JP2651065B2 - Wafer recovery / supply mechanism in single wafer horizontal cutting machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single wafer type horizontal cutting.
For details on the wafer collection and supply mechanism in the equipment,
Semiconductor wafer sliced and diffused from ingot
Horizontal type that further divides C into two single-wafer types from the center of the thickness and width
Collect the processed semiconductor wafer from the cutting mechanism and cut it.
Semiconductor wafer for supplying unprocessed semiconductor wafer to cutting mechanism
The present invention relates to an efficient collection / supply mechanism .

[0002]

2. Description of the Related Art Conventionally, a substrate for a discrete element such as a transistor has been manufactured by grinding one side of a semiconductor wafer having an impurity diffusion layer on both sides and an impurity non-diffusion layer in the center. In order to reduce material loss in the method of processing a semiconductor wafer, a method of cutting a semiconductor wafer has been developed in which a semiconductor wafer is cut into two parts from the center of the thickness thereof.
No. 1536 and Japanese Patent Application Laid-Open No. 3-181131. In order to implement the processing method, the applicant
Discloses a mechanism for collecting and supplying a wafer.
No. 27 and Japanese Patent Application Laid-Open No. 3-145726.

[0003] An earlier application by the present applicant (Japanese Unexamined Patent Publication No.
No. 145727) is a separate type wafer collection and supply mechanism.
Arrangement direction (vertical direction) of the rotation axis of the blade and perpendicular to it
A function of moving the wafer in both horizontal planes of the
To the fixedly arranged wafer collection / supply unit.
Wafer collection / supply with combined functions of eha removal and storage
Mechanism. In addition, a prior application (Japanese Unexamined Patent Application Publication No.
No. 145726), the main body of the wafer collection / supply device is one.
It has a body type, and the terminal collection and supply mechanism is separated and independent.
Are fixedly installed in pairs at a certain required interval
Collection / supply machine that moves for efficient wafer transfer
It is fine.

The above-mentioned earlier application (Japanese Patent Laid-Open No. 3-145727)
No.) is separated into vertical slicers
It is installed independently and exchanges wafers before and after cutting.
It is performed efficiently, but the reinforcement part form of the wafer to be cut is
Grooves are engraved on the outer peripheral side of the wafer, and the reinforcing agent is filled and cured.
There is no protruding part so that the wafer can be stored in the carrier
It is not necessary to forcibly correct the holding posture when the
For the surface and the cutting itself,
At least the wafer is cut to prevent
It is necessary to hold the wafer to be cut off by suction before the end of cutting.
The blade is displaced (vibration) at the moment of holding by suction.
) And the cutting streak becomes extremely deep.
There is a defect that can be damaged.
C. A wafer in the form of a reinforcement with a protruding part
It was required to be cut .

[0005] The prior application (Japanese Patent Laid-Open No. 3-145726)
No.) indicates that the wafer to be cut is a reinforced wafer with protrusions.
Although the above problem has been solved in c, the wafer
The working wafer collection / supply hand section is "required constant interval"
Are fixed to each other with a
For the wafer replacement time before and after cutting,
The cutting is unavoidable during the cutting, but this method
After the nearby collection hand unit completes the collection operation
Move this "required constant interval" to supply the next wafer
Time is needed, and challenges in terms of efficient cutting
Was leaving. A further earlier application (Japanese Patent Application Laid-Open No. 3-145727)
No. and JP-A-3-145726) are both cut after cutting.
At the same time, the wafer thickness after cutting
Is thin and brittle, approximately one-third the thickness of the material wafer,
Do not break or drop the wafer when collecting the wafer
Problem of lowering the cutting yield
was there.

