JP2556856Y2 - Frame clamping mechanism in dicing machine - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus for holding a semiconductor wafer mounted on a predetermined frame via a tape on a chuck table and cutting the semiconductor wafer with a predetermined blade or the like. The present invention relates to a clamp mechanism for holding on a table.

[0002]

2. Description of the Related Art Generally, as a dicing apparatus of this kind,
The dicing apparatus has a structure disclosed in Japanese Patent Application Laid-Open No. Sho 62-53804, and the structure shown in FIGS. 5 and 6 is well known as a conventional example. In FIG. 1, reference numeral 1 denotes a chuck table of a dicing apparatus. The chuck table 1 has a so-called suction section 1a to which a suction action can be arbitrarily provided, and is rotatably mounted on an appropriate base 2.

At a plurality of locations (four locations) on the peripheral side surface of the chuck table 1, a clamp mechanism 4 is provided via an appropriate support member 3, and the upper surface of the clamp mechanism 4 can be raised and lowered by a seesaw motion or the like. A claw portion 5 is provided, and a holder portion 6 is provided to face the claw portion.

The claw 5 is supported at two points a and b. One of the points a is engaged with a rod 7, and the rod 7 is protruded and retracted by an appropriate driving unit 8 such as a solenoid valve. When the rod 7 protrudes, the claw portion 5 falls down and comes into contact with the holder portion 6 and stands up when the rod 6 is immersed. .

The semiconductor wafer 9 mounted and held on the chuck table 1 and cut is mounted on a frame 11 via a tape 10.
Is placed on the chuck table 1, and the portion corresponding to the semiconductor wafer 9 is suction-held by the suction unit 1 a and the frame 11 is held.
Is pressed down by the claw portion 5 and held between the holder portion 6 at a position lower than the upper surface of the chuck table 1. In this state, the semiconductor wafer 9 is cut by an appropriate blade 12.

[0006]

SUMMARY OF THE INVENTION In the above conventional example,
When the clamp mechanism 4 is operated and the claw 5 clamps the frame 11 to perform a cutting process, the claw 5 is located at a lower position than the chuck table 1 and has no effect. Later, when moving to the next step, the claws 5 holding the frame 11 must be raised and opened, and the semiconductor wafer 9 together with the frame 11 must be sucked by a transfer means such as a vacuum pad and transferred to the next step. Must. At the time of this transfer, since the claw portion 5 is in the upright state, it comes into contact with the transfer means, or when there is a malfunction, the blade 12 or the spindle supporting the blade, etc. It has the problem of being damaged. Therefore, in the conventional example, the configuration of the clamp mechanism, particularly when the semiconductor wafer is transported, the claw portion must be in an open state, and there is a problem that various inconveniences caused in the open state must be solved. I have.

[0007]

According to the present invention, as a specific means for solving the above-mentioned problems, there is provided a dicing apparatus for holding a semiconductor wafer mounted on a frame via a tape on a chuck table and performing dicing. The chuck table is provided with two or more suction parts for holding the wafer part by suction and a clamp mechanism having a claw part for pushing down and holding the frame part downward with the chuck table interposed therebetween. The rotor to which rotation is applied is used as a drive unit, and the claw portion is attached to the tip of an arm attached to the rotation shaft of the rotor, and is displaced to a closed state by the rotation of the rotation shaft, pressing the frame from above and opening the frame. Disengage and release the frame, but the claw does not protrude from the upper surface of the chuck table in any state And summarized in that the sea urchin configuration.

[0008]

When the frame is conveyed, the claw for holding down the frame by pressing it down is rotated, and the opening and closing operation is performed at a rotation of about 90 °, and the opening position is lower than the height of the upper surface of the chuck table. The contact with the blade or the spindle is lost even if it comes into contact with the conveying means or there is a mechanical malfunction or an operation error due to carelessness.

[0009]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. To facilitate understanding, the same parts as those of the conventional example will be denoted by the same reference numerals.

In the first embodiment shown in FIGS. 1 to 3, a chuck table 1 of a general dicing apparatus has a so-called suction portion 1a to which a suction action can be arbitrarily provided, and is rotatable on an appropriate base 2. It is placed on. At a plurality of locations on the peripheral side surface of the chuck table 1, clamp mechanisms 4 are provided via appropriate support members 3.

The clamp mechanism 4 has a claw 5 and a holder 6 similar to those of the prior art, but the claw 5 has a base side attached to the tip of an arm 21 and the claw 5 It is configured to be substantially perpendicular to the arm 21.

The arm 21 is attached to a drive shaft 8a so as to straddle both ends of a drive unit 8 such as a rotor, which is attached to the support member 3 via a bracket 22 or the like. The arm 21 and the claw portion 5 are configured to rotate and open and close.

