JPH02239637A - Manufacturing device for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent development of many scraps of silicon which attach onto a semiconductor element and cause defective connection and contact by recognizing a location deviation amount of a semiconductor element by a picture and by providing a recognition control means which gives a driving instruction to a re-positioning stage based on the deviation amount. CONSTITUTION:A semiconductor element 1 is arranged on a table 2. After a position of the element is automatically detected and recognized with a camera 3 for a table, positioning of the element 1 is carried out. A transfer arm 4 seals the element 1 and locates it to a re-positioning stage 5. A location deviation amount of the element 1 against a sealed section thereof is automatically detected with a camera 6a for a re-positioning stage. A control section 6b gives a movement amount to the stage 5 based on the detected signal corresponding to an amount of location deviation. A recognition control means to give a location deviation correcting instruction to the stage 5 is composed of the camera 6a, the control section 6b, etc. The stage 5 moves in a rotating direction, right and left to correct a location deviation of the semiconductor element 1. Thereby, silicon scraps do not develop and defective connection and contact can be eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for manufacturing a semiconductor device, and more particularly to a structure of an apparatus for mounting a semiconductor element on a mounting portion of a semiconductor device.

[Conventional technology]

Conventionally, equipment that mounts this type of semiconductor element has a table that automatically recognizes the position of the elements lined up on the equipment and can accurately determine the position, and then picks up the element whose position has been determined from the table. After it is fixed to a part of the transfer arm and transferred to the repositioning stage, it is repositioned by pressing with claws from four directions, and it is fixed to a part of the transfer arm again and transferred to the element mounting site and mounted. It was like that.

[Problem to be solved by the invention]

The conventional semiconductor device manufacturing apparatus described above has a structure in which the semiconductor element is fixed to a part of the transport arm by means such as vacuum suction and transported, and as shown in FIG. Since the position of the semiconductor element 1 shifts when it is fixed, a repositioning stage 5 is provided between the table 2 on which the elements 1 are arranged and the element mounting part 7, and after the element 1 is placed there and repositioned, The silicon is mounted on the element mounting section 7, but the repositioning stage 5 has a structure in which positioning is performed by mechanically holding it down with repositioning pawls 15 from four directions as shown in FIGS. 6 and 7. A large amount of debris (dust) may adhere to the semiconductor element 1, resulting in poor wiring or poor contact. In addition, cracks, chips, scratches, microcracks, etc. may occur on the element due to the claws holding down the element 1, resulting in a decrease in quality. For this reason, repositioning must be performed in a manner that does not adversely affect the element as much as possible, so it is difficult to adjust the amount of extrusion of the repositioning pawl l5, the amount of extrusion force, etc.
It takes time to adjust equipment. Furthermore, the sides of the outer periphery of the semiconductor element 1 are roughened due to cutting and braking during dicing, which causes variations in the area around the claws, making positioning inaccurate. Furthermore, after determining the position, the position of the element may shift due to reaction when the claw returns, vibration of the device, etc. when the claw returns, immediately after returning, or until it is fixed to a part of the transfer arm 4. When an element is mounted, in the case of a resin-sealed semiconductor device, the element approaches the internal edge of the device, and the resin thickness in that area becomes thinner, making it easier for cracks to form there. Moisture resistance decreases. Moreover, if the element is misaligned, there will be a difference in length between the element 1 and the internal lead 12 as shown in Figure 4(b), which will make wire connection difficult in the next wire bonding process, and the bonding wire As shown in FIG. 5(b), the wire 13 may come into contact with the end of the element 1 or become too long and sag, resulting in a wire short-circuit failure, which lowers the yield and cannot be applied to high-quality products. Furthermore, when an adhesive material 11 such as epoxy resin is used to bond the element mounting part in the semiconductor device and the semiconductor element, the adhesive material 11 corresponding to the area of the back surface of the element is applied to the center of the element mounting part. If the position of the element shifts, there will be parts where the adhesive l1 is not attached, as shown in Figures 3(b) and 5(b), and good wettability of the back side will not be obtained, which will only reduce the adhesive strength. Not,
In some cases, the adhesive material may protrude from the side of the element and adhere to the surface of the element, causing wire connection defects in the next wire bonding process or corroding the circuit on the element surface, resulting in poor quality. The disadvantage is that it decreases. An object of the present invention is to provide a semiconductor device manufacturing apparatus that solves the above problems.

[Differences between the invention and the prior art]

In contrast to the above-mentioned conventional semiconductor device manufacturing equipment, the present invention uses means to automatically recognize the position of an element, and corrects deviations in two orthogonal axes and in the rotational direction based on the amount of positional deviation without using mechanisms such as claws. The difference is that it can be

[Means to solve the problem]

In order to achieve the above object, the present invention picks up a semiconductor device from a table, fixes it to a part of a transfer arm by means such as vacuum suction, repositions it while supplying it to a semiconductor device mounting area, and then picks up the semiconductor device from a table and fixes it on a part of a transfer arm by means of vacuum suction or the like. The semiconductor device is fixed to a part of the transfer arm by a means, and the semiconductor device is supplied to the device mounting area.
In semiconductor device manufacturing equipment that completes the mounting of elements,
Reposition. A repositioning stage that places a semiconductor element to be determined and operates in two orthogonal axes directions and a rotational direction, and the amount of positional deviation of the semiconductor element on the repositioning stage is determined based on the amount of deviation. and recognition control means for issuing a drive command to the repositioning stage. [Example] Next, the present invention will be described with reference to the drawings.