[0006]

[SUMMARY OF THE INVENTION The present invention, the above-described problems, which has been made in view of the technical background, be cut c
Assuming that Eha is a reinforced form with protrusions,
Reduces the time required to change wafers before and after cutting,
Reliable recovery of brittle wafers, cutting efficiency and cutting yield
To improve the efficiency.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a single wafer type horizontal cutting apparatus according to the present invention.
The eha collection / supply mechanism employs the following means. That is, according to the first aspect, a semiconductor wafer having an impurity diffusion layer on both sides and an impurity non-diffusion layer in the center is formed by a thickness width
Single-wafer horizontal type that is cut into two parts by a blade from the center of the
In a semiconductor wafer cutting device comprising a slicer,
Has a blade that rotates at high speed at a fixed position in the vertical plane
For the cutting mechanism, the rotating surface of the blade of the
In line plane, the holding mechanism or et wafer consisting of main and secondary retaining disc
Collection operation of the processed wafer cut into two parts in the collection part
Operation and transfer of unprocessed wafers from the wafer supply unit to the holding mechanism
A wafer recovery and supply mechanism for supplying operation, the switching
Handle the wafer directly to either the left or right
90 ° in a vertical plane parallel to the rotation plane of the blade
Recovery han with function to rotate 180 degrees and move up and down
Recovery mechanism for moving the door horizontally and the other of the cutting mechanism
The rotating surface of the blade for directly handling the wafer
Rotate up and down 90 ° to 180 ° in a parallel vertical plane
Supply mechanism that horizontally moves the supply hand unit having the function of
Are separated and arranged independently, and processed at the end of wafer cutting.
Efficient exchange of finished and unprocessed wafers
It is characterized in that it repeats continuously. And wafer collection
A pair of hand parts that directly handle wafers for
C The suction part, cylinder part and rotating part are connected, and wafer suction
From the structure of a pair arranged in a back-to-back configuration with the parts inverted
And rotate in a vertical plane and make a pair in a direction perpendicular to this vertical plane.
To expand and contract between the surfaces of the wafer suction part and to transfer the wafer
A wafer collection mechanism that moves vertically and horizontally in a vertical plane
You.

[0008]

According to the above-mentioned means, in the first aspect, the horizontal slide is provided.
Hands directly acting on the wafer on both the left and right sides of the cutting mechanism
The complete collection and supply mechanism, including the
Separately and independently installed to operate in vertical vertical planes
The wafer supply direction
From the wafer through the wafer holding mechanism to the wafer collection unit
The movement of the wafer in one direction results in the wafer collection / supply mechanism.
Movement is easy and mechanically simple
You. Furthermore, when considering efficient cutting,
The interruption time during wafer cutting, which is a problem of
The "wafer replacement time before and after processing"
Since the collection and supply mechanism is separated and independent, basically
The start and end of each operation is optional, in other words,
Eventually, the unprocessed
That the wafer supply operation can proceed
, And the time of replacing the "processing before and after the wafer that you are now problems
In the extreme, “between” the processed wafers against the holding plate
It can be said that only the time required for elimination, and the collection of wafers
-Separation of the supply mechanism requires "wafer replacement time before and after processing"
Acts to greatly reduce.

Then, the wafer collecting mechanism having the above-described structure is used.
The cylinder part acts as a cylinder between the surfaces of the pair of wafer suction parts.
2 processed wafers divided into two
In between, insert with the distance between the pair of wafer suction parts reduced
Can absorb errors such as “runout” due to movement, and
To ensure that the wafer is held by suction, and again
Rotate, shrink, move, thin after cutting with processing distortion
Recovers even broken very fragile wafers without any problems
Acts as possible.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the collection and supply of semiconductor wafers according to the present invention will be described.
An embodiment of the feeding mechanism will be described with reference to the drawings.

