WO2017169954A1 - Bonding tool cooling device, bonding device provided with same, and bonding tool cooling method - Google Patents

Bonding tool cooling device, bonding device provided with same, and bonding tool cooling method Download PDF

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Publication number
WO2017169954A1
WO2017169954A1 PCT/JP2017/011116 JP2017011116W WO2017169954A1 WO 2017169954 A1 WO2017169954 A1 WO 2017169954A1 JP 2017011116 W JP2017011116 W JP 2017011116W WO 2017169954 A1 WO2017169954 A1 WO 2017169954A1
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Prior art keywords
bonding
tool
bonding tool
cooling
semiconductor chip
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PCT/JP2017/011116
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French (fr)
Japanese (ja)
Inventor
寺田　勝美
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東レエンジニアリング株式会社
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Publication of WO2017169954A1 publication Critical patent/WO2017169954A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Definitions

  • the present invention relates to a bonding tool cooling device and a bonding tool cooling method for a bonding apparatus that heats and presses a semiconductor chip component on a circuit board for mounting.
  • thermocompression bonding method As a method of mounting a semiconductor chip component on a circuit board, a thermocompression bonding method, a soldering method, or the like is used.
  • a ceramic heater provided in the bonding tool is heated at a high speed, and the thermosetting resin film or thermosetting resin paste filled between the semiconductor chip component and the circuit board is heated and cured to perform thermocompression bonding. is doing.
  • the temperature of the bonding tool is raised to the solder melting temperature, the semiconductor chip component is mounted on the circuit board, and then cooled to below the solid phase temperature to mount the next semiconductor chip component.
  • a bonding apparatus for mounting a semiconductor chip component on a circuit board has a structure as shown in FIG.
  • the bonding apparatus 100 includes a bonding tool 10 that sucks and holds the semiconductor chip component 4 to press and heat the circuit board 2 and a substrate stage 20 that sucks and holds the circuit board 2.
  • a chip slider 26 is provided in a transport means 25 that horizontally transports the semiconductor chip component 4.
  • the semiconductor chip component 4 conveyed by the chip slider 26 is delivered to the bonding tool 10.
  • the bonding tool 10 has a structure as shown in FIG.
  • a holder portion 11 is provided at the tip of the bonding tool 10, and a heater base 12 is fixed to the lower surface of the holder portion 11 with mounting bolts.
  • a heater 14 is disposed on the lower surface of the heater base 12 via a heat insulating block 13, and the heater 14 and the heat insulating block 13 are fixed by bolts (not shown).
  • An attachment tool 15 for attracting and holding the semiconductor chip component 4 is provided on the lower surface of the heater 14.
  • An attachment adsorption flow path 17 is formed in the heat insulating block 13 and the heater 14, and the attachment tool 15 is sucked by vacuum through the flow path.
  • a cooling air flow path 18 is formed in the heat insulation block 13, and is configured such that compressed air is supplied from a pressure air source (not shown) and air is blown onto the upper surface of the heater 14 to cool it.
  • the bonding tool 10 When the attachment tool 15 receives the semiconductor chip component 4 when the attachment tool 15 receives the cooling, the bonding tool 10 is deformed by melting or softening the solder at the tip of the bump 5 of the semiconductor chip component 4 when the heater 14 receives it at a high temperature. It has been done to prevent that.
  • the bonding tool 10 When the resin film is laminated on the circuit surface of the semiconductor chip component 4, the bonding tool 10 needs to be cooled in order to prevent the resin film from reacting due to high temperature and proceeding curing.
  • Patent Document 1 discloses a method in which an attachment tool is brought into direct contact with a heat radiating member and cooled by heat propagation as a method for increasing the cooling time of the heater.
  • the cooling method described in Patent Document 1 requires a step in which the bonding tool is raised after the bonding is finished, the substrate stage is moved to a position where the bonding tool is brought into contact with the heat radiating member unit, and the bonding tool is lowered and cooled. There is a problem that these extra tact times are required and the production efficiency is lowered.
  • an object of the present invention is to provide a bonding tool cooling apparatus capable of efficiently cooling a bonding tool in a short time, a bonding apparatus equipped with the bonding tool, and a bonding tool cooling method.
  • a bonding tool cooling device for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater, A cooling member that cools by contacting the attachment tool surface,
  • the cooling member is a bonding tool cooling device provided in a transfer means for transferring a semiconductor chip component in a horizontal direction.
  • the invention according to claim 2 is the bonding tool cooling device according to claim 1, It is a bonding tool cooling device having a function of sucking and holding the attachment tool by providing a suction hole in the cooling member and depressurizing the inside of the suction hole.
  • the transporting means is a bonding tool cooling device for transporting the semiconductor chip component to a height between the recognition means for recognizing the image of the semiconductor chip component and the bonding tool.
  • Claim 4 is provided with the bonding tool cooling device in any one of Claims 1-3, A bonding apparatus that heats and presses a semiconductor chip component and mounts it on a circuit board using the bonding tool.
  • the bonding apparatus includes a plurality of bonding tools, and the bonding tool cooling apparatus has a function of cooling another bonding tool when one bonding tool mounts the semiconductor chip component on the circuit board.
  • a bonding tool cooling method for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater, After the attachment tool has bonded the semiconductor chip component to the circuit board and then lifted and is waiting to supply the semiconductor chip component, Move the conveying means to convey the semiconductor chip parts below the attachment tool, Contact the cooling member provided on the transport means with the attachment tool, This is a bonding tool cooling method for cooling the attachment tool surface.
  • the bonding tool can be efficiently cooled in a short time.
  • the cooling member is provided in the conveying means for conveying the semiconductor chip component, the semiconductor chip component can be supplied to the attachment tool immediately after the bonding tool is cooled, and the delivery time is shortened.
  • the attachment tool is released from the adsorption by the bonding tool and the cooling member side is adsorbed, so that the delivery to the chip slider can be performed.
  • the attachment tool is separated from the bonding tool, and the cooling speed can be increased by reducing the heat capacity on the bonding tool side and increasing the air cooling area on the attachment tool side.
  • the transport means transports the semiconductor chip component to a height between the recognition means for recognizing the image of the semiconductor chip component and the bonding tool
  • the semiconductor chip component is transferred to the bonding tool. It can be performed at the shortest distance and the delivery time can be shortened. Further, during the semiconductor chip transfer operation, the amount of positional deviation of the semiconductor chip mounted on the substrate can be measured by the lower visual field recognition means for recognizing the substrate side of the two visual field recognition means.
  • one bonding tool mounts a semiconductor chip component on a substrate and simultaneously cools another bonding tool, continuous mounting without a cooling waiting time becomes possible.
  • the transport means for transporting the semiconductor chip component is attached to the attachment tool. Since the attachment tool surface is cooled by moving it below the tool and bringing the cooling member provided in the conveying means into contact with the attachment tool, the bonding tool can be efficiently cooled in a short time without contact.
  • FIG. 1 is a schematic side view of a bonding apparatus according to an embodiment of the present invention. It is a perspective view of the conveyance means which concerns on embodiment of this invention. It is a schematic plan view of the conveyance means which concerns on embodiment of this invention. It is a temperature rise prevention measure for the cooling member according to the embodiment of the present invention, (a) a method for cooling the cooling member with gas, (b) a method for connecting the cooling member to a heat sink, and (c) a heat capacity of the cooling member. It is a figure explaining the method to increase, and the method of providing the (d) radiation fin. It is an operation
  • the direction toward the bonding apparatus 1 is the X axis as the left-right direction, the Y axis as the front direction, the Z axis as the axis perpendicular to the XY plane composed of the X axis and the Y axis, and the direction rotating around the Z axis. Is the ⁇ direction. Further, in the bonding apparatus 1, the same symbols are used for components common to the bonding apparatus 100 in FIG.