As shown in FIG.
In the closed state, the tip of the claw 5 comes into contact with the holder 6, and in the open state, the tip of the claw 5 is lower than the upper surface of the chuck table 1. Is configured to come.

In the second embodiment shown in FIG. 4, the structure of the clamp mechanism 4 is slightly changed from that of the first embodiment. That is, the claw portion 5 is mounted on a substrate 23, which is supported by a plurality of crank arms 24, and which has a rod 2 at one end through a hinge portion 25.
6, one end of the rod is attached to the other end of the hinge 2
The piston rod 28 is engaged with the distal end of the piston rod 28 via the same.

The piston rod 28 is driven by, for example, an air cylinder 29. The air cylinder is selectively driven by an appropriate drive unit. The claw portion 5 presses and holds the frame 11, and the piston rod 2
When the base 8 moves forward (projects), the substrate 23 moves in an arc shape by the crank arm 24 as shown by the imaginary line, and the claw 5 opens the frame 11. Even if there is, the claw portion 5 is at a position lower than the height of the upper surface of the chuck table 1.

The semiconductor wafer 9 cut by these dicing devices is connected to a frame 11 via a tape 10.
It is the same as in the conventional example that it is mounted on the surface and cut by an appropriate blade 12 or the like.

By configuring the clamp mechanism 4 as described above, the claw portion 5 is always kept at the height of the upper surface of the chuck table 1 regardless of whether the frame 11 is held and held or the frame 11 is opened and transported to the next process. In addition to the lower position, not only does not hinder the conveyance, but even if there is a malfunction, there is no contact or collision between the claw portion 5 and the peripheral devices, and no trouble occurs due to opening of the claw portion. .
Further, the clamp mechanism according to the present invention is not limited to the illustrated embodiment, but includes various configurations that can be implemented without departing from the spirit of the present invention.

[0018]

As described above, the clamping mechanism according to the present invention is a dicing apparatus for holding a semiconductor wafer mounted on a frame via a tape on a chuck table and dicing the semiconductor wafer. ,
A suction unit that sucks and holds the wafer unit and a clamp mechanism that has a claw unit that pushes down and holds the frame unit are disposed, and in the holding operation, the claw unit is displaced between a closed state and an open state. Even when the semiconductor wafer is transported to the next step by the transporting means, particularly when the claw portion is open, a high suction and pick-up is achieved. Even if it is slight, the contact with the claw part does not occur, and not only the workability is remarkably improved,
Even if there is a malfunction, since the end of the claw portion is located at a position lower than the upper surface of the chuck table, collision with the blade or the spindle is avoided, and an excellent effect that peripheral devices are not damaged is exhibited. .

The pawl is supported by a pair of arms. The pawl is opened and closed by a predetermined rotation applied to the arm, and the rotation is at least 90 °. Since the part is constituted by a rotor, the structure is simple and always operates accurately to hold the claw part at a position lower than the upper surface of the chuck table. It has an excellent effect of not causing it.

[Brief description of the drawings]

FIG. 1 is a plan view showing a cross section of a part of a chuck table having a clamp mechanism according to a first embodiment of the present invention.

FIG. 2 is a partial side view showing only a main part of the chuck table having the clamp mechanism according to the first embodiment of the present invention in cross section.

FIG. 3 is a side view showing only a main part of the clamp mechanism according to the first embodiment of the present invention in an operation state, in a sectional view.

FIG. 4 is a partial side view showing only a main part of a chuck table having a clamp mechanism according to a second embodiment of the present invention in cross section.

FIG. 5 is a partial side view showing only a main part of a chuck table provided with a clamping mechanism according to a conventional example in cross section.

FIG. 6 is a side view showing, in cross section, only a main part showing an operation state of a clamp mechanism according to a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chuck table 1a Suction part 2 Base 3 Support member 4 Clamp mechanism 5 Claw part 6 Holder part 8 Drive part 8a Drive shaft 9 Semiconductor wafer 10 Tape 11 Frame 12 Blade 21 Arm 22 Bracket 23 Substrate 24 Crank arm 25, 27 Hinge part 26 Rod 28 Piston rod 29 Air cylinder

Claims (1)

(57) [Scope of request for utility model registration] 1. A dicing apparatus for dicing a semiconductor wafer mounted on a frame via a tape while holding the semiconductor wafer on a chuck table, wherein the chuck table includes a suction unit for suction-holding a wafer unit and a frame unit. 2 is a clamping mechanism sandwiching a chuck table having a claw portion which holds pressed downward than
Is above disposed, the clamping mechanism rotate at least 90 ° is given
The rotor is a driving part, and the claw part is attached to the rotating shaft of the rotor.
Attached to the end of the arm
The frame is displaced to the closed state by rolling and the frame is pressed from above.
The frame is opened by displacing it to the open state.
A clamp mechanism for a frame in a dicing apparatus , wherein the claw portion is configured not to protrude from the upper surface of the chuck table in any state .