1 to 3 show a supply unit 1, a supply mechanism 2,
An apparatus configuration including a cutting mechanism 3, a holding mechanism 4, a collecting mechanism 5, and a collecting unit 6 is shown. The supply unit 1 stores the unprocessed semiconductor wafers W in a vertical state, and includes a supply carrier 11 having a commercially available wafer carrier structure capable of vertically arranging the unprocessed semiconductor wafers W at regular intervals, and a supply carrier 11. A feed base 12 on which the feed mechanism 11 is placed and which moves horizontally;
Each time one unprocessed semiconductor wafer W is taken out, the horizontal movement of the feed base 12 for one pitch in parallel with the unprocessed semiconductor wafer W is driven, and the unprocessed semiconductor wafer W is supplied by the supply mechanism 2 at a fixed position. And a drive unit 13 such as a stepping motor that enables taking out.

The supply unit 1 comprises a cutting mechanism 3, a holding mechanism 4
1, the cutting mechanism 3 and the holding mechanism 4 are disposed at the center, and the recovery unit 6 is disposed on the left side and the supply unit 1 is disposed on the right side.

The supply mechanism 2 transports and supplies one unprocessed semiconductor wafer W stored in the supply section 1 from the supply section 1 to the holding mechanism 4 in a vertical state. 12 is a horizontal moving unit 2 composed of a straight rodless cylinder horizontally erected in a direction orthogonal to the horizontal moving direction
1, a horizontal moving base 22 attached to the horizontal moving unit 21 and horizontally moving along the horizontal moving unit 21, and a straight rodless cylinder mounted on a support plate 25 vertically suspended from the moving base 22 A vertical moving base 24 of a vertical moving portion 23, a support plate 26 fixed to the vertical moving base 24 and vertically moving integrally with the moving base 24 to advance and retreat vertically with respect to the horizontal moving portion 21; A hand unit 27 attached to the lower end of the support plate 26 for attaching and detaching one unprocessed semiconductor wafer W; Further, the hand part 27 is rotated by a rotation part 27a such as a rotary actuator attached to the lower end of the support plate 26, and at the lower end of the support plate 26 from the horizontal state to the opposite horizontal state through the rotation part 27a by 180 degrees. Arm 27b rotatably connected
A suction unit 27c attached to the tip of the arm 27b and suctioning an unprocessed semiconductor wafer W by vacuum;
The suction unit 27c attached to the arm 27b is delicately moved in the horizontal movement direction of the horizontal movement base 22 and the direction perpendicular to the vertical movement direction of the vertical movement base 24, and the unprocessed semiconductor wafer W in the supply unit 1 and the holding mechanism 4 is moved. And a short-stroke cylinder 27d for smooth and reliable attachment and detachment.

The supply mechanism 2 is disposed between the supply unit 1 and the cutting mechanism 3 and the holding mechanism 4 and is arranged at a position symmetrical to the collection mechanism 5 with the cutting mechanism 3 and the holding mechanism 4 as a center. .

The cutting mechanism 3 cuts the unprocessed semiconductor wafer W held by the holding mechanism 4 in a vertical state and divides it into two, and is a dish-shaped disk that rotates at a fixed position at a high speed about a horizontal rotation axis. Chuck body 31 and chuck body 31
A blade 32 having an inner peripheral edge shape, which is attached to the blade and cuts the unprocessed semiconductor wafer W with a vertical cutting action surface;
Is fixed to the chuck body 31 by tension.