(Example 1) FIG. 1 is an explanatory diagram showing Embodiment 1 of the present invention.

In the figure, semiconductor elements 1 are arranged on a table 2, and after the table camera 3 automatically detects and recognizes the position of the elements, the table 2 that is linked to it moves in the 0 direction to remove the semiconductor elements 1 arranged on the table. Positioning is performed. 10
is a display.

The transport arm 4 fixes the positioned semiconductor element 1 by a fixing means such as vacuum suction, and places it from the table 2 on a repositioning stage 5 that operates in two orthogonal axes directions (left and right) and in a rotational (θ) direction. There, the element 1 is automatically detected by the repositioning stage camera 6a to detect the amount of positional deviation with respect to the fixed part of the element, and based on the detection signal, the control unit 6b adjusts the positional deviation in two orthogonal axes directions (
The amount of movement in the left/right) and rotational (0) directions is transmitted to the repositioning stage 5. Here, the repositioning stage camera 6
A, the control section 6b, and the like constitute a recognition control means that issues a positional deviation correction command to the repositioning stage 5.

In response to this correction command, the repositioning stage 5 moves left and right, θ
After the semiconductor element 1 is moved in the rotational direction and the positional deviation of the semiconductor element 1 is corrected, the semiconductor element 1 is again mounted on the element mounting section 7 by the transfer arm 4.

(Embodiment 2) Figure 2 is a configuration diagram showing Embodiment 2 of the present invention. In this embodiment, the transfer arm 8 picks up the semiconductor device 1 from the table 2 and places it on the repositioning stage 5. Then, while the transport arm 8 goes to pick up the next semiconductor element, the positional deviation of the first semiconductor element 1 is corrected based on drive control of the repositioning stage 5 by the camera 6a and the control section 6b. Next, when the transfer arm 8 picks up the next semiconductor device, the transfer arm 9 picks up the first semiconductor device on the repositioning stage 5, and the transfer arm 8 places the next semiconductor device on the repositioning stage 5. At times, the transport arm 9 mounts the first semiconductor element on the element mounting section 7.

In this embodiment, since there are two transfer arms, the indexing of the device becomes dramatically faster, which has the advantage of improving productivity.

〔Effect of the invention〕

As explained above, the present invention places the semiconductor device on a repositioning stage before mounting the semiconductor device on the mounting site.
A camera above the stage automatically recognizes the positional deviation of the element, and the repositioning stage itself moves in tandem with this to correct the left/right and θ rotational directions.
Since mechanical repositioning using conventional claws or the like is no longer necessary, there is no generation of silicone debris (dust) caused by the claws, and connection and contact failures due to debris (dust) adhesion are eliminated.

Furthermore, the occurrence of cracks, chips, microcracks, etc. is eliminated, and defects in circuit characteristics and moisture resistance are reduced, resulting in improved yield and quality. Furthermore, it is no longer necessary to adjust the amount of extrusion of the pawl used in the past, the amount of extrusion force, etc.
Equipment adjustment time is greatly reduced and productivity is improved. Roughness on the outer periphery of the semiconductor element due to cutting, braking, etc. during dicing does not adversely affect positioning. In addition, positional displacement caused by recoil when the claw returns or vibration of the device is eliminated. Therefore, even in the case of a resin-sealed semiconductor device, since the semiconductor element is located at the center of the device, there is no distribution of differences in resin thickness, making it difficult for cracks to occur and improving moisture resistance. Since there is no difference in length between the wires and the wires, it becomes easier to connect the wires in the next wire bonding process, and there is no problem of poor contact of the wires to the element ends or wire shorts, which improves the yield. It can also be applied to high-quality products with a large number of pins. Furthermore, when using an adhesive material to bond the element mounting area in the semiconductor device and the semiconductor element, good back surface wettability is obtained, adhesive strength is improved, and there is no need for the adhesive material to protrude or adhere to the surface. This has the effect of eliminating defects in wire connections and corrosion of surface circuits, and improving quality.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing a first embodiment of the present invention, FIG. 2 is a block diagram showing a second embodiment of the present invention, and FIG. Plan view, (b)
4(a) is a plan view of FIG. 3(a) after wire bonding, and FIG. 4(b) is a plan view of FIG. A plan view after wire bonding, FIG. 5(a) is a partial sectional view taken along the line A-A in FIG. 4(a), and FIG. Figure 6 is an explanatory diagram of the prior art, Figure 7
The figure is a top view of a prior art repositioning stage. 1... Semiconductor element 2... Table 3...
・Table camera 4, 8.9...Transport arm 5
...Repositioning stage 6a...Camera for repositioning stage 6b...Control section 7...Element mounting section 10...Display 11...Element adhesive material l2...Internal lead l3... Bonding wire l4...Repositioning stage with claw l5...Repositioning claw

Claims (1)

[Claims] (1) Pick up the semiconductor device from the table, fix it to a part of the transfer arm by means such as vacuum suction, reposition it while supplying it to the semiconductor device mounting area, and then use the above-mentioned means again to fix the semiconductor device to a part of the transfer arm. In semiconductor device manufacturing equipment, which fixes a semiconductor element to a substrate and supplies it to an element mounting site to complete the mounting of the element, a repositioning device that places a semiconductor element to be repositioned and operates in two orthogonal axes directions and a rotational direction is used. A semiconductor device comprising: a positioning stage; and recognition control means that recognizes the amount of positional deviation of a semiconductor element on the repositioning stage in an image and issues a drive command to the repositioning stage based on the amount of deviation. Manufacturing equipment.