  • the bonding apparatus 1 includes a bonding tool 10 that presses and heats a semiconductor chip component 4 (hereinafter referred to as a chip component 4) to a circuit board 2, a substrate stage 20 that holds the circuit board 2 by suction, and a chip component 4 that is bonded to the circuit board 2.
  • 10 is provided with a conveying means 25 for horizontally conveying to 10, an upper visual field recognizing means for recognizing an alignment mark attached to the chip component 4, and a lower visual field recognizing means for recognizing the alignment mark attached to the circuit board 2.
  • the recognizing unit 30 has two fields of view and a control unit 50 that controls the entire bonding apparatus 1.
  • the bonding tool 10 has the structure shown in FIG. 14 and is composed of the members described in the background art.
  • the transport means 25 includes a chip slider 26 and a transport rail 27 that horizontally transport the chip component 4 from the chip supply unit to the lower side of the attachment tool 15.
  • the chip slider 26 conveys semiconductor chip components to a height between the bonding tool 10 and the recognition means 30.
  • FIG. 3 shows a state in which the chip slider 26 is referenced from the upper side in the Z direction.
  • the chip slider 26 is provided with a chip adsorbing portion 28 that adsorbs and holds the chip component 4 and a cooling member 29 that cools the bonding tool 10 by surface contact with the attachment tool 15.
  • the cooling member 29 preferably has a high thermal conductivity (50 W / m ⁇ K or more) and is not thermally deformed.
  • Specific examples of the material having heat conductivity and heat resistance include aluminum nitride and silicon carbide.
  • the present invention is not limited to this.
  • FIG. FIG. 4A shows the case where the cooling member 29 is cooled by jetting gas from the nozzle 29N, and FIG.
  • FIG. 4B shows the case where the low-temperature heat sink 29S and the cooling member 29 are connected by the heat transfer member for cooling.
  • 4 (c) is for increasing the heat capacity of the cooling member 29 to mitigate the temperature rise
  • FIG. 4 (d) is for dissipating heat by providing the cooling member 29 with a radiating fan 29F. You may combine, and you may make another temperature rise prevention means.
  • the chip part 4 is transported so that the chip slider 26 of the transport means 25 is arranged below the bonding tool 10 (FIG. 6A), and the bonding tool 10 is lowered (FIG. 6B). Then, the chip component 4 is picked up from the chip slider 26 (FIG. 6C) (step ST01). The chip slider 26 moves to the chip component supply unit, and the bonding tool 10 moves up to the standby position.
  • the recognition means 30 having two fields of view is inserted between the circuit board 2 and the bonding tool 10.
  • the recognition means recognizes an image of the alignment marks attached to the chip component 4 and the circuit board 2 (step ST02).
  • the two-view recognition means 30 is moved to the standby position, and the bonding tool 10 is aligned in the ⁇ direction and the substrate stage 20 is aligned in the XY direction based on the data recognized as described above (step ST03).
  • step ST04 the bonding tool 10 is lowered (step ST04).
  • step ST05 the heater 14 of the bonding tool 10 is heated to bond the chip component 4 to the circuit board 2 (step ST05).
  • step ST06 the bonding tool 10 is raised to the standby position.
  • cooling air is supplied to the cooling air flow path 18 provided in the bonding tool 10 to start the internal cooling of the heater 14 (step ST07).
  • the cooling member 29 of the chip slider 26 is moved to the lower side of the bonding tool 10, and then the bonding tool is lowered to attach the attachment tool 15 to the cooling member. 29 is contacted (FIG. 7C), and surface cooling of the attachment tool 15 is started (step ST09).
  • the chip slider 26 moves in a state where the chip component 4 to be bonded next is adsorbed by the chip adsorbing portion 28.
  • the recognition means 30 having two fields of view is inserted between the circuit board 2 and the bonding tool 10.
  • a function of delivering the attachment tool 15 to the chip slider 26 can be provided by providing the suction hole 29V as shown in FIG. 8A in the cooling member 29 and communicating with a decompression mechanism (not shown). That is, after the attachment tool 15 is brought into contact with the cooling member 29 (FIG. 8B), the inside of the suction hole 29V is depressurized and is passed through the attachment suction flow path 17 (see FIG. 14) (by the bonding tool 10). If the suction holding of the attachment tool 15 is released, the attachment tool 15 is separated from the heater 14, and the delivery is completed by suction holding on the chip slider 26 side (FIG. 8C). By doing so, the heat capacity of the heater 14 is reduced and high-speed cooling is possible. In addition, since the area where the attachment tool 15 comes into contact with air is increased, the cooling efficiency is increased, and the cooling speed can be increased.
  • step ST10 it is confirmed whether or not the heater 14 has reached an appropriate temperature.
  • the temperature at which the heater 14 does not melt the solder for example, 150 ° C. or less is an appropriate temperature
  • the temperature at which the resin curing reaction does not start for example, 80 ° C. or less.
  • step ST11 when the proper temperature is reached, the cooling air for cooling the inside of the heater 14 is stopped, the bonding tool 10 is raised (the same arrangement as in FIG. 7B, the contact between the cooling member 29 of the chip slider 26 and the attachment tool 15). The cooling of the bonding tool 10 is finished (step ST11).
  • step ST12 the chip slider 26 is moved so that the chip component 4 is positioned below the attachment tool 15 (arrangement similar to FIG. 6A) (step ST12).
  • step ST13 the bonding tool 10 is lowered, and the chip component 4 is picked up from the chip slider 26 (step ST13).
  • step ST02 the bonding of the chip component 4 and the cooling of the bonding tool 10 are repeated sequentially.
  • the bonding tool 10 can be efficiently cooled, and the bonding tool 10 can be cooled. Immediately, semiconductor chip components can be supplied to the attachment tool, and the delivery time can be shortened.
  • step ST07 and step ST13 the amount of displacement of the chip component 4 mounted on the circuit board 2 can be measured by the lower visual field recognition unit 30 of the two visual field recognition unit 30. I can do it.
  • FIG. 9 shows a state in which the cooling member 29 is lowered (FIG. 9A) and a state in which it is raised (FIG. 9B) by pins 29E that move up and down along the cylinder 29S.
  • FIG. 10 shows a state in which the cooling member 29 is lowered (FIG. 10A) and a state in which it is raised (FIG. 10B) by the bellows 29B.
  • the nozzle 26N for ejecting the cooling gas is provided.
  • the conveying means 25 of the bonding apparatus 1 shown in FIG. 1 may be used for a bonding apparatus having a plurality of bonding tools, and enables efficient operation.
  • An example thereof is shown in FIG. 11 as another embodiment.
  • a bonding apparatus 200 in FIG. 11 includes two bonding tools, a bonding tool 10A and a bonding tool 10B.
  • one chip slider 26 supplies the chip component 4 to both bonding tools.
  • the bonding tool 10A and the bonding tool 10B have the same structure as the bonding tool 10 shown in FIGS.
  • the bonding tool 10B can bond the chip component 4 to the circuit board 2 at the same time that the attachment tool 15A of the bonding tool 10A is cooled by the cooling member 29 of the chip slider 26.
  • FIG. 12 shows the operations of the bonding tool 10A and the bonding tool 10B and the position of the chip slider 26 during each operation in the bonding apparatus 200 of FIG. 12, STA01 to STA12 representing the operation steps of the bonding tool 10A and STB01 to STB12 representing the operation steps of the bonding tool 10B are the same operation steps as ST01 to ST12 of (bonding tool 10) shown in FIG.
  • the bonding apparatus 200 while one bonding tool 10A (10B) is cooling, the other bonding tool 10B (10A) performs a bonding operation starting from the pickup of the chip component 4. Yes. That is, one of the bonding tools always performs bonding, and continuous bonding without a cooling waiting time can be realized.

