JPS6237942A - Pellet positioning apparatus - Google Patents

Abstract

PURPOSE:To improve economy in pellet bonding, by positioning a pellet by a pellet positioning apparatus, thereafter rotating a pellet mount by a specified angle, and sending the pellet to the advancing direction of a lead frame under this state. CONSTITUTION:Positioning pawls 1 and 3 are operated in the closing directions. A pellet 15 is held by the pawls and correctly positioned. The pawls 1 and 3 are operated in the directions of arrows 12b and opened. A driving rod 11 is operated in the direction of an arrow 13a, and the pellet mount 5 is turned in the direction of an arrow 14a through a pin 10 and a moving lever 9 by a specified angle. The pellet 15 on the mount 15 is turned by the same angle. The pellet 15, which is positioned at the specified angle, is sucked by a pellet sucking nozzle, and bonded to a specified position of a lead frame. Thus, the economy of the pellet bonding can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a pellet positioning device in pellet bonding for semiconductor device assembly.

Conventional technology In the assembly process of a semiconductor device, a semiconductor pellet is bonded to a part of the header of a lead frame.The positioning (arrangement) of this semiconductor pellet with respect to the lead frame is performed as shown in Figure 3a. When pellet bonding is performed so that the traveling direction of the lead frame on the pellet bonder is parallel to the side of the pellet, and for ease of wire bonding in the next process, the lead frame on the pellet bonder as shown in Figure 3 is There are cases where pellet bonding is performed by making a predetermined angle between the traveling direction and the side of the pellet, and the angle is usually 45 degrees.

Generally, the pellet bonder currently in use places a group of pellets attached to an adhesive sheet after dicing on an X-Y table driven by a pulse motor, etc. Detects the reject mark on the good cine pellet and the shape of the pellet through the electrical property inspection of the cine, picks up only the good pellet with a vacuum nozzle, positions the pellet on the pellet positioning station, and places the pellet on the lead frame. This is the 3-page method, in which the pellets are bonded to a predetermined position on the pellet fixing part, and in the case of pellet bonding where the traveling direction of the outer lead frame and the side of the pellet are parallel to each other as shown in Figure 3a, a group of pellets is loaded. The moving direction of the X-Y table and the side of the pellet, and the scanning line direction of the vidicon, etc. of the imaging means and the side of the pellet are approximately the same direction, and the X-Y
Although it is easy to move the table and detect it using an imaging means, the semiconductor device that is pellet-bonded with a predetermined angle between the advancing direction of the lead frame and the side of the pellet as shown in FIG. When performing pellet bonding using the same pellet bonder used for assembling semiconductor devices, where the direction of travel of the lead frame and the sides of the pellets are parallel to each other, the pellets attached to the adhesive sheet are
Since pellets are loaded in advance at a predetermined angular coordinate on the X-Y table, the angle between the moving direction of the X-Y table, the scanning line direction of the vidicon, etc. of the imaging means, and the side of the pellet is determined. If the X-Y table driving method and the imaging detection method using vidicon etc. require complicated methods, the pellet positioning device for selecting a fixed arrangement direction as shown in Fig. 4 may also be used as is. It was unusable.

Problems to be Solved by the Invention In contrast to the conventional pellet bonder that bonds the sides of the pellet approximately parallel to the direction in which the lead frame advances, it is possible to bond the pellets so that the sides of the pellet are at a predetermined angle with respect to the direction in which the lead frame advances. This requires complex methods for driving the X-Y table that loads the pellet group and for detecting images using vidicon, etc., and in addition, the installation of the pellet positioning device requires precise changes. There were some inconveniences, such as having to carry out the tests one after another.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a rotation mechanism that rotates the pellet mounting table of a pellet positioning device used in a pellet bonder by a predetermined angle around the center of the pellet. It is something that can be controlled.

According to the configuration of the present invention, after positioning the 5-page pellet with the pellet positioning device, the pellet mounting table is rotated by a predetermined angle, and the pellet is delivered in this state in the lead frame advancing direction, so that the pellet is placed in the normal position on the lead frame. Can be fixed.

Embodiment One embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG.