The holding mechanism 4 holds one unprocessed semiconductor wafer W in a vertical state and holds the two processed semiconductor wafers Wa and Wb cut and separated by the cutting operation of the cutting mechanism 3 in a vertical state. (Fig. 4,
5), a main holding plate 41 that suction-holds one side of the unprocessed semiconductor wafer W by vacuum, and then suction-holds one side of one of the two processed semiconductor wafers Wa as it is. A sub-holding plate 42 provided so as to face the main holding plate 41 for holding one side of the other Wb of the semiconductor wafer processed by vacuum, and a main holding plate 4
1. An air cylinder 43 for moving the sub-holding plate 42 closer and further away to facilitate delivery of the unprocessed semiconductor wafer W and the processed semiconductor wafers Wa and Wb to and from the supply mechanism 2 and the recovery mechanism 5.
a, the main holding plate 41 (including the sub-holding plate 42) is moved toward and away from the blade 32 of the cutting mechanism 3, and the unprocessed material held by the main holding plate 41. The center of the thickness width of the semiconductor wafer W is indexed to the cutting action surface of the blade 32 and the unprocessed semiconductor wafer W,
A position feed mechanism 44 for retracting the processed semiconductor wafers Wa and Wb to a position where the blade 32 does not hinder the delivery of the processed semiconductor wafers Wa and Wb to the collection mechanism 5;
The unprocessed semiconductor wafer W indexed by the position feed mechanism unit 44 is horizontally moved along the blade 32 (integrally with the sub-holding plate 42), and the blade 32
And a cutting feed mechanism 45 for horizontally moving on the cutting action surface of the cutting.

The holding mechanism 4 is installed so as to face the cutting mechanism 3 and moves horizontally on the rotation center axis X of the blade 32 of the cutting mechanism 3 by means of the position feed mechanism section 44. The main holding plate 41 and the sub-holding plate 42 are located in the wafer movement path plane with the semiconductor wafer 5, so that the unprocessed semiconductor wafer W and the processed semiconductor wafers Wa and Wb are delivered (FIG. 2). reference). That is, the holding mechanism 4 retracts the distance R in the direction away from the central axis X of the blade 32 of the cutting mechanism 3 in the direction away from the blade 32, and moves the sub holding plate 42 from the main holding plate 41 by the contact / separation mechanism 43. By moving the distance T apart, a moving path 10 extending in the left-right direction in FIG. 2 including the distance T between the holding plates 41 and 42 is formed, and the moving path 10 is connected to the hand unit 27 of the supply mechanism 2 and the collection mechanism. 5 so that a hand unit 57 described later can be moved.

The collecting mechanism 5 is used to cut the 2
The semiconductor wafers Wa and Wb that have been processed are held and transported from the holding mechanism 4 to the collection unit 6 while being held in a vertical state. As in the supply mechanism 2, the horizontal movement base 52 of the horizontal movement unit 51 and the vertical The vertical moving base 54 of the moving unit 53, the support plates 55 and 56, the hand unit 57 (the rotating unit 57a, the arm 5)
7b, a suction portion 57c, and a short-stroke cylinder 57d). However, unlike the case of the supply mechanism 2, the collection mechanism 5 includes a pair of hand parts 57, 57 that operate simultaneously or independently, as shown in detail in FIG. Has a rotating portion 57a, and each rotating portion 57a is provided with an arm 57b, a suction portion 57c, and a short stroke cylinder 57d, respectively.
The pair of rotating parts 57a are driven simultaneously or independently,
Thereby, each arm 57b rotates simultaneously or independently from a horizontal state (bending state) to a vertical state (extended state),
The processed semiconductor wafers Wa and Wb can be collected.

That is, in FIG.
7 is a support plate 56 attached to the vertical movement base 54.
The hand parts 57, 57 are attached in a suspended manner by connecting a support metal member 72 provided at the tip of the support member 72, which supports the rotating parts 57a of both hand parts 57, to a support metal member 73 at the tip of the support plate 56 by a bolt 75. The bolt 75 also serves as an adjustment screw for moving and adjusting the hand portions 57, 57 in the horizontal direction in the figure, and is fixed with the bolt 74 after the adjustment. Each of the rotating parts 57a is a rotary drive source such as a rotary actuator operated by air pressure, and the arms 57b can be simultaneously or independently rotated by a predetermined angle by connecting the arms 57b to their rotating shafts 58. The suction portions 57c which are connected to the rods of the short-stroke cylinders 57d are arranged in a back-to-back configuration with the suction surfaces being reversed. Expands from P to Pa, and individually suction-holds the processed semiconductor wafers Wa and Wb in the expanded state.