Abstract

To provide a bonding tool cooling device capable of efficiently cooling a bonding tool in a short time, a bonding device provided with the bonding tool cooling device, and a bonding tool cooling method. Specifically, provided is a bonding tool cooling device for cooling a bonding tool that is equipped with an attachment tool that sucks and holds a semiconductor chip component, a heater for heating the attachment tool, and a suction mechanism that sucks and holds the attachment tool to the heater. The bonding tool cooling device is equipped with a cooling member that performs cooling by being in contact with an attachment tool surface, said cooling member being provided to a transfer means that transfers the semiconductor chip component in the horizontal direction. Also provided are a bonding device that is provided with the bonding tool cooling device, and a bonding tool cooling method.

Description

ボンディングツール冷却装置およびこれを備えたボンディング装置ならびにボンディングツール冷却方法Bonding tool cooling apparatus, bonding apparatus equipped with the same, and bonding tool cooling method
　半導体チップ部品を回路基板に加熱および押圧し実装するボンディング装置のボンディングツール冷却装置およびボンディングツール冷却方法に関する。 The present invention relates to a bonding tool cooling device and a bonding tool cooling method for a bonding apparatus that heats and presses a semiconductor chip component on a circuit board for mounting.
　半導体チップ部品を回路基板に実装する方法として、熱圧着工法やはんだ工法などが用いられている。熱圧着工法ではボンディングツールに設けられたセラミック製のヒータを高速で昇温し半導体チップ部品と回路基板の間に充填された熱硬化性樹脂フィルム又は熱硬化性樹脂ペーストを加熱硬化させて熱圧着している。また、はんだ工法では、ボンディングツールをはんだ溶融温度まで昇温させて半導体チップ部品を回路基板に実装した後、固相温度以下まで冷却させて次の半導体チップ部品の実装を行うようにしている。 As a method of mounting a semiconductor chip component on a circuit board, a thermocompression bonding method, a soldering method, or the like is used. In the thermocompression bonding method, a ceramic heater provided in the bonding tool is heated at a high speed, and the thermosetting resin film or thermosetting resin paste filled between the semiconductor chip component and the circuit board is heated and cured to perform thermocompression bonding. is doing. In the soldering method, the temperature of the bonding tool is raised to the solder melting temperature, the semiconductor chip component is mounted on the circuit board, and then cooled to below the solid phase temperature to mount the next semiconductor chip component.
　半導体チップ部品を回路基板に実装するボンディング装置は、図１３に示すような構造となっている。ボンディング装置１００には、半導体チップ部品４を吸着保持して回路基板２に押圧および加熱するボンディングツール１０と、回路基板２を吸着保持する基板ステージ２０から構成されている。ボンディング装置１と半導体チップ部品４の供給部との間は、半導体チップ部品４を水平搬送する搬送手段２５にチップスライダ２６が設けられている。チップスライダ２６で搬送された半導体チップ部品４は、ボンディングツール１０に受け渡されるようになっている。 A bonding apparatus for mounting a semiconductor chip component on a circuit board has a structure as shown in FIG. The bonding apparatus 100 includes a bonding tool 10 that sucks and holds the semiconductor chip component 4 to press and heat the circuit board 2 and a substrate stage 20 that sucks and holds the circuit board 2. Between the bonding apparatus 1 and the supply part of the semiconductor chip component 4, a chip slider 26 is provided in a transport means 25 that horizontally transports the semiconductor chip component 4. The semiconductor chip component 4 conveyed by the chip slider 26 is delivered to the bonding tool 10.
　ボンディングツール１０は、図１４に示すような構造となっている。ボンディングツール１０の先端にはホルダー部１１が設けられており、ホルダー部１１の下面にはヒータベース１２が取り付けボルトにより固定されている。ヒータベース１２の下面には断熱ブロック１３を介してヒータ１４が配置されており、ヒーター１４と断熱ブロック１３、断熱ブロック１３とヒーターベース１２はそれぞれ図示しないボルトにより固定されている。ヒータ１４の下面には半導体チップ部品４を吸着保持するアタッチメントツール１５が設けられている。断熱ブロック１３およびヒータ１４にはアタッチメント吸着用流路１７が形成されており、該流路を経由してアタッチメントツール１５が真空吸引される。断熱ブロック１３には冷却エアー流路１８が形成されており、図示していない圧空源より圧空が供給されヒータ１４上面にエアーを吹き付けて冷却するように構成されている。 The bonding tool 10 has a structure as shown in FIG. A holder portion 11 is provided at the tip of the bonding tool 10, and a heater base 12 is fixed to the lower surface of the holder portion 11 with mounting bolts. A heater 14 is disposed on the lower surface of the heater base 12 via a heat insulating block 13, and the heater 14 and the heat insulating block 13 are fixed by bolts (not shown). An attachment tool 15 for attracting and holding the semiconductor chip component 4 is provided on the lower surface of the heater 14. An attachment adsorption flow path 17 is formed in the heat insulating block 13 and the heater 14, and the attachment tool 15 is sucked by vacuum through the flow path. A cooling air flow path 18 is formed in the heat insulation block 13, and is configured such that compressed air is supplied from a pressure air source (not shown) and air is blown onto the upper surface of the heater 14 to cool it.
　ボンディングツール１０の冷却は、アタッチメントツール１５が半導体チップ部品４を受け取る際に、ヒータ１４が高温のまま受け取ると、半導体チップ部品４のバンプ５先端部のはんだが溶融または軟化して変形したりすることを防止するために行われている。半導体チップ部品４の回路面に樹脂フィルムがラミネートされている場合は、樹脂フィルムが高温のため反応して硬化が進んでしまうことを防止しするためボンディングツール１０の冷却が必要となっている。 When the attachment tool 15 receives the semiconductor chip component 4 when the attachment tool 15 receives the cooling, the bonding tool 10 is deformed by melting or softening the solder at the tip of the bump 5 of the semiconductor chip component 4 when the heater 14 receives it at a high temperature. It has been done to prevent that. When the resin film is laminated on the circuit surface of the semiconductor chip component 4, the bonding tool 10 needs to be cooled in order to prevent the resin film from reacting due to high temperature and proceeding curing.
　はんだが溶融や軟化によって変形すると、半導体チップ部品４の回路基板２への接合の際にバンプ５が均等に接触せずに接続不良を起こす問題がある。また樹脂フィルムの硬化が促進すると半導体チップ部品４のバンプ５と回路基板２の電極３との間の樹脂が排除されなくて接続不良を起こす問題がある。そのため、ヒータ１４は接合性に影響の無い温度まで十分に冷却させる必要がある。しかしながら、図５のようにヒータ１４の裏面を冷却させるだけでは、アタッチメントツール１５の熱容量が大きいため冷却に時間がかかりタクトタイムが長くなると言う問題があった。 When the solder is deformed by melting or softening, there is a problem that the bumps 5 do not contact evenly when the semiconductor chip component 4 is joined to the circuit board 2 and connection failure occurs. Further, when the curing of the resin film is promoted, there is a problem that the resin between the bumps 5 of the semiconductor chip component 4 and the electrodes 3 of the circuit board 2 is not excluded, resulting in poor connection. Therefore, it is necessary to sufficiently cool the heater 14 to a temperature that does not affect the bondability. However, just cooling the back surface of the heater 14 as shown in FIG. 5 poses a problem that the heat capacity of the attachment tool 15 is large and the cooling takes time and the tact time becomes long.
