JPS5839019A - Semiconductor die-bonding device - Google Patents

Abstract

PURPOSE:To increase the positional accuracy of die-bonding by a method wherein a device, with which the position and the condition of the die-bonding after mounting are automatically detected, is provided and the amount of detection is computed and fed back. CONSTITUTION:Die-mounting parts 10a and 10a' are fed at equal intervals. A mounting agent injection head 2 is provided on a die-mounting section 10a in the state wherein a lead frame 1 is at a standstill, and a controller 3 for mounting agent injection quantity, which comes down when the mounting agent is injected, is provided, a mount head 4 is attached on an XY table 4a, picks up a die 11 located on another table 5 and carried it to the die-mounting part 10a'. An ITV camera 6 is installed on a die-mounting part 10a'' which is located after several die-mounting parts. The position where a die is mounted, the quantity of mounting agent and the deffective mounting of a die are detected and the result is inputted to a central controller 7, an arithmetic oprational processing is performed on the above data, and the mounting agent injection quantity of the controller 3 and the amount of performance of the mount head 4 are corrected by performing a feed back.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor die bonding apparatus. In conventional automatic die bonding apparatuses, defects such as the position of the die after mounting and defects such as missing dies are checked by humans at regular intervals. However, since the value check is a visual check of the state after die mounting, it is not possible to immediately check for fluctuations due to thermal fluctuations, mechanical fluctuations, or other influences in the equipment. For this reason, it has often been seen that a considerable number of defects occur continuously between one regular check and the next check. Furthermore, since it is not possible to check defects that occur at a low rate of occurrence, they may continue to occur and cause a decline in quality.

This invention has been made in view of the above-mentioned conventional drawbacks, and is provided with a device that automatically recognizes the position and state of a semiconductor die bonding device after it has been mounted, and calculates and feeds back the detected amount. It is.

Hereinafter, one embodiment of the present invention will be explained in detail with reference to the drawings. Figure 1 shows the main part of the l embodiment, (1
) is the lead frame conveyor section, and the die mounts provided at equal intervals on the lead frame) @ (10m), (
10m)... by the above interval. Then, one die mount part (10
m) is provided with a mounting agent injection head (2), which is lowered by an elevating mechanism (not shown) when injecting the mounting agent, and at the same time has a controller (3) for controlling the amount of mounting agent to be injected. C. Correction is made by commands from the central controller, which will be described later. Next, (4) is a mount head, which is located on the die mount part (10a') a few steps behind the mount agent injection head (2) in the die mount part, and is mounted on the XY table (4 m). and the function of supporting the die at+ on another XY table (5) and transporting it onto the die mount section (10a). That is, it moves forward in the ascending position and reaches above the die, then descends and supports the die aυ by suction, then rises and reaches above the die mount part (10a'), descends and places this die on the die mount part. It has the function of placing Further, the operation amount of the mount head (4) is corrected by a command from a central controller, which will be described later. Further, an ITV camera (6) is provided on the die mount section (10a') some distance behind the mount head (4). This ITV camera is a charge co, L/: :ff 7, CCD
It can detect the mounted position of the die, the amount of mounting agent, and the mounting failure, and input it to the central controller (7) (microcomputer), which processes the data and calculates the amount of mounting agent to be injected. Feedback is provided to correct the amount of movement of the controller (3) and the mount head (4). Note that the correction of the mount position is based on the deviation from the optimal mount position, Δ
X, Δy, Δ0 are computed and the corresponding values are digitally fed back as correction amounts, but in order to achieve higher accuracy, the data of the previous and previous three times are memorized and arithmetic processing is performed to perform square convergence. It is effective to do so. Next, in order to control the amount of the mounting agent, for example, in the case of epoxy mounting using a dispenser, the dispensing time may be controlled. In addition, if the occurrence rate of other detection items such as die chips, surface scratches, and dirt exceeds a set value, the equipment will stop operating, or an abnormality alarm, lamp display, etc. will be issued from the central control. It looks like this.

According to the present invention, the positional accuracy of die bonding is improved, so that it is effective in responding to high integration.

In addition, defect detection and data feedback can significantly improve yield and lead to improved reliability. Furthermore, since the system can make self-judgments without requiring any human intervention, complete automation (unmanned equipment) can be achieved.

[Brief explanation of drawings]

The figure shows a perspective view of one embodiment of the invention. l Lead frame conveyance section 2 Mounting agent injection head 3 7, controller 4 for the amount of lant agent injection
Mount head 4m, 5 XY table 6 ITV camera 7 Central controller 10 Lead frame 10a, 10a, 10a Die mount department representative Patent attorney Mr. Inoue

Claims (1)

[Claims] A die bonder for semiconductors is equipped with an ITV detector to self-recognize the mounted state, and detects the mount position, amount of mounting agent, and mount failure, and a microcomputer performs arithmetic processing based on the detected data. A semiconductor die bonding apparatus characterized in that the feedback is provided to a controller of a mounting head and a controller of a mounting agent injection head.