FIG. 1 is a perspective view showing an outline of the embodiment, and FIG.
-d is a diagram illustrating pellet positioning and angular operation by the pellet positioning device of the embodiment in FIG. 1;

The positioning claw 1 has a V-shaped claw part 2 that opens in a V-shape, and in the extending direction of the positioning claw 1, a V-shaped claw part 2 faces and is spaced apart from the V-shaped claw part 2 and opens in a V-shape like the positioning claw 1. V-shaped claw part 4
A pair of positioning claws 1 is provided, and a pair of positioning claws 1
and 3 are movable on respective extension lines by the V-shaped claws 2 and 4 in order to sandwich and position the pellet 16 placed on the upper surface of the pellet mounting table 5.

The 6-page pellet mounting table 5 is located at the center of the positioning claws 1 and 3, and is set at a height such that its upper surface is in contact with the bottom surfaces of the positioning claws 1 and 3. At the center of the upper surface of the pellet mounting table 5, a suction hole 6 is provided for vacuum suction of the pellet when the pellet is placed, and the pellet is suctioned at a predetermined timing.

The trench pellet mounting table 5 is rotatably supported by a rotary bearing 7 and a bearing holder 8, and a swinging lever 9 is attached to the lower part thereof at right angles to the axis. is moored to the drive rod 11 with a pin 10 so as to rotate by a predetermined angle.

Fig. 2a shows a state in which the positioning claws 1 and 3 are opened and the pellet 15 is placed on the upper surface of the pellet mounting table 5, and in Fig. 2, the positioning claws 1 and 3 are in the closing direction. It operates to sandwich the pellet 15 and position it correctly. After positioning the pellet 15, positioning claw 1
and 3 respectively move in the direction of the arrow 12b again, and the second
As shown in Figure C, each positioning claw 1, 3 is opened. FIG. 2C7 At the hege, the drive rod 11 moves in the direction of the arrow 13a, and the pin 10,
The pellet mounting table 5 is rotated by a predetermined angle in the direction of the arrow 14a via the swing lever 9, and the pellets 15 on the pellet mounting table 6 are also rotated by the same angle, whereby the pellets are angled at a predetermined angle.

The pellet 15 thus angled is adsorbed by a pellet adsorption nozzle (not shown) and bonded to a predetermined position of a lead frame as shown in FIG.

On the other hand, when performing pellet bonding with the side of the pellet parallel to the advancing direction of the lead frame as shown in Figure 3a,
The operation of the driving rod 11 in the direction of the arrow 13a is stopped, and from the state shown in FIG.

Effects of the Invention When bonding pellets onto a lead frame, the present invention allows the user to easily change whether the side of the pellet is bonded parallel to the advancing direction of the lead frame or at an angle, using the same pellet bonder. This improves the economic efficiency of pellet bonding.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing an outline of an apparatus according to an embodiment of the present invention, Fig. 2 is an explanatory diagram of the bullet positioning process and angular operation by the pellet positioning apparatus of the same embodiment, and Fig. 3 is a view showing the lead FIG. 4 is a plan view showing a pellet bonded to a pellet fixing portion of a frame, and a perspective view showing an outline of a conventional pellet positioning device. , 1, 3... Positioning claw, 2, 4... V-shaped claw part, 5... Pellet placement part, 6... Suction hole, 7... ... Rotating bearing, 8 ... Bearing holder, 9 ... Swinging lever, 1o ... Pin, 11 ... Drive rod, 15 ... pellet. Name of agent: Patent attorney Toshio Nakao and 1 other person 4-
11th place 1 Fushiwamaru 4---V v Chishibetsu P Fig. 2
IP-1-i IL
Figure 3 (cLn (b) Figure 4

Claims (1)

[Claims] At the pellet positioning station, in order to position the semiconductor pellet in advance and supply the semiconductor pellet to the pellet bonder that performs pellet bonding, the pellet mounting table of the pellet positioning station is
A pellet positioning device characterized in that the pellet positioning device is controlled by a rotation mechanism that rotates the semiconductor pellet at a predetermined angle with the center of the semiconductor pellet as a rotation center.