国際公開番号ＷＯ２０１４／０８７７４０公報International Publication Number WO2014 / 087740
　このようなタクトタイムの問題に対して、特許文献１ではヒータの冷却時間を早くする方法として、アタッチメントツールを直接放熱部材に当接させて、熱伝搬により冷却させる方法を開示している。しかしながら、特許文献１に記載の冷却方法では、ボンディング終了後にボンディングツールが上昇し、放熱部材ユニットに当接させる位置へ基板ステージが移動して、ボンディングツールを下降させて冷却するステップが必要となり、これらの余分なタクトタイムを要してしまい、生産効率を落としてしまう問題がある。 In order to deal with such a problem of tact time, Patent Document 1 discloses a method in which an attachment tool is brought into direct contact with a heat radiating member and cooled by heat propagation as a method for increasing the cooling time of the heater. However, the cooling method described in Patent Document 1 requires a step in which the bonding tool is raised after the bonding is finished, the substrate stage is moved to a position where the bonding tool is brought into contact with the heat radiating member unit, and the bonding tool is lowered and cooled. There is a problem that these extra tact times are required and the production efficiency is lowered.
　そこで、本発明の課題は短時間で効率よくボンディングツールを冷却できるボンディングツール冷却装置およびこれを備えたボンディング装置ならびにボンディングツール冷却方法を提供することとする。 Therefore, an object of the present invention is to provide a bonding tool cooling apparatus capable of efficiently cooling a bonding tool in a short time, a bonding apparatus equipped with the bonding tool, and a bonding tool cooling method.
　上記課題を解決するために、請求項１に記載の発明は、
半導体チップ部品を吸着保持するアタッチメントツールと、アタッチメントツールを加熱するヒータと、アタッチメントツールをヒータに吸着保持する吸着機構とを備えるボンディングツールを冷却するボンディングツール冷却装置であって、
アタッチメントツール面に接触して冷却を行う冷却部材を備え、
前記冷却部材が、半導体チップ部品を水平方向に搬送する搬送手段に設けられているボンディングツール冷却装置である。 In order to solve the above-mentioned problem, the invention described in claim 1
A bonding tool cooling device for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater,
A cooling member that cools by contacting the attachment tool surface,
The cooling member is a bonding tool cooling device provided in a transfer means for transferring a semiconductor chip component in a horizontal direction.
　請求項２に記載の発明は、請求項１に記載のボンディングツール冷却装置であって、
前記冷却部材に吸着孔を設け、前記吸着孔内を減圧することで、前記アタッチメントツールを吸着保持する機能を有するボンディングツール冷却装置である。 The invention according to claim 2 is the bonding tool cooling device according to claim 1,
It is a bonding tool cooling device having a function of sucking and holding the attachment tool by providing a suction hole in the cooling member and depressurizing the inside of the suction hole.
　請求項３に記載の発明は、請求項１または請求項２に記載のボンディングツール冷却装置であって、
前記搬送手段が、半導体チップ部品を画像認識する認識手段とボンディングツールの間の高さに半導体チップ部品を搬送するボンディングツール冷却装置である。 Invention of Claim 3 is the bonding tool cooling device of Claim 1 or Claim 2, Comprising:
The transporting means is a bonding tool cooling device for transporting the semiconductor chip component to a height between the recognition means for recognizing the image of the semiconductor chip component and the bonding tool.
　請求項４に記載の発明は、請求項１から請求項３のいずれかに記載のボンディングツール冷却装置を備え、
前記ボンディングツールを用いて、半導体チップ部品を加熱および押圧して回路基板に実装するボンディング装置である。 Invention of Claim 4 is provided with the bonding tool cooling device in any one of Claims 1-3,
A bonding apparatus that heats and presses a semiconductor chip component and mounts it on a circuit board using the bonding tool.
　請求項５に記載の発明は、請求項４に記載のボンディング装置であって、
複数のボンディングツールを備え、１つのボンディングツールが前記半導体チップ部品を前記回路基板に実装しているときに、前記ボンディングツール冷却装置が他のボンディングツールを冷却する機能を有するボンディング装置である。 Invention of Claim 5 is the bonding apparatus of Claim 4, Comprising:
The bonding apparatus includes a plurality of bonding tools, and the bonding tool cooling apparatus has a function of cooling another bonding tool when one bonding tool mounts the semiconductor chip component on the circuit board.
　請求項６に記載の発明は、
半導体チップ部品を吸着保持するアタッチメントツールと、アタッチメントツールを加熱するヒータと、アタッチメントツールをヒータに吸着保持する吸着機構とを備えるボンディングツールを冷却するボンディングツール冷却方法であって、
アタッチメントツールが半導体チップ部品を回路基板にボンディングした後、上昇し半導体チップ部品の供給を待機している際に、
半導体チップ部品を搬送する搬送手段をアタッチメントツールの下方に移動させて、
搬送手段に設けられた冷却部材とアタッチメントツールを接触させ、
アタッチメントツール面を冷却するボンディングツール冷却方法である。 The invention described in claim 6
A bonding tool cooling method for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater,
After the attachment tool has bonded the semiconductor chip component to the circuit board and then lifted and is waiting to supply the semiconductor chip component,
Move the conveying means to convey the semiconductor chip parts below the attachment tool,
Contact the cooling member provided on the transport means with the attachment tool,
This is a bonding tool cooling method for cooling the attachment tool surface.
　請求項１に記載の発明によれば、アタッチメントツール面に接触して冷却する冷却部材を備えたので、短時間に効率よくボンディングツールを冷却することが出来る。しかも、冷却部材が半導体チップ部品を搬送する搬送手段に設けられているので、ボンディングツールを冷却後すぐに、半導体チップ部品をアタッチメントツールに供給でき受け渡し時間が短縮される。 According to the first aspect of the present invention, since the cooling member that contacts and cools the attachment tool surface is provided, the bonding tool can be efficiently cooled in a short time. In addition, since the cooling member is provided in the conveying means for conveying the semiconductor chip component, the semiconductor chip component can be supplied to the attachment tool immediately after the bonding tool is cooled, and the delivery time is shortened.
　請求項２に記載の発明によれば、アタッチメントツールをボンディングツールによる吸着から解除して冷却部材側が吸着することでチップスライダーへの受け渡しが行える。これにより、ボンディングツールからアタッチメントツールが分離し、ボンディングツール側の熱容量減少、アタッチメントツール側の空冷面積増加などにより、冷却の高速化が図れる。 According to the second aspect of the present invention, the attachment tool is released from the adsorption by the bonding tool and the cooling member side is adsorbed, so that the delivery to the chip slider can be performed. Thereby, the attachment tool is separated from the bonding tool, and the cooling speed can be increased by reducing the heat capacity on the bonding tool side and increasing the air cooling area on the attachment tool side.
　請求項３に記載の発明によれば、搬送手段が半導体チップ部品を画像認識する認識手段とボンディングツールの間の高さに半導体チップ部品を搬送するので、ボンディングツールへの半導体チップ部品の受け渡しを最短距離で行うことができ受け渡し時間を短縮できる。また、半導体チップの受け渡し動作中に、２視野の認識手段の基板側を認識する下視野の認識手段によって、基板に実装された半導体チップの位置ずれ量を測定することも出来る。 According to the third aspect of the present invention, since the transport means transports the semiconductor chip component to a height between the recognition means for recognizing the image of the semiconductor chip component and the bonding tool, the semiconductor chip component is transferred to the bonding tool. It can be performed at the shortest distance and the delivery time can be shortened. Further, during the semiconductor chip transfer operation, the amount of positional deviation of the semiconductor chip mounted on the substrate can be measured by the lower visual field recognition means for recognizing the substrate side of the two visual field recognition means.
　請求項４の発明によれば、効率よく冷却されたボンディングツールにより、半導体チップ部品をピックアップするので、接続不良のない実装を短いタクトタイムで行うことが出来る。 According to the invention of claim 4, since the semiconductor chip component is picked up by the efficiently cooled bonding tool, mounting without connection failure can be performed with a short tact time.
