JPS59128735U - Semiconductor chip bonding equipment - Google Patents

Semiconductor chip bonding equipment

Info

Publication number
JPS59128735U
JPS59128735U JP2260583U JP2260583U JPS59128735U JP S59128735 U JPS59128735 U JP S59128735U JP 2260583 U JP2260583 U JP 2260583U JP 2260583 U JP2260583 U JP 2260583U JP S59128735 U JPS59128735 U JP S59128735U
Authority
JP
Japan
Prior art keywords
semiconductor chip
adhesive
mounting table
chip bonding
chip mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2260583U
Other languages
Japanese (ja)
Other versions
JPH027466Y2 (en
Inventor
小沢　淳
Original Assignee
新日本無線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新日本無線株式会社 filed Critical 新日本無線株式会社
Priority to JP2260583U priority Critical patent/JPS59128735U/en
Publication of JPS59128735U publication Critical patent/JPS59128735U/en
Application granted granted Critical
Publication of JPH027466Y2 publication Critical patent/JPH027466Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ、　　ｂは接着剤の量が異常に塗布された状態
を示す図、第２図は接着剤が正規の位置からずれて塗布
された状態を示す図、第３図は本考案の一実施例の接着
剤塗布制御のためのパターン認識部分の概略図、第４図
は同実施例の接着剤塗布制御部分の概略図、第５図はコ
ンベア部分の平面図、第６図は同側面図である。 １・・・接着剤、２・・・半導体チップ、３・・・半導
体チップ載置台、４・・・パッケージ（ヘッダー）、５
・・・カメラ、６・・・ピン、７・・・コンベア、８・
・・第１クランパ、９・・・接着剤塗布装置、１０・・
・第２クランパ、１１・・・接着装置、１２・・・選別
テーブル、１３・・・移送装置、１４・・・位置決め装
置、１５・・・制御装置、１６・・・Ｙテーブル、１７
・・・ステッピング・モータ、１８・・・Ｘテーブル、
１９・・・ステッピング・モータ、２０・・・照明。Figures 1a and b are diagrams showing a state in which an abnormal amount of adhesive has been applied, Figure 2 is a diagram showing a state in which adhesive has been applied out of the normal position, and Figure 3 is a diagram showing a state in which an abnormal amount of adhesive has been applied. A schematic diagram of a pattern recognition part for adhesive application control in one embodiment, FIG. 4 is a schematic diagram of an adhesive application control part in the same embodiment, FIG. 5 is a plan view of the conveyor part, and FIG. 6 is the same diagram. FIG. DESCRIPTION OF SYMBOLS 1... Adhesive, 2... Semiconductor chip, 3... Semiconductor chip mounting stand, 4... Package (header), 5
...Camera, 6...Pin, 7...Conveyor, 8.
...First clamper, 9...Adhesive applicator, 10...
- Second clamper, 11... Adhesive device, 12... Sorting table, 13... Transfer device, 14... Positioning device, 15... Control device, 16... Y table, 17
...Stepping motor, 18...X table,
19...Stepping motor, 20...Lighting.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 接着剤を使用して半導体チップを半導体チップ載置台等
に接着させる半導体チップ接着装置において、コンベア
により搬送されてくる上記半導体チップ載置台等の所定
の位置に接着剤を塗布する接着剤塗布装置と、該接着剤
が塗布された半導体チツピ載置台等の上に半導体チップ
を載せる半導体チップ移送機構と、上記半導体チップ載
置台等の上の接着剤の塗布状態を検出するパターン認識
装置とを具備し、該パターン認識装置による接着剤の塗
布状態の検出出力により、上記接着剤塗布装置による接
着剤塗布を制御するようにしたことを特徴とする半導体
チップの接着装置。In a semiconductor chip bonding device that uses an adhesive to bond a semiconductor chip to a semiconductor chip mounting table, etc., an adhesive application device that applies adhesive to a predetermined position of the semiconductor chip mounting table, etc. that is conveyed by a conveyor; , comprising a semiconductor chip transfer mechanism for placing a semiconductor chip on a semiconductor chip mounting table or the like coated with the adhesive, and a pattern recognition device for detecting the application state of the adhesive on the semiconductor chip mounting table or the like. A semiconductor chip bonding device, characterized in that the adhesive coating by the adhesive coating device is controlled by the detection output of the adhesive coating state by the pattern recognition device.
JP2260583U 1983-02-17 1983-02-17 Semiconductor chip bonding equipment Granted JPS59128735U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2260583U JPS59128735U (en) 1983-02-17 1983-02-17 Semiconductor chip bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2260583U JPS59128735U (en) 1983-02-17 1983-02-17 Semiconductor chip bonding equipment

Publications (2)

Publication Number Publication Date
JPS59128735U true JPS59128735U (en) 1984-08-30
JPH027466Y2 JPH027466Y2 (en) 1990-02-22

Family

ID=30153698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2260583U Granted JPS59128735U (en) 1983-02-17 1983-02-17 Semiconductor chip bonding equipment

Country Status (1)

Country Link
JP (1) JPS59128735U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135561A (en) * 1987-08-27 1989-05-29 Fuji Kikai Seizo Kk Apparatus for applying highly viscous fluid
JPH02137339A (en) * 1988-11-18 1990-05-25 Hitachi Ltd Pellet bonding device
JPH05115823A (en) * 1987-08-27 1993-05-14 Fuji Mach Mfg Co Ltd Highly viscous fluid applying device having trial shooting function
JPH05115822A (en) * 1987-08-27 1993-05-14 Fuji Mach Mfg Co Ltd Highly viscous fluid applying device
JPH09172030A (en) * 1996-10-25 1997-06-30 Toshiba Mechatronics Kk Paste applicator for pellet bonding

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018006181A1 (en) * 2016-07-08 2018-01-11 Macdonald, Dettwiler And Associates Inc. System and method for automated artificial vision guided dispensing viscous fluids for caulking and sealing operations

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164545A (en) * 1980-05-21 1981-12-17 Hitachi Ltd Pellet bonding inspection and device therefor
JPS5732587U (en) * 1980-08-01 1982-02-20
JPS5839019A (en) * 1981-08-31 1983-03-07 Toshiba Corp Semiconductor die-bonding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164545A (en) * 1980-05-21 1981-12-17 Hitachi Ltd Pellet bonding inspection and device therefor
JPS5732587U (en) * 1980-08-01 1982-02-20
JPS5839019A (en) * 1981-08-31 1983-03-07 Toshiba Corp Semiconductor die-bonding device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135561A (en) * 1987-08-27 1989-05-29 Fuji Kikai Seizo Kk Apparatus for applying highly viscous fluid
JPH05115823A (en) * 1987-08-27 1993-05-14 Fuji Mach Mfg Co Ltd Highly viscous fluid applying device having trial shooting function
JPH05115822A (en) * 1987-08-27 1993-05-14 Fuji Mach Mfg Co Ltd Highly viscous fluid applying device
JPH02137339A (en) * 1988-11-18 1990-05-25 Hitachi Ltd Pellet bonding device
JPH09172030A (en) * 1996-10-25 1997-06-30 Toshiba Mechatronics Kk Paste applicator for pellet bonding

Also Published As

Publication number Publication date
JPH027466Y2 (en) 1990-02-22

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