The collection mechanism 5 includes a collection unit 6 and a cutting mechanism 3,
The cutting mechanism 3 is provided between the holding mechanism 4 and the holding mechanism 4.
Are arranged symmetrically with respect to the supply mechanism 5 with respect to.

The collection unit 6 stores the processed semiconductor wafers Wa and Wb cut by the cutting mechanism 3 in a vertical state. As in the case of the supply unit 1, the collection carrier and the feed table 6 are provided.
2, a driving unit 63; However, unlike the supply unit 1,
Two collection carriers 61a and 61b are placed on the feed table 62 as a set with respect to one of the supply carriers 11 of the supply unit 1.

The operation of the present invention will be described below with reference to FIGS. The semiconductor wafer W used in this embodiment has a reinforcing portion P on the cutting end side to prevent breakage of the semiconductor wafer W at the time of cutting and to allow a margin for the suction timing by the sub-holding plate 42 of the holding mechanism 4. Are formed. For this reason, in order to store the semiconductor wafer W having the reinforcing portion P in a normal wafer carrier structure, the reinforcing portion P must be placed on the upper side or the lower side. 6 is set to be on the lower side in the collection carrier 61.

FIG. 4 shows a cutting operation of the cutting mechanism 3, in which the supply mechanism 2 sucks the unprocessed semiconductor wafer W to be cut next and stands by near the holding mechanism 4, and the collection mechanism 5 finishes cutting. In order to collect the processed semiconductor wafers Wa and Wb, the semiconductor wafers are waiting near the holding mechanism 4. That is, the moving base 52 of the horizontal moving unit 51 of the collection mechanism 5 is located at the rightmost end in the figure, and the moving base 22 of the horizontal moving unit 21 of the supply mechanism 2 is located at the leftmost end in the figure. The vertical movement bases 24, 54 of 53 are located at the top dead center, and the arms 27b, 57b are maintained in a bent state by the operation of the rotating parts 27a, 27b.
c is an empty state, and the suction unit 27c of the supply mechanism 2 is waiting for the end of the cutting operation of the cutting mechanism 3 while sucking the unprocessed semiconductor wafer W (FIG. 4A). Also, the holding mechanism 4
Indicates a state during the cutting operation in which the center axis X of the blade 32 of the cutting mechanism 3 is displaced to the left by the distance L. The wafer W is firmly suction-held on the main holding plate 41, and the sub-holding plate 42 The timing for sucking the wafer Wb to be cut and separated at a close position is measured (FIG. 4B).

When the cutting operation of the cutting mechanism 3 shown in FIG. 4 is completed, the holding mechanism 4 is horizontally moved by the cutting feed mechanism 45 while holding the processed semiconductor wafers Wa and Wb, and the blade 32 of the cutting mechanism 3 is moved. After returning to the position of the center axis X, the position feed mechanism 44 retracts the center axis X by the distance R and retreats to a position avoiding the blade 32. At that position, the main holding plate 4 is moved by the contact / separation mechanism 43.
1. The sub-holding plate 42 is separated to form a gap between the two processed semiconductor wafers Wa and Wb, that is, a movement path 10 (FIG. 5B).

When the moving path 10 is formed between the two processed semiconductor wafers Wa and Wb, the collecting mechanism 5
Moves downward with the hand portion 57 bent, adsorbs the two processed semiconductor wafers Wa and Wb, respectively (FIG. 5A), and then rises (FIG. 6). Thereafter, the collection mechanism 5 moves to the collection section 6 while the hand section 57 remains in the bent state, and at the same time, the supply mechanism 2 rotates the hand section 27 to the holding mechanism 4 side by 180 degrees (FIG. 7). Next, the hand unit 27 of the supply mechanism 2 descends and holds the unprocessed semiconductor wafer W.
Then, the hand portion 57 of the collecting mechanism 5 descends to start collecting the processed semiconductor wafers Wa and Wb into the collecting carrier 61 (FIG. 8A). As a result, the delivery of the unprocessed semiconductor wafer W and the processed semiconductor wafers Wa and Wb between the supply mechanism 2, the recovery mechanism 5, and the holding mechanism 4 is completed.