　請求項５の発明によれば、１つのボンディングツールが半導体チップ部品を基板に実装するのと同時に、他のボンディングツールを冷却するので、冷却待ち時間のない連続的な実装が可能になる。 According to the invention of claim 5, since one bonding tool mounts a semiconductor chip component on a substrate and simultaneously cools another bonding tool, continuous mounting without a cooling waiting time becomes possible.
　請求項６に記載の発明によれば、アタッチメントツールが半導体チップ部品を回路基板にボンディングした後、上昇し半導体チップ部品の供給を待機している際に、半導体チップ部品を搬送する搬送手段をアタッチメントツールの下方に移動させて、搬送手段に設けられた冷却部材とアタッチメントツールを接触させ、アタッチメントツール面を冷却するので、非接触で短時間に効率よくボンディングツールを冷却することが出来る。 According to the invention described in claim 6, when the attachment tool is bonded to the circuit board and then rises and waits for supply of the semiconductor chip component, the transport means for transporting the semiconductor chip component is attached to the attachment tool. Since the attachment tool surface is cooled by moving it below the tool and bringing the cooling member provided in the conveying means into contact with the attachment tool, the bonding tool can be efficiently cooled in a short time without contact.
本発明の実施の形態に係るボンディング装置の概略側面図である。1 is a schematic side view of a bonding apparatus according to an embodiment of the present invention. 本発明の実施の形態に係る搬送手段の斜視図である。It is a perspective view of the conveyance means which concerns on embodiment of this invention. 本発明の実施の形態に係る搬送手段の概略平面図である。It is a schematic plan view of the conveyance means which concerns on embodiment of this invention. 本発明の実施の形態に係る冷却部材の昇温防止策である、（ａ）冷却部材を気体で冷却する方法、（ｂ）冷却部材をヒートシンクに接続する方法、（ｃ）冷却部材の熱容量を増す方法、（ｄ）放熱フィンを設ける方法を説明する図である。It is a temperature rise prevention measure for the cooling member according to the embodiment of the present invention, (a) a method for cooling the cooling member with gas, (b) a method for connecting the cooling member to a heat sink, and (c) a heat capacity of the cooling member. It is a figure explaining the method to increase, and the method of providing the (d) radiation fin. 本発明の実施の形態に係るボンディング装置の動作フローチャートである。It is an operation | movement flowchart of the bonding apparatus which concerns on embodiment of this invention. チップスライダから半導体チップ部品をピックアップする際の、（ａ）半導体チップ部品をボンディングツール直下に配置した状態、（ｂ）ボンディングツールを下降させた状態、（ｃ）ボンディングツールのアタッチメントツールが半導体チップ部品をピックアップした状態、を示す図である。When picking up a semiconductor chip component from the chip slider, (a) a state in which the semiconductor chip component is disposed immediately below the bonding tool, (b) a state in which the bonding tool is lowered, and (c) an attachment tool of the bonding tool is the semiconductor chip component It is a figure which shows the state which picked up. 本発明の実施の形態に係る冷却部材を用いてボンディングツールを冷却する際の、（ａ）ボンディングツール直下に冷却部材が配置されるようチップスライダーを移動させる状態、（ｂ）ボンディングツール直下に冷却部材が配置された状態、（ｃ）ボンディングツールを下降させてアタッチメントツール表面を冷却部材で冷却している状態、を示す図である。When cooling the bonding tool using the cooling member according to the embodiment of the present invention, (a) a state in which the chip slider is moved so that the cooling member is disposed immediately below the bonding tool, and (b) cooling immediately below the bonding tool. It is a figure which shows the state in which the member is arrange | positioned, (c) the state which lowered | hangs the bonding tool and is cooling the attachment tool surface with the cooling member. 本発明の実施の形態に係る冷却部材が吸着孔を有している場合の、（ａ）ボンディングツール直下に冷却部材が配置された状態、（ｂ）ボンディングツールを下降させてアタッチメントツール表面に冷却部材を接触させた状態（ｃ）ボンディングツールを上昇させる際にアタッチメントツールの吸着を解除してアタッチメントツールをチップスライダに受け渡した状態、を示す図である。When the cooling member according to the embodiment of the present invention has an adsorption hole, (a) the cooling member is disposed immediately below the bonding tool, (b) the bonding tool is lowered and cooled to the surface of the attachment tool. (C) It is a figure which shows the state which canceled the adsorption | suction of an attachment tool when raising a bonding tool, and delivered the attachment tool to the chip slider, when raising a bonding tool. 本発明の実施の形態に係る冷却部材とボンディングツールの接近方法の変形であり、チップスライダーに設けた突出ピンにより、（ａ）冷却部材を下降させた状態、（ｂ）冷却部材を上昇させた状態、を示す図である。It is a modification of the approach method of the cooling member and the bonding tool according to the embodiment of the present invention, and (a) the cooling member is lowered, and (b) the cooling member is raised by the protruding pins provided on the chip slider. It is a figure which shows a state. 本発明の実施の形態に係る冷却部材とボンディングツールの接近方法の変形例であり、チップスライダーに設けた蛇腹により、（ａ）冷却部材を下降させた状態、（ｂ）冷却部材を上昇させた状態、を示す図である。It is a modification of the approach method of the cooling member and bonding tool which concerns on embodiment of this invention, (a) The state which lowered the cooling member by the bellows provided in the chip slider, (b) The cooling member was raised It is a figure which shows a state. 本発明の別の実施の形態に係るボンディング装置の概略側面図である。It is a schematic side view of the bonding apparatus which concerns on another embodiment of this invention. 本発明の別の実施の形態に係るボンディング装置の動作フローチャートである。It is an operation | movement flowchart of the bonding apparatus which concerns on another embodiment of this invention. ボンディング装置の概略側面図である。It is a schematic side view of a bonding apparatus. ボンディングツールの構造を説明する概略側面図である。It is a schematic side view explaining the structure of a bonding tool.
　以下に、本発明の実施の形態について図面を参照しながら説明する。図１において、ボンディング装置１に向かって左右方向をＸ軸、手前方向をＹ軸、Ｘ軸とＹ軸とで構成されるＸＹ平面に直交する軸をＺ軸、Ｚ軸を中心として回転する方向をθ方向とする。また、ボンディング装置１において、図１３のボンディング装置１００と共通する構成要素については同じ記号を用いる。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In FIG. 1, the direction toward the bonding apparatus 1 is the X axis as the left-right direction, the Y axis as the front direction, the Z axis as the axis perpendicular to the XY plane composed of the X axis and the Y axis, and the direction rotating around the Z axis. Is the θ direction. Further, in the bonding apparatus 1, the same symbols are used for components common to the bonding apparatus 100 in FIG.
　ボンディング装置１は、回路基板２に半導体チップ部品４（以後、チップ部品４と呼ぶ）を押圧および加熱するボンディングツール１０と、回路基板２を吸着保持する基板ステージ２０と、チップ部品４をボンディングツール１０に水平搬送する搬送手段２５と、チップ部品４に付されたアライメントマークを画像認識する上視野の認識手段と回路基板２に付されたアライメントマークを画像認識する下視野の認識手段を備えた２視野の認識手段３０と、ボンディング装置１の全体を制御する制御部５０とから構成されている。 The bonding apparatus 1 includes a bonding tool 10 that presses and heats a semiconductor chip component 4 (hereinafter referred to as a chip component 4) to a circuit board 2, a substrate stage 20 that holds the circuit board 2 by suction, and a chip component 4 that is bonded to the circuit board 2. 10 is provided with a conveying means 25 for horizontally conveying to 10, an upper visual field recognizing means for recognizing an alignment mark attached to the chip component 4, and a lower visual field recognizing means for recognizing the alignment mark attached to the circuit board 2. The recognizing unit 30 has two fields of view and a control unit 50 that controls the entire bonding apparatus 1.
