure head hot-pressing backflow device |
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| CN213547942U true CN213547942U (en) | 2021-06-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112333932A (en) * | 2020-11-23 | 2021-02-05 | 深圳远芯光路科技有限公司 | Multi-pressure-head hot-pressing backflow device and operation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112333932A (en) * | 2020-11-23 | 2021-02-05 | 深圳远芯光路科技有限公司 | Multi-pressure-head hot-pressing backflow device and operation method thereof |
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