After delivery of the processed semiconductor wafers Wa and Wb between the collection mechanism 5 and the holding mechanism 4, the supply mechanism 2 and the holding mechanism 4
During the delivery operation of the unprocessed semiconductor wafer W, the collection mechanism 5 advances the collection operation regardless of the delivery operation of the supply mechanism 2 and the holding mechanism 4. That is, as shown in FIG. 7, the collection mechanism in which the movable base 52 has moved to the leftmost end in the drawing is the one arm 57 of the hand unit 57 on the collection unit 6.
b is rotated 90 degrees to make it in the straightened state, and is lowered as shown in FIG. 8A, and the processed semiconductor wafer Wa is first stored in the carrier 61a of the collection unit 6. Next, the arm 57b
Is rotated by 90 degrees to return to the bent state, and the other arm 57b is extended (FIG. 9A). Then, the arm 57b is lowered and the processed semiconductor wafer Wb is stored in the other carrier 61b (FIG. 10A). Then, the arm 57b is raised and returned to the bent state to bring both the arms 57b and 57b into the bent state (FIG. 11A), and is returned to the position of FIG.

On the other hand, the supply mechanism 2, which has delivered the unprocessed semiconductor wafer W to the holding mechanism 4, raises the arm 27a to return to the straightened state as shown in FIG. 9A, and the moving base 22 is moved to the rightmost end in the figure. Then, at this position, the arm 27a descends to adsorb one unprocessed semiconductor wafer W from the carrier 11 of the collection unit 1 to the adsorption unit 27c.
A, as shown in FIG.
The moving base 22 moves to the leftmost position in the drawing, that is, the standby position in FIG.

The operation of storing the processed semiconductor wafers Wa and Wb in the collection unit 6 will be described in more detail with reference to FIG. The carriers 61a and 61b of the collecting unit 6 are generally the same in shape, but the front and rear directions are defined. Therefore, the directions of the two carriers 61a and 61b are reversed on the feed base 62, that is, the front ends or the rear ends of the two carriers. The substrates are placed at regular intervals K with the edges facing each other. Collection mechanism 5
The hand portion 57 of FIG. 8 holds the processed semiconductor wafers Wa and Wb with the cut surfaces facing each other and reaches the collecting portion 6 while being held by the suction portions 57c and 57c, and as described with reference to FIG. One arm 57b is in an extended state, and the other arm 5
7b is bent, and the hand unit 57 descends, and first, the processed semiconductor wafer Wa is stored in the carrier 61a.
Next, the feed table 62 is moved to position the other carrier 61b below the hand unit 57 (for convenience of explanation, the state in which the hand unit 57 is moved is shown), and the other arm 57b is moved as described with reference to FIG. 10A. The semiconductor wafer Wb is lowered in the straightened state and stored in the carrier 61b.

The above operation is repeated for each cycle of the collecting process, whereby the semiconductor wafer Wa (the wafer held on the main holding board side) is sequentially placed on the carrier 61a with the cut surface facing the same side. The semiconductor wafer Wb (wafer held on the sub-holding plate side) is sequentially stored and aligned on the other carrier 61b with the cut surface facing the same side, and furthermore, in the front-back direction of the carriers 61a and 61b. Also, the directions of the semiconductor wafers Wa and Wb are aligned. Accordingly, the carriers 61a containing the semiconductor wafers Wa and Wb,
61b can be handled without distinction, which is advantageous in subsequent processing.

When one of the arms 57b descends to store the semiconductor wafer in the carrier in the above-mentioned collecting operation, the other arm 57b is in a bent state. It does not touch the edge. And according to the said structure, both carriers 6
The distance K between 1a and 61b and both suction portions 5 of the hand portion 57
Since the interval P between 7c and 57c can be made sufficiently smaller than the length S of the carriers 61a and 61b, the size of the entire apparatus can be reduced.