　ボンディングツール１０は、図１４に示すような構造で背景技術で説明した部材から構成されている。 The bonding tool 10 has the structure shown in FIG. 14 and is composed of the members described in the background art.
　搬送手段２５は、図２に示す例のように、チップ部品４をチップ供給部からアタッチメントツール１５の下方に水平搬送するチップスライダ２６と搬送レール２７とから構成されている。チップスライダ２６は、ボンディングツール１０と認識手段３０との間の高さに半導体チップ部品を搬送するようになっている。図３には、チップスライダ２６をＺ方向上側より参照した状態を示す。チップスライダ２６にはチップ部品４を吸着保持するチップ吸着部２８とアタッチメントツール１５に面接触することでボンディングツール１０を冷却する冷却部材２９が設けられている。 As shown in the example shown in FIG. 2, the transport means 25 includes a chip slider 26 and a transport rail 27 that horizontally transport the chip component 4 from the chip supply unit to the lower side of the attachment tool 15. The chip slider 26 conveys semiconductor chip components to a height between the bonding tool 10 and the recognition means 30. FIG. 3 shows a state in which the chip slider 26 is referenced from the upper side in the Z direction. The chip slider 26 is provided with a chip adsorbing portion 28 that adsorbs and holds the chip component 4 and a cooling member 29 that cools the bonding tool 10 by surface contact with the attachment tool 15.
　冷却部材２９としては熱伝導率が高く（５０W／ｍ・K以上）、熱変形しないものが好ましく、具体的な材料としては、伝熱性と耐熱性を備えたものとして、窒化アルミニウムやシリコンカーバイド等のセラミックスを用いることが出来るがこれに限定されるものではない。また、冷却部材２９を用いたボンディングヘッド冷却装置として、冷却部材２９がアッタチメントツール１５からの受熱により温度上昇することは好ましくない。このため、冷却部材２９の温度上昇防止手段を設けておくことが望ましい。その具体例の幾つかを図４に示す。図４（ａ）はノズル２９Ｎから気体を噴出して冷却部材２９を冷却するものであり、図４（ｂ）は低温のヒートシンク２９Ｓと冷却部材２９を伝熱部材で接続して冷却するものであり、図４（ｃ）は冷却部材２９の熱容量を増して温度上昇を和らげるものであり、図４（ｄ）は冷却部材２９に放熱ファン２９Ｆを設けて放熱を行うものであるが、これらを組合わせてもよいし、別の温度上昇防手段を儲けてもよい。 The cooling member 29 preferably has a high thermal conductivity (50 W / m · K or more) and is not thermally deformed. Specific examples of the material having heat conductivity and heat resistance include aluminum nitride and silicon carbide. However, the present invention is not limited to this. Moreover, as a bonding head cooling device using the cooling member 29, it is not preferable that the temperature of the cooling member 29 rises due to heat received from the attachment tool 15. For this reason, it is desirable to provide a temperature rise prevention means for the cooling member 29. Some examples are shown in FIG. FIG. 4A shows the case where the cooling member 29 is cooled by jetting gas from the nozzle 29N, and FIG. 4B shows the case where the low-temperature heat sink 29S and the cooling member 29 are connected by the heat transfer member for cooling. 4 (c) is for increasing the heat capacity of the cooling member 29 to mitigate the temperature rise, and FIG. 4 (d) is for dissipating heat by providing the cooling member 29 with a radiating fan 29F. You may combine, and you may make another temperature rise prevention means.
　このような構成のボンディング装置１を用いてチップ部品４を回路基板２に実装する動作を図５に示すフローチャートを参照しながら説明する。 The operation of mounting the chip component 4 on the circuit board 2 using the bonding apparatus 1 having such a configuration will be described with reference to the flowchart shown in FIG.
　まず、搬送手段２５のチップスライダ２６が、ボンディングツール１０の下側に配置されるようチップ部品４をを搬送し（図６（ａ））、ボンディングツール１０が下降し（図６（ｂ））、チップスライダ２６からチップ部品４をピックアップ（図６（ｃ））する（ステップＳＴ０１）。チップスライダ２６はチップ部品供給部へ移動し、ボンディングツール１０は待機位置に上昇する。 First, the chip part 4 is transported so that the chip slider 26 of the transport means 25 is arranged below the bonding tool 10 (FIG. 6A), and the bonding tool 10 is lowered (FIG. 6B). Then, the chip component 4 is picked up from the chip slider 26 (FIG. 6C) (step ST01). The chip slider 26 moves to the chip component supply unit, and the bonding tool 10 moves up to the standby position.
　同時に、２視野の認識手段３０を回路基板２とボンディングツール１０の間に挿入する。次に認識手段はチップ部品４と回路基板２に付されたアライメントマークを画像認識する（ステップＳＴ０２）。 At the same time, the recognition means 30 having two fields of view is inserted between the circuit board 2 and the bonding tool 10. Next, the recognition means recognizes an image of the alignment marks attached to the chip component 4 and the circuit board 2 (step ST02).
　次に、２視野の認識手段３０を待機位置に移動させ、前記で画像認識したデータを基に、ボンディングツール１０をθ方向、基板ステージ２０をＸＹ方向に位置合わせする（ステップＳＴ０３）。 Next, the two-view recognition means 30 is moved to the standby position, and the bonding tool 10 is aligned in the θ direction and the substrate stage 20 is aligned in the XY direction based on the data recognized as described above (step ST03).
　次に、ボンディングツール１０を下降する（ステップＳＴ０４）。 Next, the bonding tool 10 is lowered (step ST04).
　次に、ボンディングツール１０のヒータ１４を昇温し、チップ部品４を回路基板２にボンディングする（ステップＳＴ０５）。 Next, the heater 14 of the bonding tool 10 is heated to bond the chip component 4 to the circuit board 2 (step ST05).
　次に、ボンディングツール１０を待機位置まで上昇させる（ステップＳＴ０６）。 Next, the bonding tool 10 is raised to the standby position (step ST06).
　次に、ボンディングツール１０に設けられた冷却エアー流路１８に冷却エアーを供給しヒータ１４の内部冷却を開始する（ステップＳＴ０７）。 Next, cooling air is supplied to the cooling air flow path 18 provided in the bonding tool 10 to start the internal cooling of the heater 14 (step ST07).
　次に、図７（ａ）から図７（ｂ）に示すようにチップスライダ２６の冷却部材２９をボンディングツール１０の下側に移動させてから、ボンディングツールを下降させてアタッチメントツール１５を冷却部材２９に接触させ（図７（ｃ））、アタッチメントツール１５の表面冷却を開始する（ステップＳＴ０９）。なお、チップスライダ２６は次にボンディングするチップ部品４がチップ吸着部２８に吸着されている状態で移動する。 Next, as shown in FIGS. 7A to 7B, the cooling member 29 of the chip slider 26 is moved to the lower side of the bonding tool 10, and then the bonding tool is lowered to attach the attachment tool 15 to the cooling member. 29 is contacted (FIG. 7C), and surface cooling of the attachment tool 15 is started (step ST09). The chip slider 26 moves in a state where the chip component 4 to be bonded next is adsorbed by the chip adsorbing portion 28.
　同時に、２視野の認識手段３０を回路基板２とボンディングツール１０の間に挿入する。 At the same time, the recognition means 30 having two fields of view is inserted between the circuit board 2 and the bonding tool 10.
　なお、図８（ａ）に示すような吸着孔２９Ｖを冷却部材２９に設けて、図示しない減圧機構と連通することにより、アタッチメントツール１５をチップスライダー２６に受け渡す機能も備えることができる。すなわち、アタッチメントツール１５を冷却部材２９に接触（図８（ｂ））させた後に、吸着孔２９Ｖ内を減圧するとともに、アタッチメント吸着用流路１７（図１４参照）を経由した（ボンディングツール１０による）アタッチメントツール１５の吸着保持を解除すれば、アタッチメントツール１５はヒータ１４から離れ、チップスライダ２６側で吸着保持することで受け渡しが完了する（図８（ｃ））。こうすることにより、ヒータ１４の熱容量が小さくなって高速な冷却ができる。また、アタッチメントツール１５が空気に触れる面積も増すので、冷却効率が上がって、冷却の高速化が図れる。 In addition, a function of delivering the attachment tool 15 to the chip slider 26 can be provided by providing the suction hole 29V as shown in FIG. 8A in the cooling member 29 and communicating with a decompression mechanism (not shown). That is, after the attachment tool 15 is brought into contact with the cooling member 29 (FIG. 8B), the inside of the suction hole 29V is depressurized and is passed through the attachment suction flow path 17 (see FIG. 14) (by the bonding tool 10). If the suction holding of the attachment tool 15 is released, the attachment tool 15 is separated from the heater 14, and the delivery is completed by suction holding on the chip slider 26 side (FIG. 8C). By doing so, the heat capacity of the heater 14 is reduced and high-speed cooling is possible. In addition, since the area where the attachment tool 15 comes into contact with air is increased, the cooling efficiency is increased, and the cooling speed can be increased.
　次に、ヒータ１４が適温に達したかどうかを確認する（ステップＳＴ１０）。はんだ工法の場合、ヒータ１４がはんだ溶融しない温度、例えば１５０℃以下が適温となり、樹脂を用いた熱圧着工法の場合、樹脂の硬化反応が始まらない温度、例えば８０℃以下が適温となる。 Next, it is confirmed whether or not the heater 14 has reached an appropriate temperature (step ST10). In the case of the soldering method, the temperature at which the heater 14 does not melt the solder, for example, 150 ° C. or less is an appropriate temperature, and in the case of the thermocompression bonding method using resin, the temperature at which the resin curing reaction does not start, for example, 80 ° C. or less.
　次に、適温に達したらヒータ１４の内部を冷却する冷却エアーの停止と、ボンディングツール１０の上昇（図７（ｂ）と同様な配置、チップスライダ２６の冷却部材２９とアタッチメントツール１５の接触を解除）してボンディングツール１０の冷却を終了する（ステップＳＴ１１）。 Next, when the proper temperature is reached, the cooling air for cooling the inside of the heater 14 is stopped, the bonding tool 10 is raised (the same arrangement as in FIG. 7B, the contact between the cooling member 29 of the chip slider 26 and the attachment tool 15). The cooling of the bonding tool 10 is finished (step ST11).
　次に、チップスライダ２６を移動し、アタッチメントツール１５の下側にチップ部品４が位置する（図６（ａ）と同様な配置）ようにする（ステップＳＴ１２）。 Next, the chip slider 26 is moved so that the chip component 4 is positioned below the attachment tool 15 (arrangement similar to FIG. 6A) (step ST12).
　次に、ボンディングツール１０が下降し、チップスライダ２６からチップ部品４がピックアップされる（ステップＳＴ１３）。 Next, the bonding tool 10 is lowered, and the chip component 4 is picked up from the chip slider 26 (step ST13).
　次に、ステップＳＴ０２に戻り、順次、チップ部品４のボンディングとボンディングツール１０の冷却が繰り返される。 Next, returning to step ST02, the bonding of the chip component 4 and the cooling of the bonding tool 10 are repeated sequentially.
　このように、チップ部品４を水平搬送するチップスライダ２６にアタッチメントツール１５に接触して冷却を行う冷却部材２９を設けることで、効率よくボンディングツール１０の冷却が行えるとともに、ボンディングツール１０を冷却後すぐに、半導体チップ部品をアタッチメントツールに供給でき受け渡し時間を短縮することが出来る。 As described above, by providing the cooling member 29 that cools the chip slider 26 that contacts the attachment tool 15 on the chip slider 26 that horizontally transports the chip component 4, the bonding tool 10 can be efficiently cooled, and the bonding tool 10 can be cooled. Immediately, semiconductor chip components can be supplied to the attachment tool, and the delivery time can be shortened.
　またステップＳＴ０７からステップＳＴ１３までの間の時間を利用して、２視野の認識手段３０の下視野の認識手段で、回路基板２に搭載されたチップ部品４の位置ずれ量の測定を行う事が出来る。 Further, by using the time between step ST07 and step ST13, the amount of displacement of the chip component 4 mounted on the circuit board 2 can be measured by the lower visual field recognition unit 30 of the two visual field recognition unit 30. I can do it.
　なお、ここまでは、冷却部材２９をアタッチメントツール１５に接触させるために、ボンディングツール１０を下降させる例について説明してきたが、冷却部材２９をチップスライダー２６上で上昇させて冷却部材２９をアタッチメントツール１５に接触させてもよい。そのような変形例を図９および図１０に示す。図９においては、シリンダ２９Ｓに沿って上下するピン２９Ｅによって、冷却部材２９を下降した状態（図９（ａ））と上昇させた状態（図９（ｂ））を示している。また図１０においては、蛇腹２９Ｂによって、冷却部材２９を下降した状態（図１０（ａ））と上昇させた状態（図１０（ｂ））を示している。このように冷却部材２９を上下させる場合においても、冷却部材の温度上昇を防ぐ手段を設けることが好ましく、図９の例におては冷却気体を噴出するノズル２６Ｎを設けている。 Heretofore, the example in which the bonding tool 10 is lowered to bring the cooling member 29 into contact with the attachment tool 15 has been described. However, the cooling member 29 is raised on the chip slider 26 to bring the cooling member 29 into the attachment tool. 15 may be contacted. Such a modification is shown in FIGS. FIG. 9 shows a state in which the cooling member 29 is lowered (FIG. 9A) and a state in which it is raised (FIG. 9B) by pins 29E that move up and down along the cylinder 29S. FIG. 10 shows a state in which the cooling member 29 is lowered (FIG. 10A) and a state in which it is raised (FIG. 10B) by the bellows 29B. Even when the cooling member 29 is moved up and down as described above, it is preferable to provide means for preventing the temperature of the cooling member from rising. In the example of FIG. 9, the nozzle 26N for ejecting the cooling gas is provided.
　ところで、図１に示すボンディング装置１の搬送手段２５は、複数のボンディンツールを有するボンディング装置に用いてもよく、効率的な動作を行うことを可能にしている。その一例を、別の実施形態として図１１に示す。図１１のボンディング装置２００は、ボンディングツール１０Ａとボンディングツール１０Ｂの２つのボンディングツールを備えている。搬送手段２５は、１つのチップスライダ２６が両ボンディングツールにチップ部品４を供給する。ボンディングツール１０Ａとボンディングツール１０Ｂは、図１および図１４に示すボンディングツール１０と同じ構造を有するものである。 Incidentally, the conveying means 25 of the bonding apparatus 1 shown in FIG. 1 may be used for a bonding apparatus having a plurality of bonding tools, and enables efficient operation. An example thereof is shown in FIG. 11 as another embodiment. A bonding apparatus 200 in FIG. 11 includes two bonding tools, a bonding tool 10A and a bonding tool 10B. In the conveying means 25, one chip slider 26 supplies the chip component 4 to both bonding tools. The bonding tool 10A and the bonding tool 10B have the same structure as the bonding tool 10 shown in FIGS.