During the supply operation of the supply mechanism 2 and the recovery operation of the recovery mechanism 5, the cutting operation of the cutting mechanism 3 proceeds simultaneously, and the supply mechanism 2, the recovery mechanism 5 and the holding mechanism 4
Unprocessed semiconductor wafer W, processed semiconductor wafer W
The cutting mechanism 3 always performs the cutting operation except during the delivery operation of a and Wb, thereby reducing the interruption time of the cutting operation.

[0032]

According to the present invention, a wafer collecting and supplying apparatus is provided.
The structure is perpendicular to the direction (horizontal) of the rotation axis of the blade.
And the movement for collecting and supplying wafers
It is performed only in that plane, and a mechanism for collecting and supplying the wafer
Since the separation type is used, supply of material wafers and wafers after cutting
The direction of movement of the wafer is one direction, so to speak
Collection and supply can be performed in parallel,
EHA exchange time (cutting stop loss) to minimize and cut
Efficiency can be improved.

And, in the wafer collecting mechanism of the present invention,
The function of the hand part becomes two thinner wafers after processing
Performs reliably even on very fragile wafers
can do.

[Brief description of the drawings]

FIG. 1 is a front view showing an example of a semiconductor wafer collection / supply mechanism according to the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is an enlarged side view of the collection mechanism of FIG. 1;

FIG. 4 is a process chart for explaining the operation of the present invention, and FIG.
Fig. 3 shows the linkage of each operation from the front, and Fig. 3 (B) shows the operation around the cutting mechanism and the holding mechanism from a plane.

FIG. 5 is a process drawing following FIG. 4, wherein (A) and (B) are the same as in FIG. 4;

FIG. 6 is a process drawing following FIG. 5;

FIG. 7 is a process drawing following FIG. 6;

FIG. 8 is a process drawing following FIG. 7, wherein (A) and (B) are the same as in FIG. 4;

FIG. 9 is a process drawing following FIG. 8, in which (A) and (B) are the same as in FIG. 4;

10 is a process drawing following FIG. 9, and FIGS. 10A and 10B are the same as FIG.

FIG. 11 is a process drawing following FIG. 10, and (A) and (B)
Is similar to FIG.

FIG. 12 is a side view illustrating a collecting operation in the collecting unit.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Supply part 2 ... Supply mechanism 3 ... Cutting mechanism 4 ... Holding mechanism 5 ... Recovery mechanism 6 ... Recovery part 57 ... Hand part 57a ... Rotating part 57c ...
Suction portion 57d Cylinder portion W Unprocessed semiconductor wafer Wa, Wb ... Processed semiconductor wafer

Claims (1)

(57) [Claims] 1. A semiconductor wafer comprising a single wafer type horizontal slicer.
Eha cutting device has impurity diffusion layers on both sides
The thickness of a semiconductor wafer with an undiffused layer of impurities in the center
Cut into two parts from the center of the width by the blade of the cutting device.
When cutting, the holding mechanism consisting of the main and
Collection of processed wafers cut into two parts by the collection unit, and
Supply of unprocessed wafers from the wafer supply unit to the holding mechanism.
A pair of hand units for directly handling wafers of the collecting mechanism
The wafer suction part, cylinder part and rotating part are connected,
The wafers are arranged in a back-to-back configuration with the wafer suction
It consists of a pair of placed
Between the surfaces of the pair of wafer suction portions in a direction perpendicular to
To move vertically and horizontally to transfer
(C) The collection mechanism and the wafer supply mechanism for supplying the wafer are placed on both sides of the cutting mechanism in a vertical plane parallel to the rotation plane of the blade.
Separate and independent, before and after cutting at the end of wafer cutting
To efficiently repeat and continue wafer exchange
A wafer collection and supply mechanism.