　図２のような構造の搬送手段２５を有したボンディング装置２００において、一方のボンディングツールの直下にチップスライダ２６が存在するときは、他のボンディングツールの直下は空き空間となる。このため、例えば、チップスライダ２６の冷却部材２９によりボンディングツール１０Ａのアタッチメントツール１５Ａを冷却しているのと同時に、ボンディングツール１０Ｂはチップ部品４を回路基板２にボンディングすることが出来る。 In the bonding apparatus 200 having the conveying means 25 having the structure as shown in FIG. 2, when the chip slider 26 exists directly under one bonding tool, the space immediately below the other bonding tool is an empty space. Therefore, for example, the bonding tool 10B can bond the chip component 4 to the circuit board 2 at the same time that the attachment tool 15A of the bonding tool 10A is cooled by the cooling member 29 of the chip slider 26.
　図１２は、図１１のボンディング装置２００における、ボンディングツール１０Ａとボンディングツール１０Ｂの動作および各動作時におけるチップスライダ２６の位置を記したものである。図１２において、ボンディングツール１０Ａの動作ステップを表すＳＴＡ０１～ＳＴＡ１２およびボンディングツール１０Ｂの動作ステップを表すＳＴＢ０１～ＳＴＢ１２は、図５に示した（ボンディングツール１０）のＳＴ０１～ＳＴ１２と同じ動作ステップである。図１２に示すように、ボンディング装置２００では、一方のボンディングツール１０Ａ（１０Ｂ）が冷却を行っている間に、他方のボンディングツール１０Ｂ（１０Ａ）がチップ部品４のピックアップから始まるボンディング動作をおこなっている。すなわち、常時、いずれか一方のボンディングツールがボンディングを行っており、冷却待ち時間のない連続的なボンディングを実現することが出来る。 FIG. 12 shows the operations of the bonding tool 10A and the bonding tool 10B and the position of the chip slider 26 during each operation in the bonding apparatus 200 of FIG. 12, STA01 to STA12 representing the operation steps of the bonding tool 10A and STB01 to STB12 representing the operation steps of the bonding tool 10B are the same operation steps as ST01 to ST12 of (bonding tool 10) shown in FIG. As shown in FIG. 12, in the bonding apparatus 200, while one bonding tool 10A (10B) is cooling, the other bonding tool 10B (10A) performs a bonding operation starting from the pickup of the chip component 4. Yes. That is, one of the bonding tools always performs bonding, and continuous bonding without a cooling waiting time can be realized.
　１、１００、２００　　ボンディング装置
　２　　回路基板
　３　　電極
　４　　半導体チップ部品（チップ部品）
　５　　バンプ
　１０、１０Ａ、１０Ｂ　　ボンディングツール
　１１　　ホルダー部
　１２　　ヒータベース
　１３　　断熱ブロック
　１４　　ヒータ
　１５　　アタッチメントツール
　１６　　チップ吸着用流路
　１７　　アタッチメント吸着用流路
　１８　　冷却エアー流路
　２０　　基板ステージ
　２５　　搬送手段
　２６　　チップスライダ
　２７　　搬送レール
　２８　　チップ吸着部
　２９　　冷却部材
　３０　　認識手段
　５０　　制御部 1, 100, 200 Bonding device 2 Circuit board 3 Electrode 4 Semiconductor chip component (chip component)
5 Bump 10, 10A, 10B Bonding tool 11 Holder part 12 Heater base 13 Heat insulation block 14 Heater 15 Attachment tool 16 Chip adsorption flow path 17 Attachment adsorption flow path 18 Cooling air flow path 20 Substrate stage 25 Transport means 26 Chip slider 27 Transport rail 28 Chip adsorption unit 29 Cooling member 30 Recognizing means 50 Control unit

Claims (6)

  1. 半導体チップ部品を吸着保持するアタッチメントツールと、アタッチメントツールを加熱するヒータと、アタッチメントツールをヒータに吸着保持する吸着機構とを備えるボンディングツールを冷却するボンディングツール冷却装置であって、
    アタッチメントツール面に接触して冷却を行う冷却部材を備え、
    前記冷却部材が、半導体チップ部品を水平方向に搬送する搬送手段に設けられているボンディングツール冷却装置。     A bonding tool cooling device for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater,
    A cooling member that cools by contacting the attachment tool surface,
    A bonding tool cooling device in which the cooling member is provided in a transfer means for transferring a semiconductor chip component in a horizontal direction.
  2. 請求項１に記載のボンディングツール冷却装置であって、
    前記冷却部材に吸着孔を設け、
    前記吸着孔内を減圧することで、前記アタッチメントツールを吸着保持する機能を有するボンディングツール冷却装置。     The bonding tool cooling device according to claim 1,
    An adsorption hole is provided in the cooling member,
    A bonding tool cooling device having a function of sucking and holding the attachment tool by depressurizing the inside of the suction hole.
  3. 請求項１または請求項２に記載のボンディングツール冷却装置であって、
    前記搬送手段が、半導体チップ部品を画像認識する認識手段とボンディングツールの間の高さに半導体チップ部品を搬送するボンディングツール冷却装置。     The bonding tool cooling device according to claim 1 or 2,
    A bonding tool cooling apparatus, wherein the conveying means conveys the semiconductor chip component to a height between the recognition means for recognizing the image of the semiconductor chip component and the bonding tool.
  4. 請求項１から請求項３のいずれかに記載のボンディングツール冷却装置を備え、
    前記ボンディングツールを用いて、半導体チップ部品を加熱および押圧して回路基板に実装するボンディング装置。     A bonding tool cooling device according to any one of claims 1 to 3,
    A bonding apparatus in which a semiconductor chip component is heated and pressed using the bonding tool and mounted on a circuit board.
  5. 請求項４に記載のボンディング装置であって、
    複数のボンディングツールを備え、１つのボンディングツールが前記半導体チップ部品を前記回路基板に実装しているときに、前記ボンディングツール冷却装置が他のボンディングツールを冷却する機能を有するボンディング装置。     The bonding apparatus according to claim 4,
    A bonding apparatus comprising a plurality of bonding tools, wherein the bonding tool cooling device has a function of cooling another bonding tool when one bonding tool mounts the semiconductor chip component on the circuit board.
  6. 半導体チップ部品を吸着保持するアタッチメントツールと、アタッチメントツールを加熱するヒータと、アタッチメントツールをヒータに吸着保持する吸着機構とを備えるボンディングツールを冷却するボンディングツール冷却方法であって、
    アタッチメントツールが半導体チップ部品を回路基板にボンディングした後、上昇し半導体チップ部品の供給を待機している際に、
    半導体チップ部品を搬送する搬送手段をアタッチメントツールの下方に移動させて、
    搬送手段に設けられた冷却部材とアタッチメントツールを接触させ、
    アタッチメントツール面を冷却するボンディングツール冷却方法。     A bonding tool cooling method for cooling a bonding tool comprising an attachment tool for sucking and holding semiconductor chip parts, a heater for heating the attachment tool, and a suction mechanism for sucking and holding the attachment tool on the heater,
    After the attachment tool has bonded the semiconductor chip component to the circuit board and then lifted and is waiting to supply the semiconductor chip component,
    Move the conveying means to convey the semiconductor chip parts below the attachment tool,
    Contact the cooling member provided on the transport means with the attachment tool,
    Bonding tool cooling method to cool the attachment tool surface.
PCT/JP2017/011116 2016-03-31 2017-03-21 Bonding tool cooling device, bonding device provided with same, and bonding tool cooling method WO2017169954A1 (en)

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JP2010093013A (en) * 2008-10-07 2010-04-22 Fujitsu Ltd Bonding apparatus and bonding method
WO2014157134A1 (en) * 2013-03-28 2014-10-02 東レエンジニアリング株式会社 Mounting method and mounting device

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Publication number Priority date Publication date Assignee Title
JP2010093013A (en) * 2008-10-07 2010-04-22 Fujitsu Ltd Bonding apparatus and bonding method
WO2014157134A1 (en) * 2013-03-28 2014-10-02 東レエンジニアリング株式会社 Mounting method and mounting device

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